CN112216654A - 被加工物的加工方法 - Google Patents
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Abstract
提供被加工物的加工方法,将背面上层叠有材质不同的部件的被加工物高效地分割。被加工物的加工方法包含保持步骤和分割起点形成步骤。保持步骤是将被加工物的背面侧的部件保持于保持工作台的步骤。分割起点形成步骤是如下的步骤:在实施了保持步骤之后,从被加工物的正面侧按照使聚光点会聚于被加工物的内部的状态照射对于被加工物具有透过性的波长的激光光线,在被加工物的内部形成改质层,同时,通过从聚光点向背面侧泄漏的激光光线在层叠于被加工物的背面上的材质与被加工物不同的部件中形成分割起点。
Description
技术领域
本发明涉及被加工物的加工方法。
背景技术
在对背面上粘贴有DAF(Die Attached Film,芯片贴装膜)的被加工物进行分割的情况下,已知有如下的技术:在对被加工物进行分割之后,与被加工物分开地对DAF进行分割(参照专利文献1)。另外,在对背面上形成有金属膜的被加工物进行分割的情况下,已知有如下的技术:在对被加工物进行分割之后,与被加工物分开地对金属膜进行分割(参照专利文献2)。
专利文献1:日本特开2014-130910号公报
专利文献2:日本特开2006-073690号公报
但是,如专利文献1和专利文献2所记载的技术那样,在分成两次工序而进行分割的情况下,存在分割的效率较差的问题。
发明内容
由此,本发明的目的在于提供被加工物的加工方法,将背面上层叠有材质不同的部件的被加工物高效地分割。
根据本发明,提供被加工物的加工方法,在被加工物的背面上层叠有材质与被加工物不同的部件,其中,该被加工物的加工方法具有如下的步骤:保持步骤,利用保持工作台对被加工物的背面侧的该部件进行保持;以及分割起点形成步骤,在实施了该保持步骤之后,从被加工物的正面侧按照使聚光点会聚于被加工物的内部的状态照射对于被加工物具有透过性的波长的激光光线,在被加工物的内部形成改质层,同时,通过从该聚光点向背面侧泄漏的激光光线在该部件中形成分割起点。
优选被加工物的加工方法还包含如下的步骤:粘贴步骤,在实施了该分割起点形成步骤之后,将被加工物的正面侧粘贴于扩展带;以及分割步骤,对该扩展带进行扩展而沿着该分割起点将被加工物和该部件分割。
优选该部件是DAF或金属膜。
根据本申请发明,能够将背面上层叠有材质不同的部件的被加工物高效地分割。
附图说明
图1是作为本发明实施方式的被加工物的加工方法的加工对象的包含被加工物在内的被加工物单元的立体图。
图2是示出实施方式的被加工物的加工方法的流程图。
图3是实施图2的分割起点形成步骤的加工装置的立体图。
图4是示意性示出图3所示的加工装置的激光照射单元的结构的图。
图5是示出图4所示的激光照射单元所照射的激光光线的光斑形状的一例的晶片的主要部分的俯视图。
图6是对图2的分割起点形成步骤进行说明的剖视图。
图7是对图2的分割步骤进行说明的剖视图。
图8是对图2的分割步骤进行说明的剖视图。
标号说明
10:加工装置;11:保持工作台;12:保持面;14:激光照射单元;15:激光光线;16:聚光点;20:分割装置;21:框架固定单元;22:带扩展单元;100:被加工物单元;101:被加工物;102:基板;103:正面;104:分割预定线;105:器件;107:背面;109:部件;121:改质层;129:分割起点;131:距离;139:厚度;141:扩展带;142:框架;143:环状区域。
具体实施方式
以下,参照附图对本发明的实施方式进行详细说明。本发明并不被以下实施方式所记载的内容限定。另外,在以下所记载的构成要素中包含本领域技术人员能够容易想到的内容、实质上相同的内容。另外,以下所记载的结构可以适当组合。另外,可以在不脱离本发明的主旨的范围内进行结构的各种省略、置换或变更。
根据附图对本发明的实施方式的被加工物的加工方法进行说明。首先,对实施方式的被加工物的加工方法的加工对象进行说明。图1是作为实施方式的被加工物的加工方法的加工对象的包含被加工物101在内的被加工物单元100的立体图。另外,图1中,为了说明本实施方式,与实际相比将器件105等相对于被加工物101和被加工物单元100放大而示意性示出,之后的附图也是同样的。
被加工物单元100作为实施方式的被加工物的加工方法的加工对象,该被加工物单元100至少包含被加工物101和层叠在被加工物101的背面107上的与被加工物101不同的部件109。在被加工物单元100中,被加工物101和部件109在本实施方式中形成为径向的大小相互相等的圆板状,但本发明不限于此,任意一方可以形成为直径比任意另一方大的圆板状,也可以形成为方形状等其他形状。
如图1所示,被加工物101在本实施方式中是以硅、蓝宝石、砷化镓或SiC(碳化硅)等作为基板102的圆板状的半导体晶片或光器件晶片。如图1所示,被加工物101在由交叉(在本实施方式中为垂直)的多条分割预定线104划分的基板102的正面103的各区域内分别形成有器件105。
部件109在本实施方式中是粘贴于被加工物101的背面107的DAF(Die AttachFilm,芯片贴装膜)或是成膜在被加工物101的背面107的金属膜,但在本发明中不限于此。作为部件109的一例的DAF用于将从被加工物单元100一个一个地分割而得的器件105固定于其他器件芯片或其他基板等,是具有伸缩性的延展性材料。作为部件109的其他例的金属膜例如是器件105的电极或散热片等。
关于被加工物单元100,被加工物101和部件109一起沿着各分割预定线104被分割而分割成各个带部件109的器件105。
接着,对实施方式的被加工物的加工方法进行说明。图2是示出实施方式的被加工物的加工方法的流程图。图3是实施图2的分割起点形成步骤ST12的加工装置10的立体图。图4是示意性示出图3所示的加工装置10的激光照射单元的结构的图。图5是示出图4所示的激光照射单元所照射的激光光线的光斑形状的一例的晶片的主要部分的俯视图。图6是对图2的分割起点形成步骤ST12进行说明的剖视图。图7和图8是对图2的分割步骤ST14进行说明的剖视图。如图2所示,实施方式的被加工物的加工方法具有保持步骤ST11、分割起点形成步骤ST12、粘贴步骤ST13以及分割步骤ST14。
在实施方式的被加工物的加工方法中,保持步骤ST11和分割起点形成步骤ST12通过图3所示的加工装置10来实施。如图3所示,加工装置10具有:保持工作台11,其利用保持面12对被加工物单元100(被加工物101和部件109)进行保持;激光照射单元14,其朝向保持工作台11所保持的被加工物单元100(被加工物101和部件109)照射激光光线15(参照图6);X轴移动单元17,其使保持工作台11在作为水平面内的一个方向的X轴方向上移动;Y轴移动单元18,其使保持工作台11沿在该水平面内与X轴方向垂直的Y轴方向移动;拍摄单元19,其对保持工作台11所保持的被加工物单元100(被加工物101和部件109)进行拍摄;以及未图示的控制单元,其对各部和各单元进行控制。
如图4所示,激光照射单元14具有:激光振荡器144,其射出对于被加工物101的基板102具有透过性的波长的激光光线15;反射镜145,其使从激光振荡器144射出的激光光线15朝向保持工作台11的保持面12所保持的被加工物101反射;聚光透镜149,其使激光光线15会聚至被加工物101的内部;未图示的聚光点位置调整单元,其使激光光线15的聚光点16在与X轴方向和Y轴方向这两个方向垂直的Z轴方向上移动;以及椭圆光斑整形单元146,其将激光光线15在被加工物101的正面103上的光斑形状151整形为椭圆形。
在本实施方式中,椭圆光斑整形单元146配置于反射镜145与聚光透镜149之间,由平凹柱面透镜147和平凸柱面透镜148构成。激光光线15利用平凹柱面透镜147线状会聚之后,利用平凸柱面透镜148转换成具有椭圆形状的光斑形状151的准直光束(平行光线)。
在本实施方式中,椭圆光斑整形单元146将激光光线15在被加工物101的正面103上的椭圆形的光斑形状151的长轴如图5所示那样定位成与作为被加工物101的加工进给方向的X轴方向平行。
保持步骤ST11是将被加工物101的背面107侧即被加工物单元100的部件109侧保持于图3所示的加工装置10的保持工作台11的步骤。
在保持步骤ST11中,具体而言,在本实施方式中,首先如图6所示,在作为保持工作台11所保持的那一侧的被加工物单元100的部件109侧,粘贴直径比被加工物单元100(被加工物101和部件109)大的保护带111,该保护带111对部件109侧进行保护,另外,在保护带111的外周粘贴环状的框架112。在保持步骤ST11中,接着如图6所示,隔着保护带111而利用保持工作台11的保持面12对被加工物单元100的部件109侧进行吸引保持。另外,加工装置10的保持工作台11连接有未图示的真空源,能够利用保持面12进行吸引保持。
分割起点形成步骤ST12是如下的步骤:在实施了保持步骤ST11之后,如图6所示那样从被加工物101的正面103侧按照使聚光点16会聚于被加工物101的内部的状态照射对于被加工物101具有透过性的波长的激光光线15,在被加工物101的内部形成改质层121,并且通过从聚光点16向背面107侧泄漏的激光光线15而在部件109中形成分割起点129。
在分割起点形成步骤ST12中,具体而言,首先在激光光线15的照射之前,通过拍摄单元19对被加工物单元100(被加工物101和部件109)进行拍摄而执行对准,进行被加工物单元100(被加工物101和部件109)与激光照射单元14的对位。
在分割起点形成步骤ST12中,接着使对于被加工物101具有透过性的波长的激光光线15的聚光点16会聚于被加工物101的内部。在分割起点形成步骤ST12中,接着在使激光光线15的聚光点16会聚于被加工物101的内部的状态下,一边通过激光照射单元14照射激光光线15一边通过X轴移动单元17使对被加工物单元100(被加工物101和部件109)进行保持的保持工作台11侧移动,从而沿着分割预定线104照射激光光线15。
由此,在分割起点形成步骤ST12中,以聚光点16所会聚的位置为中心而在被加工物101的内部沿着分割预定线104形成改质层121的线,并且通过从聚光点16向背面107侧泄漏的激光光线15,以与改质层121在厚度方向上对置的部件109的内部的位置为中心,在部件109的内部沿着分割预定线104形成分割起点129的线。
在图6中,示出从-Y方向侧依次沿着沿X轴方向的6条分割预定线104在被加工物单元100的被加工物101和部件109各自的内部形成改质层121和分割起点129各自的线的状态。在分割起点形成步骤ST12中,最终沿着所有的分割预定线104在被加工物101和部件109各自的内部形成改质层121和分割起点129各自的线。
而且,在分割起点形成步骤ST12中,在本实施方式中,关于所有的分割预定线104,将激光光线15的聚光点16定位于被加工物101的内部的第1规定深度和第2规定深度,合计照射两次激光光线15,从而在被加工物101的内部形成改质层121,并且在两次中的将聚光点16定位于被加工物101的内部的最深的规定深度时,通过从聚光点16向背面107侧泄漏的激光光线15形成分割起点129。另外,分割起点形成步骤ST12中的激光光线15的照射次数不限于上述方式的两次,可以根据被加工物101的厚度和激光光线15的照射条件等而适当变更。
这里,在分割起点形成步骤ST12中,期望使激光光线15的聚光点16所会聚的位置与背面107之间的被加工物101的厚度方向上的距离131极短,即期望聚光点16更靠近部件109。即,距离131是能够因会聚在聚光点16的激光光线15的漏光的热而使部件109溶解变质从而在部件109的内部的分割预定线104的正下方形成分割起点129的距离。
在实施方式的被加工物的加工方法中,当结束分割起点形成步骤ST12的实施时,将在保持步骤ST11中安装于被加工物单元100(被加工物101和部件109)上的保护带111和框架112取下。
如图7所示,粘贴步骤ST13是在实施了分割起点形成步骤ST12之后将被加工物101的正面103侧粘贴于扩展带141的步骤。
在粘贴步骤ST13中,具体而言,在本实施方式中,首先如图7所示,在被加工物101的正面103侧粘贴直径比被加工物单元100(被加工物101和部件109)大且具有伸缩性的扩展带141的粘接层侧,在扩展带141的粘接层侧的外周粘贴环状的框架142。
在实施方式的被加工物的加工方法中,分割步骤ST14通过图7和图8所示的分割装置20来实施。如图7和图8所示,分割装置20具有:框架固定单元21,其对粘贴有扩展带141的外周部分的框架142进行固定;带扩展单元22,其对扩展带141进行扩展;以及未图示的控制单元,其对各单元进行控制。框架固定单元21和带扩展单元22的平面形状形成为大致同轴的圆形。带扩展单元22相对于框架固定单元21在径向的内侧设置于形成在框架固定单元21的开口内。
如图7和图8所示,分割步骤ST14是对扩展带141进行扩展而沿着改质层121和分割起点129将被加工物101和部件109分割从而将被加工物单元100一次分割的步骤。
在分割步骤ST14中,首先如图7所示,通过框架固定单元21沿着整个圆周从外周侧夹持框架142,从而对框架142进行固定。在分割步骤ST14中,接着如图8所示,使带扩展单元22相对于框架固定单元21沿着沿铅垂方向的轴心朝向上方相对地移动,从而将扩展带141的框架142的内周缘与被加工物单元100的外周缘之间的环状区域143向与被加工物101的正面103垂直的方向按压,对扩展带141进行扩展。
由此,在分割步骤ST14中,通过扩展带141的扩展对改质层121和分割起点129同时且同程度地赋予沿着扩展带141延伸的方向的分离方向的外力,从沿着分割预定线104形成的作为分割起点的改质层121和分割起点129使被加工物101和部件109分别一次断裂。其结果是,在分割步骤ST14中,将被加工物单元100的被加工物101和部件109沿着各分割预定线104分割而得到各个分割的带部件109的器件105。
这样,经过实施方式的被加工物的加工方法,从包含被加工物101和部件109的被加工物单元100得到各个分割的带部件109的器件105。
实施方式的被加工物的加工方法中,在分割起点形成步骤ST12中使光斑形状151形成为长轴与X轴方向平行的椭圆形,从被加工物101的正面103侧按照使聚光点16会聚于被加工物101的内部的状态照射对于被加工物101具有透过性的波长的激光光线15,从而在被加工物101的内部形成改质层121,并且通过从聚光点16向背面107侧泄漏的激光光线15而在部件109中形成分割起点129。因此,实施方式的被加工物的加工方法起到如下的作用效果:对改质层121和分割起点129同时赋予分离方向的外力,从而能够将作为材质不同的层的被加工物101和部件109一次分割。即,实施方式的被加工物的加工方法起到能够将在背面107上层叠有材质不同的部件109的被加工物101高效地分割的作用效果。
另外,实施方式的被加工物的加工方法中,使光斑形状151形成为长轴与X轴方向平行的椭圆形,将聚光点16设定在作为上述距离131的位置而照射激光光线15。在光斑形状为正圆状的情况下,从聚光点泄漏的光有可能在分割预定线104的下方照射至分割预定线104的外侧的位置。与此相对,本实施方式的被加工物的加工方法中,光斑形状为椭圆状,因此能够缩小向与X方向垂直的Y方向的扩展,容易使从聚光点16泄漏的激光在分割预定线104的下方进入到分割预定线104的宽度内、即正下方而照射,而非进入到比分割预定线104靠外侧的位置。另外,通过一次的沿着分割预定线104的激光光线15的照射,能够同时形成改质层121和分割起点129,因此与以往那样分成两次而进行加工相比,以改质层121为起点的分割线与以分割起点129为起点的分割线的偏移缩小。因此,实施方式的被加工物的加工方法起到如下的作用效果:能够大幅抑制像以往那样在将被加工物101和部件109分别分割的情况下可能产生的在被加工物101的分割线和部件109的分割线之间产生的线偏移的现象。
实施方式的被加工物的加工方法具有在实施了分割起点形成步骤ST12之后将被加工物101的正面103侧粘贴于扩展带141的粘贴步骤ST13以及对扩展带141进行扩展而沿着改质层121和分割起点129将被加工物101和部件109分割的分割步骤ST14。因此,实施方式的被加工物的加工方法起到如下的作用效果:使用扩展带141对改质层121和分割起点129同时赋予分离方向的外力,从而能够适当地将作为材质不同的层的被加工物101和部件109一次分割。
实施方式的被加工物的加工方法中,部件109使用DAF或金属膜。因此,根据实施方式的被加工物的加工方法,即使在将以往需要进行与被加工物101的分割工序不同的分割工序的DAF或金属膜层叠在被加工物101的情况下,也起到能够一次高效地分割的作用效果。
另外,本发明并不限于上述实施方式。即,可以在不脱离本发明的主旨的范围内进行各种变形并实施。
Claims (3)
1.一种被加工物的加工方法,在被加工物的背面上层叠有材质与被加工物不同的部件,其中,
该被加工物的加工方法具有如下的步骤:
保持步骤,利用保持工作台对被加工物的背面侧的该部件进行保持;以及
分割起点形成步骤,在实施了该保持步骤之后,从被加工物的正面侧按照使聚光点会聚于被加工物的内部的状态照射对于被加工物具有透过性的波长的激光光线,在被加工物的内部形成改质层,同时,通过从该聚光点向背面侧泄漏的激光光线在该部件中形成分割起点。
2.根据权利要求1所述的被加工物的加工方法,其中,
该被加工物的加工方法还具有如下的步骤:
粘贴步骤,在实施了该分割起点形成步骤之后,将被加工物的正面侧粘贴于扩展带;以及
分割步骤,对该扩展带进行扩展而沿着该分割起点将被加工物和该部件分割。
3.根据权利要求1或2所述的被加工物的加工方法,其中,
该部件是芯片贴装膜或金属膜。
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