CN112106178B - 安装装置以及薄膜供应装置 - Google Patents

安装装置以及薄膜供应装置 Download PDF

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Publication number
CN112106178B
CN112106178B CN201980025245.0A CN201980025245A CN112106178B CN 112106178 B CN112106178 B CN 112106178B CN 201980025245 A CN201980025245 A CN 201980025245A CN 112106178 B CN112106178 B CN 112106178B
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arm
tension
winding
film
motor
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CN112106178A (zh
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野口勇一郎
野村胜利
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Shinkawa Ltd
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Shinkawa Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/02—Advancing webs by friction roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
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    • B65H23/1806—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in reel-to-reel type web winding and unwinding mechanism, e.g. mechanism acting on web-roll spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
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    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/1955—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations and controlling web tension
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    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
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Abstract

本发明提供一种安装装置以及薄膜供应装置。使薄膜介于安装头的底面与电子零件之间而进行电子零件的安装的安装装置(10)包括：薄膜卷取机构(18)，使卷取卷轴(26)旋转而卷取自送出卷轴架设至卷取卷轴(26)的薄膜，且每当进行安装时，以将新的薄膜配置于安装头的底面的方式卷取；张力检测部(38)，检测经薄膜卷取机构(18)卷取后的薄膜的张力；及控制部(20)，基于由张力检测部(38)所检测出的张力，利用卷取马达(30)使卷取卷轴(26)旋转而调整张力。由此，可使安装头底面的薄膜产生所期望的张力。

Description

安装装置以及薄膜供应装置
技术领域
本发明涉及一种使薄膜介于安装头的底面与电子零件之间而进行电子零件的安装的安装装置以及薄膜供应装置。
背景技术
以往以来，将半导体芯片(电子零件)不经由引线而安装于基板的倒装芯片接合机(flip-chip bonder)技术已广为人知。在所述倒装芯片接合机中，有时在基板上预先涂布包含热硬化性树脂的粘接材料，经由所述粘接材料将半导体芯片固定于基板。在所述情形时，在以安装头将半导体芯片加热及加压时，有时被半导体芯片挤出的粘接材料向上方爬升而附着于安装头。另外，即便在未附着于安装头的情形时，有时由经加热的粘接材料产生的烟气(fume gas)也侵入安装头内。
在专利文献1中，公开有一种为了防止此种粘接材料对热压接工具(安装头)的附着，而以薄膜构件(薄膜)覆盖热压接工具的底面的安装装置。即，在专利文献1的安装装置中设有薄膜构件搬送机构(薄膜供应装置)，所述薄膜构件搬送机构(薄膜供应装置)依次供应介于安装头的底面与芯片零件(电子零件)之间的薄膜。每当安装芯片零件时，将新的薄膜构件供应至热压接工具的底面。根据所述安装装置而有效地防止粘接材料对热压接工具的附着。
现有技术文献
专利文献
专利文献1：日本专利特开2015-35493号公报
发明内容
发明所要解决的问题
现有技术中，电子零件抽吸保持于安装头的底面。所述抽吸面经薄膜覆盖，因此在电子零件的抽吸之前，使用针在薄膜中形成抽吸用的孔。
以往，在薄膜的张力小的情形时，有安装头的底面的薄膜出现松弛而针难以刺进薄膜的问题。另外，若安装头的底面的薄膜有松弛，则隔着薄膜将电子零件吸附于安装头时，安装头与电子零件的密接度变差。另一方面，在薄膜的张力大的情形时，安装头的底面的薄膜出现皱褶，在所述情形下，在将电子零件吸附于安装头时，安装头与电子零件的密接度也变差。
本发明的目的在于，在使薄膜介于安装头的底面与电子零件之间而进行电子零件的安装的安装装置以及薄膜供应装置中，使薄膜产生所期望的张力。
解决问题的技术手段
本发明的安装装置使薄膜介于安装头的底面与电子零件之间而进行电子零件的安装，包括：薄膜卷取机构，使卷取卷轴旋转而卷取自送出卷轴架设至卷取卷轴的薄膜，且每当进行安装时，以将新的薄膜配置于安装头的底面的方式进行卷取；张力检测部，检测经薄膜卷取机构卷取后的薄膜的张力；及控制部，基于由张力检测部所检测出的张力，利用卷取马达使卷取卷轴旋转而调整张力，薄膜卷取机构包括弹性构件，弹性构件以使卷取卷轴追随卷取马达的旋转轴的旋转的方式配置在卷取马达的旋转轴与卷取卷轴之间，张力检测部，基于弹性构件的变形量检测出薄膜的张力。
本发明的安装装置中，也优选为薄膜卷取机构还包括：马达臂，直接或间接地连接于卷取马达的旋转轴，在一定方向上延伸；及卷轴臂，直接或间接地连接于卷取卷轴的旋转轴，在与马达臂对应的方向上延伸，与马达臂以同一中心旋转；弹性构件的一端连结于马达臂，弹性构件的另一端连结于卷轴臂，弹性构件使卷轴臂追随马达臂，且张力检测部基于通过弹性构件的变形而产生的马达臂与卷轴臂的旋转方向上的间隔而检测张力。
本发明的安装装置中，也优选为张力检测部在所述间隔小于第一规定值的情形时检测出张力过小，在所述间隔超过大于第一规定值的第二规定值的情形时检测出张力过大。
本发明的安装装置中，也优选为一对检测臂直接或间接地连结于第一臂，第一臂为马达臂与卷轴臂中的一者，并朝第二臂延伸，第二臂为马达臂与卷轴臂中的另一者、且以跨越第二臂与连结于第二臂的被检测体中的至少一个的方式配置，一对检测臂包括第一传感器及第二传感器，所述第一传感器及第二传感器可探测检测臂之间的第二臂与被检测体中的至少一者，第一传感器配置于一对检测臂的第一臂侧，第二传感器在一对检测臂中相对于自第一臂远离的方向与第一传感器空开规定间隔而配置，张力检测部在第一传感器探测到第二臂与被检测体中的至少一者的情形时检测出张力过小，在第一传感器未探测到第二臂及被检测体，且第二传感器未探测到第二臂及被检测体的情形时，检测出张力过大。
本发明的安装装置中，也优选为控制部在检测出张力过小时，经由卷取马达使卷取卷轴朝卷取方向旋转，在检测出张力过大时，经由卷取马达使卷取卷轴朝与卷取方向相反的方向旋转。
本发明的安装装置中，也优选为控制部在检测到张力过小或过大时，经由卷取马达使卷取卷轴旋转，直至第一传感器未探测到第二臂及被检测体，且第二传感器探测到第二臂与被检测体中的至少一者为止。
本发明的薄膜供应装置包括：薄膜卷取机构，使卷取卷轴旋转而卷取自送出卷轴架设至卷取卷轴的薄膜；张力检测部，检测利用薄膜卷取机构卷取规定量的薄膜之后的薄膜的张力；及控制部，基于由张力检测部所检测出的张力，利用卷取马达使卷取卷轴旋转而调整张力，且薄膜卷取机构包括：马达臂，直接或间接地连接于卷取马达的旋转轴，在一定方向上延伸；卷轴臂，直接或间接地连接于卷取卷轴的旋转轴，在与马达臂对应的方向上延伸，与马达臂以同一中心旋转；及弹性构件，一端连结于马达臂，另一端连结于卷轴臂，使卷轴臂追随马达臂，且张力检测部在马达臂与卷轴臂的旋转方向上的间隔小于第一规定值的情形时检测出张力过小，在所述间隔超过大于第一规定值的第二规定值的情形时检测出张力过大，控制部在检测出张力过小时，经由卷取马达使卷取卷轴朝卷取方向旋转，在检测出张力过大时，经由卷取马达使卷取卷轴朝与卷取方向相反的方向旋转。
发明的效果
根据本发明，可使薄膜产生所期望的张力。
附图说明
图1为表示安装装置的结构的图。
图2为表示安装状况的侧面图。
图3为表示安装装置的处理流程的流程图。
图4为表示薄膜供应装置的概略结构的区块图。
图5为薄膜卷取机构的立体图。
图6A为表示薄膜的张力合适的情形时的卷轴臂相对于辅助臂的位置的图。
图6B为表示薄膜的张力合适的情形时的卷轴臂相对于辅助臂的位置的图。
图6C为表示薄膜的张力合适的情形时的卷轴臂相对于辅助臂的位置的图。
附图标记说明
10：安装装置
12：安装头
14：接合平台
16：基台
18：薄膜卷取机构
20：控制部
21：存储部
22：抽吸孔
24：送出卷轴
26：卷取卷轴
28：送出马达
30：卷取马达
32、34：辊
36：带
37：框架
38：张力检测部
39：判定部
40：第一光电传感器(第一传感器)
40a：发光部
40b：光接收部
42：第二光电传感器(第二传感器)
42a：发光部
42b：光接收部
44：配线
46：滑环
48：配线
50：旋转轴
52：马达臂
54：辅助臂
56：拉伸弹簧(弹性构件)
58：一对检测臂
58a、58b：检测臂
60：被检测体
62：卷轴臂
64：旋转轴
66：芯材
68：圆形盖
88：针
90：薄膜供应装置
100：半导体芯片(电子零件)
102：凸块
104：基板
106：电极
108：粘接材料
110：薄膜
具体实施方式
＜安装的概略＞
以下，一方面参照附图一方面说明本发明的实施方式。
图1为表示本实施方式的安装装置10的构成的图。图1中的箭头X表示装置左右方向，箭头Y表示装置前后方向，箭头Z表示装置上下方向，在以下将说明的图中也相同。
安装装置10为通过将多个半导体芯片100(电子零件)安装于基板104而制造半导体装置的装置。半导体芯片100通过倒装芯片接合机技术而安装于基板104。具体而言，在各半导体芯片100的底面，形成有被称为凸块102的包含导电性材料的突起，通过将所述凸块102接合于基板104的表面上所形成的电极106，而将半导体芯片100与基板104电连接。
在基板104上，在半导体芯片100的安装位置，预先涂布有被称为非导电性糊(non-conductive paste，NCP)或非导电性薄膜(non-conductive film，NCF)的粘接材料108。粘接材料108包含具有绝缘性并且具有热硬化性的热硬化性树脂。如图2所示，在所述粘接材料108上载置半导体芯片100，按压于基板104并且将半导体芯片100加热。由此，粘接材料108硬化而将半导体芯片100机械固定于基板104。通过对半导体芯片100的加热而凸块102熔融，若停止对半导体芯片100的加热，则经熔融的凸块102凝固而电接合于基板104(电路基板)的电极106。
＜安装装置的构成＞
如图1所示，安装装置10包括接合平台14、基台16、安装头12及薄膜供应装置90。
接合平台14为载置基板104的平台。在所述接合平台14，例如设有抽吸保持基板104的抽吸孔(未图示)、及用以加热基板104的加热器(未图示)等。所述接合平台14是由基台16所支持。在基台16，设有用以在覆盖安装头12的底面的薄膜110(后述)形成抽吸用的孔的针88。基台16在XY方向(水平方向)上可移动。
安装头12与接合平台14相向地设置，在Z方向(垂直方向)上可移动。在安装头12的底面，形成有用以抽吸保持半导体芯片100的抽吸孔22。所述抽吸孔22与未图示的抽吸泵连通，利用通过所述抽吸泵所产生的负压而将半导体芯片100隔着薄膜110抽吸保持于安装头12的底面。另外，在安装头12，为了在安装时加热半导体芯片100，内置有加热器(未图示)。
薄膜供应装置90朝一个方向将长条带状的薄膜110供应至安装头12的底面。所述薄膜110在安装头12的底面被加热，且可能与粘接材料108接触，故而薄膜110的原材料合适的是耐热性优异且对粘接材料108的剥离性高的原材料。因此，薄膜110的原材料例如可使用聚四氟乙烯(polytetrafluoroethylene，PTFE)、四氟乙烯-全氟烷基乙烯醚共聚物(全氟烷氧基烷烃(Perfluoroalkoxy Alkane，PFA))等氟树脂。
薄膜供应装置90包括框架37、夹着安装头12而设置的送出卷轴24及卷取卷轴26、使自送出卷轴24朝卷取卷轴26传送薄膜110的辊32、辊34旋转的送出马达28、及使卷取卷轴26旋转的卷取马达30。薄膜供应装置90与安装头12一体化，与安装头12一起移动。
送出卷轴24及卷取卷轴26可旋转地保持于框架37。在送出卷轴24的外周，卷绕有使用前(配置于安装头12的底面之前)的薄膜110，同样地，在卷取卷轴26的外周，卷绕有已使用(配置于安装头12的底面之后)的薄膜110。再者，也可在送出卷轴24、卷取卷轴26分别直接卷绕有薄膜110，但在本实施方式中，隔着圆环状的芯材而在送出卷轴24、卷取卷轴26分别卷绕有薄膜110。为将卷绕有薄膜110的两个芯材分别压入至送出卷轴24、卷取卷轴26各自的外周的结构。
送出马达28为步进马达，其旋转力经由带36而传至辊32。与辊32相向地设有辊34，在辊32、辊34之间夹入有薄膜110。通过送出马达28驱动，辊32旋转而辊34也旋转，自其间送出薄膜110。卷取马达30为步进马达，配置于卷取卷轴26的背侧(安装装置10的后侧)。再者，在本实施方式中，未设置使送出卷轴24旋转驱动的马达，但也可为设有所述马达的结构。
＜安装动作＞
此处，对安装装置10的安装动作进行说明。图3为表示安装装置10进行的处理的流程的流程图。首先，步骤S100中，使薄膜供应装置90的送出马达28及卷取马达30旋转而送出规定量的薄膜110，步骤S102中，使送出马达28及卷取马达30停止。再者，在设有使送出卷轴24旋转驱动的马达的情形时，使所述马达也同样地旋转，然后停止。由此，将新的薄膜110配置于安装头12的底面。继而，步骤S104中，进行薄膜110的张力调整。在本实施方式中，所述张力调整具有特征，其详细情况将在后面叙述。
步骤S104的张力调整后，步骤S106中，使用针88在位于安装头12的底面的薄膜110中形成抽吸用的孔。其是通过如下方式进行：图1所示的接合平台14的基台16水平移动，将针88设置于安装头12的正下方，然后安装头12朝针88下降(垂直移动)。继而，使安装头12上升。
然后，步骤S108中，将半导体芯片100安装于基板104。具体而言，如下那样进行。放置有半导体芯片100的底座(未图示)水平移动，使安装头12下降，安装头12自此拾取半导体芯片100。继而，使安装头12上升后，接合平台14的基台16水平移动，将基板104上的半导体芯片100的安装位置设置于安装头12的正下方。再者，在所述安装位置如图1所示那样涂布有粘接材料108。然后，安装头12朝基板104下降，将半导体芯片100载置于基板104上的安装位置(粘接材料108)后，进行加热及加压而安装。
此时，安装头12对半导体芯片100加压，由此如图2所示，有时被半导体芯片100挤出至外侧的粘接材料108的一部分渗出并爬升。若所述爬升的粘接材料108附着于安装头12，则有无法合适进行后续的安装处理之虞。另外，即便在粘接材料108未附着于安装头12的情形时，有时由经加热的粘接材料108产生的烟气也进入安装头12的抽吸孔22，由此污染安装头12。
在本实施方式中，使薄膜110介于安装头12与半导体芯片100之间，故而如图2所示，防止粘接材料108对安装头12的附着、及烟气对安装头12的抽吸孔22的侵入。
安装半导体芯片100后，使安装头12上升，一系列处理结束。针对每个半导体芯片100进行以上所说明的安装处理。每当安装半导体芯片100时，将薄膜110卷取于卷取卷轴26，将新的薄膜110配置于安装头12的底面。
＜张力调整的概略＞
继而，对薄膜110的张力调整进行说明。在薄膜110的张力小的情形时，安装头的底面的薄膜110出现松弛。在所述情形时，用以形成抽吸用的孔的针88难以刺进，无法形成所期望形状的孔。另外，因安装头的底面的薄膜110的松弛，故而在将半导体芯片100吸附于安装头12的底面时，安装头12与半导体芯片100的密接度变差。另外，另一方面，在薄膜110的张力大的情形时，安装头12的底面的薄膜110出现皱褶，在所述情形时，安装头12与半导体芯片100的密接度也变差。
因此，本实施方式的安装装置10进行薄膜110的张力调整，有效地抑制这些情况。安装装置10的薄膜供应装置90检测薄膜110的张力，并基于所检测出的张力，利用卷取马达30使卷取卷轴26旋转而调整薄膜110的张力。
＜薄膜供应装置的概略结构＞
图4为表示薄膜供应装置90的概略结构的框图。薄膜供应装置90包括：薄膜卷取机构18，每当进行安装时，以将新的薄膜110配置于安装头12的底面的方式卷取；张力检测部38，检测经薄膜卷取机构18卷取后的薄膜110的张力；及控制部20，基于由张力检测部38所检测出的张力，利用卷取马达30使卷取卷轴26旋转而调整张力。
薄膜卷取机构18包含上文所述的送出马达28、卷取马达30及卷取卷轴26。薄膜卷取机构18具有用以检测及调整薄膜110的张力的特征性结构，关于其详细情况将在后面叙述。
张力检测部38包含第一光电传感器40(第一传感器)、第二光电传感器42(第二传感器)及作为控制部20的一部分的判定部39。将第一光电传感器40、第二光电传感器42各自的检测信号输入至判定部39，判定部39根据所输入的检测信号，判定薄膜110的张力的过大、过小或合适。关于具体的第一光电传感器40、第二光电传感器42的配置或功能、及基于这些传感器的检测信号的判定部39的判定方法，将在后面叙述。
控制部20包含处理器(processor)，通过按照存储部21中存储的程序来执行处理，而控制薄膜卷取机构18，进行安装半导体芯片100后的薄膜110的卷取，进行卷取后的薄膜110的张力调整，进而也作为张力检测部38的判定部39发挥功能。再者，所述薄膜供应装置90的控制部20可与安装装置10的控制部(控制安装头12或接合平台14等的控制部)相同，也可为另外的控制部。在为相同的控制部的情形时，按照安装装置10的控制部的指令来运行。
＜薄膜卷取机构＞
继而，对薄膜卷取机构18的结构进行说明。图5为薄膜卷取机构18的立体图。如图5所示，薄膜卷取机构18包括：马达臂52，连接于卷取马达30的旋转轴50，在卷取卷轴26的半径方向(一定方向)上延伸；卷轴臂62，连接于卷取卷轴26的旋转轴64，在卷取卷轴26的半径方向(与马达臂52对应的方向)上延伸；及拉伸弹簧(tension spring)56(弹性构件)。
卷取马达30配置于卷取卷轴26的后侧，固定于框架，连接有电力供应线等配线44。卷取马达30的旋转轴50朝前方延伸，在其前端连结有马达臂52。
在卷取卷轴26，隔着芯材66而卷绕有已使用的薄膜110。再者，图5的粗线的黑箭头为薄膜110的卷取方向。在卷取卷轴26，固定有堵塞后侧开口的圆形盖68。卷取卷轴26的旋转轴64自圆形盖68的后侧表面朝后侧突出，可旋转地支持于框架上所固定的未图示的轴承。在卷取卷轴26的旋转轴64的前端，连结有卷轴臂62。
卷取马达30的旋转轴50与卷取卷轴26的旋转轴64配置于同一直线上。即，马达臂52与卷轴臂62配置成以同一中心C旋转。拉伸弹簧56的一端连结于马达臂52的前端附近，另一端连结于卷轴臂62的前端附近。
再者，如图5所示，薄膜卷取机构18进而包括连结于马达臂52的前端附近的辅助臂54、连结于辅助臂54的一对检测臂58、及连结于卷轴臂62的被检测体60，但这些构件的详细情况将在后面描述。再者，图5中为辅助臂54与卷轴臂62未结合，马达臂52与卷轴臂62仅由拉伸弹簧56相连的结构。
另外，在本实施方式中，虽然将马达臂52直接连接于卷取马达30的旋转轴50，但这些构件也可经由齿轮或辅助臂等而间接地连接。同样地，虽然将卷轴臂62直接连接于卷取卷轴26的旋转轴64，但这些构件也可经由齿轮或辅助臂等而间接地连接。而且，只要以马达臂52在一定方向上延伸，卷轴臂62在与马达臂52对应的方向上延伸，其以同一中心C旋转的方式构成，且马达臂52与卷轴臂62经拉伸弹簧56等弹性构件相连即可。
图5中，若卷取马达30的旋转轴50逆时针旋转，则马达臂52旋转并经由拉伸弹簧56而拉动卷轴臂62，卷取卷轴26的旋转轴64逆时针(粗线的黑箭头方向)旋转，将薄膜110卷取于卷取卷轴26。如此而为使卷轴臂62追随马达臂52的结构。
＜张力检测部＞
继而，对张力检测部38进行说明。卷取薄膜110后，图1所示的送出侧的辊32、辊34锁定(lock)，辊32、辊34之间的薄膜110被固定。规定的张力作用于自这些辊至卷取卷轴26的薄膜110。
在薄膜110的张力大的情形时，图5所示的拉伸弹簧56大幅伸长，马达臂52与卷轴臂62的旋转方向上的间隔α变大。另一方面，在薄膜110的张力小的情形时，拉伸弹簧56小幅伸长或不伸长，马达臂52与卷轴臂62的旋转方向上的间隔α变小。通过检测所述间隔α，而可检测薄膜110的张力。所述间隔α不限于马达臂52与卷轴臂62之间的距离，也可为马达臂52与卷轴臂62所成的角度，或者在其中一者或两者连结有辅助臂等的情形时，可为自辅助臂等至马达臂52、卷轴臂62或其他辅助臂等的距离、角度。通过设置可检测间隔α的适当的传感器作为张力检测部38，例如在间隔α小于第一规定值(预定的值)的情形时可检测出张力过小，在间隔α超过大于第一规定值的第二规定值(预定的值)的情形时可检测出张力过大。
此处，对具体的本实施方式的张力检测部38进行说明。如图5所示，在卷轴臂62的前端附近且与马达臂52为相反侧的侧面，固定有棒状的被检测体60。另一方面，在马达臂52的前端附近连结有辅助臂54，辅助臂54自马达臂52的前侧侧面突出，在中途折曲并向卷轴臂62侧延伸。在辅助臂54的前后侧面，连结有一对检测臂58。一对检测臂58以跨越卷轴臂62及被检测体60的方式配置。
在图6A中，表示自上侧观看辅助臂54、一对检测臂58、卷轴臂62及被检测体60的图。如图6A所示，一对检测臂58包括具有发光部40a及光接收部40b的第一光电传感器40、以及具有发光部42a及光接收部42b的第二光电传感器42。发光部40a、发光部42a分别配置于检测臂58a的内表面，光接收部40b、光接收部42b分别与各个发光部40a、发光部42a相向地设置，配置于检测臂58b的内表面。第一光电传感器40配置于一对检测臂58的辅助臂54侧(马达臂侧)，第二光电传感器42在一对检测臂58中与第一光电传感器40空开规定间隔而配置于卷轴臂62侧。
第一光电传感器40可探测自发光部40a到达光接收部40b的光的遮蔽(遮光)，第二光电传感器42可探测自发光部42a到达光接收部42b的光的遮蔽(遮光)。当卷轴臂62或被检测体60进入各自的位置的一对检测臂58之间，第一光电传感器40与第二光电传感器42探测到遮光，而探测到其存在。如图6A至图6C所示，根据第一光电传感器40与第二光电传感器42各自的有无遮光的组合，能以三阶段探测卷轴臂62(被检测体60)相对于辅助臂54(马达臂)的位置。即，所述间隔α能以三阶段进行探测。对判定部39(参照图4)输入第一光电传感器40及第二光电传感器42的探测信号(探测结果)，判定部39基于作为探测结果的有无遮光的组合，来判定薄膜110的张力的过大、过小或合适。
再者，第一光电传感器40与第二光电传感器42配置于通过图5所示的马达臂52旋转而旋转的检测臂58a、检测臂58b(旋转体)，故而无需设计用以自外部向第一光电传感器40及第二光电传感器42供应电力，另外向外部传送来自其中的探测信号的配线。在本实施方式中，图5所示的检测臂58a、检测臂58b、辅助臂54、马达臂52及卷取马达30的旋转轴50成为中空的结构，第一光电传感器40及第二光电传感器42的配线配置于其中，自检测臂58a、检测臂58b引导至卷取马达30的旋转轴50。而且，在旋转轴50设有被称为滑环(slip ring)46的可将旋转轴中的配线与外部的配线48(被固定的配线)电连接的构件。由此，可自外部向旋转的第一光电传感器40及第二光电传感器42供应电力，且向外部传送来自其中的探测信号。
＜张力调整＞
继而，对本实施方式的张力调整进行说明。图3的流程的步骤S104为张力调整的步骤。如上文所述，步骤S100、步骤S102中为了在安装头12的底面配置新的薄膜110而卷取薄膜110，步骤S104中进行薄膜110的张力调整。
首先，图3的步骤S200中，张力检测部38的判定部39确认第一光电传感器40(第一传感器)有无遮光(卷轴臂62或被检测体60的探测)。在有遮光的情形(步骤S200：否(No))时进入步骤S208。所述状态为图6B所示的状态，为卷轴臂62相对于辅助臂54(马达臂)的位置近的状态、即拉伸弹簧56小幅伸长或不伸长的状态。在所述情形时，图3的步骤S208中，判定部39判定为薄膜110的张力过小。继而，步骤S212中，控制部20使卷取马达30朝卷取薄膜110的方向(顺向)旋转，使卷取卷轴26朝卷取方向(图5的粗线黑箭头的方向)旋转。由此，拉伸弹簧56成为比以前更为伸长的状态，并且薄膜110的张力增加。
另一方面，图3的步骤S200中，在无遮光的情形(步骤S200：是(Yes))时进入步骤S202。步骤S202中，判定部39确认第二光电传感器42(第二传感器)有无遮光(卷轴臂62或被检测体60的探测)。在有遮光的情形(步骤S202：否(No))时进入步骤S206。所述状态为图6A所示的状态，为卷轴臂62相对于辅助臂54(马达臂)的位置合适的状态、即拉伸弹簧56的伸长为所期望的状态。在所述情形时，图3的步骤S206中，判定部39判定为薄膜110的张力合适，结束张力调整的处理，进入步骤S106。
另一方面，步骤S202中，在无遮光的情形(步骤S202：是(Yes))时进入步骤S204。所述状态为图6C所示的状态，为卷轴臂62相对于辅助臂54(马达臂)的位置远的状态、即拉伸弹簧56大幅伸长的状态。在所述情形时，图3的步骤S204中，判定部39判定为薄膜110的张力过大。继而，步骤S210中，控制部20使卷取马达30朝与卷取薄膜110的方向相反的方向旋转，由此使卷取卷轴26朝相反方向(图5的粗线的虚线黑箭头的方向)旋转。由此，成为拉伸弹簧56比以前更为缩短的状态，并且薄膜110的张力减少。
控制部20在判定为张力过小或过大(步骤S208或步骤S204)而进行了张力的调整(步骤S212或步骤S210)时，再次回到步骤S200，确认是否张力变得合适，继续进行张力的调整直至判定为张力合适(步骤S206)为止。具体而言，直至并无第一光电传感器的遮光(卷轴臂62或被检测体60的探测)，且有第二光电传感器的遮光(卷轴臂62或被检测体60的探测)为止，控制部20经由卷取马达30使卷取卷轴26旋转而进行张力调整。如此，进行反馈控制。
＜作用效果＞
继而，对本实施方式的安装装置10的作用效果进行说明。本实施方式的安装装置10检测薄膜110的张力，并基于其检测结果来调整薄膜110的张力。因此，可使配置于安装头12的底面的薄膜110产生所期望的张力。由此，可使用于形成抽吸用的孔的针88顺利地刺进薄膜110，形成所期望形状的孔。另外，可提高在安装头12的底面隔着薄膜110吸附有半导体芯片100时的安装头12与半导体芯片100的密接度。由此，可确实地防止密接度差而半导体芯片100自安装头12掉落那样的事态。
另外，本实施方式中，送出马达28及卷取马达30使用步进马达，故而可使其旋转轴以小的旋转角度单位旋转，可进行薄膜110的卷取量的微调整。尤其在张力调整时，可使卷取马达30的旋转轴以小的旋转角度单位旋转，故而可进行薄膜110的张力的微调整。另外，通过使用步进马达，可实现卷取马达30的反向旋转。
＜其他＞
在以上所说明的实施方式中，使用两个光电传感器作为张力检测部38，但只要可直接或间接地检测图5所示的马达臂52与卷轴臂62的间隔α，则可使用任意的传感器。另外，关于传感器的位置也无限定。例如，通过在马达臂52或卷轴臂62中的一者设置激光距离传感器，朝另一者进行激光照射，可检测间隔α。另外，也可利用传感器检测拉伸弹簧56自身的长度作为间隔α。
另外，在如以上所说明的实施方式那样在一对检测臂58设置光电传感器的情形时，光电传感器的个数也可为一个，也可为三个以上。若在一对检测臂58将三个以上的光电传感器各自空开规定间隔配置，则可更细致地把握卷轴臂62相对于马达臂52的位置，可更细致地调整张力调整中的卷取马达30的旋转量。
另外，在以上所说明的实施方式中，在马达臂52经由辅助臂54间接地连结有一对检测臂58，但也可在马达臂52直接连结有一对检测臂58。另外，在以上所说明的实施方式中，为在马达臂52(间接地)连结有一对检测臂58，在卷轴臂62固定有被检测体60的结构。然而，也可为在卷轴臂62直接或间接地连结有一对检测臂58，在马达臂52固定有被检测体60的结构。
另外，在以上所说明的实施方式中，一对检测臂58为跨越卷轴臂62及被检测体60的结构，但一对检测臂58只要为跨越卷轴臂62与被检测体60的至少一个的结构即可。即，若在旋转方向上大幅度地形成卷轴臂62，则卷轴臂62可兼作被检测体60，故而无需被检测体60，一对检测臂58仅跨越卷轴臂62。另一方面，例如，若被检测体60为自卷轴臂62的前侧(图5的右侧)侧面突出，在中途折曲而向马达臂52侧延伸的形状(与图5所示的辅助臂54相同的形状)，则一对检测臂58能以仅跨越被检测体60而不跨越卷轴臂62的方式构成。
另外，在以上所说明的实施方式中，卷取薄膜110后，将送出侧的辊32、辊34锁定，将辊32、辊34之间的薄膜110固定。继而，在所述状态下进行薄膜110的张力检测及张力调整。然而，辊32、辊34的锁定不是必要的。例如，在以在送出侧包括多数个辊，且其蜿蜒地送出薄膜110的方式配置的情形时，即便辊未完全锁定，也可成为薄膜110在送出侧固定的状态。
另外，以上所说明的实施方式中，在马达臂52与卷轴臂62之间设有拉伸弹簧56作为弹性构件。然而，也可设置橡胶(gum)等作为弹性构件。
另外，如上所述，若设置可检测马达臂52与卷轴臂62的间隔α的适当的传感器作为张力检测部38，则可在间隔α小于第一规定值(预定的值)的情形时检测出张力过小，在间隔α超过大于第一规定值的第二规定值(预定的值)的情形时检测出张力过大。所述第一规定值与第二规定值也可根据在卷取卷轴26卷绕薄膜110的量而变化。在卷取卷轴26卷绕的薄膜110的量多的情形时，卷取卷轴26的加上薄膜110的半径变大，故而即便薄膜110的张力相同，也对卷轴臂62产生更大的转矩。由此，有可能即便实际上薄膜110的张力过小也检测出张力合适，即便实际上薄膜110的张力合适也检测出张力过大。因此，也可设为所卷绕的薄膜110的量越多，则将第一规定值及第二规定值设为更大的值。
另外，同样地，也可根据在卷取卷轴26卷绕的薄膜110的量，改变使张力调整时的卷取马达30的旋转量。在卷取卷轴26卷绕的薄膜110的量越多，则因卷取卷轴26的朝卷取方向的旋转而越卷取更多的薄膜110，薄膜110的张力变得更大。同样地，在卷取卷轴26卷绕的薄膜110的量越多，则因卷取卷轴26的朝相反方向的旋转而越自卷取卷轴26送出更多的薄膜110，薄膜110的张力变得更小。因此，也可设为卷绕的薄膜110的量越多，则越减小张力调整时的卷取马达30的朝卷取方向、或相反方向的旋转量。
另外，以上所说明的实施方式的安装装置10为进行倒装芯片接合的装置(倒装芯片接合机)，但安装装置10也可为不将半导体晶粒电连接于基板，而利用粘接材料将半导体晶粒固定于基板的装置(固晶机)等。另外，以上所说明的实施方式的安装装置10为在基板104预先涂布粘接材料的方式(先涂布方式)，但也可不在基板104涂布粘接材料，而在半导体芯片100的背面贴附NCF等粘接材料，使所述NCF等加热硬化而将半导体芯片100安装于基板104。
另外，以上所说明的实施方式的安装装置10将半导体芯片100安装于基板104，但也可将半导体芯片100以外的电子零件(例如电晶体或电容器等)安装于基板104或基板104以外的被安装构件(晶片、玻璃、树脂等)。
以上所说明的实施方式的薄膜供应装置90也可用于安装装置10以外的用途。所述张力检测及张力调整的技术可应用于将薄膜、绳、丝等自送出卷轴卷取至卷取卷轴的所有装置。
以上，对本发明进行了说明，但本发明不受此种实施方式任何限定，当然可在不偏离本发明的主旨的范围内以各种实施例实施。

Claims (6)

1.一种安装装置，使薄膜介于安装头的底面与电子零件之间而进行所述电子零件的安装，其特征在于，包括：
薄膜卷取机构，使卷取卷轴旋转而卷取自送出卷轴架设至所述卷取卷轴的薄膜，且每当进行所述安装时，以将新的薄膜配置于所述安装头的底面的方式进行卷取；
张力检测部，检测经所述薄膜卷取机构卷取后的薄膜的张力；及
控制部，基于由所述张力检测部所检测出的所述张力，利用卷取马达使所述卷取卷轴旋转而调整所述张力，
所述薄膜卷取机构包括弹性构件，所述弹性构件为弹簧，且所述弹性构件以使所述卷取卷轴追随所述卷取马达的旋转轴的旋转的方式配置在所述卷取马达的旋转轴与所述卷取卷轴之间，
所述张力检测部，基于所述弹性构件的变形量检测出所述薄膜的所述张力，且
所述薄膜卷取机构还包括：
马达臂，直接或间接地连接于所述卷取马达的旋转轴，在一定方向上延伸；及
卷轴臂，直接或间接地连接于所述卷取卷轴的旋转轴，在与所述马达臂对应的方向上延伸，与所述马达臂以同一中心旋转；
所述弹性构件的一端连结于所述马达臂，所述弹性构件的另一端连结于所述卷轴臂，所述弹性构件使所述卷轴臂追随所述马达臂，且
所述张力检测部基于通过所述弹性构件的变形而产生的所述马达臂与所述卷轴臂的旋转方向上的间隔而检测所述张力。
2.根据权利要求1所述的安装装置，其特征在于，
所述张力检测部在所述间隔小于第一规定值的情形时检测出所述张力过小，
在所述间隔超过大于所述第一规定值的第二规定值的情形时检测出所述张力过大。
3.根据权利要求1或2所述的安装装置，其特征在于，
一对检测臂直接或间接地连结于第一臂，所述第一臂为所述马达臂与所述卷轴臂中的一者，并朝第二臂延伸，所述第二臂为所述马达臂与所述卷轴臂中的另一者、且以跨越所述第二臂与连结于所述第二臂的被检测体中的至少一个的方式配置，
所述一对检测臂包括第一传感器及第二传感器，所述第一传感器及所述第二传感器能够探测检测臂之间的所述所述第二臂与所述被检测体中的至少一者，
所述第一传感器配置于所述一对检测臂的所述第一臂侧，所述第二传感器在所述一对检测臂中相对于自所述第一臂远离的方向与所述第一传感器空开规定间隔而配置，
所述张力检测部在所述第一传感器探测到所述第二臂与所述被检测体中的至少一者的情形时检测出所述张力过小，
在所述第一传感器未探测到所述第二臂以及所述被检测体，且所述第二传感器未探测到所述第二臂以及所述被检测体的情形时，检测出所述张力过大。
4.根据权利要求2所述的安装装置，其特征在于，
所述控制部在检测到所述张力过小时，经由所述卷取马达使所述卷取卷轴朝卷取方向旋转，
在检测到所述张力过大时，经由所述卷取马达使所述卷取卷轴朝与所述卷取方向相反的方向旋转。
5.根据权利要求3所述的安装装置，其特征在于，
所述控制部在检测出所述张力过小或过大时，经由所述卷取马达使所述卷取卷轴旋转，直至所述第一传感器未探测到所述第二臂及所述被检测体，且所述第二传感器探测到所述第二臂与所述被检测体中的至少一者为止。
6.一种薄膜供应装置，其特征在于，包括：
薄膜卷取机构，使卷取卷轴旋转而卷取自送出卷轴架设至所述卷取卷轴的薄膜；
张力检测部，检测利用所述薄膜卷取机构卷取规定量的薄膜之后的薄膜的张力；及
控制部，基于由所述张力检测部所检测出的所述张力，利用卷取马达使所述卷取卷轴旋转而调整所述张力，且
所述薄膜卷取机构包括：
马达臂，直接或间接地连接于所述卷取马达的旋转轴，在一定方向上延伸；
卷轴臂，直接或间接地连接于所述卷取卷轴的旋转轴，在与所述马达臂对应的方向上延伸，与所述马达臂以同一中心旋转；及
弹性构件，一端连结于所述马达臂，另一端连结于所述卷轴臂，使所述卷轴臂追随所述马达臂，且
所述张力检测部在所述马达臂与所述卷轴臂的旋转方向上的间隔小于第一规定值的情形时，检测出所述张力过小，
在所述间隔超过大于所述第一规定值的第二规定值的情形时，检测出所述张力过大，
所述控制部在检测出所述张力过小时，经由所述卷取马达使所述卷取卷轴朝卷取方向旋转，
在检测出所述张力过大时，经由所述卷取马达使所述卷取卷轴朝与所述卷取方向相反的方向旋转。
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TWI685902B (zh) 2020-02-21
JP6973827B2 (ja) 2021-12-01
US11848219B2 (en) 2023-12-19
TW201946161A (zh) 2019-12-01
CN112106178A (zh) 2020-12-18
US20210242051A1 (en) 2021-08-05
KR102362980B1 (ko) 2022-02-15
KR20200124277A (ko) 2020-11-02
JPWO2019207858A1 (ja) 2021-02-12

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