TW201946161A - 安裝裝置以及薄膜供應裝置 - Google Patents

安裝裝置以及薄膜供應裝置 Download PDF

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Publication number
TW201946161A
TW201946161A TW108103531A TW108103531A TW201946161A TW 201946161 A TW201946161 A TW 201946161A TW 108103531 A TW108103531 A TW 108103531A TW 108103531 A TW108103531 A TW 108103531A TW 201946161 A TW201946161 A TW 201946161A
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Taiwan
Prior art keywords
tension
reel
film
arm
motor
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TW108103531A
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English (en)
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TWI685902B (zh
Inventor
野口勇一郎
野村勝利
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日商新川股份有限公司
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Publication of TWI685902B publication Critical patent/TWI685902B/zh

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H20/00—Advancing webs
    • B65H20/02—Advancing webs by friction roller
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/1806—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in reel-to-reel type web winding and unwinding mechanism, e.g. mechanism acting on web-roll spindle
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
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    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/1955—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations and controlling web tension
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    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
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Abstract

本發明提供一種可使安裝頭底面的薄膜產生所期望的張力的電子零件的安裝裝置。使薄膜介於安裝頭的底面與電子零件之間而進行電子零件的安裝的安裝裝置10包括：薄膜捲取機構18，使捲取捲軸26旋轉而捲取自送出捲軸架設至捲取捲軸26的薄膜，且每當進行安裝時，以將新的薄膜配置於安裝頭的底面的方式捲取；張力檢測部38，檢測經薄膜捲取機構18捲取後的薄膜的張力；及控制部20，基於由張力檢測部38所檢測出的張力，藉由捲取馬達30使捲取捲軸26旋轉而調整張力。

Description

安裝裝置以及薄膜供應裝置
本發明是有關於一種使薄膜介於安裝頭的底面與電子零件之間而進行電子零件的安裝的安裝裝置以及薄膜供應裝置。
先前以來，將半導體晶片（電子零件）不經由引線而安裝於基板的覆晶接合機（flip-chip bonder）技術已廣為人知。於該覆晶接合機中，有時於基板上預先塗佈包含熱硬化性樹脂的黏接材料，經由該黏接材料將半導體晶片固定於基板。於該情形時，於以安裝頭將半導體晶片加熱及加壓時，有時被半導體晶片擠出的黏接材料向上方爬升而附著於安裝頭。另外，即便於未附著於安裝頭的情形時，有時由經加熱的黏接材料產生的煙氣（fume gas）亦侵入安裝頭內。
於專利文獻1中，揭示有一種為了防止此種黏接材料對熱壓接工具（安裝頭）的附著，而以薄膜構件（薄膜）覆蓋熱壓接工具的底面的安裝裝置。即，於專利文獻1的安裝裝置中設有薄膜構件搬送機構（薄膜供應裝置），該薄膜構件搬送機構（薄膜供應裝置）依次供應介於安裝頭的底面與晶片零件（電子零件）之間的薄膜。每當安裝晶片零件時，將新的薄膜構件供應至熱壓接工具的底面。根據該安裝裝置而有效地防止黏接材料對熱壓接工具的附著。
[先前技術文獻][專利文獻]
[專利文獻1]日本專利特開2015-35493號公報
[發明所欲解決之課題]
先前技術中，電子零件抽吸保持於安裝頭的底面。該抽吸面經薄膜覆蓋，因此在電子零件的抽吸之前，使用針於薄膜中形成抽吸用的孔。
先前，於薄膜的張力小的情形時，有安裝頭的底面的薄膜出現鬆弛而針難以刺進薄膜的問題。另外，若安裝頭的底面的薄膜有鬆弛，則介著薄膜將電子零件吸附於安裝頭時，安裝頭與電子零件的密接度變差。另一方面，於薄膜的張力大的情形時，安裝頭的底面的薄膜出現皺褶，在該情形下，於將電子零件吸附於安裝頭時，安裝頭與電子零件的密接度亦變差。
本發明的目的在於，於使薄膜介於安裝頭的底面與電子零件之間而進行電子零件的安裝的安裝裝置以及薄膜供應裝置中，使薄膜產生所期望的張力。
[解決課題之手段]
本發明的安裝裝置使薄膜介於安裝頭的底面與電子零件之間而進行電子零件的安裝，其特徵在於包括：薄膜捲取機構，使捲取捲軸旋轉而捲取自送出捲軸架設至捲取捲軸的薄膜，且每當進行安裝時，以將新的薄膜配置於安裝頭的底面的方式進行捲取；張力檢測部，檢測經薄膜捲取機構捲取後的薄膜的張力；及控制部，基於由張力檢測部所檢測出的張力，藉由捲取馬達使捲取捲軸旋轉而調整張力。
本發明的安裝裝置中，亦較佳為薄膜捲取機構包括：馬達臂，直接或間接地連接於捲取馬達的旋轉軸，於一定方向上延伸；捲軸臂，直接或間接地連接於捲取捲軸的旋轉軸，於與馬達臂對應的方向上延伸，與馬達臂以同一中心旋轉；及彈性構件，一端連結於馬達臂，另一端連結於捲軸臂，使捲軸臂追隨馬達臂，張力檢測部基於馬達臂與捲軸臂的旋轉方向上的間隔而檢測張力。
本發明的安裝裝置中，亦較佳為張力檢測部於所述間隔小於第一既定值的情形時檢測出張力過小，於所述間隔超過大於第一既定值的第二既定值的情形時檢測出張力過大。
本發明的安裝裝置中，亦較佳為一對檢測臂直接或間接地連結於馬達臂或捲軸臂中的一者，並朝另一者延伸、且以跨越另一者或連結於另一者的被檢測體的至少一個的方式配置，一對檢測臂具備第一感測器及第二感測器，第一感測器及第二感測器可偵測檢測臂之間的所述另一者或被檢測體，第一感測器配置於一對檢測臂的所述一者側，第二感測器於一對檢測臂中與第一感測器空開既定間隔而配置於所述另一者側，張力檢測部於第一感測器偵測到所述另一者或被檢測體的情形時檢測出張力過小，於第一感測器未偵測到所述另一者及被檢測體，且第二感測器未偵測到所述另一者及被檢測體的情形時，檢測出張力過大。
本發明的安裝裝置中，亦較佳為控制部於檢測出張力過小時，經由捲取馬達使捲取捲軸朝捲取方向旋轉，於檢測出張力過大時，經由捲取馬達使捲取捲軸朝與捲取方向相反的方向旋轉。
本發明的安裝裝置中，亦較佳為控制部於檢測到張力過小或過大時，經由捲取馬達使捲取捲軸旋轉，直至第一感測器未偵測到所述另一者及被檢測體，且第二感測器偵測到所述另一者或被檢測體為止。
本發明的薄膜供應裝置的特徵在於包括：薄膜捲取機構，使捲取捲軸旋轉而捲取自送出捲軸架設至捲取捲軸的薄膜；張力檢測部，檢測藉由薄膜捲取機構捲取既定量的薄膜之後的薄膜的張力；及控制部，基於由張力檢測部所檢測出的張力，藉由捲取馬達使捲取捲軸旋轉而調整張力，薄膜捲取機構包括：馬達臂，直接或間接地連接於捲取馬達的旋轉軸，於一定方向上延伸；捲軸臂，直接或間接地連接於捲取捲軸的旋轉軸，於與馬達臂對應的方向上延伸，與馬達臂以同一中心旋轉；及彈性構件，一端連結於馬達臂，另一端連結於捲軸臂，使捲軸臂追隨馬達臂，張力檢測部於馬達臂與捲軸臂的旋轉方向上的間隔小於第一既定值的情形時檢測出張力過小，於所述間隔超過大於第一既定值的第二既定值的情形時檢測出張力過大，控制部於檢測出張力過小時，經由捲取馬達使捲取捲軸朝捲取方向旋轉，於檢測出張力過大時，經由捲取馬達使捲取捲軸朝與捲取方向相反的方向旋轉。
[發明的效果]
根據本發明，可使薄膜產生所期望的張力。
＜安裝的概略＞
以下，一方面參照圖式一方面說明本發明的實施形態。
圖1為表示本實施形態的安裝裝置10的構成的圖。圖1中的箭頭X表示裝置左右方向，箭頭Y表示裝置前後方向，箭頭Z表示裝置上下方向，於以下將說明的圖中亦相同。
安裝裝置10為藉由將多個半導體晶片100（電子零件）安裝於基板104而製造半導體裝置的裝置。半導體晶片100藉由覆晶接合機技術而安裝於基板104。具體而言，於各半導體晶片100的底面，形成有被稱為凸塊102的包含導電性材料的突起，藉由將該凸塊102接合於形成於基板104的表面的電極106，而將半導體晶片100與基板104電性連接。
於基板104上，於半導體晶片100的安裝位置，預先塗佈有被稱為非導電性糊（non-conductive paste，NCP）或非導電性薄膜（non-conductive film，NCF）的黏接材料108。黏接材料108包含具有絕緣性並且具有熱硬化性的熱硬化性樹脂。如圖2所示，於該黏接材料108上載置半導體晶片100，按壓於基板104並且將半導體晶片100加熱。藉此，黏接材料108硬化而將半導體晶片100機械固定於基板104。藉由對半導體晶片100的加熱而凸塊102熔融，若停止對半導體晶片100的加熱，則經熔融的凸塊102凝固而電性接合於基板104（電路基板）的電極106。
＜安裝裝置的構成＞
如圖1所示，安裝裝置10包括接合平台14、基台16、安裝頭12及薄膜供應裝置90。
接合平台14為載置基板104的平台。於該接合平台14中，例如設有抽吸保持基板104的抽吸孔（未圖示）、及用以加熱基板104的加熱器（未圖示）等。該接合平台14是由基台16所支持。於基台16上，設有用以於覆蓋安裝頭12的底面的薄膜110（後述）中形成抽吸用的孔的針88。基台16於XY方向（水平方向）上可移動。
安裝頭12與接合平台14相向地設置，於Z方向（垂直方向）上可移動。於安裝頭12的底面，形成有用以抽吸保持半導體晶片100的抽吸孔22。該抽吸孔22與未圖示的抽吸泵連通，利用藉由該抽吸泵所產生的負壓而將半導體晶片100介著薄膜110抽吸保持於安裝頭12的底面。另外，於安裝頭12中，為了於安裝時加熱半導體晶片100，內置有加熱器（未圖示）。
薄膜供應裝置90朝一個方向將長條帶狀的薄膜110供應於安裝頭12的底面。該薄膜110於安裝頭12的底面被加熱，且可能與黏接材料108接觸，故而薄膜110的原材料合適的是耐熱性優異且黏接材料108的剝離性高的原材料。因此，薄膜110的原材料例如可使用聚四氟乙烯（polytetrafluoroethylene，PTFE）、四氟乙烯-全氟烷基乙烯醚共聚物（tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer，PFA）等氟樹脂。
薄膜供應裝置90包括框架37、夾著安裝頭12而設置的送出捲軸24及捲取捲軸26、使自送出捲軸24朝捲取捲軸26傳送薄膜110的輥32、輥34旋轉的送出馬達28、及使捲取捲軸26旋轉的捲取馬達30。薄膜供應裝置90與安裝頭12一體化，與安裝頭12一起移動。
送出捲軸24及捲取捲軸26可旋轉地保持於框架37。於送出捲軸24的外周，捲繞有使用前（配置於安裝頭12的底面之前）的薄膜110，同樣地，於捲取捲軸26的外周，捲繞有已使用（配置於安裝頭12的底面之後）的薄膜110。再者，亦可於送出捲軸24、捲取捲軸26上分別直接捲繞有薄膜110，但於本實施形態中，介著圓環狀的芯材而於送出捲軸24、捲取捲軸26上分別捲繞有薄膜110。為將捲繞有薄膜110的兩個芯材分別壓入至送出捲軸24、捲取捲軸26各自的外周的構成。
送出馬達28為步進馬達，其旋轉力經由皮帶36而傳至輥32。與輥32相向地設有輥34，於輥32、輥34之間夾入有薄膜110。藉由送出馬達28驅動，輥32旋轉而輥34亦旋轉，自其間送出薄膜110。捲取馬達30為步進馬達，配置於捲取捲軸26的背側（安裝裝置10的後側）。再者，於本實施形態中，未設置使送出捲軸24旋轉驅動的馬達，但亦可為設有該馬達的構成。
＜安裝動作＞
此處，對安裝裝置10的安裝動作進行說明。圖3為表示安裝裝置10進行的處理的流程的流程圖。首先，S100中，使薄膜供應裝置90的送出馬達28及捲取馬達30旋轉而送出既定量的薄膜110，S102中，使送出馬達28及捲取馬達30停止。再者，於設有使送出捲軸24旋轉驅動的馬達的情形時，使該馬達亦同樣地旋轉，然後停止。藉此，將新的薄膜110配置於安裝頭12的底面。繼而，S104中，進行薄膜110的張力調整。於本實施形態中，該張力調整具有特徵，其詳細情況將於後述。
S104的張力調整後，S106中，使用針88在位於安裝頭12的底面的薄膜110中形成抽吸用的孔。其是藉由如下方式進行：圖1所示的接合平台14的基台16水平移動，將針88設置於安裝頭12的正下方，然後安裝頭12朝針88下降（垂直移動）。繼而，使安裝頭12上升。
然後，S108中，將半導體晶片100安裝於基板104。具體而言，如下般進行。放置有半導體晶片100的底座（未圖示）水平移動，使安裝頭12下降，安裝頭12自此拾取半導體晶片100。繼而，使安裝頭12上升後，接合平台14的基台16水平移動，將基板104上的半導體晶片100的安裝位置設置於安裝頭12的正下方。再者，於該安裝位置如圖1所示般塗佈有黏接材料108。然後，安裝頭12朝基板104下降，將半導體晶片100載置於基板104上的安裝位置（黏接材料108）後，進行加熱及加壓而安裝。
此時，安裝頭12對半導體晶片100加壓，藉此如圖2所示，有時被半導體晶片100擠出至外側的黏接材料108的一部分滲出並爬升。若該爬升的黏接材料108附著於安裝頭12，則有無法合適進行後續的安裝處理之虞。另外，即便於黏接材料108未附著於安裝頭12的情形時，有時由經加熱的黏接材料108產生的煙氣亦進入安裝頭12的抽吸孔22，由此污染安裝頭12。
於本實施形態中，使薄膜110介於安裝頭12與半導體晶片100之間，故而如圖2所示，防止黏接材料108對安裝頭12的附著、及煙氣對安裝頭12的抽吸孔22的侵入。
安裝半導體晶片100後，使安裝頭12上升，一系列處理結束。針對每個半導體晶片100進行以上所說明的安裝處理。每當安裝半導體晶片100時，將薄膜110捲取於捲取捲軸26，將新的薄膜110配置於安裝頭12的底面。
＜張力調整的概略＞
繼而，對薄膜110的張力調整進行說明。於薄膜110的張力小的情形時，安裝頭的底面的薄膜110出現鬆弛。於該情形時，用以形成抽吸用的孔的針88難以刺進，無法形成所期望形狀的孔。另外，因安裝頭的底面的薄膜110的鬆弛，故而於將半導體晶片100吸附於安裝頭12的底面時，安裝頭12與半導體晶片100的密接度變差。另外，另一方面，於薄膜110的張力大的情形時，安裝頭12的底面的薄膜110出現皺褶，於該情形時，安裝頭12與半導體晶片100的密接度亦變差。
因此，本實施形態的安裝裝置10進行薄膜110的張力調整，有效地抑制該些情況。安裝裝置10的薄膜供應裝置90檢測薄膜110的張力，並基於所檢測出的張力，藉由捲取馬達30使捲取捲軸26旋轉而調整薄膜110的張力。
＜薄膜供應裝置的概略構成＞
圖4為表示薄膜供應裝置90的概略構成的區塊圖。薄膜供應裝置90包括：薄膜捲取機構18，每當進行安裝時，以將新的薄膜110配置於安裝頭12的底面的方式捲取；張力檢測部38，檢測經薄膜捲取機構18捲取後的薄膜110的張力；及控制部20，基於由張力檢測部38所檢測出的張力，藉由捲取馬達30使捲取捲軸26旋轉而調整張力。
薄膜捲取機構18包含上文所述的送出馬達28、捲取馬達30及捲取捲軸26。薄膜捲取機構18具有用以檢測及調整薄膜110的張力的特徵性結構，關於其詳細情況將於後述。
張力檢測部38包含第一光電感測器40（第一感測器）、第二光電感測器42（第二感測器）及作為控制部20的一部分的判定部39。將第一光電感測器40、第二光電感測器42各自的檢測訊號輸入至判定部39，判定部39根據所輸入的檢測訊號，判定薄膜110的張力的過大、過小或合適。關於具體的第一光電感測器40、第二光電感測器42的配置或功能、及基於這些感測器的檢測訊號的判定部39的判定方法，將於後述。
控制部20包含處理器（processor），通過按照記憶部21中記憶的程式來執行處理，而控制薄膜捲取機構18，進行安裝半導體晶片100後的薄膜110的捲取，進行捲取後的薄膜110的張力調整，進而亦作為張力檢測部38的判定部39發揮功能。再者，該薄膜供應裝置90的控制部20可與安裝裝置10的控制部（控制安裝頭12或接合平台14等的控制部）相同，亦可為另外的控制部。於為另外的控制部的情形時，按照安裝裝置10的控制部的指令來動作。
＜薄膜捲取機構＞
繼而，對薄膜捲取機構18的結構進行說明。圖5為薄膜捲取機構18的立體圖。如圖5所示，薄膜捲取機構18包括：馬達臂52，連接於捲取馬達30的旋轉軸50，於捲取捲軸26的半徑方向（一定方向）上延伸；捲軸臂62，連接於捲取捲軸26的旋轉軸64，於捲取捲軸26的半徑方向（與馬達臂52對應的方向）上延伸；及拉伸彈簧（tension spring）56（彈性構件）。
捲取馬達30配置於捲取捲軸26的後側，固定於框架，連接有電力供應線等配線44。捲取馬達30的旋轉軸50朝前方延伸，於其前端連結有馬達臂52。
於捲取捲軸26上，介著芯材66而捲繞有已使用的薄膜110。再者，圖5的粗線的黑箭頭為薄膜110的捲取方向。於捲取捲軸26上，固定有堵塞後側開口的圓形蓋68。捲取捲軸26的旋轉軸64自圓形蓋68的後側表面朝後側突出，可旋轉地支持於固定於框架的未圖示的軸承。於捲取捲軸26的旋轉軸64的前端，連結有捲軸臂62。
捲取馬達30的旋轉軸50與捲取捲軸26的旋轉軸64配置於同一直線上。即，馬達臂52與捲軸臂62配置成以同一中心C旋轉。拉伸彈簧56的一端連結於馬達臂52的前端附近，另一端連結於捲軸臂62的前端附近。
再者，如圖5所示，薄膜捲取機構18進而包括連結於馬達臂52的前端附近的輔助臂54、連結於輔助臂54的一對檢測臂58、及連結於捲軸臂62的被檢測體60，但該些構件的詳細情況將於後述。再者，圖5中為輔助臂54與捲軸臂62未結合，馬達臂52與捲軸臂62僅由拉伸彈簧56相連的結構。
另外，於本實施形態中，雖然將馬達臂52直接連接於捲取馬達30的旋轉軸50，但該些構件亦可經由齒輪或輔助臂等而間接地連接。同樣地，雖然將捲軸臂62直接連接於捲取捲軸26的旋轉軸64，但該些構件亦可經由齒輪或輔助臂等而間接地連接。而且，只要以馬達臂52於一定方向上延伸，捲軸臂62於與馬達臂52對應的方向上延伸，其以同一中心C旋轉的方式構成，且馬達臂52與捲軸臂62經拉伸彈簧56等彈性構件相連即可。
圖5中，若捲取馬達30的旋轉軸50逆時針旋轉，則馬達臂52旋轉並經由拉伸彈簧56而拉動捲軸臂62，捲取捲軸26的旋轉軸64逆時針（粗線的黑箭頭方向）旋轉，將薄膜110捲取於捲取捲軸26。如此而為使捲軸臂62追隨馬達臂52的構成。
＜張力檢測部＞
繼而，對張力檢測部38進行說明。捲取薄膜110後，圖1所示的送出側的輥32、輥34鎖定（lock），輥32、輥34之間的薄膜110被固定。既定的張力作用於自該些輥至捲取捲軸26的薄膜110。
於薄膜110的張力大的情形時，圖5所示的拉伸彈簧56大幅伸長，馬達臂52與捲軸臂62的旋轉方向上的間隔α變大。另一方面，於薄膜110的張力小的情形時，拉伸彈簧56小幅伸長或不伸長，馬達臂52與捲軸臂62的旋轉方向上的間隔α變小。藉由檢測該間隔α，而可檢測薄膜110的張力。該間隔α不限於馬達臂52與捲軸臂62之間的距離，亦可為馬達臂52與捲軸臂62所成的角度，或者於其中的一者或兩者上連結有輔助臂等的情形時，可為自輔助臂等至馬達臂52、捲軸臂62或其他輔助臂等的距離、角度。藉由設置可檢測間隔α的適當的感測器作為張力檢測部38，例如於間隔α小於第一既定值（預定的值）的情形時可檢測出張力過小，於間隔α超過大於第一既定值的第二既定值（預定的值）的情形時可檢測出張力過大。
此處，對具體的本實施形態的張力檢測部38進行說明。如圖5所示，於捲軸臂62的前端附近且與馬達臂52為相反側的側面，固定有棒狀的被檢測體60。另一方面，於馬達臂52的前端附近連結有輔助臂54，輔助臂54自馬達臂52的前側側面突出，於中途折曲並向捲軸臂62側延伸。於輔助臂54的前後側面，連結有一對檢測臂58。一對檢測臂58以跨越捲軸臂62及被檢測體60的方式配置。
於圖6（A）中，表示自上側觀看輔助臂54、一對檢測臂58、捲軸臂62及被檢測體60的圖。如圖6（A）所示，一對檢測臂58具備具有發光部40a及光接收部40b的第一光電感測器40、以及具有發光部42a及光接收部42b的第二光電感測器42。發光部40a、發光部42a分別配置於檢測臂58a的內表面，光接收部40b、光接收部42b分別與各個發光部40a、發光部42a相向地設置，配置於檢測臂58b的內表面。第一光電感測器40配置於一對檢測臂58的輔助臂54側（馬達臂側），第二光電感測器42於一對檢測臂58中與第一光電感測器40空開既定間隔而配置於捲軸臂62側。
第一光電感測器40可偵測自發光部40a到達光接收部40b的光的遮蔽（遮光），第二光電感測器42可偵測自發光部42a到達光接收部42b的光的遮蔽（遮光）。當捲軸臂62或被檢測體60進入各自的位置的一對檢測臂58之間，第一光電感測器40與第二光電感測器42偵測到遮光，而偵測到其存在。如圖6（A）至圖6（C）所示，根據第一光電感測器40與第二光電感測器42各自的有無遮光的組合，能以三階段偵測捲軸臂62（被檢測體60）相對於輔助臂54（馬達臂）的位置。即，所述間隔α能以三階段進行偵測。對判定部39（參照圖4）輸入第一光電感測器40及第二光電感測器42的偵測訊號（偵測結果），判定部39基於作為偵測結果的有無遮光的組合，來判定薄膜110的張力的過大、過小或合適。
再者，第一光電感測器40與第二光電感測器42配置於藉由圖5所示的馬達臂52旋轉而旋轉的檢測臂58a、檢測臂58b（旋轉體），故而無需設計用以自外部向第一光電感測器40及第二光電感測器42供應電力，另外向外部傳送來自其中的偵測訊號的配線。於本實施形態中，圖5所示的檢測臂58a、檢測臂58b、輔助臂54、馬達臂52及捲取馬達30的旋轉軸50成為中空的結構，第一光電感測器40及第二光電感測器42的配線配置於其中，自檢測臂58a、檢測臂58b引導至捲取馬達30的旋轉軸50。而且，於旋轉軸50上設有被稱為滑環（slip ring）46的可將旋轉軸中的配線與外部的配線48（被固定的配線）電性連接的構件。藉此，可自外部向旋轉的第一光電感測器40及第二光電感測器42供應電力，且向外部傳送來自其中的偵測訊號。
＜張力調整＞
繼而，對本實施形態的張力調整進行說明。圖3的流程的S104為張力調整的步驟。如上文所述，S100、S102中為了於安裝頭12的底面配置新的薄膜110而捲取薄膜110，S104中進行薄膜110的張力調整。
首先，圖3的S200中，張力檢測部38的判定部39確認第一光電感測器40（第一感測器）有無遮光（捲軸臂62或被檢測體60的偵測）。於有遮光的情形（S200：否（No））時進入S208。該狀態為圖6（B）所示的狀態，為捲軸臂62相對於輔助臂54（馬達臂）的位置近的狀態、即拉伸彈簧56小幅伸長或不伸長的狀態。於該情形時，圖3的S208中，判定部39判定為薄膜110的張力過小。繼而，S212中，控制部20使捲取馬達30朝捲取薄膜110的方向（順向）旋轉，使捲取捲軸26朝捲取方向（圖5的粗線黑箭頭的方向）旋轉。藉此，拉伸彈簧56成為較以前更為伸長的狀態，並且薄膜110的張力增加。
另一方面，圖3的S200中，於無遮光的情形（S200：是（Yes））時進入S202。S202中，判定部39確認第二光電感測器42（第二感測器）有無遮光（捲軸臂62或被檢測體60的偵測）。於有遮光的情形（S202：否（No））時進入S206。該狀態為圖6（A）所示的狀態，為捲軸臂62相對於輔助臂54（馬達臂）的位置合適的狀態，即拉伸彈簧56的伸長為所期望的狀態。於該情形時，圖3的S206中，判定部39判定為薄膜110的張力合適，結束張力調整的處理，進入S106。
另一方面，S202中，於無遮光的情形（S202：是（Yes））時進入S204。該狀態為圖6（C）所示的狀態，為捲軸臂62相對於輔助臂54（馬達臂）的位置遠的狀態、即拉伸彈簧56大幅伸長的狀態。於該情形時，圖3的S204中，判定部39判定為薄膜110的張力過大。繼而，S210中，控制部20使捲取馬達30朝與捲取薄膜110的方向相反的方向旋轉，藉此使捲取捲軸26朝相反方向（圖5的粗線的虛線黑箭頭的方向）旋轉。藉此，成為拉伸彈簧56較以前更為縮短的狀態，並且薄膜110的張力減少。
控制部20於判定為張力過小或過大（S208或S204）而進行了張力的調整（S212或S210）時，再次回到S200，確認是否張力變得合適，繼續進行張力的調整直至判定為張力合適（S206）為止。具體而言，直至並無第一光電感測器的遮光（捲軸臂62或被檢測體60的偵測），且有第二光電感測器的遮光（捲軸臂62或被檢測體60的偵測）為止，控制部20經由捲取馬達30使捲取捲軸26旋轉而進行張力調整。如此，進行反饋控制。
＜作用效果＞
繼而，對本實施形態的安裝裝置10的作用效果進行說明。本實施形態的安裝裝置10檢測薄膜110的張力，並基於其檢測結果來調整薄膜110的張力。因此，可使配置於安裝頭12的底面的薄膜110產生所期望的張力。藉此，可使用於形成抽吸用的孔的針88順利地刺進薄膜110，形成所期望形狀的孔。另外，可提高於安裝頭12的底面介著薄膜110吸附有半導體晶片100時的安裝頭12與半導體晶片100的密接度。藉此，可確實地防止密接度差而半導體晶片100自安裝頭12掉落般的事態。
另外，本實施形態中，送出馬達28及捲取馬達30使用步進馬達，故而可使其旋轉軸以小的旋轉角度單位旋轉，可進行薄膜110的捲取量的微調整。尤其於張力調整時，可使捲取馬達30的旋轉軸以小的旋轉角度單位旋轉，故而可進行薄膜110的張力的微調整。另外，藉由使用步進馬達，可實現捲取馬達30的反向旋轉。
＜其他＞
於以上所說明的實施形態中，使用兩個光電感測器作為張力檢測部38，但只要可直接或間接地檢測圖5所示的馬達臂52與捲軸臂62的間隔α，則可使用任意的感測器。另外，關於感測器的位置亦無限定。例如，藉由在馬達臂52或捲軸臂62中的一者設置雷射距離感測器，朝另一者進行雷射照射，可檢測間隔α。另外，亦可藉由感測器檢測拉伸彈簧56自身的長度作為間隔α。
另外，於如以上所說明的實施形態般於一對檢測臂58上設置光電感測器的情形時，光電感測器的個數亦可為一個，亦可為三個以上。若於一對檢測臂58上將三個以上的光電感測器各自空開既定間隔配置，則可更細緻地把握捲軸臂62相對於馬達臂52的位置，可更細緻地調整張力調整中的捲取馬達30的旋轉量。
另外，於以上所說明的實施形態中，於馬達臂52上經由輔助臂54間接地連結有一對檢測臂58，但亦可於馬達臂52上直接連結有一對檢測臂58。另外，於以上所說明的實施形態中，為於馬達臂52上（間接地）連結有一對檢測臂58，於捲軸臂62上固定有被檢測體60的構成。然而，亦可為於捲軸臂62上直接或間接地連結有一對檢測臂58，於馬達臂52上固定有被檢測體60的構成。
另外，於以上所說明的實施形態中，一對檢測臂58為跨越捲軸臂62及被檢測體60的構成，但一對檢測臂58只要為跨越捲軸臂62與被檢測體60的至少一個的構成即可。即，若於旋轉方向上大幅度地形成捲軸臂62，則捲軸臂62可兼作被檢測體60，故而無需被檢測體60，一對檢測臂58僅跨越捲軸臂62。另一方面，例如，若被檢測體60為自捲軸臂62的前側（圖5的右側）側面突出，於中途折曲而向馬達臂52側延伸的形狀（與圖5所示的輔助臂54相同的形狀），則一對檢測臂58能以僅跨越被檢測體60而不跨越捲軸臂62的方式構成。
另外，於以上所說明的實施形態中，捲取薄膜110後，將送出側的輥32、輥34鎖定，將輥32、輥34之間的薄膜110固定。繼而，於該狀態下進行薄膜110的張力檢測及張力調整。然而，輥32、輥34的鎖定不是必要的。例如，於以在送出側具備多數個輥，且其蜿蜒地送出薄膜110的方式配置的情形時，即便輥未完全鎖定，亦可成為薄膜110於送出側固定的狀態。
另外，以上所說明的實施形態中，於馬達臂52與捲軸臂62之間設有拉伸彈簧56作為彈性構件。然而，亦可設置橡膠（gum）等作為彈性構件。
另外，如上所述，若設置可檢測馬達臂52與捲軸臂62的間隔α的適當的感測器作為張力檢測部38，則可於間隔α小於第一既定值（預定的值）的情形時檢測出張力過小，於間隔α超過大於第一既定值的第二既定值（預定的值）的情形時檢測出張力過大。該第一既定值與第二既定值亦可根據捲取捲軸26上捲繞薄膜110的量而變化。於捲取捲軸26上捲繞的薄膜110的量多的情形時，捲取捲軸26的加上薄膜110的半徑變大，故而即便薄膜110的張力相同，亦對捲軸臂62產生更大的轉矩。藉此，有可能即便實際上薄膜110的張力過小亦檢測出張力合適，即便實際上薄膜110的張力合適亦檢測出張力過大。因此，亦可所捲繞的薄膜110的量越多，則將第一既定值及第二既定值設為更大的值。
另外，同樣地，亦可根據捲取捲軸26上捲繞的薄膜110的量，改變使張力調整時的捲取馬達30的旋轉量。捲取捲軸26上捲繞的薄膜110的量越多，則因捲取捲軸26的朝捲取方向的旋轉而越捲取更多的薄膜110，薄膜110的張力變得更大。同樣地，捲取捲軸26上捲繞的薄膜110的量越多，則因捲取捲軸26的朝相反方向的旋轉而越自捲取捲軸26送出更多的薄膜110，薄膜110的張力變得更小。因此，亦可捲繞的薄膜110的量越多，則越減小張力調整時的捲取馬達30的朝捲取方向、或相反方向的旋轉量。
另外，以上所說明的實施形態的安裝裝置10為進行覆晶接合的裝置（覆晶接合機），但安裝裝置10亦可為不將半導體晶粒電性連接於基板，而藉由黏接材料將半導體晶粒固定於基板的裝置（固晶機）等。另外，以上所說明的實施形態的安裝裝置10為於基板104上預先塗佈黏接材料的方式（先塗佈方式），但亦可不於基板104上塗佈黏接材料，而於半導體晶片100的背面貼附NCF等黏接材料，使該NCF等加熱硬化而將半導體晶片100安裝於基板104。
另外，以上所說明的實施形態的安裝裝置10將半導體晶片100安裝於基板104，但亦可將半導體晶片100以外的電子零件（例如電晶體或電容器等）安裝於基板104或基板104以外的被安裝構件（晶圓、玻璃、樹脂等）。
以上所說明的實施形態的薄膜供應裝置90亦可用於安裝裝置10以外的用途。所述張力檢測及張力調整的技術可應用於將薄膜、繩、絲等自送出捲軸捲取於捲取捲軸的所有裝置。
以上，對本發明進行了說明，但本發明不受此種實施形態之任何限定，當然可於不偏離本發明的主旨的範圍內以各種形態實施。
10‧‧‧安裝裝置
12‧‧‧安裝頭
14‧‧‧接合平台
16‧‧‧基台
18‧‧‧薄膜捲取機構
20‧‧‧控制部
21‧‧‧記憶部
22‧‧‧抽吸孔
24‧‧‧送出捲軸
26‧‧‧捲取捲軸
28‧‧‧送出馬達
30‧‧‧捲取馬達
32、34‧‧‧輥
36‧‧‧皮帶
37‧‧‧框架
38‧‧‧張力檢測部
39‧‧‧判定部
40‧‧‧第一光電感測器（第一感測器）
40a、42a‧‧‧發光部
40b、42b‧‧‧光接收部
42‧‧‧第二光電感測器（第二感測器）
44、48‧‧‧配線
46‧‧‧滑環
50‧‧‧旋轉軸
52‧‧‧馬達臂
54‧‧‧輔助臂
56‧‧‧拉伸彈簧（彈性構件）
58‧‧‧一對檢測臂
58a、58b‧‧‧檢測臂（旋轉體）
60‧‧‧被檢測體
62‧‧‧捲軸臂
64‧‧‧旋轉軸
66‧‧‧芯材
68‧‧‧圓形蓋
88‧‧‧針
90‧‧‧薄膜供應裝置
100‧‧‧半導體晶片（電子零件）
102‧‧‧凸塊
104‧‧‧基板（電路基板）
106‧‧‧電極
108‧‧‧黏接材料
110‧‧‧薄膜
C‧‧‧中心
S100、S102、S104、S106、S108、S200、S202、S204、S206、S208、S210、S212‧‧‧步驟
α‧‧‧間隔
圖1為表示安裝裝置的構成的圖。
圖2為表示安裝狀況的側面圖。圖3為表示安裝裝置的處理流程的流程圖。圖4為表示薄膜供應裝置的概略構成的區塊圖。圖5為薄膜捲取機構的立體圖。 圖6為用以對張力檢測進行說明的圖。

Claims (7)

  1. 一種安裝裝置，使薄膜介於安裝頭的底面與電子零件之間而進行所述電子零件的安裝，其特徵在於包括： 薄膜捲取機構，使捲取捲軸旋轉而捲取自送出捲軸架設至所述捲取捲軸的薄膜，且每當進行所述安裝時，以將新的薄膜配置於所述安裝頭的底面的方式進行捲取；張力檢測部，檢測經所述薄膜捲取機構捲取後的薄膜的張力；及控制部，基於由所述張力檢測部所檢測出的所述張力，藉由捲取馬達使所述捲取捲軸旋轉而調整所述張力。
  2. 如申請專利範圍第1項所述的安裝裝置，其中所述薄膜捲取機構包括： 馬達臂，直接或間接地連接於所述捲取馬達的旋轉軸，於一定方向上延伸；捲軸臂，直接或間接地連接於所述捲取捲軸的旋轉軸，於與所述馬達臂對應的方向上延伸，與所述馬達臂以同一中心旋轉；及彈性構件，一端連結於所述馬達臂，另一端連結於所述捲軸臂，使所述捲軸臂追隨所述馬達臂，所述張力檢測部基於所述馬達臂與所述捲軸臂的旋轉方向上的間隔而檢測所述張力。
  3. 如申請專利範圍第2項所述的安裝裝置，其中所述張力檢測部於所述間隔小於第一既定值的情形時檢測出所述張力過小， 於所述間隔超過大於所述第一既定值的第二既定值的情形時檢測出所述張力過大。
  4. 如申請專利範圍第2項或第3項所述的安裝裝置，其中，一對檢測臂直接或間接地連結於所述馬達臂或所述捲軸臂中的一者，並朝另一者延伸、且以跨越另一者或連結於另一者的被檢測體的至少一個的方式配置， 所述一對檢測臂包括第一感測器及第二感測器，所述第一感測器及所述第二感測器能夠偵測檢測臂之間的所述另一者或所述被檢測體，所述第一感測器配置於所述一對檢測臂的所述一者側，所述第二感測器於所述一對檢測臂中與所述第一感測器空開既定間隔而配置於所述另一者側，所述張力檢測部於所述第一感測器偵測到所述另一者或所述被檢測體的情形時檢測出所述張力過小，於所述第一感測器未偵測到所述另一者以及所述被檢測體，且所述第二感測器未偵測到所述另一者以及所述被檢測體的情形時，檢測出所述張力過大。
  5. 如申請專利範圍第3項或第4項所述的安裝裝置，其中所述控制部於檢測到所述張力過小時，經由所述捲取馬達使所述捲取捲軸朝捲取方向旋轉， 於檢測到所述張力過大時，經由所述捲取馬達使所述捲取捲軸朝與所述捲取方向相反的方向旋轉。
  6. 如申請專利範圍第4項所述的安裝裝置，其中所述控制部於檢測出所述張力過小或過大時，經由所述捲取馬達使所述捲取捲軸旋轉，直至所述第一感測器未偵測到所述另一者及所述被檢測體，且所述第二感測器偵測到所述另一者或所述被檢測體為止。
  7. 一種薄膜供應裝置，其特徵在於包括： 薄膜捲取機構，使捲取捲軸旋轉而捲取自送出捲軸架設至所述捲取捲軸的薄膜；張力檢測部，檢測藉由所述薄膜捲取機構捲取既定量的薄膜之後的薄膜的張力；及控制部，基於由所述張力檢測部所檢測出的所述張力，藉由捲取馬達使所述捲取捲軸旋轉而調整所述張力，所述薄膜捲取機構包括：馬達臂，直接或間接地連接於所述捲取馬達的旋轉軸，於一定方向上延伸；捲軸臂，直接或間接地連接於所述捲取捲軸的旋轉軸，於與所述馬達臂對應的方向上延伸，與所述馬達臂以同一中心旋轉；及彈性構件，一端連結於所述馬達臂，另一端連結於所述捲軸臂，使所述捲軸臂追隨所述馬達臂，所述張力檢測部於所述馬達臂與所述捲軸臂的旋轉方向上的間隔小於第一既定值的情形時，檢測出所述張力過小，於所述間隔超過大於所述第一既定值的第二既定值的情形時，檢測出所述張力過大，所述控制部於檢測出所述張力過小時，經由所述捲取馬達使所述捲取捲軸朝捲取方向旋轉， 於檢測出所述張力過大時，經由所述捲取馬達使所述捲取捲軸朝與所述捲取方向相反的方向旋轉。
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WO2019207858A1 (ja) 2019-10-31
TWI685902B (zh) 2020-02-21
KR102362980B1 (ko) 2022-02-15

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