JP6787613B2 - 実装装置 - Google Patents
実装装置 Download PDFInfo
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- JP6787613B2 JP6787613B2 JP2019557260A JP2019557260A JP6787613B2 JP 6787613 B2 JP6787613 B2 JP 6787613B2 JP 2019557260 A JP2019557260 A JP 2019557260A JP 2019557260 A JP2019557260 A JP 2019557260A JP 6787613 B2 JP6787613 B2 JP 6787613B2
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- 239000013039 cover film Substances 0.000 claims description 184
- 239000004065 semiconductor Substances 0.000 claims description 146
- 238000002788 crimping Methods 0.000 claims description 103
- 239000010408 film Substances 0.000 claims description 87
- 230000007246 mechanism Effects 0.000 claims description 84
- 238000000034 method Methods 0.000 claims description 64
- 239000000758 substrate Substances 0.000 claims description 56
- 239000000463 material Substances 0.000 claims description 39
- 239000000853 adhesive Substances 0.000 claims description 36
- 230000001070 adhesive effect Effects 0.000 claims description 36
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000005452 bending Methods 0.000 claims description 3
- 230000002452 interceptive effect Effects 0.000 claims description 3
- 238000005553 drilling Methods 0.000 description 9
- 239000003517 fume Substances 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000012447 hatching Effects 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 238000000576 coating method Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 238000004804 winding Methods 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical group FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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- Engineering & Computer Science (AREA)
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- Condensed Matter Physics & Semiconductors (AREA)
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Description
Claims (5)
- 半導体チップを接着材料を介して基板または他の半導体チップである被実装体に実装する実装装置であって、
前記基板が載置されるボンディングステージと、
前記ボンディングステージを支える基台と、
前記半導体チップを吸引保持して前記被実装体に仮圧着する仮圧着処理と、前記仮圧着された半導体チップを本圧着する本圧着処理と、を行う実装ヘッドと、
前記ボンディングステージまたは前記基台に設けられ、前記本圧着処理時に、前記仮圧着された半導体チップと前記実装ヘッドとの間にカバーフィルムを介在させるフィルム配置機構と、
前記実装ヘッドおよび前記フィルム配置機構の駆動を制御する制御部と、
を備え、
前記フィルム配置機構は、
前記カバーフィルムが掛け渡された一対のローラを有し、順次、新たなカバーフィルムを送り出すフィルム送出機構と、
前記カバーフィルムを、前記基板に対して水平方向に移動させるフィルム移動機構と、
を備え、
前記制御部は、前記カバーフィルムが、前記仮圧着処理時には、前記半導体チップが仮圧着される実装区画から水平方向に離間した退避位置に位置し、前記本圧着処理時には、本圧着対象の半導体チップの真上である仲介位置に位置するように、前記フィルム移動機構を制御し、
前記フィルム送出機構は、前記仲介位置において、前記カバーフィルムが複数回の本圧着処理に分けて本圧着される複数の実装区画の上方を覆うように、前記カバーフィルムを掛け渡しており、
前記制御部は、前記複数回の本圧着処理が終了するまで、前記カバーフィルムの移動およびフィードのいずれも実行することなく当該カバーフィルムを前記仲介位置で待機させ、前記複数回の本圧着処理が終了すれば、前記フィルム移動機構を駆動して前記カバーフィルムが新たな複数の実装区画の上方を覆う位置に移動させるとともに、前記フィルム送出機構を駆動して前記カバーフィルムを前記複数の実装区画に応じた距離だけフィードさせる、
ことを特徴とする実装装置。 - 請求項1に記載の実装装置であって、
前記基板には、半導体チップを実装する実装区画が二次元アレイ状に規定されており、
前記フィルム送出機構は、前記二次元アレイ状の実装区画を、列単位で覆うように、前記カバーフィルムを掛け渡している、
ことを特徴とする実装装置。 - 請求項1または2に記載の実装装置であって、
前記制御部は、前記実装ヘッドに、複数の前記実装区画において前記半導体チップの仮圧着を連続して実行させた後、前記仮圧着された複数の前記半導体チップの本圧着を連続して実行させる、ことを特徴とする実装装置。 - 請求項1から3のいずれか1項に記載の実装装置であって、
前記フィルム配置機構は、さらに、前記カバーフィルムを、前記ボンディングステージに対して昇降させる昇降機構を備える、ことを特徴とする実装装置。 - 請求項1から4のいずれか1項に記載の実装装置であって、
前記フィルム送出機構は、前記実装ヘッドにより押圧されて下方に撓んだ前記カバーフィルムの一部と干渉することで、前記撓みの解消を支援する干渉部材を備える、ことを特徴とする実装装置。
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