SG11201405431TA - Method and apparatus for manufacturing semiconductor device - Google Patents
Method and apparatus for manufacturing semiconductor deviceInfo
- Publication number
- SG11201405431TA SG11201405431TA SG11201405431TA SG11201405431TA SG11201405431TA SG 11201405431T A SG11201405431T A SG 11201405431TA SG 11201405431T A SG11201405431T A SG 11201405431TA SG 11201405431T A SG11201405431T A SG 11201405431TA SG 11201405431T A SG11201405431T A SG 11201405431TA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- manufacturing semiconductor
- manufacturing
- semiconductor
- Prior art date
Links
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0046—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by constructional aspects of the apparatus
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/0036—Heat treatment
- B32B38/004—Heat treatment by physically contacting the layers, e.g. by the use of heated platens or rollers
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- H01L2924/157—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/156—Material
- H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
- H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Thermal Sciences (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012050094 | 2012-03-07 | ||
PCT/JP2013/054096 WO2013133015A1 (en) | 2012-03-07 | 2013-02-20 | Method and apparatus for manufacturing semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
SG11201405431TA true SG11201405431TA (en) | 2014-10-30 |
Family
ID=49116498
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG11201405431TA SG11201405431TA (en) | 2012-03-07 | 2013-02-20 | Method and apparatus for manufacturing semiconductor device |
Country Status (8)
Country | Link |
---|---|
US (1) | US20150050778A1 (en) |
JP (1) | JPWO2013133015A1 (en) |
KR (1) | KR20140140042A (en) |
CN (1) | CN104145328A (en) |
PH (1) | PH12014501961A1 (en) |
SG (1) | SG11201405431TA (en) |
TW (1) | TW201347054A (en) |
WO (1) | WO2013133015A1 (en) |
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JP5876000B2 (en) * | 2012-06-11 | 2016-03-02 | 株式会社新川 | Bonding apparatus and bonding method |
KR101435459B1 (en) * | 2014-03-26 | 2014-08-28 | 실리콘밸리(주) | Semiconductor test pad using adhesive and stacked thin sheets of metal and manufacturing method thereof |
CH708932B1 (en) * | 2013-12-09 | 2017-04-13 | Besi Switzerland Ag | Downholder for holding down the substrate locations of a substrate for the purpose of mounting semiconductor components. |
JP2016009850A (en) * | 2014-06-26 | 2016-01-18 | 東レエンジニアリング株式会社 | Mounting device and mounting method |
US10181460B2 (en) | 2015-03-30 | 2019-01-15 | Toray Engineering Co., Ltd. | Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by method for manufacturing semiconductor device |
JP6483500B2 (en) * | 2015-03-31 | 2019-03-13 | デクセリアルズ株式会社 | Manufacturing method of semiconductor device |
JP6438340B2 (en) * | 2015-04-08 | 2018-12-12 | 積水化学工業株式会社 | Adhesive film for semiconductor bonding and method for manufacturing semiconductor device |
JP2018515908A (en) | 2015-04-10 | 2018-06-14 | エーファウ・グループ・エー・タルナー・ゲーエムベーハー | Substrate holder and method for bonding two substrates |
KR102341750B1 (en) | 2015-06-30 | 2021-12-23 | 삼성전자주식회사 | Semiconductor package and method for fabricating the same |
JP6544146B2 (en) * | 2015-08-27 | 2019-07-17 | 日立化成株式会社 | Semiconductor device and method of manufacturing the same |
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JP6690308B2 (en) * | 2016-03-08 | 2020-04-28 | 日立化成株式会社 | Method for manufacturing semiconductor device |
JP6613194B2 (en) * | 2016-03-30 | 2019-11-27 | 東レエンジニアリング株式会社 | Semiconductor device manufacturing method and manufacturing apparatus |
JP6688543B2 (en) * | 2016-03-30 | 2020-04-28 | 東レエンジニアリング株式会社 | Semiconductor device manufacturing method and semiconductor device manufacturing apparatus |
SG11201809734RA (en) | 2016-05-09 | 2018-12-28 | Hitachi Chemical Co Ltd | Method for manufacturing semiconductor device |
JP6316873B2 (en) * | 2016-05-31 | 2018-04-25 | 株式会社新川 | Die mounting method |
KR102521881B1 (en) * | 2016-06-15 | 2023-04-18 | 삼성전자주식회사 | Semiconductor device and method for fabricating the same |
US20180005916A1 (en) * | 2016-06-30 | 2018-01-04 | Taiwan Semiconductor Manufacturing Company Ltd. | Semiconductor structure and manufacturing method thereof |
KR102371148B1 (en) * | 2016-09-09 | 2022-03-08 | 도레이 카부시키가이샤 | resin composition |
JP2018060836A (en) * | 2016-09-30 | 2018-04-12 | デクセリアルズ株式会社 | Semiconductor device manufacturing method |
JP6789791B2 (en) * | 2016-12-13 | 2020-11-25 | 東レエンジニアリング株式会社 | Semiconductor device manufacturing equipment and manufacturing method |
TWI666738B (en) * | 2017-01-31 | 2019-07-21 | 日商新川股份有限公司 | Device and method for mounting semiconductor wafer |
TWI692044B (en) * | 2017-05-29 | 2020-04-21 | 日商新川股份有限公司 | Packaging device and method for manufacturing semiconductor device |
KR102012237B1 (en) * | 2017-11-24 | 2019-08-21 | 한국기계연구원 | Method of trasferring micro-device array |
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TWI669794B (en) * | 2018-09-27 | 2019-08-21 | 頎邦科技股份有限公司 | Method and device for compression bonding of chip to substrate |
US11309278B2 (en) | 2018-10-29 | 2022-04-19 | Applied Materials, Inc. | Methods for bonding substrates |
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TWI743726B (en) * | 2019-04-15 | 2021-10-21 | 日商新川股份有限公司 | Package device |
US10854530B1 (en) * | 2019-07-31 | 2020-12-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Heat dissipation structures |
JP7083795B2 (en) * | 2019-10-08 | 2022-06-13 | 東レエンジニアリング株式会社 | Mounting device and mounting method |
CN113556882B (en) * | 2020-04-23 | 2022-08-16 | 鹏鼎控股(深圳)股份有限公司 | Manufacturing method of transparent circuit board and transparent circuit board |
KR20220005724A (en) * | 2020-07-07 | 2022-01-14 | 주식회사 프로텍 | Method of Bonding Copper Pillar to PCB by Pressurizing Copper Pillar |
KR102619955B1 (en) * | 2020-07-16 | 2024-01-02 | 가부시키가이샤 신가와 | mounting device |
CN113130336A (en) * | 2021-04-16 | 2021-07-16 | 中国电子科技集团公司第二十四研究所 | Flip-chip welding process method for pre-implanting Au salient points on substrate |
WO2024009498A1 (en) * | 2022-07-08 | 2024-01-11 | 株式会社レゾナック | Method for manufacturing semiconductor device, substrate, and semiconductor element |
CN118136525B (en) * | 2024-05-08 | 2024-07-23 | 日月新半导体(威海)有限公司 | Semiconductor packaging structure and preparation method thereof |
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JP4297984B2 (en) * | 1994-02-17 | 2009-07-15 | 日立化成工業株式会社 | Anisotropic conductive film crimping device |
JP3326382B2 (en) * | 1998-03-26 | 2002-09-24 | 松下電器産業株式会社 | Method for manufacturing semiconductor device |
JP2001237268A (en) * | 2000-02-22 | 2001-08-31 | Nec Corp | Method for mounting semiconductor element and apparatus for manufacturing the same |
JP4684502B2 (en) * | 2001-09-27 | 2011-05-18 | 日東電工株式会社 | Conductive connection method and release sheet used therefor |
JP4449325B2 (en) * | 2003-04-17 | 2010-04-14 | 住友ベークライト株式会社 | Adhesive film for semiconductor, semiconductor device, and manufacturing method of semiconductor device. |
JP2004319823A (en) * | 2003-04-17 | 2004-11-11 | Sumitomo Bakelite Co Ltd | Adhesive film for semiconductor, semiconductor device and method for manufacturing the same |
JP4254650B2 (en) * | 2004-08-02 | 2009-04-15 | セイコーエプソン株式会社 | Semiconductor device mounting apparatus and mounting method |
JP2006066625A (en) * | 2004-08-26 | 2006-03-09 | Nec Corp | Bare chip mounting apparatus, bare chip mounting method, and sheet |
JP2006229124A (en) * | 2005-02-21 | 2006-08-31 | Canon Inc | Connection method and connection structure of ic chip |
JP5024117B2 (en) * | 2007-10-09 | 2012-09-12 | 日立化成工業株式会社 | Circuit member mounting method |
JP5646899B2 (en) * | 2010-07-26 | 2014-12-24 | 新光電気工業株式会社 | Electronic component mounting apparatus and electronic component mounting method |
-
2013
- 2013-02-20 SG SG11201405431TA patent/SG11201405431TA/en unknown
- 2013-02-20 US US14/383,494 patent/US20150050778A1/en not_active Abandoned
- 2013-02-20 KR KR1020147026562A patent/KR20140140042A/en not_active Application Discontinuation
- 2013-02-20 CN CN201380012563.6A patent/CN104145328A/en active Pending
- 2013-02-20 JP JP2013510817A patent/JPWO2013133015A1/en active Pending
- 2013-02-20 WO PCT/JP2013/054096 patent/WO2013133015A1/en active Application Filing
- 2013-03-06 TW TW102107761A patent/TW201347054A/en unknown
-
2014
- 2014-09-01 PH PH12014501961A patent/PH12014501961A1/en unknown
Also Published As
Publication number | Publication date |
---|---|
JPWO2013133015A1 (en) | 2015-07-30 |
KR20140140042A (en) | 2014-12-08 |
WO2013133015A1 (en) | 2013-09-12 |
US20150050778A1 (en) | 2015-02-19 |
TW201347054A (en) | 2013-11-16 |
PH12014501961A1 (en) | 2014-11-24 |
CN104145328A (en) | 2014-11-12 |
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