SG11201809734RA - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor deviceInfo
- Publication number
- SG11201809734RA SG11201809734RA SG11201809734RA SG11201809734RA SG11201809734RA SG 11201809734R A SG11201809734R A SG 11201809734RA SG 11201809734R A SG11201809734R A SG 11201809734RA SG 11201809734R A SG11201809734R A SG 11201809734RA SG 11201809734R A SG11201809734R A SG 11201809734RA
- Authority
- SG
- Singapore
- Prior art keywords
- semiconductor device
- connection portions
- semiconductor
- connection portion
- metal
- Prior art date
Links
- 239000004065 semiconductor Substances 0.000 title abstract 9
- 238000000034 method Methods 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title abstract 3
- 239000002184 metal Substances 0.000 abstract 3
- 238000002844 melting Methods 0.000 abstract 2
- 230000008018 melting Effects 0.000 abstract 2
- 238000007789 sealing Methods 0.000 abstract 2
- 239000000853 adhesive Substances 0.000 abstract 1
- 230000001070 adhesive effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
Classifications
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- H—ELECTRICITY
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- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L24/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
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- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L25/065—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L27/00
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Adhesive Tapes (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE There is disclosed a method for manufacturing a semiconductor device comprising a semiconductor chip having a connection portion and a wiring circuit board having a connection portion, the respective 5 connection portions being electrically connected to each other, or a semiconductor device comprising a plurality of semiconductor chips having connection portions, the respective connection portions being electrically connected to each other. The connection portions consist of metal. The above described method comprises: (a) a first step of 10 press-bonding the semiconductor chip and the wiring circuit board or the semiconductor chips to each other so that the respective connection portions are in contact with each other with a semiconductor adhesive interposed therebetween, at a temperature lower than a melting point of the metal of the connection portion, to obtain a temporarily connected 15 body; (b) a second step of sealing at least a part of the temporarily connected body with a sealing resin to obtain a sealed temporarily connected body; and (c) a third step of heating the sealed temporarily connected body at a temperature equal to or higher than the melting point of the metal of the connection portion, to obtain a sealed 20 connected body. Fig. 1
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JP2016093809 | 2016-05-09 | ||
JP2016115355 | 2016-06-09 | ||
PCT/JP2017/014680 WO2017195517A1 (en) | 2016-05-09 | 2017-04-10 | Method for manufacturing semiconductor device |
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JP (1) | JP6477971B2 (en) |
KR (1) | KR102190177B1 (en) |
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SG (1) | SG11201809734RA (en) |
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WO (1) | WO2017195517A1 (en) |
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JP7176532B2 (en) * | 2017-12-18 | 2022-11-22 | 昭和電工マテリアルズ株式会社 | Semiconductor device, method for manufacturing semiconductor device, and adhesive |
JP6926018B2 (en) * | 2018-03-28 | 2021-08-25 | 東レエンジニアリング株式会社 | Transfer substrate, mounting method using it, and manufacturing method of image display device |
JP7238453B2 (en) * | 2019-02-15 | 2023-03-14 | 株式会社レゾナック | Adhesive for semiconductor |
EP4075485A4 (en) * | 2019-12-13 | 2024-04-10 | Connectec America, Inc. | Method for manufacturing electronic component |
JP2021129083A (en) * | 2020-02-17 | 2021-09-02 | キオクシア株式会社 | Semiconductor device and method for manufacturing the same |
US11769730B2 (en) * | 2020-03-27 | 2023-09-26 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of providing high density component spacing |
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JP2016058655A (en) * | 2014-09-11 | 2016-04-21 | 株式会社ジェイデバイス | Semiconductor device manufacturing method |
US10181460B2 (en) | 2015-03-30 | 2019-01-15 | Toray Engineering Co., Ltd. | Method for manufacturing semiconductor device, semiconductor mounting device, and memory device manufactured by method for manufacturing semiconductor device |
US10669454B2 (en) * | 2015-10-29 | 2020-06-02 | Hitachi Chemical Company, Ltd. | Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer |
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2017
- 2017-04-10 US US16/099,753 patent/US10734350B2/en active Active
- 2017-04-10 KR KR1020187031285A patent/KR102190177B1/en active IP Right Grant
- 2017-04-10 WO PCT/JP2017/014680 patent/WO2017195517A1/en active Application Filing
- 2017-04-10 JP JP2018516901A patent/JP6477971B2/en active Active
- 2017-04-10 SG SG11201809734RA patent/SG11201809734RA/en unknown
- 2017-04-10 CN CN201780028064.4A patent/CN109075088B/en active Active
- 2017-04-12 TW TW106112128A patent/TWI721150B/en active
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JP6477971B2 (en) | 2019-03-06 |
TW201806044A (en) | 2018-02-16 |
US20190123014A1 (en) | 2019-04-25 |
JPWO2017195517A1 (en) | 2018-11-22 |
CN109075088B (en) | 2022-01-07 |
US10734350B2 (en) | 2020-08-04 |
KR102190177B1 (en) | 2020-12-11 |
WO2017195517A1 (en) | 2017-11-16 |
CN109075088A (en) | 2018-12-21 |
TWI721150B (en) | 2021-03-11 |
KR20180128958A (en) | 2018-12-04 |
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