CN100587930C - Flip-chip mounting body and flip-chip mounting method - Google Patents

Flip-chip mounting body and flip-chip mounting method Download PDF

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Publication number
CN100587930C
CN100587930C CN200680016698A CN200680016698A CN100587930C CN 100587930 C CN100587930 C CN 100587930C CN 200680016698 A CN200680016698 A CN 200680016698A CN 200680016698 A CN200680016698 A CN 200680016698A CN 100587930 C CN100587930 C CN 100587930C
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CN
China
Prior art keywords
circuit substrate
electrode terminal
resin
semiconductor chip
flip
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Expired - Fee Related
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CN200680016698A
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Chinese (zh)
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CN101176199A (en
Inventor
白石司
中谷诚一
辛岛靖治
平野浩一
北江孝史
山下嘉久
一柳贵志
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Panasonic Holdings Corp
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Matsushita Electric Industrial Co Ltd
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Publication of CN101176199A publication Critical patent/CN101176199A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
    • H01L24/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

A flip-chip mounting body and a flip-chip mounting method in which a circuit board having a plurality of connection terminals and an electronic component (semiconductor chip) disposed facing the connection terminals and having a plurality of electrode terminals are allowed to face each other with a resin composition consisting of solder powder, resin and a convective additive between them by, so as to provide a uniform interval between them, interposing a spacer or other means or by installing the electronic component (semiconductor chip) inside a platy element having at least two protrusions,solder powder is moved by boiling the convective additive to allow it to self-aggregate to thereby form a solder layer, and the connection terminals and the electrode terminals are electrically connected together.

Description

Flip-chip mounting body and flip-chip mounting method
Technical field
[0001]
The present invention relates on circuit substrate, carry the flip-chip mounting method of semiconductor chip, electronic unit, particularly can also be corresponding with semiconductor chip, the electronic unit of thin spaceization, productivity ratio is high and the flip-chip mounting body and the flip-chip mounting method of the reliability excellence that connects.
Background technology
[0002]
In recent years, the high density of (below be called " semiconductor " or " LSI ") chip, the highly integrated because semiconductor integrated circuit that e-machine uses, high function/multifunction the fast development of e-machine, meanwhile, the multiway of the electrode terminal of semiconductor chip, thin spaceization are advanced by leaps and bounds.When being installed to these semiconductor chips on the circuit substrate, in order to reduce wiring delay, and extensively adopt flip-chip to install.
[0003]
As the method that the LSI chip is installed on the circuit substrate, roughly can be divided into the method for installing again after the LSI chip directly is installed to the method that the flip-chip on the circuit substrate installs and is assembled in the semiconductor packages earlier.
[0004]
In general, installation method as LSI chip with multiway, in the flip-chip mounting process, the convex electrode terminal (pad electrode terminal) that is used in the LSI chip of area array shape arrangement is gone up the solder protuberance (solder bump) that forms, mounting means with electrode engagement on the circuit substrate, with in encapsulation (package) is installed, in the area array type encapsulation of having arranged electrode with encapsulating zone, back side array-like, do media by solder ball, be installed to the mode on the circuit substrate, as the high outstanding technology of reliability, extensively adopt aborning by (for example patent documentation 1 or patent documentation 2).
[0005]
, on the basis of LSI chip multiwayization, be accompanied by the granular of Wiring technique rules, the downsizing of LSI chip size, pin thin spaceization is at interval quickened.In the mounting means of the joint that the solder ball that the backplate of utilizing solder protuberance that the LSI chip electrode forms and the encapsulation of area array N-type semiconductor N of prior art forms carries out, be accompanied by thin spaceization, electrode size is more and more littler, need dwindle the size of solder protuberance and solder ball.This is that the scolder of fusing will overflow to the electrode convex because the size of solder protuberance and solder ball is when big, and the pin that makes adjacency is the cause of short circuit each other., be formed uniformly minute sized solder protuberance and solder ball, and then stably on circuit substrate, engage, but very difficult.
[0006]
In addition, in flip-chip is installed, normally on the electrode terminal of semiconductor chip, form solder protuberance, the unified again splicing ear that forms on this solder protuberance and the circuit substrate that engages.But be installed on the circuit substrate for electrode terminal quantity being surpassed 5000 the sort of follow-on semiconductor chip, need to form and the corresponding solder protuberance of thin space below the 100 μ m., present solder protuberance forms technology, but is difficult to adapt to this requirement.
[0007]
In addition, because need to form the solder protuberance corresponding, so, also require to enhance productivity by the lift-launch beat that shortens each chip in order to realize cost degradation with electrode terminal quantity.
[0008]
At present, for corresponding with the increase of electrode terminal, the electrode terminal of semiconductor chip is divided a word with a hyphen at the end of a line from disposing to area configurations on every side.
[0009]
In addition, according to high density, highly integrated requirement, can expect that semiconductor technology will develop to 65nm, 45nm from 90nm.For corresponding therewith, press for insulating material, and, introducing the insulating material of porous in order to realize this hope with low dielectric constant.
[0010]
, behind the insulating material of use porous,, need install with low load in order to reduce damage to insulating material and active circuit.And then because the slimming of semiconductor chip, the damage that occurs in order to prevent to operate is also wished to install with low load.Particularly during area configurations, need on active circuit, constitute electrode, so require the method for installing with lower load.
[0011]
Therefore, that requirement can be applicable to that the progress of semiconductor technology from now on occurs is slim, the flip-chip mounting method of densification.
[0012]
In the prior art,, develop galvanoplastic and screen painting method etc. as the formation technology of solder protuberance.Although galvanoplastic are suitable for thin space, because complex procedures etc. exist the low problem of production efficiency.In addition, though screen painting method production efficiency height using on the mask this point, but is not suitable for thin space.
[0013]
Under this situation, develop several form solder protuberance selectively on semiconductor chip and circuit substrate technology recently.These technology owing to not only be suitable for forming trickle solder protuberance, and can unify to form solder protuberance, thus the production efficiency excellence be used as and may be suitable for follow-on semiconductor chip is installed to technology on the circuit substrate, noticeable.
[0014]
One of them is: adopt the solder cream with the mixture formation of solder powder and flux, the dense surface that is coated to forms on the circuit substrate of electrode terminal, again with after the circuit substrate heating, make the solder powder fusing, on the high electrode terminal of wetability, form the technology (for example patent documentation 3) of solder protuberance selectively.
[0015]
In addition, also has a technology that is known as " super solder cream method ".This technology will be with organic acid lead salt and the metallic tin paste constituent (chemical reaction precipitation type scolder) as main component, dense being coated on the circuit substrate that forms electrode terminal, again with after the circuit substrate heating, make it produce the displacement reaction of Pb and Sn, on the electrode terminal of circuit substrate, separate out the technology (for example patent documentation 4) of the alloy of Pb and Sn selectively.
[0016]
In addition, in the flip-chip of prior art is installed, with after semiconductor-chip-mounting is to the circuit substrate that forms solder protuberance, for semiconductor chip is fixed on the circuit substrate, and then the resin that needs to be known as " filler " injects the operation between semiconductor chip and the circuit substrate.Therefore, exist the problem of the increase of operation quantity, decrease in yield.
[0017]
Therefore, be electrically connected and semiconductor chip is fixed to the method for carrying out simultaneously on the circuit substrate, develop the flip-chip mounting technique of using anisotropic conductive material as the splicing ear of electrode terminal that makes relative semiconductor chip and circuit substrate.This is to contain between the thermosetting resin supply circuit substrate and semiconductor chip of conducting particles, in the semiconductor chip pressurization, with thermosetting resin heating, thereby realize being electrically connected and fixing method (for example patent documentation 5) of semiconductor chip and circuit substrate simultaneously.
Patent documentation 1: the spy of Japan opens flat 11-163510 communique
Patent documentation 2: the spy of Japan opens flat 11-067829 communique
Patent documentation 3: the spy of Japan opens the 2000-94179 communique
Patent documentation 4: the spy of Japan opens flat 1-157796 communique
Patent documentation 5: the spy of Japan opens the 2000-332055 communique
[0018]
; in the sort of super solder cream method shown in the sort of solder protuberance formation method shown in the patent documentation 3 and the patent documentation 4; merely behind coating paste constituent on the circuit substrate; owing to produce the thickness of locality and the deviation of concentration; the scolder amount of separating out is different mutually in each splicing ear, so can not obtain solder protuberance highly uniformly.In addition, because these methods form coating paste constituent on splicing ear, the irregular circuit substrate on the surface, so can not on the splicing ear that becomes protuberance, supply with the scolder of q.s, in flip-chip is installed, be difficult to obtain the solder protuberance of desired height.
[0019]
In addition, in the sort of flip-chip mounting method shown in the patent documentation 5, aspect production performance and reliability, exist urgency shown below many problems to be solved.
[0020]
In other words, the 1st, owing to utilize to be situated between the mechanical contact of conducting particles is arranged, obtain the conducting of the electric property between the electrode terminal, so be difficult to realize stable conducting state.The 2nd, because the difference along with the difference of the amount of the conducting particles that exists between semiconductor chip and each terminal of circuit substrate at interval, so the joint instability of electric property.The 3rd, the thermal process that thermosetting resin is hardened is dispersed conducting particles, causes short circuit, causes decrease in yield.The 4th, owing to become the structure that semiconductor chip exposes on circuit substrate,, become the reason of fault so the friction when being installed to circuit substrate on the machine, impact etc. cause the bad connection of semiconductor chip.The 5th, in order to realize stable electrical connection, need with very high pressure (load) pressurization crimping, so be easy to generate problems such as semiconductor chip is damaged.
Summary of the invention
[0021]
The present invention develops in order to address the above problem, and its purpose is to provide and electrode terminal quantity can be surpassed that 5000 the sort of follow-on semiconductor chip is installed to, production performance and all excellent flip-chip mounting body and the flip-chip mounting method of reliability.
[0022]
In other words, electronic unit installed part provided by the invention (the 1st invention), it is characterized in that: be the electronic device installing bodies that possesses electronic unit, the circuit substrate parts of described electronic unit are installed, described electronic unit, surface towards the electronic unit of described circuit substrate forms a plurality of electrode terminals; Described circuit substrate is with the electrode terminal of formation correspondingly of described a plurality of electrode terminals; Employing is disposed the structure of a plurality of liners (spacer) parts in the electrode terminal section zone in addition of the electrode terminal and the electronic unit of the circuit substrate of described connection; The electrode terminal of described circuit substrate and the electrode terminal of described electronic unit, the solder protuberance that is formed by self-assembly is electrically connected (self-aggregating manner).
[0023]
In certain suitable execution mode, the height of described a plurality of liner components, setting becomes the height of described solder protuberance, in the electrode terminal of described electronic unit in the electrode terminal of a half-sum at described circuit substrate of the length on the shortest limit below the height of half addition of the length on the shortest limit.
[0024]
In certain suitable execution mode, described a plurality of liner components adopt scolder to constitute.
[0025]
In certain suitable execution mode, described a plurality of liner components adopt thermmohardening type resin material to constitute.
[0026]
In certain suitable execution mode, described a plurality of liner components adopt photo-hardening type resin material to constitute.
[0027]
In certain suitable execution mode, described a plurality of liner components adopt the thermoplastic resin material to constitute.
[0028]
In certain suitable execution mode, described a plurality of liner components adopt heat fusing type resin material to constitute.
[0029]
In certain suitable execution mode, described a plurality of liner components adopt with resin material and cover the core material structure.
[0030]
E-machine of the present invention is the e-machine that possesses above-mentioned electronic device installing bodies.
The manufacture method of electronic device installing bodies of the present invention comprises: preparation has the operation (a) of the electronic unit on the surface of having arranged electrode terminal; Preparation has the operation (b) of circuit substrate of having arranged the surface of electrode terminal with the electrode terminal of described electronic unit accordingly, beyond the described electrode terminal section on the face with described electrode terminal of at least one in described electronic unit or circuit substrate, form the operation (c) of a plurality of liners; To contain the solder resin cream of the convection current additive that seethes with excitement when solder powder and this resin are heated in the resin, give the operation (d) of described circuit substrate; Across described solder resin cream, described electronic unit is configured in operation (e) on the described circuit substrate; Heat described solder resin cream, make the boiling of described convection current additive, utilize described resin, electrode terminal that described electronic unit is had and the operation (f) that is electrically connected with electrode terminal that described electrode terminal forms on described circuit substrate accordingly; Under the effect of a plurality of liners of preparing with described operation, the electrode terminal of arranging at described electronic unit and correspondingly between the electrode terminal of arranging on the circuit substrate face forms certain clearance.
[0031]
The manufacture method of other of electronic device installing bodies of the present invention, preparation has the operation (a) of the electronic unit on the surface of having arranged electrode terminal; Preparation has the operation (b) of circuit substrate of having arranged the surface of electrode terminal with the electrode terminal of described electronic unit accordingly, beyond the described electrode terminal section on the face with described electrode terminal of at least one in described electronic unit or circuit substrate, form the operation (c) of a plurality of liners; Described electronic unit is configured in operation (d) on the described circuit substrate; To make the solder resin cream that contains the convection current additive that seethes with excitement when solder powder is heated with this resin in the resin, be filled to the operation (e) in the space that forms between described electronic unit and the circuit substrate; Heat described solder resin cream, make the boiling of described convection current additive, utilize described resin, electrode terminal that described electronic unit is had and the operation (f) that is electrically connected with electrode terminal that described electrode terminal forms on described circuit substrate accordingly; Under the effect of a plurality of liners of preparing with described operation,
The electrode terminal of arranging at described electronic unit and correspondingly between the electrode terminal of arranging on the circuit substrate face forms certain clearance.
[0032]
Other manufacture method of the present invention is characterized in that: in the operation that described electronic unit is configured on the described circuit substrate, utilize described a plurality of liner, carry out adhering to, keeping of electronic unit and circuit substrate.
[0033]
And then the invention provides flip-chip mounting body (the 2nd invention), it is characterized in that: have circuit substrate (this circuit substrate has a plurality of splicing ears), semiconductor chip (this semiconductor chip has a plurality of electrode terminals of relative configuration with splicing ear), plate body (this plate body is bonding in the inboard contraposition of semiconductor chip, has 2 lug bosses at least in the end); In the electrode terminal of electrode terminal that is electrically connected circuit substrate with solder layer and semiconductor chip, also use resin permanent circuit substrate and semiconductor chip at least.
[0034]
And then, can surround circuit substrate electrode terminal electrode is set, on electrode, form pseudopods (pseudbump).
[0035]
And then electrode can form discretely.
[0036]
And then the front end of the lug boss of plate body can be made of the resin of metal or coating metal at least, and scolder is had wetability.
[0037]
And then the lug boss of circuit substrate and plate body engages by crimping or ultrasonic wave, is joined together.
[0038]
And then circuit substrate and plate body can be by the resin-bonded of resin combination.
[0039]
After adopting these structures, because lug boss is arranged, can the interval of the electrode terminal of the splicing ear of circuit substrate and semiconductor chip is certain, so can become uniform connection.And then, because do not expose, so the fault of the bad connection that the impact can realize stopping to transport the time, friction cause, the flip-chip mounting body of reliability excellence at circuit substrate semiconductor-on-insulator chip.
[0040]
In addition, flip-chip mounting method of the present invention, it is characterized in that: be relative with circuit substrate with a plurality of splicing ears, configuration has the semiconductor chip of a plurality of electrode terminals, flip-chip mounting method with the electrode terminal of the splicing ear of circuit substrate and semiconductor chip is electrically connected has: make semiconductor chip and end at least have bonding operation after the plate body contraposition of 2 lug bosses; To be the resin combination of main component with solder powder and convection current additive and resin, coating or attached to the operation on circuit substrate or the semiconductor chip; Make after the lug boss contraposition of the plate body of bonding semiconductor chip on the circuit substrate and dispose, also utilize lug boss simultaneously, make the interval of circuit substrate and semiconductor chip become fixing definitely operation; Resin combination is heated to the temperature that solder powder melts, makes the boiling of convection current additive or decompose the operation of generation gas; Gaseous exchange, the process of discharging between the lug boss of plate body, the solder powder that makes fusing flows in resin combination, makes solder powder self-assembly and growth, thus the operation that splicing ear and electrode terminal are electrically connected.
[0041]
And then resin combination can be made of tabular resin, resins in film form or paste resin, can be attached on circuit substrate or the semiconductor chip.
[0042]
And then, the lug boss of plate body is fixed to operation on the circuit substrate, can utilize the scolder of the fixedly usefulness that on circuit substrate, forms in advance to fix.
[0043]
And then, the lug boss of plate body being fixed to operation on the circuit substrate, can engage by crimping or ultrasonic wave, the lug boss of plate body is joined on the circuit substrate.
[0044]
After adopting these methods, because can be enough low load installs, so can use the semiconductor chip of slim, area configurations etc. and the insulating material of low dielectric constant.And then, the firm connection and the flip-chip mounting method of reliability excellence that can realize semiconductor chip and circuit substrate.And then, owing to can make the engagement state between electrode terminal and the splicing ear even, can also improve rate of finished products and make efficient.
[0045]
In addition, flip-chip mounting body of the present invention, it is characterized in that: have circuit substrate (this circuit substrate has a plurality of splicing ears), semiconductor chip (this semiconductor chip has a plurality of electrode terminals of relative configuration with splicing ear), box-shaped body (this box-shaped body is bonding in the inboard contraposition of semiconductor chip, has the hole that can ventilate of opening in one direction at least); In the electrode terminal of electrode terminal that is electrically connected circuit substrate with solder layer and semiconductor chip, also use resin permanent circuit substrate and semiconductor chip at least.
[0046]
And then box-shaped body can cover semiconductor chip, is processed to the periphery at the opening of box-shaped body, has the box shape of holding the outstanding flange in limit week.
[0047]
And then, the described hole that can ventilate of box-shaped body, can be only at the side wall portion opening of the not bonding semiconductor chip of box-shaped body.
[0048]
And then, electrode is set the electrode terminal of encirclement circuit substrate, can on electrode, form pseudopods.
[0049]
And then electrode can form discretely.
[0050]
And then box-shaped body can be made of the resin of metal or coating metal, and scolder is had wetability.
[0051]
And then circuit substrate and box-shaped body can engage by crimping or ultrasonic wave, are joined together.
[0052]
And then circuit substrate and box-shaped body can be by the resin-bonded of resin combination.
[0053]
After adopting these structures, because it is can utilize the side wall portion of box-shaped body that the interval of the electrode of the splicing ear of circuit substrate and semiconductor chip is certain, so can become uniform connection, also reduce the warpage of circuit substrate.And then, because do not expose, so the fault of the bad connection that the impact can realize stopping to transport the time, friction cause, the flip-chip mounting body of reliability excellence at circuit substrate semiconductor-on-insulator chip.
[0054]
In addition, flip-chip mounting method of the present invention, it is characterized in that: be relative with circuit substrate with a plurality of splicing ears, configuration has the semiconductor chip of a plurality of electrode terminals, flip-chip mounting method with the electrode terminal of the splicing ear of circuit substrate and semiconductor chip is electrically connected has: make bonding operation after semiconductor chip and the box-shaped body contraposition that has the hole that can ventilate of opening in one direction at least; To be the resin combination of main component with solder powder and convection current additive and resin, coating or attached to the operation on circuit substrate or the semiconductor chip; Make bonding on the circuit substrate and dispose after the box-shaped body contraposition of semiconductor chip, also utilize the side end of the open side of box-shaped body simultaneously, make the interval of circuit substrate and semiconductor chip become fixing definitely operation; Resin combination is heated to the temperature that solder powder melts, makes the boiling of convection current additive or decompose the operation of generation gas; Gaseous exchange the process of discharging from the hole of box-shaped body, flows the solder powder of fusing in resin combination, make solder powder self-assembly and growth, thus the operation that splicing ear and electrode terminal are electrically connected.
[0055]
And then resin combination can be made of tabular resin, resins in film form or paste resin, can be attached on circuit substrate or the semiconductor chip.
[0056]
And then, the side end of the open side of box-shaped body is fixed to operation on the circuit substrate, can utilize the scolder of the fixedly usefulness that on circuit substrate, forms in advance to fix.
[0057]
And then, the side end of the open side of box-shaped body being fixed to operation on the circuit substrate, can engage by crimping or ultrasonic wave, box-shaped body is joined on the circuit substrate.
[0058]
And then, the side end of the open side of box-shaped body is fixed to operation on the circuit substrate, can be to make resin combination between circuit substrate and semiconductor chip, the side end of the open side of box-shaped body is pressed into operation till joining with circuit substrate.
[0059]
After adopting these methods, because can be enough low load installs, so can use the semiconductor chip of slim, area configurations etc. and the insulating material of low dielectric constant.And then, the firm connection and the flip-chip mounting method of reliability excellence that can realize semiconductor chip and circuit substrate.In addition, owing to can make the engagement state between electrode terminal and the splicing ear even, can also improve rate of finished products and make efficient.
[0060]
After adopting the present invention, possessing electronic unit and the fixing body that the circuit substrate of described electronic unit has been installed---on the electronic unit surface towards described circuit substrate of described electronic unit, form a plurality of electrode terminals, on described circuit substrate, corresponding with each of described a plurality of electrode terminals, form electrode terminal, zone beyond the electrode terminal section of the electrode terminal of the circuit substrate of described connection and electronic unit, dispose in the structure of a plurality of adjustment component, the electrode terminal of described circuit substrate and the electrode terminal of described electronic unit, the scolder that is formed by self-assembly ground is electrically connected.Like this, the gaps between electrodes of the correspondence of the high realization easily of precision actual installation is apart from the unified suitable distance that connects.Be easy to realize accurately the electrode of the electronic unit that will install and the gaps between electrodes distance of corresponding circuit substrate with it, as the unified suitable distance that connects the solder protuberance formation of self-assembly ground formation therebetween.Its result can realize the electronic device installing bodies that productivity and reliability are all excellent.
[0061]
And then, after adopting flip-chip mounting body of the present invention and installation method thereof, in the method that can become the installation that is connected firmly that makes semiconductor chip and circuit substrate, also because on the circuit substrate that semiconductor chip has been installed, semiconductor chip does not expose, so be not easy to produce the impact when transporting, the faults such as bad connection that friction causes, can realize the flip-chip mounting body of reliability excellence.And then, owing to can make the engagement state between electrode terminal and the splicing ear even, can also produce the effect that improves rate of finished products and make efficient.
Description of drawings
[0062]
Fig. 1 (a)～(c) is the concise and to the point profile that utilizes this fixing body in the manufacturing process of electronic device installing bodies of solder protuberance formation technology.
Fig. 2 (a)～(e) is the concise and to the point profile of this fixing body in the manufacturing process of the electronic device installing bodies in a kind of sample attitude of the present invention.
Fig. 3 is the flow chart of the manufacturing process of the electronic device installing bodies in a kind of sample attitude of the present invention.
Fig. 4 (a)～(e) is the concise and to the point profile of this fixing body in the manufacturing process of the electronic device installing bodies in other sample attitude of the present invention.
Fig. 5 is the flow chart of the manufacturing process of the electronic device installing bodies in other sample attitude of the present invention.
Fig. 6 is a figure of telling about the desirable clearance distance between the electrode terminal of the backplate of the semiconductor packages that embodiments of the present invention relate to and circuit substrate.
Fig. 7 (a)～(e) is the concise and to the point profile of this fixing body in the manufacturing process of the electronic device installing bodies in other sample attitude of the present invention.
Fig. 8 (a) is the stereogram of the flip-chip mounting body in expression the 1st execution mode of the present invention, (b) is A～A line profile of Fig. 8 (a).
Fig. 9 tells about the flip-chip mounting body in the 1st execution mode of the present invention and the concise and to the point process profile of flip-chip mounting method.
Figure 10 (a) is the stereogram from the plate body of oblique beneath Fig. 3 (a), (b) is the stereogram of plate body that the semiconductor chip of Fig. 3 (b) has been installed from oblique beneath.
Figure 11 (a) is the stereogram of the flip-chip mounting body in expression the 2nd execution mode of the present invention, (b) is A～A line profile of Fig. 5 (a).
Figure 12 tells about the flip-chip mounting body in the 2nd execution mode of the present invention and the concise and to the point process profile of flip-chip mounting method.
Figure 13 (a) is the stereogram from the box-shaped body of oblique beneath Fig. 6 (a), (b) is the stereogram of box-shaped body that the semiconductor chip of Fig. 6 (b) has been installed from oblique beneath.
Symbol description
[0063]
10 semiconductor packages (electronic unit)
11 backplate terminals
20 liners (spacer)
21,22 engages protrusion (joining pad)
23 core material
24 resin materials
30 solder creams
31 convection current
40 circuit substrates
41 electrode terminals
50 solder protuberances
100 electronic device installing bodies (electronic-part mounting body)
110 circuit substrates
111 splicing ears
112 convection current additives
113 solder resin cream
121 element electrodes
122 solder protuberances
201,307,401,510 circuit substrates
204,308,402,511 splicing ears
407 resins
306 resin combinations
206,304,404,507 semiconductor chips
207,305,406,508 electrode terminals
208,313,405,514 solder layers
200,400 flip-chip mounting bodies
202,302 lug bosses
203,407,509 resin combinations
205,301 plate bodys
209,314 pseudopodses (pseudbump)
210,309 electrodes
403,504 box-shaped bodies
303 vacuum suction devices
310 bonding electrodes
311,512 heaters
312,513 gases
408,506 holes
409,505 flanges
501 Handling devices
502 hinges
Embodiment
[0064]
Below, tell about the 1st invention.
[0065]
The applicant develops and can make the scolder self-assembly under rated condition, forms solder protuberance or carries out the technology that has alone that flip-chip is installed, and is willing to tell about in 2004-257206 specification and the special 2004-267919 of the hope specification the spy.The spy is willing to 2004-257206 specification and special be willing to quote as the part of this specification for 2004-267919 number here.
[0066]
Below, with reference to Fig. 1 (a)～Fig. 1 (c), simply tell about the technology that self-assembly forms solder protuberance.
[0067]
At first, shown in Fig. 1 (a),, supply with and contain not shown metallic (for example solder powder) and convection current additive 112 to the circuit substrate 110 that forms a plurality of splicing ears 111.In addition and mentioned above same, the boiling back produced the additive of convection current when convection current additive 112 was heating solder resin cream 113.
[0068]
Then, shown in Fig. 1 (b), will have the semiconductor chip 120 of a plurality of element electrodes 121 and the surface of solder resin cream 113 and join.At this moment, the element electrode 121 of semiconductor chip 120 is relatively disposed by the splicing ear 111 with circuit substrate 110.Then, under this state, heating solder resin cream 113.Here, the heating-up temperature of solder resin cream 113 is carried out with the temperature of the boiling point that is higher than the fusing point of metallic and convection current additive 112.
[0069]
Be heated the molten metal particle, in solder resin cream 113, interosculate, shown in Fig. 1 (c), self-assembly between high splicing ear 111 of wetability and element electrode 121.Like this, form the connector 122 that is electrically connected between the splicing ear 111 with the element electrode 121 of semiconductor chip 120 and circuit substrate 110.Then, make the hardening of resin in the solder resin cream 113, thereby semiconductor chip 120 is fixed on the circuit substrate 110.
[0070]
Above-mentioned technology is characterised in that: when solder resin cream 113 is heated, convection current additive 112 boilings that contain in the solder resin cream 113, the convection current additive 112 of boiling makes in the solder resin cream 113 and produces convection current, thereby promotes to be dispersed in moving of metallic in the solder resin cream 113.Like this, the combination of metallic is carried out equably, self-assembly ground forms connector (solder protuberance) 122.Can think that solder resin cream 113 has been the effects that make " sea " that metallic freely swims, moves here.But because the process that metallic is bonded to each other, finish in the extremely short time, so no matter " sea " that how many metallics can freely move is set, also can only carry out the combination of locality, become the solder resin cream 113 in this " sea " and the combination of the convection current that convection current additive 112 causes so utilize, can form solder protuberance 122 in self-assembly ground.In addition, solder protuberance 122 as the character of solder protuberance, also oneself is integrally formed when self-assembly ground forms.
[0071]
The purpose of said method is to make the resin combination that contains solder powder and then contain the convection current additive, thus the additional unit that the solder powder of dissolving is moved.In addition, the convection current additive can be the solvent that seethes with excitement or evaporate after the heating, after operation finishes, does not almost remain in resin combination.
[0072]
In above-mentioned technology, shown in Fig. 1 (b), need be between the splicing ear 111 of the element electrode 121 of semiconductor chip 120 and circuit substrate 110, forming is situated between the suitable certain clearance distance of solder resin cream 113.In other words, the interval of semiconductor chip 120 and circuit substrate 110 is near excessively, will be created in the not connecting portion in this gap, can not form the problem of described connector 122; Otherwise, far away excessively, then can not be created in not the connecting portion that joins with described resin, can not form the problem of described connector 122.
[0073]
Therefore, the inventor makes great efforts to study the content of the solder bonds technology that need separate this self-assembly that must not form this problem of connector, found that the way that addresses this problem, and has formed the present invention.
[0074]
Below, with reference to accompanying drawing, tell about embodiments of the present invention.In following accompanying drawing, for making interest of clarity, for the inscape that has identical function in fact, give identical symbol.In addition, the present invention is not limited to following execution mode.
[0075]
Below, with reference to Fig. 2～Fig. 7, tell about electronic device installing bodies 100 and manufacture method thereof that embodiments of the present invention relate to.
[0076]
Fig. 2 (a)～Fig. 2 (e) is in the master operation of the electronic device installing bodies that relates to of expression present embodiment and the concise and to the point profile when finishing, and Fig. 3 is the flow chart of this installation procedure.
[0077]
In Fig. 2 (a), the section structure of the semiconductor packages that the electronic device installing bodies 100 of 10 expression present embodiments uses with the arrangement of area array terminal, the 11st, the backplate terminal that area array is arranged, the 20th, by having the liner that dystectic scolder constitutes, the engages protrusion that 21 expressions engage with liner.
[0078]
In Fig. 2 (b), the section structure of the circuit substrate that the electronic device installing bodies 100 of 40 expression present embodiments uses, the 41st, with backplate terminal 11 electrode terminals that be connected correspondingly, that form on the surface of circuit substrate 40 of semiconductor packages 10 formation, the engages protrusion that the surface at circuit substrate 40 that 22 expressions engage with liner 20 forms, 30 expression solder creams.
[0079]
At first, shown in Fig. 2 (a), prepare the assigned position that has the semiconductor packages 10 of backplate terminal 11 in one side, form engages protrusion 21 and form the parts (S01) of liner 20 thereon.As the material of engages protrusion 21, must be the material that can engage maintenance behind the materials such as scolder that use of coating liner 20.As an example, can to encapsulate 10 backplate terminal 11 same with ordinary semiconductor, adopt the structure of gold-plated on metals such as Cu (Au).Liner 20 preferably is made of the high dystectic scolder of the fusion temperature of the scolder powder body material that comprises in the solder cream of hereinafter telling about 30.For example: the scolder powder body material that comprises in the solder cream 30 is PbSn eutectic solder (183 ℃ of a fusing point), the SnAgCu class material that the high melting point solder of liner 20 is (220 ℃ of fusing points).
[0080]
On the other hand, prepare to have required wiring pattern (not shown), on one face, form respectively the circuit substrate 40 (S02) of the engages protrusion 22 that electrode terminal 41 corresponding with the backplate terminal 11 of semiconductor packages 10 and liner 20 engage.
[0081]
Shown in Fig. 2 (b), the position of the regulation on circuit substrate 40, being situated between has liner 20 ground to carry semiconductor packages 10 (S03).At this moment, the electrode terminal 41 that backplate terminal 11 that semiconductor packages 10 forms and the circuit substrate corresponding with it 40 form is provided with predetermined gap.
[0082]
After carrying semiconductor packages 10, shown in Fig. 2 (c), will in resin, add the solder resin cream 30 of solder powder and convection current additive, flowed into the clearance space of semiconductor packages 10 and circuit substrate 40, carried out filling (S04).
[0083]
The convection current additive is the material that this resin is heated time boiling, for example is organic solvent.Behind the heating solder resin cream 30, shown in Fig. 2 (d), the convection current additive boiling in the solder resin cream 30 produces convection current in resin.So shown in Fig. 2 (e), the solder powder self-assembly in the solder resin cream 30 forms solder protuberance 50.Utilize this solder protuberance 50, with the backplate terminal 11 of semiconductor packages 10 and electrode terminal 41 unified be connected (S05) of circuit substrate 40.
[0084]
In addition, carry in the later operation of operation (S03), need carry out the disposal of for example clamping semiconductor packages 10 and circuit substrate 40 etc., from circuit substrate 40 so that semiconductor packages 10 is not come off in semiconductor packages 10.
[0085]
In the present embodiment, because can be between the electrode terminal 41 of the backplate terminal 11 of semiconductor packages 10 and corresponding with it circuit substrate 40, precision is provided with the suitable clearance distance of regulation well and at an easy rate, does not form the problem that connects projection 50 so can prevent.
[0086]
Then, with reference to Fig. 4 (a)～Fig. 4 (e) and Fig. 5, tell about a Change Example of the manufacture method of present embodiment.
Fig. 4 (a)～Fig. 4 (e) is in the master operation of the electronic device installing bodies that relates to of the Change Example of present embodiment and the concise and to the point profile when finishing.And then Fig. 5 is the flow chart of this installation procedure.
[0087]
In the present embodiment, at first, shown in Fig. 4 (a), prepare the assigned position that has the semiconductor packages 10 of backplate terminal 11 in one side, form engages protrusion 21 and form the parts (S01) of liner 20 thereon.
[0088]
For another example shown in Fig. 4 (b), preparation has applied the parts (S06) of the solder resin cream 30 of aequum having required wiring pattern (not shown), forming respectively the assigned position on the face of circuit substrate 40 of the engages protrusion 22 that the electrode terminal 41 corresponding with the backplate terminal 11 of semiconductor packages 10 and liner 20 engage on the one face.
[0089]
Shown in Fig. 4 (c), the position of the regulation on circuit substrate 40, be situated between have liner 20 and with solder resin cream 30 mutually ground connection carry semiconductor packages 10 (S03).
[0090]
Behind the heating solder resin cream 30, shown in Fig. 4 (d), the convection current additive boiling in the solder resin cream 30 produces convection current 31 in resin.So shown in Fig. 4 (e), the solder powder self-assembly in the solder resin cream 30 forms solder protuberance 50.Utilize this solder protuberance 50, with the backplate terminal 11 of semiconductor packages 10 and electrode terminal 41 unified be connected (S05) of circuit substrate 40.
[0091]
In addition, carry in the later operation of operation (S03), need carry out the disposal of for example clamping semiconductor packages 10 and circuit substrate 40 etc., from circuit substrate 40 so that semiconductor packages 10 is not come off in semiconductor packages 10.
[0092]
In the Change Example of present embodiment, solder-coating resin plaster 30 on the face of circuit substrate 40 in advance, thus can omit the operation (S4) that solder resin cream 30 is flowed into the gap of semiconductor packages 10 and circuit substrate 40.Like this, because solder resin cream 30 needn't possess the inflow performance, so can enlarge the scope that material is selected.
[0093]
In the above-described embodiment, semiconductor packages 10 is carried on the circuit substrate 40 operation (S03) afterwards, use liner 20 parts that form with scolder to utilize the maintenance of solder bonds, thereby prevent that semiconductor packages 10 from not coming off from circuit substrate 40.In addition, undoubtedly, in advance solder resin cream 30 is coated to a side of semiconductor packages 10, also can obtains same effect.
[0094]
In the above-described embodiment, in order to form the very high gap of precision, form the number of liner 20, preferably more than 3.This is because the semiconductor packages 10 of carrying on circuit substrate 40 does not tilt the cause that the clearance distance precision is high.
[0095]
In the above-described embodiment, desirable clearance distance between the backplate terminal 11 of semiconductor packages 10 and the electrode terminal of circuit substrate 40, as shown in Figure 6, the length that makes the minor face in the backplate terminal 11 of semiconductor packages 10 sides is that the length of the minor face in the electrode terminal 41 of min.Lp, circuit substrate 40 sides is min.Ls, and the maximum of clearance distance is just preferably below half of min.Lp and min.Ls so.Its reason is: the solder protuberance 50 that forms between the backplate terminal 11 of semiconductor packages 10 and the electrode terminal of circuit substrate 40 greater than this distance after, overflowing causes the big cause of possibility of short circuit to the electrode terminal 11,41.
[0096]
In the above-described embodiment, use high-temperature solder as liner 20.But be to use thermmohardening type resin, photo-hardening type resin, thermoplastic resin, heat fusing type resin etc. to have the resin material of diversified cementability, also can obtain same effect.
[0097]
And then, also can be shown in Fig. 7 (a)～(e), the adhering resin of structure that adopts the thermmohardening type resin material of keeping unhardened part 24 that for example will have cementability to cover the core material 23 of the thermmohardening type resin after the sclerosis fully covers the such composite construction of magnetic core liner.
[0098]
Here, thermmohardening type resin for example can be enumerated epoxy resin, phenolic resin, cyanate resin, poly-(two) phenylate resin or their mixture.
[0099]
Photo-hardening type resin, be to shine the ultraviolet ray back generation polymerization reaction of stipulating and the resin that forms, for example, can enumerate the material that has used acrylic quasi-oligomer such as polyester acrylic fat, urethane acrylate, epoxy acrylate and unsaturated polyester, alkene mercaptan (enthiol) or their compound as the atomic group polymeric type.As the cationic polymerization class, can enumerate the epoxy resin that used glycidol ethers, alicyclic epoxy resin class etc. or the material of oxetanes class, vinethene cluster or their compound.
[0100]
As thermoplastic resin, for example can enumerate polyethylene (PE), polypropylene (PP), polystyrene (PS), propylene green grass or young crops/styrene resin (AS), propylene green grass or young crops/butadiene/styrene resin (ABS), methacryl resin (PMMA), vinyl chloride (PVC) etc.
[0101]
As heat fusing type resin material, for example can enumerate EVA (vinyl acetate class), PA (polyamide-based), PP (polypropylene type), rubber-like etc.
[0102]
The solder resin cream 30 of above-mentioned execution mode as mentioned above, contains the convection current additive that seethes with excitement when solder powder and this resin are heated in resin.In other words, solder resin cream 30 by resin, be dispersed in solder powder (not shown) in the resin and this resin when being heated the convection current additive (not shown) of boiling constitute.In the present embodiment, as resin, use thermmohardening type resin (for example epoxy resin); As solder powder, use the free solder powder of Pb, as the convection current additive, can use solvent (for example high boiling organic solvent), as an example, can use isopropyl alcohol, butyl acetate, butyl carbitol, ethylene glycol etc.The amount of solder powder is preferably below the 30vol%.The amount of convection current additive in resin is not particularly limited, but contains in resin with the ratio of 0.1～20 weight %, and be the most desirable.
[0103]
In addition, as mentioned above, " convection current " of so-called convection current additive, be meant convection current as motion morphology, so long as the boiling the convection current additive in resin, move after, award metallic (solder powder) kinetic energy that is dispersed in the resin, work to promote the motion of moving of metallic, no matter which kind of form is all right.In addition, the convection current additive except the back of itself seething with excitement produces the material of convection current, can also use resin heating back generation gas (H 2O, CO 2, N 2Deng gas) the convection current additive, as this examples of substances, can enumerate the compound that comprises the crystallization water, the compound or the blowing agent of heating and decomposition.
[0104]
The formation time of the solder protuberance 50 among Fig. 2 (b)～(c) and Fig. 4 (d)～Fig. 4 (e), because of condition different, about for example 5 seconds～30 seconds (representational example is about 5 seconds).In addition, in the formation of solder protuberance 50, can introduce the preheating procedure of prior heating solder resin cream 30.
[0105]
Solder protuberance 50 when self-assembly ground forms, also oneself is integrally formed backplate terminal 11 and electrode terminal 41.Like this, the dislocation between backplate terminal 11 and electrode terminal 41 and the solder protuberance 50 does not just have in fact, can be automatically forms solder protuberance 50 accordingly with the pattern of backplate terminal 11 and electrode terminal 41.
[0106]
Solder protuberance 50 is because be by forming behind the solder powder self-assembly in the solder resin cream 30, so in the resin that constitutes solder resin cream 30, do not comprise conducting particles in fact, the solder protuberance 50 of adjacency is configured the insulation resin of the solder resin cream 30 among Fig. 2 (e) and Fig. 4 (e) each other.In addition, become gas after the convection current additive is heated, be discharged into the outside, thereby can from solder resin cream 30, remove.In addition, can also be after forming solder protuberance 50, flushing solder resin cream 30, other resin (also can be resin of the same race) of filling.
[0107]
After making resin (or other resin) sclerosis that constitutes solder resin cream 30, just can obtain the electronic device installing bodies 100 of the present embodiment shown in Fig. 2 (e) and Fig. 4 (e).But during other resin of filling,, can also use the resin (photo-hardening type resin, thermoplastic resin etc.) beyond the thermmohardening type resin as the resin that constitutes solder resin cream 30.
[0108]
More than, told about the present invention by suitable execution mode, but these to tell about not be to limit item, undoubtedly, various changes can be arranged.
[0109]
Constitute the LSI chip of semiconductor packages 10, representational is memory IC and logic IC or system LSI, but its kind is not had particular determination.In the execution mode of the invention described above, told about the situation of LSI chip, but be not limited to semiconductor packages 10 as semiconductor packages 10, for example can also use as the bare chip installation unit that adopts flip chip technology.And then semiconductor packages 10 can also be that semiconductor elements such as bare chip are through transition piece (Intermediate substrate) and by modularization.This module possesses a plurality of electrodes (install and use terminal), as this module, can comprise RF module, power module etc.In addition, except implementing the modularization, can also be to possess a plurality of installations parts built-in substrate module (for example SIMPACTM) of terminal and so on transition piece.
[0110]
In addition, the fixing body 100 that embodiments of the present invention relate to can carry in the e-machine of the thin small that erection space is restricted.In addition, be not limited to mobile phone, can also be used for PDA and notebook computer, can also be used for other purposes (for example digital camera, wall-hanging slim TV machine (FPD in addition; The blank screen display)).
[0111]
Below, tell about the 2nd invention
[0112]
Applicant has proposed the new-type flip-chip mounting method (special hope 2004-267919 number) of semiconductor chip of future generation.And the present invention applies for a patent according to above-mentioned, has told about the flip-chip mounting method that can obtain better effect.
[0113]
The present invention is based on and with the same technological standpoint of flip-chip mounting method that Fig. 1 tells about, realizes the new-type flip-chip mounting method more firm, that reliability is higher.And, behind enforcement the present invention, can make the high flip-chip mounting body of production efficiency.
[0114]
Below, with reference to accompanying drawing, tell about embodiments of the present invention in detail.In addition, for easy understanding, drawing has carried out enlarging arbitrarily.
[0115]
(the 1st execution mode)
Fig. 8 (a) is the stereogram of the flip-chip mounting body in expression the 1st execution mode of the present invention, and Fig. 8 (b) is A～A line profile of Fig. 8 (a).
[0116]
In Fig. 8, flip-chip mounting body 200 in the 1st execution mode of the present invention, employing utilizes solder layer 208, the structure of a plurality of splicing ears 204 that will form on circuit substrate 201 and 206 electrical connections of the semiconductor chip of a plurality of electrode terminals 207 with relative configuration.And, and the bight of the bonding plate body 205 of the opposition side of the formation face of the electrode terminal 207 of semiconductor chip 206 near, cover semiconductor chip 206 ground and form 4 lug bosses 202.4 lug bosses 202 of plate body 205 directly (for example adopt crimping or scolder etc.) and engage with circuit substrate 201.In addition, lug boss 202 is at least with scolder when engaging with circuit substrate 201, can use the material of metallizing on for solder wettability good metal or resin.And then, in the space that forms with circuit substrate 201 and plate body 205, utilize the resin 203 that covers around it and solder layer 208 that splicing ear 204 and electrode terminal 207 are electrically connected together, at least fixedly semiconductor chip 206 and circuit substrate 201.
[0117]
In addition, also surround splicing ear 204 ground that engage with electrode terminal 207 semiconductor chip 206 circuit substrate 201 electrode 210 is set, make solder powder melt set thereon then, form pseudopods 209.And solder powder is when heat fused, and 209 fusings are gathered as pseudopods on electrode 210, thereby are captured, so can not disperse to the outside.Like this, can prevent that solder powder from flowing out short circuit that causes etc. from plate body 205, can obtain the high flip-chip mounting body of reliability 200.
[0118]
In addition, adopt flip-chip mounting body 200 of the present invention after, can utilize lug boss 202 specified altitudes of plate body 205, so the interval of semiconductor chip 206 and circuit substrate 201 is certain, can form uniform flip-chip mounting body 200.Therefore,, become the length of best distance ground decision lug boss 202, just can utilize a certain amount of scolder, connect splicing ear 204 and electrode terminal 207 if preestablish the interval of semiconductor chip 206 and circuit substrate 201.Its result can realize stable and firm engagement state, can also suppress the warpage of circuit substrate etc. simultaneously, realizes the flip-chip mounting body 200 of reliability excellence.
[0119]
In addition, in the 1st execution mode of the present invention, use plate body to tell about, but be not limited thereto with 4 lug bosses.For example when the shape of lug boss can design arbitrarily, as long as form a peristome at least.In addition, when only being provided with near the bight of plate body, lug boss has 3 at least just, can stably keep plate body like this.And then, when lug boss being set in the relative side of plate body, if can be under static state holding position stably, undoubtedly have only two lug bosses just.
[0120]
In addition, adopt flip-chip mounting body of the present invention after, can utilize the inner semiconductor chip of plate body protection.And then, because can when carrying waits, not be subjected to friction, impact etc., so can increase substantially reliability.Even for example the semiconductor chip of the thickness about 30 μ m if use the plate body of the thickness about 100 μ m, just can obtain enough intensity in operation.
[0121]
Below, with reference to Fig. 9 and Figure 10, tell about flip-chip mounting body and flip-chip mounting method that the 1st execution mode of the present invention relates to.
[0122]
Fig. 9 tells about the flip-chip mounting body in the 1st execution mode of the present invention and the concise and to the point process profile of flip-chip mounting method.In addition, Figure 10 (a) is the stereogram from the plate body of oblique beneath Fig. 9 (a), and Figure 10 (b) is the stereogram of plate body that the semiconductor chip of Fig. 9 (b) has been installed from oblique beneath.
[0123]
At first, shown in Fig. 9 (a), plate body 301 is attracted carrying by vacuum suction device 303.And shown in Figure 10 (a), plate body 301 possesses 4 lug bosses 302 near its bight.
[0124]
Then, shown in Fig. 9 (b), in the inboard of plate body 301, semiconductor chip 304 is fixed on the position of regulation by bonding or attraction.Shown in Figure 10 (b), below the semiconductor chip 304, a plurality of electrode terminals 305 are being set here.And on the face of the electrode terminal 305 of semiconductor chip 304, bonding is the resin combination 306 of main component with laminal solder powder and convection current additive and resin.
[0125]
Follow again, shown in Fig. 9 (c), use Handling device (not shown), move it circuit substrate 307 assigned positions.Then, for example use image-processing system, the splicing ear 308 of circuit substrate 307 and the electrode terminal 305 of semiconductor chip 304 are carried out contraposition, circuit substrate 307 and plate body 301 are situated between has lug boss 302 ground to join.Like this, the electrode terminal 305 of semiconductor chip 304 and the splicing ear 308 of circuit substrate 307 are just under the effect of the lug boss 302 of plate body 301, relative with the interval of regulation.Here, so-called " interval of regulation " is the discontiguous at least degree of splicing ear 308 of the electrode terminal 305 and the circuit substrate 307 of semiconductor chip 304, is the degree that can immerse the solder powder of the fusing of hereinafter telling about.For example consider the thickness of semiconductor chip 304 etc., adjust the height of lug boss 302, so that the distance of the splicing ear 308 of the electrode terminal 305 of semiconductor chip 304 and circuit substrate 307 is become about 10 μ m～50 μ m.In addition, in circuit substrate 307, can be as required, the bonding electrodes 310 different with a plurality of splicing ear 308 is set, so that the electrode 309 of the pseudopods that joint is told about below being intended to form and the lug boss 302 of plate body 301.
[0126]
In addition, the contraposition that utilizes image-processing system to carry out, for example can by identification engagement arrangement on circuit substrate 307 plate body 301 and the bonding electrodes 310 of circuit substrate 307 carry out.In addition, undoubtedly, also can be on circuit substrate 307 adhering resin constituent 306.
[0127]
Then, shown in Fig. 9 (d), using vacuum suction device 303 to make the plate body 301 that carries semiconductor chip 304 and under the state that circuit substrate 307 joins, for example utilize heaters 311 such as infrared heater, with about 150 ℃～250 ℃ temperature, from external heat to the temperature that makes the solder powder fusing the resin combination 306.
[0128]
After this heating, in the time of convection current additive (not shown) boiling in the resin combination 306 or the vaporization of evaporation back, solder powder (not shown) also becomes the solder powder of fusing.Then, in the process that gas 312 passes through to discharge to the outside between the lug boss 302 of plate body 301, utilize convection current that the solder powder of the fusing in the resin combination 306 is moved.
[0129]
And then, the solder powder of the fusing that is moved, between the splicing ear 308 of the electrode terminal 305 of the good semiconductor chip 304 of the wettability of relatively configuration and circuit substrate 307, self-assembly, growth.
[0130]
Like this, shown in Fig. 9 (e), when forming the solder layer 313 that electrode terminal 305 and splicing ear 308 are electrically connected, also make the hardening of resin in the resin combination 306 after, take out vacuum suction device 303, just produce flip-chip mounting body 200.
[0131]
In addition, on the electrode 310 that forms pseudopods, the solder powder of fusing is self-assembly, growth also, forms pseudopods 314.After forming this pseudopods 314, be not used in the solder powder of the fusing that forms solder layer 313, just be formed on the electrode 310 of pseudopods and catch, thereby can prevent to flow out to the outside.
[0132]
In addition, form the electrode 310 of pseudopods, when solder powder is not dispersed, even and disperse in the time of also can not bringing problem, just may not need setting.
[0133]
In addition, in the 1st execution mode, told about under state, formed the example of solder layer 313, but be not limited thereto with vacuum suction device 303 holding circuit substrates 307 and plate body 301.For example: can be in advance engage by crimping and ultrasonic wave, be fixed to the lug boss 302 of plate body 301 on the circuit substrate 307 after, implement the later processing of heating process.For example can automatically make with reflow soldering apparatus etc.
[0134]
In addition, in the 1st execution mode, laminal resin combination is bonded to heating afterwards on semiconductor chip or the circuit substrate, but be not limited thereto.For example: after the lug boss 302 of plate body 301 can being bonded on the circuit substrate 307,, behind the resin combination that injects paste between semiconductor chip 304 and the circuit substrate 307, heat to keep the state of certain intervals.
[0135]
Like this, because the intermediate of the flip-chip mounting body that a plurality of circuit substrates of making and plate body are fixed can be handled, so can further enhance productivity in enough heating process unifications.
[0136]
In addition, can also adopt have metal or at least its front end by the electrode 310 of the lug boss 302 of the plate body 301 of the lug boss 302 of metal coat and circuit substrate 307 on, be pre-formed solder film, in the moment that heat treated finishes, utilize scolder with circuit substrate 307 and the fixing structure of plate body 301 combinations.And then, with than the fusing point height of the solder powder in the resin combination 306, for example have the material of 300 ℃ fusing point, form solder film, for example make the solder film local melting again with laser etc. after, with solder bonds circuit substrate 307 and lug boss 302, carry out later operation.At this moment, can under the state that takes out vacuum suction device 303, carry out later operation.But, in the operation of heating resin combination 306, need carry out later heat treated, in order to avoid the electrode 310 of lug boss 302 and circuit substrate 307 comes off for example with the following temperature of the fusing point (300 ℃) of solder film.
[0137]
In addition, when the fusing point of the solder powder in the fusing point of solder film and the resin combination 306 was identical, after heating finished, plate body 301 and circuit substrate 307 just were engaged.Like this, can not increase the quantity of operation, effectively permanent circuit substrate and plate body.
[0138]
In addition, in the 1st execution mode, tell about clear and easy to understandly,, tell about with gapped example between the lug boss of semiconductor chip and plate body for making.But also can adopt the structure that semiconductor chip all is set in lug boss.Like this, can further realize miniaturization.
[0139]
In addition, in the 1st execution mode, be example with laminal resin, told about resin combination 306, but be not limited thereto.For example: undoubtedly, also can apply the resin of paste and jelly shape.
[0140]
In sum, adopt the 1st execution mode of the present invention after, can enough very easy and practical methods, realize that the flip-chip of semiconductor chip is installed.
[0141]
In addition, owing to utilize plate body, in the protection semiconductor chip, the bad connection that the impact in the time of can also preventing to carry etc. causes is so can realize the flip-chip mounting body that reliability and productivity are all excellent.
[0142]
(the 2nd execution mode)
Figure 11 (a) is the stereogram of the flip-chip mounting body in expression the 2nd execution mode of the present invention, and Figure 11 (b) is A～A line profile of Figure 11 (a).
[0143]
In Figure 11, flip-chip mounting body 400 in the 2nd execution mode of the present invention, adopt by solder layer 405 structure that a plurality of electrode terminals 406 of a plurality of splicing ears 402 that will form and the semiconductor chip 404 of relative configuration are electrically connected on circuit substrate 401.And, with the bonding box-shaped body 403 of opposition side of the electrode terminal 406 of semiconductor chip 404, cover semiconductor chip 404 ground and constitute.And then, box-shaped body 403, when periphery has flange 409, also have can inside and outside ventilation a plurality of holes 408, do media by flange 409, for example utilize resin adhesive etc., engage with circuit substrate 401.In addition, more than told about the joint that utilizes resin adhesive to carry out, but also can use the whole bag of tricks such as crimping, weldering and ultrasonic wave joint, box-shaped body 403 has been installed on the circuit substrate 401.In addition, box-shaped body 403 can also use resin or metal and applied the material of metal on resin.And for semiconductor chip 404 is carried out electrostatic protection, box-shaped body 403 can also use the electroconductive resin that has for example mixed carbon etc.And then undoubtedly, for electromagnetic wave shielding, box-shaped body 403 can also use the electroconductive resin that has for example mixed nickel.
[0144]
In addition, circuit substrate 401 and box-shaped body 403 at the solder layer 405 that splicing ear 402 and electrode terminal 406 is electrically connected and cover under the effect of the resin 407 around it, are fixed together to major general's semiconductor chip 404 and circuit substrate 401.Here, for fixing box-shaped body 403 and the resin 407 that uses, both can be with resin combination in the resin identical materials, also can use different materials.At this moment, behind the formation solder layer 405, temporarily remove the resin combination resin, inject other resins of filling from the hole 408 of box-shaped body 403 once again then, thereby can realize.
[0145]
In addition, in the 2nd execution mode of the present invention, the periphery in the part of the bond semiconductor chip 404 of circuit substrate 401 is not provided with the sort of electrode that prevents that solder powder from dispersing shown in the 1st execution mode.Its reason is because flange 409 hinders the outflow of solder powder, can prevent that them from dispersing to the cause of outside.Undoubtedly, when not having the bigger box-shaped body in the box-shaped body of flange 409 and hole, can be same with the 1st execution mode, be provided with and prevent the electrode that solder powder is dispersed, form pseudopods.
[0146]
After adopting the 2nd execution mode of invention, can use simple structure, stop the solder powder outflow and disperse to the caused short circuit in outside etc., can obtain the high flip-chip mounting body of reliability.
[0147]
In addition, because can form the shape of surrounding semiconductor chip with box-shaped body fully, so in mechanical excellent strength, after constituting with conductive material etc. again, can reduce the radiation of electromagnetic wave etc. for distortion.
[0148]
In addition, owing to can utilize the height of the side of box-shaped body 403, the interval of semiconductor chip 404 and circuit substrate 401 is held in necessarily, so the uniformity of the height of the solder layer 405 can guarantee semiconductor chip 404 is installed the time and size etc.Therefore, preestablish the interval of semiconductor chip 404 and circuit substrate 401, the height of the side of decision box-shaped body 403, so that become best distance, just can utilize a certain amount of scolder to connect splicing ear 402 and electrode terminal 406, thereby can realize having the flip-chip mounting body 400 of the reliability excellence of highly stable firm engagement state.
[0149]
In addition, in the 2nd execution mode of the present invention, enumerated the example that the hole is 408 bigger, configurable number is also fewer of box-shaped body 403.But the quantity in hole 408, size are arbitrarily, can consider various variation undoubtedly.
[0150]
In addition, adopt flip-chip mounting body of the present invention after, can utilize the inner semiconductor chip of box-shaped body protection.And then, because semiconductor chip can not be subjected to friction, impact etc. when carrying waits.Use can increase substantially reliability.
[0151]
Below, with reference to Figure 12 and Figure 13, tell about flip-chip mounting body and flip-chip mounting method that the 2nd execution mode of the present invention relates to.
[0152]
Figure 12 tells about the flip-chip mounting body in the 2nd execution mode of the present invention and the concise and to the point process profile of flip-chip mounting method.In addition, Figure 13 (a) is the stereogram from the box-shaped body of oblique beneath Figure 12 (a), and Figure 13 (b) is the stereogram of box-shaped body that the semiconductor chip of Fig. 3 (b) has been installed from oblique beneath.
[0153]
At first, shown in Figure 12 (a), utilize to be rolled into arm 503 maintenances, the preformed box-shaped body 504 of carrying.Here, Handling device 501, its front end have clamp load be rolled into arm 503 and switching is rolled into arm 503 and rotary hinge 502.And shown in Figure 13 (a), box-shaped body 504 possesses a plurality of holes 506 that can ventilate in its side, possesses flange 505 at the peristome of its end face.
[0154]
Then, shown in Figure 12 (b), in the inboard of box-shaped body 504, semiconductor chip 507 is fixed on the position of regulation by bonding or attraction.And, shown in Figure 13 (b), below the semiconductor chip 507, a plurality of electrode terminals 508 are being set.
[0155]
Follow again, shown in Figure 12 (c), it is the resin combination 509 of main composition that preliminary election applies with solder powder and convection current additive and resin on circuit substrate 501, uses Handling device 501, the box-shaped body 504 of bonding semiconductor chip 507 is moved to the top of assigned position.Then, for example use image-processing system etc., the splicing ear 511 of circuit substrate 501 and the electrode terminal 508 of semiconductor chip 507 are carried out contraposition, the flange 505 of circuit substrate 510 and box-shaped body 504 is joined.Like this, the electrode terminal 508 of semiconductor chip 507 and the splicing ear 511 of circuit substrate 510 are just under the effect of the height of the flange 505 of box-shaped body 504 and side surface part, relative with the interval of regulation.Here, so-called " interval of regulation " is the discontiguous at least degree of splicing ear 511 of the electrode terminal 508 and the circuit substrate 510 of semiconductor chip 507, is the degree that can immerse the solder powder of the fusing of hereinafter telling about.
[0156]
In addition, the contraposition that utilizes image-processing system to carry out, the mark (not shown) that for example can be by being identified in the formation on the circuit substrate 510 and the flange 505 of box-shaped body 504 carry out.
[0157]
Then, shown in Figure 12 (d), doing media by Handling device 501, make under the state that the box-shaped body 504 that carried semiconductor chip 507 and circuit substrate 510 join, for example utilize heaters 512 such as infrared heater, with about 150 ℃～250 ℃ temperature, from external heat to the temperature that makes the solder powder fusing the resin combination 306.
[0158]
After this heating, in the time of convection current additive (not shown) boiling in the resin combination 509 or the vaporization of evaporation back, solder powder (not shown) also becomes the solder powder of fusing.Then, the hole 408 of passing through box-shaped body 504 at gas 513 utilizes convection current that the solder powder of the fusing in the resin combination 509 is moved in the process that discharge the outside.
[0159]
And then, the solder powder of the fusing that is moved, between the splicing ear 511 of the electrode terminal 508 of the good semiconductor chip 507 of the wettability of relatively configuration and circuit substrate 510, self-assembly, growth are electrically connected thereby form between electrode terminal 508 and splicing ear 511.
[0160]
Like this, shown in Figure 12 (e), when forming the solder layer 514 that electrode terminal 508 and splicing ear 511 are electrically connected, also make the hardening of resin in the resin combination 509 after, take out Handling device 501, just produce flip-chip mounting body 400.
[0161]
At this moment, the resin in the resin combination 509 is softening, in bond semiconductor chip 507 and circuit substrate 510, also flows into the gap of the flange 505 and the circuit substrate 510 of box-shaped body 504, engages fixedly box-shaped body 504 and circuit substrate 510.
[0162]
In addition, in the 2nd execution mode of the present invention, there is not to be provided with the electrode that prevents thrown solder.But undoubtedly also can be provided with.
[0163]
In addition, in the 2nd execution mode of the present invention, told about the box-shaped body 504 that forms flange 505.But undoubtedly, this flange 505 can not have yet, and then flange 505 can also adopt crooked to the inside shape not in the outside of box-shaped body 504.
[0164]
In sum, adopt the 2nd execution mode of the present invention after, can enough very easy and practical methods, realize that the flip-chip of semiconductor chip is installed.
[0165]
In addition, owing to utilize box-shaped body, in the protection semiconductor chip, the bad connection that the impact in the time of can also preventing to carry etc. causes is so can realize the flip-chip mounting body that reliability and productivity are all excellent.
[0166]
In addition, in the 2nd execution mode of the present invention, told about the bigger situation in hole 506, but many less holes also can be set.At this moment, can also expect the final plugging hole 506 of resin in the resin combination 509.Its result because semiconductor chip 507 is opened with outer air bound fully, so humidity etc. can not immerse, improves the life-span and the reliability of the connecting portion of semiconductor chip and solder layer etc.
[0167]
More than, told about half invention by each execution mode, but these narrations not to limit item, and various distortion can be arranged., be that example is told about for example with thermmohardening type resin as the resin that contains solder powder and convection current additive.But for example also can use more than the fusion temperature of solder powder, have mobile photo-hardening type resin and they and use the type resin.
[0168]
In addition, in the embodiments of the present invention, told about semiconductor chip and be one situation.But also can dispose a plurality ofly at circuit substrate simultaneously, carry out the operation of each operation.
[0169]
In addition, in the embodiments of the present invention, tell about with plate body and the crooked rectangular shape of box-shaped body.But be not limited thereto.It for example also can be taper.Like this, the handling ease of plate body and box-shaped body can reduce cost.
[0170]
In addition, in the embodiments of the present invention, as the resin in the resin combination, can also use the some resins in epoxy resin, unsaturated polyester resin, polybutadiene, polyimide resin, polyamide, the cyanate resin as host.
[0171]
And then, in the embodiments of the present invention, as the convection current additive, can also use the sodium acid carbonate of breakdown type, ammonium metaborate (ammonium methaborate), aluminium hydroxide, dorsonite, barium metaborate (barium methaborate), as the explosive evaporation type, can use butyl carbitol (butyl carbitol), flux (flux), isobutanol (isobutyl alcohol), dimethylbenzene, isoamyl alcohol (isopentyl alcohol)), butyl acetate (butyl acetate), tetrachloro-ethylene, hexone (methylisobutylketon), ethyl carbitol (ethyl carbitol), butyl carbitol, medium-boiling solvent or high boiling solvents such as styrene.
[0172]
After adopting the present invention, can when installing, the flip-chip that is applicable to the follow-on semiconductor chip that thin space makes rapid progress also, be of great use in the field that requires all excellent flip-chip of productivity and reliability to install.

Claims (18)

1, a kind of manufacture method of electronic device installing bodies, described electronic device installing bodies possess electronic unit and the circuit substrate of described electronic unit are installed, and described manufacture method comprises:
Preparation has the operation a of the electronic unit on the surface of having arranged electrode terminal;
Preparation has the operation b of circuit substrate that has arranged the surface of electrode terminal with the electrode terminal of described electronic unit accordingly;
At least one side in described electronic unit or circuit substrate beyond the described electrode terminal section that has on the face of described electrode terminal, forms the operation c of a plurality of liners;
To in resin, contain solder powder and the solder resin cream of convection current additive of boiling when this resin is heated, give the operation d on the face of at least one side in described electronic unit or the described circuit substrate;
Across described solder resin cream, described electronic unit is configured in operation e on the described circuit substrate; And
Heat described solder resin cream, make described convection current additive boiling, utilize described resin, the described solder powder that melts in described resin is flowed in described resin, make described solder powder self-assembly and growth, thereby the operation f that the electrode terminal that the electrode terminal that described electronic unit has is formed on described circuit substrate with corresponding described electrode terminal is electrically connected
On the described electronic unit, the surface towards the electronic unit of described circuit substrate is formed with a plurality of electrode terminals;
On the described circuit substrate, form electrode terminal correspondingly with described a plurality of electrode terminals;
Zone beyond the electrode terminal section of the electrode terminal of the circuit substrate of described connection and electronic unit, by a plurality of liner components of preparing with described operation, at the electrode terminal of arranging on the described electronic unit with correspondingly between the electrode terminal of arranging on the circuit substrate face, form certain clearance
The electrode terminal of described circuit substrate and the electrode terminal of described electronic unit, the solder protuberance that is formed by self-assembly ground is electrically connected.
2, the manufacture method of electronic device installing bodies as claimed in claim 1, it is characterized in that: in the operation that described electronic unit is configured on the described circuit substrate, utilize described a plurality of liner, carry out adhering to and keep between electronic unit and the circuit substrate.
3, the manufacture method of electronic device installing bodies as claimed in claim 1 is characterized in that: electrode is set, and makes the described electrode terminal of the described circuit substrate of this electrodes surrounding, form pseudopods on described electrode.
4, a kind of manufacture method of electronic device installing bodies, described electronic device installing bodies possess electronic unit and the circuit substrate of described electronic unit are installed, and described manufacture method comprises:
Preparation has the operation a of the electronic unit on the surface of having arranged electrode terminal;
Preparation has the operation b of circuit substrate that has arranged the surface of electrode terminal with the electrode terminal of described electronic unit accordingly,
At least one side in described electronic unit or circuit substrate beyond the described electrode terminal section that has on the face of described electrode terminal, forms the operation c of a plurality of liners;
Described electronic unit is configured in operation d on the described circuit substrate;
To in resin, contain solder powder and the solder resin cream of convection current additive of boiling when this resin is heated, be filled to the operation e in the space that forms between described electronic unit and the circuit substrate; And
Heat described solder resin cream, make described convection current additive boiling, utilize described resin, the described solder powder that melts in described resin is flowed in described resin, make described solder powder self-assembly and growth, thereby the operation f that the electrode terminal that the electrode terminal that described electronic unit has is formed on described circuit substrate with corresponding described electrode terminal is electrically connected
On the described electronic unit, the surface towards the electronic unit of described circuit substrate is formed with a plurality of electrode terminals;
On the described circuit substrate, form electrode terminal correspondingly with described a plurality of electrode terminals;
Zone beyond the electrode terminal section of the electrode terminal of the circuit substrate of described connection and electronic unit, by a plurality of liner components of preparing with described operation, at the electrode terminal of arranging on the described electronic unit with correspondingly between the electrode terminal of arranging on the circuit substrate face, form certain clearance
The electrode terminal of described circuit substrate and the electrode terminal of described electronic unit, the solder protuberance that is formed by self-assembly ground is electrically connected.
5, the manufacture method of electronic device installing bodies as claimed in claim 4, it is characterized in that: in the operation that described electronic unit is configured on the described circuit substrate, utilize described a plurality of liner, carry out adhering to and keep between electronic unit and the circuit substrate.
6, the manufacture method of electronic device installing bodies as claimed in claim 4 is characterized in that: electrode is set, and makes the described electrode terminal of the described circuit substrate of this electrodes surrounding, form pseudopods on described electrode.
7, a kind of flip-chip mounting method, be dispose relative of semiconductor chip that will have a plurality of electrode terminals with circuit substrate with a plurality of splicing ears, the flip-chip mounting method that the splicing ear of described circuit substrate is electrically connected with the electrode terminal of described semiconductor chip
Described flip-chip mounting method has:
Described semiconductor chip contraposition is bonded at least the operation that has in the end on the plate body of 2 lug bosses;
To be the resin combination of main component with solder powder and convection current additive and resin, coating or attached to the operation on described circuit substrate or the described semiconductor chip;
The described lug boss contraposition of the described plate body of bonding described semiconductor chip is configured on the described circuit substrate, and utilizes described lug boss, make the fixed interval of described circuit substrate and described semiconductor chip become certain operation;
Described resin combination is heated to the temperature that described solder powder melts, makes described convection current additive boiling or decomposition and the operation of generation gas; And
The described gaseous exchange and the process of between the described lug boss of described plate body, discharging, the described solder powder of fusing is flowed in described resin combination, make described solder powder self-assembly and growth, thus the operation that described splicing ear is electrically connected with described electrode terminal.
8, flip-chip mounting method as claimed in claim 7 is characterized in that: described resin combination is made of tabular resin, resins in film form or paste resin, on described circuit substrate or described semiconductor chip.
9, as claim 7 or 8 described flip-chip mounting methods, it is characterized in that: the described lug boss of described plate body is fixed to operation on the described circuit substrate, utilizes the scolder of the fixedly usefulness that on described circuit substrate, forms in advance to fix.
10, as claim 7 or 8 described flip-chip mounting methods, it is characterized in that: the described lug boss of described plate body is fixed to operation on the described circuit substrate, engage by crimping or ultrasonic wave, the described lug boss of described plate body is joined on the described circuit substrate.
11, a kind of manufacture method of flip-chip mounting body, be dispose relative of semiconductor chip that will have a plurality of electrode terminals with circuit substrate with a plurality of splicing ears, the flip-chip mounting method that the splicing ear of described circuit substrate is electrically connected with the electrode terminal of described semiconductor chip
Described flip-chip mounting method has:
Described semiconductor chip contraposition is bonded to the operation of inboard of the box-shaped body in the hole of ventilating that has opening at least in one direction;
To be the resin combination of main component with solder powder and convection current additive and resin, coating or attached to the operation on described circuit substrate or the described semiconductor chip;
The described box-shaped body contraposition of bonding described semiconductor chip is configured on the described circuit substrate, utilizes the side end of the open side of described box-shaped body simultaneously, make the fixed interval of described circuit substrate and described semiconductor chip become certain operation;
Described resin combination is heated to the temperature that described solder powder melts, makes described convection current additive boiling or decomposition and the operation of generation gas; And
At described gaseous exchange and from the process that discharge in the described hole of described box-shaped body, the described solder powder of fusing is flowed in described resin combination, make described solder powder self-assembly and growth, thus the operation that described splicing ear is electrically connected with described electrode terminal
Described flip-chip mounting body has:
Circuit substrate, this circuit substrate has a plurality of splicing ears;
Semiconductor chip, this semiconductor chip have a plurality of electrode terminals of relative configuration with described splicing ear; And
Box-shaped body, the bonding described semiconductor chip of the inboard contraposition of this box-shaped body, and this box-shaped body has the hole that can ventilate of opening in one direction at least,
Be electrically connected the described splicing ear of described circuit substrate and the described electrode terminal of described semiconductor chip with solder layer, simultaneously, at least with fixing described circuit substrate of resin and described semiconductor chip.
12, the manufacture method of flip-chip mounting body as claimed in claim 11 is characterized in that: electrode is set, and makes the described splicing ear of the described circuit substrate of this electrodes surrounding, form pseudopods on described electrode.
13, the manufacture method of flip-chip mounting body as claimed in claim 11 is characterized in that: described circuit substrate and described box-shaped body are bonded together by crimping or ultrasonic wave.
14, a kind of flip-chip mounting method, be dispose relative of semiconductor chip that will have a plurality of electrode terminals with circuit substrate with a plurality of splicing ears, the flip-chip mounting method that the splicing ear of described circuit substrate is electrically connected with the electrode terminal of described semiconductor chip
Described flip-chip mounting method has:
Described semiconductor chip contraposition is bonded to the operation of inboard of the box-shaped body in the hole of ventilating that has opening at least in one direction;
To be the resin combination of main component with solder powder and convection current additive and resin, coating or attached to the operation on described circuit substrate or the described semiconductor chip;
The described box-shaped body contraposition of bonding described semiconductor chip is configured on the described circuit substrate, utilizes the side end of the open side of described box-shaped body simultaneously, make the fixed interval of described circuit substrate and described semiconductor chip become certain operation;
Described resin combination is heated to the temperature that described solder powder melts, makes described convection current additive boiling or decomposition and the operation of generation gas; And
At described gaseous exchange and from the process that discharge in the described hole of described box-shaped body, the described solder powder of fusing is flowed in described resin combination, make described solder powder self-assembly and growth, thus the operation that described splicing ear is electrically connected with described electrode terminal.
15, flip-chip mounting method as claimed in claim 14 is characterized in that: described resin combination is made of tabular resin, resins in film form or paste resin, on described circuit substrate or described semiconductor chip.
16, flip-chip mounting method as claimed in claim 14 is characterized in that: the side end of the open side of described box-shaped body is fixed to operation on the described circuit substrate, utilizes the scolder of the fixedly usefulness that forms on described circuit substrate in advance to fix.
17, flip-chip mounting method as claimed in claim 14 is characterized in that: the side end of the open side of described box-shaped body is fixed to operation on the described circuit substrate, engages by crimping or ultrasonic wave, described box-shaped body is joined on the described circuit substrate.
18, flip-chip mounting method as claimed in claim 14, it is characterized in that: the side end of the open side of described box-shaped body is fixed in the operation on the described circuit substrate, make described resin combination between described circuit substrate and described semiconductor chip, with the side end of the described open side of described box-shaped body be pressed into join with described circuit substrate till.
CN200680016698A 2005-05-17 2006-05-09 Flip-chip mounting body and flip-chip mounting method Expired - Fee Related CN100587930C (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP143745/2005 2005-05-17
JP2005143745 2005-05-17
JP144887/2005 2005-05-18

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CN100587930C true CN100587930C (en) 2010-02-03

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WO2017104500A1 (en) * 2015-12-16 2017-06-22 三菱電機株式会社 Semiconductor device and manufacturing method therefor
US10734350B2 (en) * 2016-05-09 2020-08-04 Hitachi Chemical Company, Ltd. Method for manufacturing semiconductor device
JP6984183B2 (en) * 2017-06-05 2021-12-17 富士電機株式会社 Semiconductor packages, semiconductor devices and methods for manufacturing semiconductor devices
US10660216B1 (en) * 2018-11-18 2020-05-19 Lenovo (Singapore) Pte. Ltd. Method of manufacturing electronic board and mounting sheet

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