CN112055889A - 绝缘覆盖线的结合方法、连接构造、绝缘覆盖线的剥离方法以及接合装置 - Google Patents
绝缘覆盖线的结合方法、连接构造、绝缘覆盖线的剥离方法以及接合装置 Download PDFInfo
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- CN112055889A CN112055889A CN201980023612.3A CN201980023612A CN112055889A CN 112055889 A CN112055889 A CN 112055889A CN 201980023612 A CN201980023612 A CN 201980023612A CN 112055889 A CN112055889 A CN 112055889A
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Abstract
提供一种能将绝缘覆盖线的金属线与电极稳定地进行结合的绝缘覆盖线的结合方法。本发明的一方式的绝缘覆盖线的结合方法,为通过金属线被有机物覆盖的绝缘覆盖线(11)使第一电极(12)和第二电极导通的绝缘覆盖线的结合方法,具备:将所述绝缘覆盖线(11)载置于第一电极(12)上的工序(a);使金属线从所述绝缘覆盖线露出的工序(b);和通过形成遍及已露出的所述金属线以及所述第一电极的第一凸块,从而将所述金属线与所述第一电极电连接的工序(c)。
Description
技术领域
本发明涉及绝缘覆盖线的结合方法、连接构造、绝缘覆盖线的剥离方法以及接合装置。
背景技术
通常,线接合由金属的裸线进行,但在高密度布线中的短路防止、医疗领域中与人体直接接触的器件的布线等中,采用由有机物绝缘覆盖的金属线即绝缘覆盖线。
作为在医疗器具的领域中使用的电子部件例如有体内埋入型传感器、体内埋入型BMI(brain-machine interface,脑机接口)装置等。在如该传感器那样与人体直接接触的产品的情况下,如果想要将线材与传感器的电极结合,则需要使用由绝缘被膜覆盖了线材的绝缘覆盖线以使得金属制的线材不对人体带来影响。但是,由于存在覆盖而需要自剥离绝缘覆盖线的前端的覆盖起进行绝缘覆盖线与传感器的电极的结合,其结合变难。
在对医疗器具的领域以外的半导体领域的产品(器件)的电极的布线中,也需要以高品质、高生产性接合绝缘覆盖线。如果想要将绝缘覆盖线的前端与该器件的电极相结合,则需要与医疗器具领域同样地自剥离覆盖起进行结合。
如上述那样自剥离覆盖起进行结合的理由如下那样。其原因在于,如果不剥离绝缘覆盖线的前端的覆盖而将绝缘覆盖线的前端与电极相结合,则电极与绝缘覆盖线的结合强度变弱,并发生不能充分取得电气的导通等的产品不合格,有时欠缺作为产品的稳定性。
因而,以往采用了自预先剥离绝缘覆盖线的前端的覆盖起与电极相结合的方法。例如半导体领域中,如图17所示那样,通过对绝缘覆盖线101的前端照射激光,并使绝缘覆盖线101的前端与加热器相接触而熔化覆盖,从而使其中的芯线(金属线)101a露出,将该芯线101a与电极102相结合。
例如,将器件设置于加热板上,有时进行基于加热的超声波热压接。通过对器件进行加热,从而使由接合工具加压的绝缘覆盖线的绝缘覆盖流动化而从结合面除去。进而,通过同时采用加热所引起的超声波热压接缩短结合品质和时间。
但是,如果进行加热直到绝缘覆盖进行流动化为止(数百度以上),则在对多个绝缘覆盖线进行接合时,先进行了接合的绝缘覆盖线被继续加热而覆盖熔化。此外,如果加热器温度过低,则不能充分除去绝缘覆盖,产生结合不合格。此外,不能对耐热弱的器件充分进行加热,高热容量的器件中,加热和冷却耗费时间,生产性显著降低。
上述的方法确保结合强度,另一方面需要对进行结合的装置搭载除去覆盖专用的激光器、加热器(例如,参照专利文献1)。通过搭载有这些功能而装置本身变大,装置成本也增加。此外,也有由加热器的热量除去覆盖的材质变得困难这样的情况。此外,也会担心由于添加用于除去覆盖的热的工序所引起的绝缘覆盖线的损坏。
此外,如果与电极的结合部以外的部分的绝缘覆盖线的覆盖剥离,则绝缘状态难以维持,因而需要稳定地剥离绝缘覆盖线的前端的覆盖的高难度的技术。此外,有时不剥离与电极的结合部以外的部分的绝缘覆盖线的覆盖并且可靠地将电极与金属线进行电结合变得困难。
此外,前述的医疗器具的领域中,多数情况下采用人的手进行剥离绝缘覆盖线的前端的覆盖的作业、绝缘覆盖线的前端与电极的结合作业。因此,存在生产性显著变差,使产品小型化也困难这样的课题。
在先技术文献
专利文献
专利文献1:日本特开2011-28923号公报
发明内容
发明要解决的课题
本发明的一方式的课题在于提供一种能将绝缘覆盖线的金属线与电极稳定地进行结合的绝缘覆盖线的结合方法。
此外,本发明的一方式的课题在于,提供一种即使不采用激光器、加热器也能剥离绝缘覆盖线的覆盖而与电极稳定地结合的绝缘覆盖线的结合方法、连接构造或者接合装置。
此外,本发明的一方式的课题在于,提供一种能够稳定地剥离与电极的结合部的绝缘覆盖线的覆盖的绝缘覆盖线的剥离方法或者接合装置。
用于解决课题的手段
以下对本发明的各种方式进行说明。
[1]一种绝缘覆盖线的结合方法,为通过金属线被有机物覆盖的绝缘覆盖线使第一电极和第二电极导通的绝缘覆盖线的结合方法,该绝缘覆盖线的结合方法的特征在于,具备:
工序(a),将所述绝缘覆盖线载置于第一电极上;
工序(b),使金属线从所述绝缘覆盖线露出;
工序(c),通过形成遍及已露出的所述金属线以及所述第一电极的第一凸块,从而将所述金属线与所述第一电极电连接。
[2]在上述[1]的绝缘覆盖线的结合方法中,其特征在于,
所述工序(b)为以下工序,即通过工具的前端将所述绝缘覆盖线按压到所述第一电极,从而使所述金属线从所述绝缘覆盖线露出。
[3]在上述[2]的绝缘覆盖线的结合方法中,其特征在于,
在所述工序(b)中,使用具备超声波喇叭形辐射体和对所述超声波喇叭形辐射体提供超声波的超声波振子的接合装置,使所述超声波喇叭形辐射体保持所述工具,通过对所述工具施加超声波振动从而使所述金属线从所述绝缘覆盖线露出,
在所述工序(c)中,使用所述接合装置,使所述超声波喇叭形辐射体保持线被插通的毛细管,通过对从所述毛细管前端突出的线的前端和放电电极之间施加高电压从而引起放电,通过该放电能量使线前端部熔融而形成所述第一凸块。
[4]在上述[1]至[3]中任一项所述的绝缘覆盖线的结合方法中,其特征在于,
所述工序(a)为以下的工序,即将从接合装置的毛细管的前端抽出的绝缘覆盖线载置于第一位置,从所述毛细管的前端抽出绝缘覆盖线并使所述毛细管移动到第二位置,从而将所述绝缘覆盖线载置于所述第一电极上。
[5]在上述[1]至[3]的任一项所述的绝缘覆盖线的结合方法中,其特征在于,
在所述工序(a)之前具有以下工序:
将从接合装置的毛细管的前端抽出的绝缘覆盖线载置于第二电极上,通过工具的前端将所述绝缘覆盖线按压到所述第二电极,从而使所述金属线从所述绝缘覆盖线露出;和
通过形成遍及已露出的所述金属线以及所述第二电极的第二凸块,从而将所述金属线与所述第二电极电连接,
所述工序(a)为以下的工序,即从所述毛细管的前端抽出绝缘覆盖线并使所述毛细管移动,从而将所述绝缘覆盖线载置于所述第一电极上。
[6]在上述[1]的绝缘覆盖线的结合方法中,其特征在于,
所述工序(a)为由加压力将从接合装置的毛细管的前端抽出的所述绝缘覆盖线按压到所述第一电极的工序,
所述工序(b)为以下的工序,即通过使所述接合装置的超声波喇叭形辐射体超声波振动,从而检测到在所述绝缘覆盖线与所述第一电极的紧贴部处所述毛细管与所述第一电极经由所述绝缘覆盖线的金属线而处于导通状态,此后,通过使电流在所述毛细管与所述第一电极之间流动而对所述紧贴部的所述金属线进行加热,从而使所述绝缘覆盖移动到所述紧贴部之外,将所述绝缘覆盖从所述绝缘覆盖线剥离。
[7]一种绝缘覆盖线的剥离方法,其特征在于,具备:
工序(a),将从接合装置的毛细管的前端抽出的绝缘覆盖线加压并按压到第一电极;
工序(b),通过使所述接合装置的超声波喇叭形辐射体超声波振动,从而对所述毛细管与所述第一电极在所述绝缘覆盖线与所述第一电极的紧贴部处经由所述绝缘覆盖线的金属线而处于导通状态进行检测;
工序(c),通过使电流在所述毛细管与所述第一电极之间流动并对所述紧贴部的所述金属线进行加热,从而使所述绝缘覆盖移动到所述紧贴部之外,将所述绝缘覆盖从所述绝缘覆盖线剥离。
[8]一种绝缘覆盖线的结合方法,其特征在于,具有:
工序(d),在采用权利要求[7]所记载的绝缘覆盖线的剥离方法剥离了所述绝缘覆盖线的所述绝缘覆盖之后,使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且使所述超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线与所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
[9]一种绝缘覆盖线的结合方法,具备:
工序(c),在从接合装置的毛细管的前端抽出的绝缘覆盖线与第一电极的紧贴部,通过所述毛细管将所述绝缘覆盖线的绝缘覆盖被剥离而露出的金属线按压到所述第一电极;和
工序(d),使电流在所述毛细管与所述第一电极之间流动且使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且使所述接合装置的超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线和所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
[10]在上述[8]或者[9]的绝缘覆盖线的结合方法中,其特征在于,
在所述工序(d)之后具有工序(e),该工序(e)停止所述超声波振动,通过所述毛细管将所述紧贴部的所述金属线加压到所述第一电极并且使电流在所述金属线与所述第一电极之间流动,从而使所述金属线与所述第一电极的合金层生长而提高结合强度。
[11]在上述[8]至[10]的任一项所述的缘覆盖线的结合方法中,其特征在于,
在所述工序(d)或者所述工序(e)之后具有工序(f),工序(f)通过形成遍及所述金属线以及所述第一电极的凸块,从而通过所述凸块将所述金属线与所述第一电极电连接。
[12]一种连接构造,其特征在于,具备:
第一电极;
绝缘覆盖线,配置于所述第一电极上且金属线已由有机物覆盖;和
第一凸块,遍及所述绝缘覆盖线以及所述第一电极地形成;
从位于所述第一电极上的所述绝缘覆盖线露出的金属线和所述第一电极通过所述第一凸块被电连接。
[13]在上述[12]的连接构造中,其特征在于,
所述绝缘覆盖线的一端被所述有机物覆盖,
从所述绝缘覆盖线露出的金属线位于与所述绝缘覆盖线的一端相比更靠另一端侧的位置。
[14]在上述[12]或者[13]的连接构造中,其特征在于,
具备:
第二电极;
配置于所述第二电极上的所述绝缘覆盖线;和
形成于所述绝缘覆盖线以及所述第二电极上的第二凸块,
从位于所述第二电极上的所述绝缘覆盖线露出的金属线和所述第二电极通过所述第二凸块被电连接。
[15]一种连接构造,其特征在于,
具备:
第一电极;和
配置于所述第一电极上,金属线被有机物覆盖的绝缘覆盖线,
从位于所述第一电极上的所述绝缘覆盖线露出的金属线和所述第一电极通过在所述金属线与所述第一电极之间成长的合金层而被结合。
[16]在上述[12]至[15]的任一项所述的连接构造,其特征在于,
具有配置有所述第一电极的基板,
所述基板为用于医疗用领域的电子部件的基板。
[17]一种接合装置,其特征在于,具备:
毛细管,抽出绝缘覆盖线并具有导电性;
超声波喇叭形辐射体,保持所述毛细管;
使保持于所述超声波喇叭形辐射体的所述毛细管上下移动的机构;
超声波振子,对所述超声波喇叭形辐射体施加超声波振动;
超声波振荡器,使所述超声波振子振荡超声波;
电流源,使电流在结合所述绝缘覆盖线的金属线的第一电极与所述毛细管之间经由所述金属线流动;
电阻检测器,检测所述电极、所述金属线与所述毛细管之间的电阻值;和
控制部,对所述机构、所述超声波振荡器、所述电流源以及电阻检测器进行控制。
[18]在上述[17]的接合装置中,其特征在于,
所述控制部进行控制,以使得通过所述机构对从所述毛细管的前端抽出的所述绝缘覆盖线加压并按压到所述电极,通过所述超声波振荡器使所述超声波喇叭形辐射体超声波振动,从而通过所述电阻检测器检测到所述毛细管与所述第一电极在所述绝缘覆盖线与所述第一电极的紧贴部处经由所述绝缘覆盖线的金属线而处于导通状态之后,通过所述电流源而使电流在所述毛细管与所述第一电极之间流动而对所述紧贴部的所述金属线进行加热,从而剥离所述绝缘覆盖线的所述绝缘覆盖。
[19]在上述[18]的接合装置中,其特征在于,
所述控制部进行控制,以使得在剥离了所述绝缘覆盖线的所述绝缘覆盖之后,通过所述电流源使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且通过所述超声波振荡器使所述超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线与所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
发明效果
本发明的一方式能够提供一种能稳定地结合绝缘覆盖线的金属线和电极的绝缘覆盖线的结合方法。
此外,本发明的一方式能够提供一种即使不使用激光器、加热器也能剥离绝缘覆盖线的覆盖而与电极稳定地结合的绝缘覆盖线的结合方法、连接构造或者接合装置。
此外,本发明的一方式能够提供一种提供一种能够稳定地剥离与电极的结合部的绝缘覆盖线的覆盖的绝缘覆盖线的剥离方法或者接合装置。
另外,本说明书中,所谓“接合装置”包括能够适用本发明的各种接合装置。
附图说明
图1的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的上表面图,图1的(B)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图2为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图3的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的上表面图,图3的(B)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图4的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的上表面图,图4的(B)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图5的(A)~(C)为表示图2所示的专用工具的具体例的立体图。
图6为表示以凸块将绝缘覆盖线的前端与电极相结合的状态的例子的侧视图。
图7的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的上表面图,图7的(B)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图8为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的侧视图。
图9的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的图,图9的(B)为表示本发明的一方式所涉及的绝缘覆盖线的结合状态的变形例的图。
图10为表示用于本发明的一方式所涉及的医疗用的领域的电子部件的基板的立体图。
图11为表示用于本发明的一方式所涉及的半导体领域的基板的立体图。
图12为用于说明图11所示的连接构造的效果的立体图。
图13为示意性地表示本发明的一方式所涉及的线接合装置的图。
图14为用于详细地说明图13所示的线接合装置的动作的示意图。
图15为用于说明图14所示的动作的时序图。
图16为示意性地表示楔形接合装置的一部分的结构图。
图17为用于说明将绝缘覆盖线的前端与以往的半导体领域的产品的电极结合的方法的剖视图。
具体实施方式
以下,采用附图对本发明的实施的方式详细地进行说明。其中,本发明并不限于以下的说明,能不脱离本发明的主旨及其范围地对其方式以及详细内容进行各种变更,这一点对于本领域技术人员来说容易理解。因此,本发明并不限定于以下所示的实施的方式的记载内容来解释。
[第一实施方式]
图1~图4为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的图。
首先,如图1的(A)、(B)所示那样,将没有剥离覆盖的绝缘覆盖线11载置或者设置于电子部件或者基板的电极(也称为第一电极)12上。该动作也可通过人的手进行,也可以通过机械进行。另外,绝缘覆盖线11为金属线被有机物覆盖的绝缘覆盖线。金属线的材质为金、银、铜、铂、不锈钢、钨、铑、铱。此外,有机物的材质为聚酰胺系(例如聚酰胺,聚酰胺酰亚胺),聚酯系(例如聚酯,聚酯酰亚胺),聚酰亚胺,聚乙烯,聚丙烯,氯乙烯,氟系树脂系(例如,FEP、ETFE、PFA、PVDF、PTFE、PCTFE)。此外,基板包括用于医疗用的领域的电子部件等的基板、用于医疗用的领域以外的半导体领域的基板等。作为用于医疗用的领域的电子部件,举出体内埋入型传感器、体内埋入型BMI装置等。
接下来,如图2所示那样,通过专用工具13的前端将绝缘覆盖线11的靠近一端11a的另一端一侧按压到电极12,使专用工具13前后地移动来剥离覆盖。作为其他的方法也可在专用工具13的上部(未图示)安装超声波喇叭形辐射体(未图示)以使超声波振动能够施加,以超声波振动剥离覆盖。通过由该超声波振动对覆盖面的一部分施加热量而熔化的效果和由专用工具的前端剥离的效果来剥离覆盖面。
此后,将专用工具13的前端从绝缘覆盖线11拆下。由此,如图3的(A)、(B)所示那样,绝缘覆盖线11的覆盖被剥离,绝缘覆盖线11的靠近一端11a的另一端侧的金属线14露出。此时,绝缘覆盖线11成为一较弱的力与电极12结合的“暂时固定状态”,绝缘覆盖线11的表面有若干的裂纹,绝缘覆盖线11中的金属线(芯线)14处于裸露。
图2所示的工序也可采用将毛细管更换为专用工具13的线接合装置(未图示)来进行。换句话说,专用工具13也可不采用通常的线接合装置中所使用的毛细管(将线通过工具内部而使用的部件),而采用对设置于电极12上的绝缘覆盖线11的上表面进行压接那样的捣固工具。另外,专用工具13也可使用金属制或者陶瓷制的工具。此外,线接合装置也可采用公知的线接合装置,但例如线接合装置具备超声波喇叭形辐射体和对所述超声波喇叭形辐射体提供超声波的超声波振子,使所述超声波喇叭形辐射体保持专用工具13,通过对专用工具13施加超声波振动从而能使金属线14从绝缘覆盖线11露出。
此外,由于只要专用工具13的前端为能使金属线14从绝缘覆盖线11露出的程度的形状即可,因而能采用各种形状,此外能与绝缘覆盖线以及电极的材质、尺寸相匹配地采用各种形状。作为具体例,如图5的(A)所示那样专用工具13a的前端10a也可具有网眼状的部分(多个尖头的部分),如图5的(B)所示那样专用工具13b的前端10b也可具有十字形状的部分,如图5的(C)所示那样专用工具13的前端10也可具有四边形状的部分。另外,在本实施方式中,采用图5的(C)所示的专用工具13。
此后,使用线接合装置(未图示),使超声波喇叭形辐射体保持金、银、铜、铂等的金属制的线被插通的毛细管,从毛细管抽出线,通过对从毛细管前端突出的线的前端与放电电极之间施加高电压从而引起火花放电,通过该放电能量使线前端部熔融而作成球,将该球从图3所示的暂时固定于电极12上的绝缘覆盖线11上按压并断开线。由此,如图4的(A)、(B)所示那样,将金属线14露出的绝缘覆盖线11和电极12通过凸块(也成为第一凸块)15直接结合。通过使用由金属制的球构成的凸块15,从而如果即使绝缘覆盖线11与电极12的接触部分被绝缘,若干的裂纹进入覆盖,也能确保从这里露出的金属线14和电极12的电气的导通。与此同时,绝缘覆盖线11与电极12的结合强度增加,能保证稳定的结合状态,能确保稳定的电气的导通。另外,凸块15的材质为金、银、铜、铂等。
如上那样得到的图4的(A)、(B)所示的连接构造,在绝缘覆盖线11以及电极12上形成凸块15,从位于电极12上的绝缘覆盖线11露出的金属线14和电极12通过凸块15被电连接。绝缘覆盖线11的一端11a被有机物覆盖,通过从绝缘覆盖线11的靠近一端11a的另一端侧露出的金属线和电极12被凸块15电连接。
另外,形成图4所示的凸块15的线接合装置也能使用与在图2所示的工序中使用的线接合装置相同的装置,也能使用其他的装置。例如,通过将安装于线接合装置的工具变更为除毛细管以为的器件,也能以相同的线接合装置进行图4所示的凸块形成工序和图2所示的工序的动作。
此外,在本实施方式中,如图4所示那样绝缘覆盖线11的一端11a从结合了绝缘覆盖线11和电极12的凸块15露出,但也可如图6所示那样绝缘覆盖线11的前端不从结合了绝缘覆盖线11和电极12的凸块15露出。
图6所示的结合方法不使用专用夹具而使用通常的线接合装置的毛细管将绝缘覆盖线11推拉到电极,从而绝缘覆盖线11的前端的覆盖被剥离,使绝缘覆盖线11的前端的金属线露出,通过凸块15将绝缘覆盖线11的前端与电极12直接结合,也可使绝缘覆盖线11的前端不从该凸块15露出。
凸块15的形成方法与图4所示的凸块15的形成方法同样。详细地来说,将通过毛细管的线从绝缘覆盖线更换为金、银、铜、铂等的金属线,对线给予放电而作成球从而从绝缘覆盖线11上断开按压线,因而能进行与图4的结合同样的结合(参照图6)。
如果为该方法,则由于使用线接合装置的毛细管因而具有不使用专用夹具而能结合的优点。
根据本实施方式,即使不使用激光器、加热器也能剥离绝缘覆盖线11的覆盖而与电极12稳定地结合。换句话说,由于通过另换线接合装置的结合工具而能进行全部的动作,因而不需要剥离激光器单元、加热器单元等的覆盖的大型机械构造,能够剥离绝缘覆盖线11的覆盖而与电极12稳定地结合。
此外,由于在结合前不需要剥离覆盖的工序,因而能实现操作的简易化以及高速化。
此外,即使不完全除去覆盖也由金属制的凸块15结合电极12与绝缘覆盖线11,从而能确保金属线14与电极12的电气的导通以及结合强度的这两者,与产品的稳定化相关联。
此外,由于将覆盖除去了必要以上,因而即使使用于在医疗器具的领域中所使用的产品中也能减少对人体的影响。此外,通过采用机械来使人所进行的作业自动化,从而能实现生产性的提高、品质的提高、产品的品质的偏差的抑制、产品的小型化。
[第二实施方式]
图7以及图8为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的图,对与图1~图4相同的部分赋予相同的符号。
首先,如图7的(A)、(B)所示那样,将从线接合装置(未图示)的毛细管21的前端抽出的绝缘覆盖线11载置或者固定于第一位置,通过从毛细管21的前端抽出绝缘覆盖线11并使毛细管21移动到第二位置,从而将覆盖未被剥离的绝缘覆盖线11载置于电子部件的第一电极12上。
接下来,如图8所示那样,通过专用工具13的前端将绝缘覆盖线11按压到第一电极12。
此后的工序未图示,但从绝缘覆盖线11拆下专用工具13的前端。由此,绝缘覆盖线11的覆盖被剥离,露出绝缘覆盖线11的金属线。此时,绝缘覆盖线11处于与第一电极12以较弱的力量结合的“暂时固定状态”,在绝缘覆盖线11的表面有若干的裂纹,绝缘覆盖线11中的金属线(芯线)处于裸露状态。
此后,通过线接合装置(未图示)将使用金、银、铜、铂等的金属制的线所作成的球从被暂时固定于第一电极12上的绝缘覆盖线11上按压,从而通过凸块将金属线露出的绝缘覆盖线11和第一电极12直接结合。
此后,也可通过凸块将被载置或者固定于上述的第一位置的绝缘覆盖线11的端部侧所露出的金属线和第二电极结合(未图示)。
本实施方式中也能得到与第一实施方式相同的效果。
[第三实施方式]
图9的(A)为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的图。
首先,将从线接合装置(未图示)的毛细管(未图示)的前端抽出的绝缘覆盖线11载置或者固定于电子部件的第一电极(也称为第二电极)22上。
接下来,通过图5的(C)所示的专用工具13的前端10将绝缘覆盖线11按压到第一电极22,从绝缘覆盖线11拆下专用工具13的前端,从而使金属线从绝缘覆盖线11露出,将绝缘覆盖线11暂时固定于第一电极22上。
此后,通过线接合装置(未图示)将采用金属制的线所作成而得到的球从暂时被固定于第一电极22上的绝缘覆盖线11上进行按压,从而通过第一凸块(也称作第二凸块)25将金属线露出了的绝缘覆盖线11与第一电极22直接结合。由此,绝缘覆盖线11中的金属线与第一电极22电连接。
接下来,通过从毛细管的前端抽出绝缘覆盖线11并使毛细管在第二电极(也称作第一电极)32上移动,从而将绝缘覆盖线11载置或者固定于第二电极32上。
接下来,通过图5的(C)所示的专用工具13的前端10将绝缘覆盖线11按压到第二电极32,从绝缘覆盖线11拆下专用工具13的前端,从而使金属线从绝缘覆盖线11露出,将绝缘覆盖线11暂时固定于第二电极32上。
此后,通过线接合装置(未图示)将采用金属制的线所作成而得到的球从被暂时固定于第二电极32上的绝缘覆盖线11上按压,从而通过第二凸块(也称作第一凸块)35将金属线露出的绝缘覆盖线11和第二电极32直接结合。由此,绝缘覆盖线11中的金属线与第二电极32电连接。
如上那样得到的图9的(A)所示的连接构造成为如下那样。绝缘覆盖线11的一端配置于第一电极22上,在绝缘覆盖线11的一端以及第一电极22上形成第一凸块25。从位于第一电极22上的绝缘覆盖线11露出的金属线通过第一电极22和第一凸块25被电连接。绝缘覆盖线11的另一端被配置于第二电极32上,在绝缘覆盖线11的另一端以及第二电极32上形成第二凸块35。从位于第二电极32上的绝缘覆盖线11露出的金属线通过第二电极32和第二凸块35被电连接。
在本实施方式中也能得到与第一实施方式同样的效果。
另外,在本实施方式中,在将绝缘覆盖线11载置或者固定于第一电极22上时,以及将绝缘覆盖线11载置或者固定于第二电极32上时,使用了线接合装置的毛细管,但也可通过人的手进行这些动作。
此外,在本实施方式中,如图9的(A)所示那样将第一电极22与第二电极32之间的绝缘覆盖线11设为直线形状,但并不限于此,也可如图9的(B)所示那样将第一电极22与第二电极32之间的绝缘覆盖线11设为环状形状。
[第四实施方式]
图10为表示使用于本发明的一方式所涉及的医疗用的领域的电子部件的基板的立体图。
该医疗用产品的基板具有第一基板16以及第二基板26,在第一基板16上配置多个第一电极22,在第二基板26上配置多个第二电极32。第一电极22以及第二电极32分别为接合垫。
第一电极22与第二电极32通过绝缘覆盖线11、第一以及第二凸块25、35被电连接。另外,第一电极22与第二电极32的连接方法以及连接构造能使用第一至第三实施方式中的任一个实施方式。
在本实施方式中也能得到与第一实施方式同样的效果。
[第五实施方式]
图11为表示用于本发明的一方式所涉及的半导体领域的基板的立体图。所谓半导体用产品称作用于半导体领域的电子部件等。
该半导体产品的基板具有第一基板36以及第二基板46,在第一基板36上配置多个第一电极42,在第二基板46上配置多个第二电极52。
第一电极42与第二电极52通过绝缘覆盖线11、第一凸块(未图示)以及第二凸块55被电连接。另外,第一电极42与第二电极52的连接方法以及连接构造能使用第一至第三实施方式的任一个实施方式。
在本实施方式中也能得到与第一实施方式相同的效果。
此外,对第一电极42与第二电极52的电连接不采用未被覆盖的金属线而采用绝缘覆盖线11的理由在于,如果电极间的间距变窄则如图12所示那样由于绝缘覆盖线11稍微倾斜而有时会与与相邻的绝缘覆盖线11相接触。如上那样与相邻的绝缘覆盖线11相接触了的情况下,如果采用未被覆盖的金属线则短路,但如果使用绝缘覆盖线11则确保绝缘。
[第六实施方式]
图13为示意性地表示本发明的一方式所涉及的线接合装置的图,对与图1~图4相同的部分赋予相同的符号。
图13的线接合装置为对绝缘覆盖线11进行接合的装置。该装置具有作为抽出绝缘覆盖线11的接合工具的毛细管61,毛细管61由具有超硬合金、金属陶瓷那样的硬的导电性的材料来制作,在毛细管61的中央形成通过绝缘覆盖线11的贯通孔。
毛细管61被装在超声波喇叭形辐射体62的前端部的安装孔,通过未图示的螺丝等而被紧固从而被保持。此外,线接合装置具有使保持于超声波喇叭形辐射体62的毛细管61上下移动的机构,该机构为使用了电动机63的动力的图中未示出的机构。通过该机构能使超声波喇叭形辐射体62在箭头64的方向上上下运动。由此,能够使安装于超声波喇叭形辐射体62的毛细管61按压到第一电极12,或者离开第一电极12。此外,通过上述的机构,能够将毛细管61在箭头65的方向上以规定的加压力按压到第一电极12。
超声波喇叭形辐射体62中安装有施加超声波振动的超声波振子66,超声波振子66与使超声波振荡的超声波振荡器69连接。详细地来说,超声波振子66连接振子正电极67与振子负电极68,振子正电极67与振子负电极68与超声波振荡器69电连接。通过从超声波振荡器69对振子正电极67和振子负电极68施加正弦波电压,从而超声波振子66被驱动,由此超声波振子66进行超声波振动。详细地来说,该超声波振动的振动频率被控制为与超声波喇叭形辐射体62的固有振动一致,通过超声波喇叭形辐射体62的谐振而振动振幅放大,能够对毛细管61的前端部给予用于机械的加工的超声波振动。
此外,线接合装置具有在结合绝缘覆盖线11的金属线的电极(也称作第一电极)12与毛细管61之间经由金属线流动电流的恒流源70,该恒流源70具有电流ON/OFF功能和电流值可变功能。与第一电极12电连接的通电正电极71和与振子负电极68共用的通电负电极72被电连接到恒流源70。由此,如箭头74所示那样恒定的通电电流能从第一电极12立冬到绝缘覆盖线11的金属线、毛细管61以及超声波喇叭形辐射体62。
此外,线接合装置具有对第一电极12、绝缘覆盖线11的金属线和毛细管61间的电阻值进行检测的电阻检测器73。该电阻检测器73被电连接到恒流源70的两极。电阻检测器73对通电正电极71与通电负电极72之间的电阻值进行监控,为了以两电极间的绝缘破坏为起点而从恒流源70供给电流而发挥功能。
此外,线接合装置具有作为对使上述的超声波喇叭形辐射体62圆弧移动的机构、超声波振荡器69、恒流源70以及电阻检测器73进行控制的控制部的控制器75。通过来自控制器75的指令由超声波振荡器69能够使超声波振子66超声波振动。此外,通过来自控制器75的指令由恒流源70能使电流从第一电极12流到毛细管61。电阻检测器73将第一电极12与毛细管61之间的绝缘破坏传递到控制器75。进而,通过控制器75控制电动机63,从而能使超声波喇叭形辐射体62上下运动,能够使毛细管61如箭头65那样运动并将绝缘覆盖线11加压到第一电极12。
接下来,对上述的线接合装置的动作进行说明并对绝缘覆盖线的结合方法也进行说明。
首先,从作为接合工具的毛细管61的前端抽出的绝缘覆盖线11以规定的加压力被按压到第一电极12。在该时间点,绝缘覆盖线11的绝缘覆盖不被破坏,带有导电性的毛细管61与带有相同的导电性的第一电极12之间的电气的绝缘被维持。接下来,通过使超声波喇叭形辐射体62超声波振动,从而对于毛细管61与绝缘覆盖线11的接触点,以及,绝缘覆盖线11与第一电极12之间的紧贴部施加由于超声波振动所引起的高频度的反复应力,裂纹在两接点的绝缘覆盖中产生,绝缘覆盖中产生部分的破坏。由此,在绝缘覆盖线11与第一电极12的紧贴部经由绝缘覆盖线11的金属线(芯线)毛细管61与第一电极12成为导通状态。从绝缘状态向导通状态的变化被电阻检测器73检测,并被传达到控制器75。
此后,从电阻检测器73传达了导通状态的控制器75对恒流源70进行指令,该恒流源70使预先设定的电流开始从设置于第一电极12的通电正电极71流动到设置于超声波喇叭形辐射体62的通电负电极72。通过使从通电正电极71起到第一电极12为止、从通电负电极72起到毛细管61的前端为止的电阻值尽可能地降低的结构,从而毛细管61与绝缘覆盖线11内的金属线(芯线)的接触部和该金属线与第一电极12的接触部之间的相对的电阻值相对于该电阻值变高,电力损耗集中的结果,局部地产生高的焦耳热,并被加热。由此,使绝缘覆盖在绝缘覆盖线11与第一电极12的紧贴部外移动,从绝缘覆盖线11剥离绝缘覆盖。
如果详细地进行说明,则通过该绝缘破坏之后不久的加热,绝缘覆盖线11与第一电极12的结合面周围的由热可塑性有机物构成的绝缘覆盖进行流动化。在此,通过施加适当的加压和超声波振动,从而进行了流动化的绝缘覆盖不会进行分散而被推到结合面的外缘,通过热量、加压与超声波振动的相互作用除去对于结合面成为结合的障碍的有机物、氧化物、水分等,形成清净的结合面。如上那样从绝缘覆盖线11剥离绝缘覆盖。
接下来,切换通电电流值、超声波振动振幅、加压力而转移到结合工序。作为一例,降低通电电流值,增加超声波振动,使加压力逐渐增加,进行绝缘覆盖线11内的金属线与第一电极12的表面的超声波固相结合。由此,绝缘覆盖线11内的金属线与第一电极12电连接。
如果金属线与第一电极12的结合完成了,则停止超声波振动,并维持加压不变,通过增加恒定时间通电电流,从而对结合部进行加热,使金属线与第一电极12的合金层生长,实现更强固的结合状态。此外,通过通电电流来控制温度、加热时间,从而在结合面的合金层与周边金属的再结晶过程中对结晶粒的大小进行控制,能使结合强度进一步提高。
另外,也可如下那样变更本实施方式并进行实施。
在从绝缘覆盖线11剥离了绝缘覆盖之后,不如上述那样进行绝缘覆盖线11内的金属线与第一电极12的表面的超声波固相结合,而进行图4所示的工序。换句话说,在由上述的方法从绝缘覆盖线11剥离了绝缘覆盖之后,使毛细管61从第一电极12移动,使其他的超声波喇叭形辐射体(未图示)保持插通了金、银、铜、铂等的金属制的线的毛细管(未图示),从毛细管抽出线,通过对从毛细管前端突出的线的前端和放电电极之间加上高电压从而引起火花放电,通过该放电能量使线前端部熔融而作成球,将该球从被暂时固定于第一电极12上的绝缘覆盖线11的上按压并断开线。由此,通过未图示的凸块(也称作第一凸块)直接结合金属线露出的绝缘覆盖线11和第一电极12。
此外,如上述那样使金属线与第一电极12的合金层生长,实现更强固的结合状态之后,形成遍及金属线以及第一电极12的凸块(未图示),从而也可通过凸块进一步将金属线与第一电极12电连接。
图14为用于详细地说明图13所示的线接合装置的动作的示意图,为用于说明本发明的一方式所涉及的绝缘覆盖线的结合方法的图。图15为用于说明图14所示的动作的时序图。
在图15所示的最初的工具下降阶段81,如接合工具轨迹77所示那样通过了绝缘覆盖线11的毛细管(工具)61朝向第一电极12的接合点而下降。详细地来说,使绝缘覆盖线11从工具前端朝向接线的倾斜相反方向露出的工具61如箭头88那样朝向第一电极12在接线的倾斜方向上下降(参照图14的(A))。为了毛细管61的着地时的冲击的缓和以及稳定化,毛细管61的下降速度以恒定的低速进行。
接下来,如果检测到毛细管61的着地,则转移到绝缘破坏工序82。通过由稍微弱小的加压力78和强大的超声波能量(超声波振动振幅79)时间大振幅的超声波振动从而抑制结合前的绝缘覆盖线11的芯线(金属线)的变形,并损伤绝缘覆盖,而达到迅速的绝缘破坏。详细地来说,由工具61将绝缘覆盖线11按压到第一电极12,以超声波喇叭形辐射体使工具61超声波振动,破坏绝缘覆盖(参照图14的(B))。通过电阻检测器73以不多的电流所引起的电阻值变化检测绝缘状态80从而对结合前的意外的加热、绝缘破坏时的毛细管61的表面的电解腐蚀发生进行抑制。
接下来,如果经由绝缘覆盖被部分地破坏的绝缘覆盖线11通过电阻检测器73检测到毛细管61与第一电极12的导通状态80,则转移到结合面净化活性化工序83。在继续低的加压力78且抑制了超声波振动振幅79的状态下流动高的通电电流84,对绝缘覆盖线11与毛细管61的前端在第一电极12的结合面上相接的部分迅速地进行加热。换句话说,电流从第一电极12流到工具61,在由工具61被按压到第一电极12的绝缘覆盖线11的金属线(芯线)部分产生焦耳热(参照图14的(C))。由此,由该热量和超声波振动使绝缘覆盖流动化而推出到结合面的外侧,将其他的有机物、水分同时从结合面除去,在接下来的结合动作中制备并形成清净的结合面,并且通过加热降低结合部的杨氏模量,激活结合面的分子运动,并使第一电极12的表面活性化。通过设定通电电流值和通电时间以使成为构成加热部的绝缘覆盖的热可塑性有机物流动化的温度(数百度),从而避免由于加热不足所引起的覆盖剩余、过热所引起的必要以上的覆盖除去、进而成为覆盖的碳化所引起的结合的障碍的杂质的产生。此外,通过抑制加压力78与超声波振动振幅79,从而抑制结合前的绝缘覆盖线的金属芯线的变形,流程加工余地,从而在结合时能采用更多的加压力和超声波振动振幅而成为强固的结合。
如果结合面的净化结束,则转移到结合工序85。在结合工序85中,使超声波振动振幅79增加,降低通电电流84,从而形成超声波热压接的条件。换句话说,由超声波热压接结合绝缘覆盖线11的金属线(芯线)与第一电极12(参照图14的(C))。通过使加压力78也逐次地增加,从而抑制绝缘覆盖线11的芯线变形时的毛细管11的追随下降延迟所引起的加压释放,使结合稳定化。
如果超声波结合结束,则转移到扩散成长工序86。维持加压力78不变,切断超声波振动,由通电电流84保持热量,从而结合部的芯线与第一电极12的合金层扩散成长,更强固的结合状态得以实现。此时,避免过热所引起的绝缘覆盖线11的损坏,并且在结合面的合金层与周边金属的再结晶过程中对结晶粒的大小进行控制,为了进一步提高结合强度,最佳地设定通电电流值和通电时间。换句话来说,如果形成结合面,得到足够的绝缘覆盖线11的金属线(芯线)的变形,则停止超声波振动,由加压和通电加热使结合面的合金层以最佳的结晶粒的大小生长(参照图14的(D))。
如图5所示那样,扩散成长工序86后,如果全部的结合过程完成了,则转移到工具上升阶段87。使毛细管11如接合工具轨迹77所示那样上升。详细地来说,停止通电,使工具61在箭头89的接线方向上上升/移动,形成绝缘覆盖线11的环状(参照图14的(E))。
从前端抽出绝缘覆盖线11,并使工具61如箭头92那样朝向第二电极90在接线的倾斜方向上下降(参照图14的(F))。
由工具61将绝缘覆盖线11按压到第二电极90,以超声波喇叭形辐射体使工具61超声波振动,而破坏绝缘覆盖(参照图14的(G))。
如果由电阻检测器检测到工具61与第二电极90的绝缘破坏,则电流如箭头那样从第二电极90流动工具61,在由工具61被按压到第二电极90的绝缘覆盖线11的金属线(芯线)部分产生焦耳热,由该热量和超声波振动使绝缘覆盖流动而被推到结合面的外侧。进而以超声波热压接将绝缘覆盖线11的金属线(芯线)与第二电极90进行结合(参照图14的(H))。
如果形成结合面,得到足够的绝缘覆盖线11的金属线(芯线)的变形,则停止超声波振动,由加压和通电加热使结合面的合金层以最佳的结晶粒的大小生长(参照图14的(I))。
停止通电,在接线方向上使工具61如箭头93那样稍微倾斜地上升,通过与工具61一体的切钳94夹紧绝缘覆盖线11(参照图14的(J))。
在夹紧了绝缘覆盖线11的状态下,使工具在接线方向上如箭头95那样上升/移动,在结合面的边界拉断绝缘覆盖线11(参照图14的(K))。
上述的线接合装置的动作通过控制器75被控制。
根据本实施方式,在将绝缘覆盖线11与电极12进行接合时,能有效地除去成为结合的障碍的结合面的绝缘覆盖,能够实现高品质并且高生产性的接合方法。进而,能较多地利用现有的接合工艺,能不改变线接合装置的结构地实现,因而为也具有低成本且通用性高的方法这样的优点。
此外,在本实施方式中,还具有以下的效果。
(1)由于不需要将热源等追加到接合工具、工件周围,因而能够直接利用以往的线接合装置。此外,也不会使作业区域变窄。
(2)通过对加压、超声波振动、通电电流的功率、时间的参数进行调整,从而将结合过程中的绝缘破坏、结合面净化活性化、结合扩散成长的各过程分离,能单个地进行最优化。
(3)由于以恒流通电所产生的焦耳热而相对电阻值高的结合点进行自发热,因而能以低热容量迅速进行升温、冷却。其结果是,能成为最小的加热区域和短时间的加热,能使绝缘覆盖的损坏最小化。
(4)通过对通电加热的电源进行恒流控制,从而对发热部的温度进行稳定化,能够避免加热不足所引起的覆盖剩余、过热所引起的对覆盖的损坏。此外,正确的通电时间的设定、通电电流值的可变功能进一步代理覆盖线结合的最优化。
(5)对通电加热所产生的区域和时间进行了限定的局部加热不是加热板随引起的器件的加热,而能成为超声波热压接。超声波热压接相对于仅超声波的加热,降低结合面的杨氏模量,具有除去阻碍结合的水分的效果,促进由结合产生的合金层的扩散成长,能进行强固的结合。此外,通过抑制超声波振幅,从而减小工具损坏,通过工具的长寿命化能够抑制伴随着工具更换的生产性的降低和操作成本的上升。综合来说,相对于热压接和超声波结合,超声波热压接能减少对线和器件的损坏。
(6)在结合过程编入覆盖线除去过程的本实施方式,相对于预先除去覆盖线的结合位置的覆盖的方法,不需要复杂的机构部分,能使工序简单化,生产性显著提高。
(7)通过通电加热将区域和时间最小化,从而能进行仅覆盖除去、结合所需要的部分的局部加热。该效果不仅为对覆盖线的损坏抑制,而且对结合对象得到以下的效果。
(a)能够使用耐热较弱的材料,例如,树脂基座的薄膜、挠性基板,容易破裂的陶瓷基板。其理由在于由于不对全体进行加热,因而能仅对结合部充分地进行加热。
(b)能够使用热传导性差的材料,例如树脂基板。其理由在于,不通过基座材料对结合部进行加热,而进行直接加热,因而升温较快,周围也具有绝热特性,因而能更加提高加热效率。
(c)能够使用热容量大的基板,能适用于被搭载于散热器的功率器件。其理由在于,不进行低效的全体加热,以局部加热进行超声波热压接。其结果是,能进行品质更高的结合。
此外,相对于以往的结合方法具有以下的效果。
(1)超声波所引起的固相结合不如点焊、电阻焊接那样熔化材料,因而加压力、电流值的参数的设定范围广。此外,由于不熔化金属,因而能够防止金属蒸气所引起的热束产生。此外,由于仅为超声波结合辅助的加热,因而不需要大电流。
(2)对于仅超声波振动的结合,通过热量所引起的表面活性化和结合部的杨氏模量降低所引起的相互搅拌以及合金层的成长能提高结合强度。此外,通过热辅助,由材料软化、超声波振动振幅的抑制能防止摩擦所引起的灰尘。
(3)由于能直接使用现有的设备,因而能够实现低成本化。
[第七实施方式]
图16为示意性地表示楔形接合装置的一部分的结构图,与图13相同的部分赋予相同的符号,进行对不同的部分进行说明。
楔形接合中,采用楔形接合工具91。除此以外的结构与图13所示的线接合装置相同,接合过程也相同。
在本实施方式中也能得到与第六实施方式同样的效果。
另外,第一至第七的实施方式也能相互组合来进行实施。
符号说明
10、10a、10b…专用工具的前端
11…绝缘覆盖线
11a…绝缘覆盖线的一端
12…第一电极
13、13a、13b…专用工具
14…金属线(芯线)
15…凸块(第一凸块)
16、36…第一基板
21…毛细管
22、42…第一电极
25…第一凸块
26、46…第二基板
32、52…第二电极
35、55…第二凸块
61…毛细管
62…超声波喇叭形辐射体
63…电动机
64、65…箭头
66…超声波振子
67…振子正电极
68…振子负电极
69…超声波振荡器
70…恒流源
71…通电正电极
72…通电负电极
73…电阻检测器
74…箭头
75…控制器
77…接合工具轨迹
78…加压力
79…超声波振动振幅
80…导通状态或者绝缘状态
81…工具下降阶段
82…绝缘破坏工序
83…结合面净化活性化工序
84…通电电流
85…结合工序
86…扩散成长工序
87…工具上升阶段
88、89、92、93、95…箭头
90…第二电极
91…楔形接合工具
94…切钳
101…绝缘覆盖线
101a…芯线(金属线)
102…电极。
Claims (19)
1.一种绝缘覆盖线的结合方法,为通过金属线被有机物覆盖的绝缘覆盖线使第一电极和第二电极导通的绝缘覆盖线的结合方法,该绝缘覆盖线的结合方法的特征在于,具备:
工序(a),将所述绝缘覆盖线载置于第一电极上;
工序(b),使金属线从所述绝缘覆盖线露出;
工序(c),通过形成遍及已露出的所述金属线以及所述第一电极的第一凸块,从而将所述金属线与所述第一电极电连接。
2.根据权利要求1所述的绝缘覆盖线的结合方法,其中,
所述工序(b)为以下工序,即通过工具的前端将所述绝缘覆盖线按压到所述第一电极,从而使所述金属线从所述绝缘覆盖线露出。
3.根据权利要求2所述的绝缘覆盖线的结合方法,其中,
在所述工序(b)中,使用具备超声波喇叭形辐射体和对所述超声波喇叭形辐射体提供超声波的超声波振子的接合装置,使所述超声波喇叭形辐射体保持所述工具,通过对所述工具施加超声波振动从而使所述金属线从所述绝缘覆盖线露出,
在所述工序(c)中,使用所述接合装置,使所述超声波喇叭形辐射体保持线被插通的毛细管,通过对从所述毛细管前端突出的线的前端和放电电极之间施加高电压从而引起放电,通过该放电能量使线前端部熔融而形成所述第一凸块。
4.根据权利要求1~3中任一项所述的绝缘覆盖线的结合方法,其中,
所述工序(a)为以下的工序,即将从接合装置的毛细管的前端抽出的绝缘覆盖线载置于第一位置,从所述毛细管的前端抽出绝缘覆盖线并使所述毛细管移动到第二位置,从而将所述绝缘覆盖线载置于所述第一电极上。
5.根据权利要求1~3中任一项所述的绝缘覆盖线的结合方法,其中,
在所述工序(a)之前具有以下工序:
将从接合装置的毛细管的前端抽出的绝缘覆盖线载置于第二电极上,通过工具的前端将所述绝缘覆盖线按压到所述第二电极,从而使所述金属线从所述绝缘覆盖线露出;和
通过形成遍及已露出的所述金属线以及所述第二电极的第二凸块,从而将所述金属线与所述第二电极电连接,
所述工序(a)为以下的工序,即从所述毛细管的前端抽出绝缘覆盖线并使所述毛细管移动,从而将所述绝缘覆盖线载置于所述第一电极上。
6.根据权利要求1所述的绝缘覆盖线的结合方法,其中,
所述工序(a)为由加压力将从接合装置的毛细管的前端抽出的所述绝缘覆盖线按压到所述第一电极的工序,
所述工序(b)为以下的工序,即通过使所述接合装置的超声波喇叭形辐射体超声波振动,从而检测到在所述绝缘覆盖线与所述第一电极的紧贴部处所述毛细管与所述第一电极经由所述绝缘覆盖线的金属线而处于导通状态,此后,通过使电流在所述毛细管与所述第一电极之间流动而对所述紧贴部的所述金属线进行加热,从而使所述绝缘覆盖移动到所述紧贴部之外,将所述绝缘覆盖从所述绝缘覆盖线剥离。
7.一种绝缘覆盖线的剥离方法,其特征在于,具备:
工序(a),将从接合装置的毛细管的前端抽出的绝缘覆盖线加压并按压到第一电极;
工序(b),通过使所述接合装置的超声波喇叭形辐射体超声波振动,从而对所述毛细管与所述第一电极在所述绝缘覆盖线与所述第一电极的紧贴部处经由所述绝缘覆盖线的金属线而处于导通状态进行检测;
工序(c),通过使电流在所述毛细管与所述第一电极之间流动并对所述紧贴部的所述金属线进行加热,从而使所述绝缘覆盖移动到所述紧贴部之外,将所述绝缘覆盖从所述绝缘覆盖线剥离。
8.一种绝缘覆盖线的结合方法,其特征在于,具有:
工序(d),在采用权利要求7所记载的绝缘覆盖线的剥离方法剥离了所述绝缘覆盖线的所述绝缘覆盖之后,使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且使所述超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线与所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
9.一种绝缘覆盖线的结合方法,具备:
工序(c),在从接合装置的毛细管的前端抽出的绝缘覆盖线与第一电极的紧贴部,通过所述毛细管将所述绝缘覆盖线的绝缘覆盖被剥离而露出的金属线按压到所述第一电极;和
工序(d),使电流在所述毛细管与所述第一电极之间流动且使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且使所述接合装置的超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线和所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
10.根据权利要求8或者9所述的绝缘覆盖线的结合方法,其特征在于,
在所述工序(d)之后具有工序(e),该工序(e)停止所述超声波振动,通过所述毛细管将所述紧贴部的所述金属线加压到所述第一电极并且使电流在所述金属线与所述第一电极之间流动,从而使所述金属线与所述第一电极的合金层生长而提高结合强度。
11.根据权利要求8~10中任一项所述的绝缘覆盖线的结合方法,其特征在于,
在所述工序(d)或者所述工序(e)之后具有工序(f),工序(f)通过形成遍及所述金属线以及所述第一电极的凸块,从而通过所述凸块将所述金属线与所述第一电极电连接。
12.一种连接构造,其特征在于,具备:
第一电极;
绝缘覆盖线,配置于所述第一电极上且金属线已由有机物覆盖;和
第一凸块,遍及所述绝缘覆盖线以及所述第一电极地形成;
从位于所述第一电极上的所述绝缘覆盖线露出的金属线和所述第一电极通过所述第一凸块被电连接。
13.根据权利要求12所述的连接构造,其特征在于,
所述绝缘覆盖线的一端被所述有机物覆盖,
从所述绝缘覆盖线露出的金属线位于与所述绝缘覆盖线的一端相比更靠另一端侧的位置。
14.根据权利要求12或13所述的连接构造,其特征在于,
具备:
第二电极;
配置于所述第二电极上的所述绝缘覆盖线;和
形成于所述绝缘覆盖线以及所述第二电极上的第二凸块,
从位于所述第二电极上的所述绝缘覆盖线露出的金属线和所述第二电极通过所述第二凸块被电连接。
15.一种连接构造,其特征在于,
具备:
第一电极;和
配置于所述第一电极上,金属线被有机物覆盖的绝缘覆盖线,
从位于所述第一电极上的所述绝缘覆盖线露出的金属线和所述第一电极通过在所述金属线与所述第一电极之间成长的合金层而被结合。
16.根据权利要求12~15中任一项所述的连接构造,其特征在于,
具有配置有所述第一电极的基板,
所述基板为用于医疗用领域的电子部件的基板。
17.一种接合装置,其特征在于,具备:
毛细管,抽出绝缘覆盖线并具有导电性;
超声波喇叭形辐射体,保持所述毛细管;
使保持于所述超声波喇叭形辐射体的所述毛细管上下移动的机构;
超声波振子,对所述超声波喇叭形辐射体施加超声波振动;
超声波振荡器,使所述超声波振子振荡超声波;
电流源,使电流在结合所述绝缘覆盖线的金属线的第一电极与所述毛细管之间经由所述金属线流动;
电阻检测器,检测所述电极、所述金属线与所述毛细管之间的电阻值;和
控制部,对所述机构、所述超声波振荡器、所述电流源以及电阻检测器进行控制。
18.根据权利要求17所述的接合装置,其特征在于,
所述控制部进行控制,以使得通过所述机构对从所述毛细管的前端抽出的所述绝缘覆盖线加压并按压到所述电极,通过所述超声波振荡器使所述超声波喇叭形辐射体超声波振动,从而通过所述电阻检测器检测到所述毛细管与所述第一电极在所述绝缘覆盖线与所述第一电极的紧贴部处经由所述绝缘覆盖线的金属线而处于导通状态之后,通过所述电流源而使电流在所述毛细管与所述第一电极之间流动而对所述紧贴部的所述金属线进行加热,从而剥离所述绝缘覆盖线的所述绝缘覆盖。
19.根据权利要求18所述的接合装置,其特征在于,
所述控制部进行控制,以使得在剥离了所述绝缘覆盖线的所述绝缘覆盖之后,通过所述电流源使电流在所述紧贴部的所述金属线与所述第一电极之间流动,并且通过所述超声波振荡器使所述超声波喇叭形辐射体超声波振动而经过所述毛细管对所述金属线与所述第一电极施加超声波振动,从而将所述金属线与所述第一电极电连接。
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