JPS58122742A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS58122742A
JPS58122742A JP57004027A JP402782A JPS58122742A JP S58122742 A JPS58122742 A JP S58122742A JP 57004027 A JP57004027 A JP 57004027A JP 402782 A JP402782 A JP 402782A JP S58122742 A JPS58122742 A JP S58122742A
Authority
JP
Japan
Prior art keywords
wire
tool
lead frame
bonding
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57004027A
Other languages
English (en)
Other versions
JPH0132655B2 (ja
Inventor
Nobuhito Yamazaki
山崎　信人
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP57004027A priority Critical patent/JPS58122742A/ja
Publication of JPS58122742A publication Critical patent/JPS58122742A/ja
Publication of JPH0132655B2 publication Critical patent/JPH0132655B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/852—Applying energy for connecting
    • H01L2224/85201—Compression bonding
    • H01L2224/85205—Ultrasonic bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/85951—Forming additional members, e.g. for reinforcing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明は半導体のワイヤポンディング方法に関する。
周知の如く、半導体部品の組立においては、ペレットの
バットとリードフレームのリードポストとの間をワイヤ
で接続する。このワイヤ接続はワイヤが挿通されたツー
ルによってワイヤをバット又はリードポストに押付け、
熱圧着法又は超音波法或いは超音波併用熱圧着法によっ
てポンディングされる。
前記ワイヤは金縁又はアルミニウムー等よりなり、また
バットには一般にアルミニウム金属膜が形成されている
ので、バットへのワイヤの接続は上記方法で容易に行わ
れる。しかしながら、リートホスト（リードフレーム）
はコパール、アロイ等の金属材よりなるので、上記方法
で金−等のワイヤを接続するのは容易でない。このため
リードフレームにはワイヤとの接続を良くするために金
メッキ又は銀メッキを施している。ところで、貴金属で
ある金、銀は非常に高価であるので、半導体部品が非常
にコスト高になるという問題があった。
そこで、本発明はリードフレームに特別に表面処理を行
わなくても良好なワイヤポンディングが行えるワイヤボ
ンディング方法を提供することを目的とする。
以下、本発明を図示の一実施例により説明する。
まず、ツール１の下端より延在したワイヤ２の端部に水
素又は電気トーチ（図示せず］によってポールが形成さ
れる。次にツール１が下降してベレット３のバットにワ
イヤ２を押付け、熱圧着又は超音波或いは超音波併用熱
圧着等によってワイヤ２がペレット３のバットにボッデ
ィングされる。
次にツールｌが上昇及び水平移動してリードフレーム４
のリードポスト４ｍの上方に位置し、続いてツール１が
下降して前記と同様にリードポスト４ａにワイヤ２を押
付けてポンディングする。次にツール１がわずかに上昇
し、図示しないクラ／パーによってワイヤ２が引張られ
、リードポスト４ｍの根元より切断される。
さて、本発明においては、ツールｌが下降してリードポ
スト４１にワイヤ２を押付けてボッディングする時に電
源回路５を通電させ、ツールｌとリードフレーム４を載
置するリードフレーム載置台６との間に電流を流す。こ
のようにワイヤ２とリードポスト４ｍとのポンディフグ
部に電流を流しながらポンディングするので、リードフ
レームに金メッキ等を施さなくても従来の熱圧着又は超
音波或いは超音波併用熱圧着でワイヤ２はリードボスｌ
−４ａｆこ容易にポンディングができる。
なお、ツール１の材質としては、耐熱性の導電材、例え
ばタングステア等を用いる。また電源回路５を通電させ
るタイミング信号は、例えば特開昭５６−８８３２号公
報に示すようにツール（正確にはツール先端のワイヤ）
がリードポストに接触した時ｉこ発する信号を用いる。
以上の説明から明らかな如く、本発明になるワイヤボッ
ディング方法によれば、リードフレームに金メッキ等の
特殊な表面処理をしなくてもワイヤボンディングができ
るので、大幅なコストダウ／が図れる。
【図面の簡単な説明】
図は本発明になるワイヤボッディング方法の一実施例を
示す正面説明図である。 １・・・ツール、　　　　　　　　２・・・ワイヤ、３
・・・ペレット、　　　　　　　４・・・リードフレー
ム、４ａ・・・リードポスト、　　　　５・・・電源回
路、６・・・リードフレーム載置台。

Claims (1)

    【特許請求の範囲】
  1. ペレットのバットとリードフレームのリードポストとの
    間をツールに挿通されたワイヤて接続するワイヤボンデ
    ィング方法において、前記リードポストにワイヤをポン
    ディングする時に前記ツールとリードフレーム載量台と
    の間に電流を流してワイヤをリードポストに溶接するこ
    とを特徴とするワイヤポンディング方法。
JP57004027A 1982-01-16 1982-01-16 ワイヤボンデイング方法 Granted JPS58122742A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57004027A JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57004027A JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS58122742A true JPS58122742A (ja) 1983-07-21
JPH0132655B2 JPH0132655B2 (ja) 1989-07-10

Family

ID=11573474

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57004027A Granted JPS58122742A (ja) 1982-01-16 1982-01-16 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS58122742A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020208850A1 (ja) * 2019-04-09 2020-10-15 株式会社カイジョー 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020208850A1 (ja) * 2019-04-09 2020-10-15 株式会社カイジョー 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置
JPWO2020208850A1 (ja) * 2019-04-09 2021-09-13 株式会社カイジョー 絶縁被覆線の接合方法、接続構造、絶縁被覆線の剥離方法及びボンディング装置
TWI762888B (zh) * 2019-04-09 2022-05-01 日商海上股份有限公司 絕緣被覆線之接合方法、連接構造、絕緣被覆線之剝離方法及結合裝置
US11791304B2 (en) 2019-04-09 2023-10-17 Kaijo Corporation Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus

Also Published As

Publication number Publication date
JPH0132655B2 (ja) 1989-07-10

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