CN111063785A - 发光装置的制造方法 - Google Patents

发光装置的制造方法 Download PDF

Info

Publication number
CN111063785A
CN111063785A CN201911315174.6A CN201911315174A CN111063785A CN 111063785 A CN111063785 A CN 111063785A CN 201911315174 A CN201911315174 A CN 201911315174A CN 111063785 A CN111063785 A CN 111063785A
Authority
CN
China
Prior art keywords
light
emitting elements
emitting
emitting device
emitting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911315174.6A
Other languages
English (en)
Chinese (zh)
Inventor
三次智纪
小关健司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Publication of CN111063785A publication Critical patent/CN111063785A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
    • F21K9/68—Details of reflectors forming part of the light source
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
CN201911315174.6A 2013-06-05 2014-06-05 发光装置的制造方法 Pending CN111063785A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013-118558 2013-06-05
JP2013118558A JP6186904B2 (ja) 2013-06-05 2013-06-05 発光装置
CN201410247326.4A CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CN201410247326.4A Division CN104241510A (zh) 2013-06-05 2014-06-05 发光装置

Publications (1)

Publication Number Publication Date
CN111063785A true CN111063785A (zh) 2020-04-24

Family

ID=50828810

Family Applications (3)

Application Number Title Priority Date Filing Date
CN201911315174.6A Pending CN111063785A (zh) 2013-06-05 2014-06-05 发光装置的制造方法
CN201410247326.4A Pending CN104241510A (zh) 2013-06-05 2014-06-05 发光装置
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
CN201410247326.4A Pending CN104241510A (zh) 2013-06-05 2014-06-05 发光装置
CN202110086719.1A Pending CN112838156A (zh) 2013-06-05 2014-06-05 发光装置

Country Status (4)

Country Link
US (2) US20140362570A1 (cg-RX-API-DMAC7.html)
EP (1) EP2811517B1 (cg-RX-API-DMAC7.html)
JP (1) JP6186904B2 (cg-RX-API-DMAC7.html)
CN (3) CN111063785A (cg-RX-API-DMAC7.html)

Families Citing this family (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6149727B2 (ja) * 2013-12-28 2017-06-21 日亜化学工業株式会社 発光装置及びその製造方法
TWI506605B (zh) * 2014-03-28 2015-11-01 Macroblock Inc Display structure
WO2016161161A1 (en) * 2015-03-31 2016-10-06 Cree, Inc. Light emitting diodes and methods with encapsulation
US12364074B2 (en) 2015-03-31 2025-07-15 Creeled, Inc. Light emitting diodes and methods
JP6805532B2 (ja) * 2015-06-18 2020-12-23 日亜化学工業株式会社 発光装置
JP6269702B2 (ja) * 2015-11-30 2018-01-31 日亜化学工業株式会社 発光装置の製造方法
EP3174109B1 (en) 2015-11-30 2020-11-18 Nichia Corporation Method of manufacturing a light emitting device
US10941926B2 (en) * 2015-12-18 2021-03-09 Applied Electronic Materials, LLC Modular lighting system including light modules with integrated LED units
US20170175961A1 (en) * 2015-12-18 2017-06-22 Applied Electronic Materials, LLC Lighting system having structural components with integrated lighting
JP6314968B2 (ja) * 2015-12-25 2018-04-25 日亜化学工業株式会社 発光装置
GB2548706B (en) * 2016-02-24 2019-12-11 Nichia Corp Method of manufacturing fluorescent-material-containing member
JP6384508B2 (ja) 2016-04-06 2018-09-05 日亜化学工業株式会社 発光装置
US20180022274A1 (en) * 2016-07-21 2018-01-25 Sharpline Converting, Inc. Illuminating emblem device and methods of manufacture and use
JP6724634B2 (ja) * 2016-07-28 2020-07-15 日亜化学工業株式会社 発光装置の製造方法
JP6512201B2 (ja) * 2016-09-30 2019-05-15 日亜化学工業株式会社 線状発光装置の製造方法及び線状発光装置
DE102016119002B4 (de) 2016-10-06 2022-01-13 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelement und verfahren zum herstellen eines optoelektronischen bauelements
CN107994109A (zh) * 2016-10-27 2018-05-04 佛山市国星光电股份有限公司 一种cob显示模组及其制造方法
JP6699580B2 (ja) 2017-02-09 2020-05-27 日亜化学工業株式会社 発光装置
JP6662322B2 (ja) 2017-02-09 2020-03-11 日亜化学工業株式会社 発光装置
KR102503462B1 (ko) * 2017-03-21 2023-02-24 루미리즈 홀딩 비.브이. 평탄한 캐리어 상에 led 요소의 장착
US10672957B2 (en) 2017-07-19 2020-06-02 Cree, Inc. LED apparatuses and methods for high lumen output density
DE102017117150A1 (de) * 2017-07-28 2019-01-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
JP6733646B2 (ja) * 2017-11-30 2020-08-05 日亜化学工業株式会社 発光装置とその製造方法
US11557703B2 (en) * 2017-12-21 2023-01-17 Lumileds Llc Light intensity adaptive LED sidewalls
US10453827B1 (en) 2018-05-30 2019-10-22 Cree, Inc. LED apparatuses and methods
JP7177336B2 (ja) * 2018-07-20 2022-11-24 日亜化学工業株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
JP7190890B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置
JP6947990B2 (ja) * 2019-04-22 2021-10-13 日亜化学工業株式会社 発光装置の製造方法及び発光装置
JP7307874B2 (ja) 2019-04-26 2023-07-13 日亜化学工業株式会社 発光装置及び発光モジュール
KR102718824B1 (ko) * 2020-01-23 2024-10-18 보에 테크놀로지 그룹 컴퍼니 리미티드 디스플레이 기판 및 그 제조 방법 및 디스플레이 디바이스
CN119630152A (zh) * 2020-03-31 2025-03-14 光宝光电(常州)有限公司 封装结构
CN113851502A (zh) * 2020-06-10 2021-12-28 华为机器有限公司 显示面板、显示装置及显示面板的制备方法
CN116745910A (zh) * 2020-11-20 2023-09-12 首尔半导体株式会社 发光装置
JP7744597B2 (ja) * 2023-03-27 2025-09-26 日亜化学工業株式会社 発光装置及びその製造方法
US20240332263A1 (en) * 2023-03-27 2024-10-03 Nichia Corporation Light emitting device and method of manufacturing same
JP7769239B2 (ja) * 2023-09-29 2025-11-13 日亜化学工業株式会社 発光装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080174995A1 (en) * 2007-01-19 2008-07-24 Kwo Kiun George Tong Led lamp string device in which the led lamp assemblies have roughly the same shining luminance, and its realizing method
CN101471413A (zh) * 2007-12-28 2009-07-01 晶元光电股份有限公司 发光元件及其制造方法
CN101878540A (zh) * 2007-11-29 2010-11-03 日亚化学工业株式会社 发光装置及其制造方法
CN102109136A (zh) * 2009-11-20 2011-06-29 株式会社小糸制作所 发光模块和车辆用灯具
CN102738323A (zh) * 2011-04-14 2012-10-17 日东电工株式会社 发光元件转印片及其制造方法、发光装置及其制造方法

Family Cites Families (37)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4254453A (en) * 1978-08-25 1981-03-03 General Instrument Corporation Alpha-numeric display array and method of manufacture
JPH0416468Y2 (cg-RX-API-DMAC7.html) * 1986-07-31 1992-04-13
US5779351A (en) * 1995-05-02 1998-07-14 Daktronics, Inc. Matrix display with multiple pixel lens and multiple partial parabolic reflector surfaces
US5836676A (en) * 1996-05-07 1998-11-17 Koha Co., Ltd. Light emitting display apparatus
JP2001326388A (ja) * 2000-05-12 2001-11-22 Rohm Co Ltd 半導体発光装置
JP4167519B2 (ja) * 2003-01-09 2008-10-15 京セラ株式会社 発光素子収納用パッケージおよび発光装置
WO2007037035A1 (ja) * 2005-09-28 2007-04-05 The Furukawa Electric Co., Ltd. ライトボックスおよびその光反射板ならび光反射板の製造方法
JP2008140873A (ja) * 2006-11-30 2008-06-19 Toyoda Gosei Co Ltd フリップチップ実装されたiii−v族半導体素子およびその製造方法
US7828456B2 (en) * 2007-10-17 2010-11-09 Lsi Industries, Inc. Roadway luminaire and methods of use
DE102008011153B4 (de) * 2007-11-27 2023-02-02 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur Herstellung einer Anordnung mit mindestens zwei lichtemittierenden Halbleiterbauelementen
JP2009134965A (ja) * 2007-11-29 2009-06-18 Stanley Electric Co Ltd 照明装置及び照明装置の製造方法
CN101463989B (zh) * 2007-12-18 2011-07-06 富士迈半导体精密工业(上海)有限公司 水底照明灯
JP5224173B2 (ja) 2008-03-07 2013-07-03 スタンレー電気株式会社 半導体発光装置
US7637630B2 (en) * 2008-04-22 2009-12-29 Ruud Lighting, Inc. Integrated shield-gasket member in LED apparatus
US7748412B2 (en) * 2008-08-05 2010-07-06 Veyance Technologies Inc. Hose having a single reinforcing layer
CN201246664Y (zh) * 2008-08-28 2009-05-27 周金丹 太阳能led水上景观灯
JP5521325B2 (ja) * 2008-12-27 2014-06-11 日亜化学工業株式会社 発光装置及びその製造方法
US8378358B2 (en) * 2009-02-18 2013-02-19 Everlight Electronics Co., Ltd. Light emitting device
JP5278023B2 (ja) * 2009-02-18 2013-09-04 日亜化学工業株式会社 発光装置の製造方法
JP5332921B2 (ja) * 2009-06-05 2013-11-06 三菱化学株式会社 半導体発光装置、照明装置、及び画像表示装置
JP5612298B2 (ja) * 2009-11-20 2014-10-22 株式会社小糸製作所 発光モジュールおよび車両用灯具
WO2011122122A1 (ja) * 2010-03-31 2011-10-06 シャープ株式会社 表示装置及びテレビ受信装置
JP2012004519A (ja) * 2010-05-17 2012-01-05 Sharp Corp 発光装置および照明装置
JP5622494B2 (ja) * 2010-09-09 2014-11-12 スタンレー電気株式会社 発光装置およびその製造方法
JP5554680B2 (ja) * 2010-10-15 2014-07-23 スタンレー電気株式会社 発光素子搭載用基板、発光装置およびこれらの製造方法
JP5648422B2 (ja) 2010-10-29 2015-01-07 日亜化学工業株式会社 発光装置及びその製造方法
EP2448028B1 (en) 2010-10-29 2017-05-31 Nichia Corporation Light emitting apparatus and production method thereof
JP5647028B2 (ja) * 2011-02-14 2014-12-24 スタンレー電気株式会社 発光装置およびその製造方法
JP2012169189A (ja) 2011-02-15 2012-09-06 Koito Mfg Co Ltd 発光モジュールおよび車両用灯具
WO2012165007A1 (ja) * 2011-05-27 2012-12-06 シャープ株式会社 発光装置、照明装置および発光装置の製造方法
JP5840388B2 (ja) * 2011-06-01 2016-01-06 日東電工株式会社 発光ダイオード装置
JP5730680B2 (ja) * 2011-06-17 2015-06-10 シチズン電子株式会社 Led発光装置とその製造方法
JP5173004B1 (ja) * 2011-09-14 2013-03-27 シャープ株式会社 植物栽培用の発光装置およびその製造方法
DE102011083669B4 (de) * 2011-09-29 2019-10-10 Osram Gmbh Halbleiter-Leuchtvorrichtung mit Reflexions-Oberflächenbereich und Verfahren zur Herstellung
JP6052952B2 (ja) 2012-03-22 2016-12-27 株式会社小糸製作所 発光モジュールおよび車両用灯具
US9735198B2 (en) * 2012-03-30 2017-08-15 Cree, Inc. Substrate based light emitter devices, components, and related methods
JPWO2014081042A1 (ja) 2012-11-26 2017-01-05 シチズン電子株式会社 発光装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080174995A1 (en) * 2007-01-19 2008-07-24 Kwo Kiun George Tong Led lamp string device in which the led lamp assemblies have roughly the same shining luminance, and its realizing method
CN101878540A (zh) * 2007-11-29 2010-11-03 日亚化学工业株式会社 发光装置及其制造方法
CN101471413A (zh) * 2007-12-28 2009-07-01 晶元光电股份有限公司 发光元件及其制造方法
CN102109136A (zh) * 2009-11-20 2011-06-29 株式会社小糸制作所 发光模块和车辆用灯具
CN102738323A (zh) * 2011-04-14 2012-10-17 日东电工株式会社 发光元件转印片及其制造方法、发光装置及其制造方法

Also Published As

Publication number Publication date
EP2811517B1 (en) 2020-02-26
JP6186904B2 (ja) 2017-08-30
EP2811517A1 (en) 2014-12-10
US10429011B2 (en) 2019-10-01
JP2014236175A (ja) 2014-12-15
US20140362570A1 (en) 2014-12-11
CN104241510A (zh) 2014-12-24
CN112838156A (zh) 2021-05-25
US20180195675A1 (en) 2018-07-12

Similar Documents

Publication Publication Date Title
US11791324B2 (en) Light emitting device
CN112838156A (zh) 发光装置
CN105221954B (zh) 发光装置
US9496465B2 (en) Light emitting device
US8759124B2 (en) Light emitting apparatus and production method thereof
JP5648422B2 (ja) 発光装置及びその製造方法
JP2018082197A (ja) 発光装置
JP6673410B2 (ja) Ledモジュール
JP6485503B2 (ja) 発光装置の製造方法
JP7177336B2 (ja) 発光装置
JP5811770B2 (ja) 発光装置およびその製造方法
JP2015092622A (ja) 発光装置

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination