CN110554567B - 树脂组合物及其应用 - Google Patents
树脂组合物及其应用 Download PDFInfo
- Publication number
- CN110554567B CN110554567B CN201910804508.XA CN201910804508A CN110554567B CN 110554567 B CN110554567 B CN 110554567B CN 201910804508 A CN201910804508 A CN 201910804508A CN 110554567 B CN110554567 B CN 110554567B
- Authority
- CN
- China
- Prior art keywords
- resin
- epoxy resin
- resin composition
- weight
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 95
- 239000003822 epoxy resin Substances 0.000 claims abstract description 147
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 147
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims abstract description 45
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 34
- 239000000178 monomer Substances 0.000 claims abstract description 30
- 238000011161 development Methods 0.000 claims abstract description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 45
- 229920000178 Acrylic resin Polymers 0.000 claims description 41
- 239000004593 Epoxy Substances 0.000 claims description 29
- -1 naphthylene ether Chemical compound 0.000 claims description 28
- 239000002253 acid Substances 0.000 claims description 26
- 239000003504 photosensitizing agent Substances 0.000 claims description 25
- 239000003999 initiator Substances 0.000 claims description 23
- 229920001187 thermosetting polymer Polymers 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- 239000002270 dispersing agent Substances 0.000 claims description 18
- 125000001624 naphthyl group Chemical group 0.000 claims description 18
- 239000000243 solution Substances 0.000 claims description 18
- 239000002518 antifoaming agent Substances 0.000 claims description 17
- 239000006229 carbon black Substances 0.000 claims description 17
- 238000002360 preparation method Methods 0.000 claims description 17
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 11
- 239000005060 rubber Substances 0.000 claims description 11
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 10
- 239000000945 filler Substances 0.000 claims description 10
- 239000004843 novolac epoxy resin Substances 0.000 claims description 10
- 239000000049 pigment Substances 0.000 claims description 10
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 9
- 125000004386 diacrylate group Chemical group 0.000 claims description 9
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- JDVIRCVIXCMTPU-UHFFFAOYSA-N ethanamine;trifluoroborane Chemical compound CCN.FB(F)F JDVIRCVIXCMTPU-UHFFFAOYSA-N 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- MPIAGWXWVAHQBB-UHFFFAOYSA-N [3-prop-2-enoyloxy-2-[[3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propoxy]methyl]-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C MPIAGWXWVAHQBB-UHFFFAOYSA-N 0.000 claims description 6
- 239000000654 additive Substances 0.000 claims description 6
- 230000000996 additive effect Effects 0.000 claims description 6
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 6
- 230000009477 glass transition Effects 0.000 claims description 6
- 238000013007 heat curing Methods 0.000 claims description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 6
- 239000003513 alkali Substances 0.000 claims description 5
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical group C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000011258 core-shell material Substances 0.000 claims description 5
- 239000007788 liquid Substances 0.000 claims description 5
- 229920001451 polypropylene glycol Polymers 0.000 claims description 5
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 claims description 4
- KTALPKYXQZGAEG-UHFFFAOYSA-N 2-propan-2-ylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC=C3SC2=C1 KTALPKYXQZGAEG-UHFFFAOYSA-N 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 4
- 239000000843 powder Substances 0.000 claims description 4
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 4
- OSNILPMOSNGHLC-UHFFFAOYSA-N 1-[4-methoxy-3-(piperidin-1-ylmethyl)phenyl]ethanone Chemical compound COC1=CC=C(C(C)=O)C=C1CN1CCCCC1 OSNILPMOSNGHLC-UHFFFAOYSA-N 0.000 claims description 3
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 claims description 3
- IQYWSAQGMJBBCZ-UHFFFAOYSA-N 2-(1-ethoxy-1-propoxyethyl)-2-(hydroxymethyl)propane-1,3-diol Chemical compound C(C)OC(C(CO)(CO)CO)(C)OCCC IQYWSAQGMJBBCZ-UHFFFAOYSA-N 0.000 claims description 3
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims description 3
- MOEFFSWKSMRFRQ-UHFFFAOYSA-N 2-ethoxyphenol Chemical group CCOC1=CC=CC=C1O MOEFFSWKSMRFRQ-UHFFFAOYSA-N 0.000 claims description 3
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 claims description 3
- LPKFUUCTGPTWBH-UHFFFAOYSA-N 4-ethoxy-2-nonyl-3-propoxyphenol Chemical compound C(C)OC1=C(C(=C(C=C1)O)CCCCCCCCC)OCCC LPKFUUCTGPTWBH-UHFFFAOYSA-N 0.000 claims description 3
- ZMZGIVVRBMFZSG-UHFFFAOYSA-N 4-hydroxybenzohydrazide Chemical compound NNC(=O)C1=CC=C(O)C=C1 ZMZGIVVRBMFZSG-UHFFFAOYSA-N 0.000 claims description 3
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 claims description 3
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 3
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 claims description 3
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 claims description 3
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 3
- VEBCLRKUSAGCDF-UHFFFAOYSA-N ac1mi23b Chemical compound C1C2C3C(COC(=O)C=C)CCC3C1C(COC(=O)C=C)C2 VEBCLRKUSAGCDF-UHFFFAOYSA-N 0.000 claims description 3
- IBVAQQYNSHJXBV-UHFFFAOYSA-N adipic acid dihydrazide Chemical compound NNC(=O)CCCCC(=O)NN IBVAQQYNSHJXBV-UHFFFAOYSA-N 0.000 claims description 3
- 125000002723 alicyclic group Chemical group 0.000 claims description 3
- 125000001931 aliphatic group Chemical group 0.000 claims description 3
- 125000003118 aryl group Chemical group 0.000 claims description 3
- UTTHLMXOSUFZCQ-UHFFFAOYSA-N benzene-1,3-dicarbohydrazide Chemical compound NNC(=O)C1=CC=CC(C(=O)NN)=C1 UTTHLMXOSUFZCQ-UHFFFAOYSA-N 0.000 claims description 3
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 3
- XCJYREBRNVKWGJ-UHFFFAOYSA-N copper(II) phthalocyanine Chemical compound [Cu+2].C12=CC=CC=C2C(N=C2[N-]C(C3=CC=CC=C32)=N2)=NC1=NC([C]1C=CC=CC1=1)=NC=1N=C1[C]3C=CC=CC3=C2[N-]1 XCJYREBRNVKWGJ-UHFFFAOYSA-N 0.000 claims description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims description 3
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 claims description 3
- 125000004177 diethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 claims description 3
- 125000003700 epoxy group Chemical group 0.000 claims description 3
- 229960001545 hydrotalcite Drugs 0.000 claims description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 claims description 3
- OEDAJYOQELMMFC-UHFFFAOYSA-N octadecanoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CCCCCCCCCCCCCCCCCC(O)=O OEDAJYOQELMMFC-UHFFFAOYSA-N 0.000 claims description 3
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical compound N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 2
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 2
- YMCOIFVFCYKISC-UHFFFAOYSA-N ethoxy-[2-(2,4,6-trimethylbenzoyl)phenyl]phosphinic acid Chemical class CCOP(O)(=O)c1ccccc1C(=O)c1c(C)cc(C)cc1C YMCOIFVFCYKISC-UHFFFAOYSA-N 0.000 claims description 2
- 239000000454 talc Substances 0.000 claims description 2
- 229910052623 talc Inorganic materials 0.000 claims description 2
- 229920005792 styrene-acrylic resin Polymers 0.000 claims 3
- GKZPEYIPJQHPNC-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OCC(CO)(CO)CO GKZPEYIPJQHPNC-UHFFFAOYSA-N 0.000 claims 1
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims 1
- 125000000486 o-cresyl group Chemical class [H]C1=C([H])C(O*)=C(C([H])=C1[H])C([H])([H])[H] 0.000 claims 1
- 229940068918 polyethylene glycol 400 Drugs 0.000 claims 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L sodium carbonate Substances [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 claims 1
- 229910000029 sodium carbonate Inorganic materials 0.000 claims 1
- 238000005452 bending Methods 0.000 abstract description 6
- 238000012546 transfer Methods 0.000 abstract description 4
- 239000010408 film Substances 0.000 description 35
- 239000007787 solid Substances 0.000 description 16
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 14
- 239000012752 auxiliary agent Substances 0.000 description 13
- 238000001723 curing Methods 0.000 description 13
- 238000000227 grinding Methods 0.000 description 11
- NIHNNTQXNPWCJQ-UHFFFAOYSA-N fluorene Chemical compound C1=CC=C2CC3=CC=CC=C3C2=C1 NIHNNTQXNPWCJQ-UHFFFAOYSA-N 0.000 description 10
- 239000003292 glue Substances 0.000 description 10
- 238000009775 high-speed stirring Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 238000001914 filtration Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 8
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 7
- 235000010290 biphenyl Nutrition 0.000 description 7
- 239000004305 biphenyl Substances 0.000 description 7
- HVABKWYVQHSGHW-UHFFFAOYSA-N boron;ethanamine Chemical compound [B].CCN HVABKWYVQHSGHW-UHFFFAOYSA-N 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 229920002635 polyurethane Polymers 0.000 description 7
- 239000004814 polyurethane Substances 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 6
- 229920001955 polyphenylene ether Polymers 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 239000012787 coverlay film Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000013039 cover film Substances 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 230000006872 improvement Effects 0.000 description 4
- 239000000976 ink Substances 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- ZQXCQTAELHSNAT-UHFFFAOYSA-N 1-chloro-3-nitro-5-(trifluoromethyl)benzene Chemical compound [O-][N+](=O)C1=CC(Cl)=CC(C(F)(F)F)=C1 ZQXCQTAELHSNAT-UHFFFAOYSA-N 0.000 description 3
- 206010034972 Photosensitivity reaction Diseases 0.000 description 3
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 238000004090 dissolution Methods 0.000 description 3
- 229920002313 fluoropolymer Polymers 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 238000013508 migration Methods 0.000 description 3
- 230000005012 migration Effects 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 230000036211 photosensitivity Effects 0.000 description 3
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- NJVOHKFLBKQLIZ-UHFFFAOYSA-N (2-ethenylphenyl) prop-2-enoate Chemical compound C=CC(=O)OC1=CC=CC=C1C=C NJVOHKFLBKQLIZ-UHFFFAOYSA-N 0.000 description 2
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- WEAHSRCPIYTIFK-UHFFFAOYSA-N CCN.FB(F)F.F Chemical compound CCN.FB(F)F.F WEAHSRCPIYTIFK-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 229920006335 epoxy glue Polymers 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- 238000000016 photochemical curing Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 239000009719 polyimide resin Substances 0.000 description 2
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 2
- JZEXORLUKMQOFA-UHFFFAOYSA-N 2-(1-ethoxyethyl)-2-(hydroxymethyl)propane-1,3-diol prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCOC(C)C(CO)(CO)CO JZEXORLUKMQOFA-UHFFFAOYSA-N 0.000 description 1
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 1
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 102100026735 Coagulation factor VIII Human genes 0.000 description 1
- 101000911390 Homo sapiens Coagulation factor VIII Proteins 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 235000010627 Phaseolus vulgaris Nutrition 0.000 description 1
- 244000046052 Phaseolus vulgaris Species 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000004494 ethyl ester group Chemical group 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000006232 furnace black Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 235000012222 talc Nutrition 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
- C09D133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09D133/062—Copolymers with monomers not covered by C09D133/06
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
- C09D163/10—Epoxy resins modified by unsaturated compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D175/00—Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
- C09D175/04—Polyurethanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D4/00—Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
- C09D4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/65—Additives macromolecular
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
- G03F7/035—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polyurethanes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0385—Macromolecular compounds which are rendered insoluble or differentially wettable using epoxidised novolak resin
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/105—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having substances, e.g. indicators, for forming visible images
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Architecture (AREA)
- Structural Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials For Photolithography (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
本发明提供了一种树脂组合物及其应用。该树脂组合物按重量份计包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂和0~15份的第二环氧树脂;第一环氧树脂为介电常数<3.5的低介电环氧树脂,第二环氧树脂不同于第一环氧树脂。该树脂组合物通过添加介电常数<3.5的低介电环氧树脂,再通过调整各组分的配比,显著降低了介电常数和介电损耗,介电常数降至3.0以下,介电损耗降至0.008以下。此外,该树脂组合物还兼具了良好的耐热性、解像度,反弹力较小,且具有相对较好的柔韧性和耐弯折性。同时,该树脂组合物为感光性树脂组合物,能够通过感光显影进行图像转移。
Description
技术领域
本发明涉及线路板印刷技术领域,具体而言,涉及一种树脂组合物及其应用,尤其涉及一种高频高速印刷线路板用的树脂组合物。
背景技术
随着5G时代的到来,当前小型化、薄型化、高集成化、全面屏的形态趋势,使得终端设备对支撑材料的要求越来越高。由于5G信号在传输过程中将采用更高的频率、更快的传输速度,要求PCB及FPCB材料能降低在高频区域、具体而言为频率1GHz以上的区域中的电信号损耗,这就要求PCB及FPCB材料具有较低的介电常数(Dk)和介电损耗(Df)。其中,Dk要小于等于3.0,Df要小于等于0.008。
在现有技术中,感光性聚酰亚胺覆盖膜具有较低的Dk,为3.0以下,但Df偏高超过0.01。传统PI覆盖膜(CVL)由环氧胶层和聚酰亚胺树脂层构成,而环氧胶层的极性较高导致传统CVL的Dk高达3.5以上。现有的阻焊油墨、弯曲性油墨以及PIC感光覆盖膜中均含有大量的高极性环氧树脂和较高浓度的极性基团,材料的介电性能也欠佳。
因此,业界迫切希望能有低介电常数和低介电损耗的感光性阻焊保护层材料(比如覆盖膜、阻焊油墨或者感光性覆盖膜等)。在覆铜板领域,低介电型材料的开发基本上多采用聚四氟乙烯树脂、马来酰亚胺树脂、热固性聚苯醚树脂、氰酸树脂、聚酰亚胺树脂、低介电环氧树脂以及液晶高分子聚合物;而在阻焊保护层领域,低介电覆盖膜、低介电阻焊油墨和低介电感光覆盖膜的研究较少。
中国专利CN108287451A公开了一种低介电感光覆盖膜树脂组合物,通过在环氧丙烯酸树脂体系中加入氟化聚合物来降低材料的介电常数,该氟化聚合粒径0.1-7微米,容易团聚析出且与主体树脂的相容性较差,影响材料整体的介电性和透光性。中国专利CN109923176A公开了用于高频信号传输性的低介电覆盖膜,其技术路线是通过加入低介电损耗的聚苯醚树脂以及咪唑化合物、低极性的联苯型、萘环骨架环氧树脂等来降低传统CVL中环氧胶层的介电常数,但该组合物跟传统CVL一样,无法通过感光显影来进行图像转移,依然需要模具冲切来开窗,开窗精度低,难以满足高精细、超薄集成线路板对解像度的要求。
基于以上原因,有必要提供在感光性、介电性、柔软性和加工性等方面表现更加的低介电感光性阻焊保护层材料。
发明内容
本发明的主要目的在于提供一种树脂组合物及其应用,以解决现有技术中的树脂组合物因感光性、介电性、柔软性或加工性方面的欠缺而不适于在高频高速印刷线路板中应用的问题。
为了实现上述目的,根据本发明的一个方面,提供了一种树脂组合物,按重量份计,该树脂组合物包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂和0~15份的第二环氧树脂;其中第一环氧树脂为介电常数<3.5的低介电环氧树脂,第二环氧树脂不同于第一环氧树脂。
进一步地,低介电环氧树脂为至少含有两个环氧基、环氧当量为160~2000g/eq的环氧树脂;优选地,低介电环氧树脂为联苯型环氧树脂、萘环型环氧树脂、萘酚型环氧树脂、亚萘基醚型环氧树脂、聚苯醚型环氧树脂、双环戊二烯型酚醛环氧树脂、结晶性芴型环氧树脂中的一种或多种,更优选为萘环型环氧树脂。
进一步地,联苯型环氧树脂具有式I所示结构:
萘环型环氧树脂具有式II所示结构:
萘酚型环氧树脂具有式III所示结构:
亚萘基醚型环氧树脂具有式Ⅳ所示结构:
双环戊二烯型酚醛环氧树脂具有式Ⅵ所示结构:
结晶性芴型环氧树脂具有式Ⅶ所示结构:
进一步地,碱溶性树脂的酸值为60~150mg KOH/g;优选地,碱溶性树脂选自感光性环氧丙烯酸树脂、苯丙烯树脂、感光性聚氨酯丙烯酸树脂中的一种或多种;优选地,感光性环氧丙烯酸树脂选自羧酸改性双酚A型环氧树脂、羧酸改性双酚F型环氧树脂、羧酸改性酚醛环氧树脂、羧酸改性邻甲酚醛环氧树脂中的一种或多种;优选地,苯丙烯树脂选自重均分子量为3~20w、玻璃化转变温度为90~150℃的羧酸改性苯丙烯酸树脂;优选地,感光性聚氨酯丙烯酸树脂选自脂肪族聚氨酯丙烯酸树脂、脂环族聚氨酯丙烯酸树脂、芳香族聚氨酯丙烯酸树脂中的一种或多种。
进一步地,丙烯酸酯类单体的重均分子量为200~2000,玻璃化转变温度为-20~100℃;优选地,丙烯酸酯类单体选自(乙氧基)苯酚(甲基)丙烯酸酯、硬脂酸丙烯酸酯、乙氧基(丙氧基)壬基苯酚(甲基)丙烯酸酯、乙氧基(丙氧基)四氢糠基(甲基)丙烯酸酯、1,6-己二醇二丙烯酸酯、PPG(400)二丙烯酸酯、三环葵烷二甲醇二丙烯酸酯、二氧杂环己烷二醇二丙烯酸酯、乙氧化(丙氧化)双酚A二(甲基)丙烯酸酯、聚乙二醇(400)二丙烯酸酯、聚丙二醇(600)二丙烯酸酯、乙氧基(丙氧基)三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、六丙烯酸二季戊四醇酯、乙氧基化季戊四醇四丙烯酸酯、双季戊四醇六丙烯酸酯中的一种或多种。
进一步地,光引发剂包括光聚合引发剂和光敏剂,且光聚合引发剂和光敏剂的重量比为2~20:1;优选地,光聚合引发剂选自1-羟基环己基苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、1-[4-(2-羟基)-苯基]-3-羟基-2-甲基-1-丙酮-1-酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮、2-苯基苄-2-二甲基胺-1-(4-吗啉苄苯基)丁酮、2,4,6-三甲基苯甲酰-二苯基氧化磷、双(2,4,6-三甲基苯甲酰基)苯基氧化膦、2,4,6-三甲基苯甲酰基苯基膦酸乙酯中的一种或多种;优选地,光敏剂选自2,4-乙二酸二乙酯、2-异丙基硫杂蒽酮、2,4-二乙基硫杂蒽酮、二苯甲酮、聚丁二醇双(9-氧代-9H-噻吨氧乙酸)酯中的一种或多种。
进一步地,按重量份计,树脂组合物还包括3~10份的增韧树脂;优选地,增韧树脂选自核壳橡胶增韧环氧树脂、热塑性弹性体、聚氨酯弹性体、液体橡胶、橡胶粉中的一种或多种。
进一步地,按重量份计,树脂组合物还包括0~5份的颜填料和0.01~5份的添加剂,添加剂选自热固化促进剂、分散剂、流平剂、消泡剂中的一种或多种;优选地,颜填料选自联苯胺黄、酞菁绿、酞菁蓝、炭黑、二氧化硅、硫酸钡、硫酸钙、滑石粉、水滑石中的一种多种;优选地,热固化促进剂为潜伏型热固化促进剂,更优选热固化促进剂选自三氟化硼乙胺络合物、己二酸二酰肼、对羟基安息香酸酰肼、间苯二甲酸酰肼、二胺基二苯砜、双氰胺及其衍生物中的一种或多种。
进一步地,按重量份计,树脂组合物包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂、0~15份的第二环氧树脂、5~7份的增韧树脂、1~5份的颜填料和1~5份的添加剂。
根据本发明的另一方面,还提供了上述树脂组合物在高频高速印刷线路板领域的应用。
根据本发明的另一方面,还提供了一种高频高速印刷线路板阻焊保护层的制备方法,其包括以下步骤:将上述树脂组合物进行辊涂成膜,形成湿膜;将湿膜进行预烘干后,依次进行热辊贴膜、曝光、显影、热固化,得到阻焊保护层。
根据本发明的另一方面,还提供了湿膜的厚度为25~50μm;优选地,预烘干过程中,预烘干温度为80℃~100℃,时间为15~30min;优选地,曝光过程中的曝光能量为100~500mJ cm-2;优选地,显影过程中,采用的显影液为0.8~1.2wt%Na2CO3溶液,显影时间为30~60s,显影温度为27~33℃,喷淋压力为0.2~0.4MPa;优选地,热固化过程中,热固化温度为150~200℃,热固化时间为1~1.5h。
本发明提供的树脂组合物按重量份计包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂和0~15份的第二环氧树脂;其中第一环氧树脂为介电常数<3.5的低介电环氧树脂,所述第二环氧树脂不同于所述第一环氧树脂。该树脂组合物通过添加介电常数<3.5的低介电环氧树脂,再通过调整各组分的配比,显著地降低了其介电常数和介电损耗,介电常数能够降至3.0以下,介电损耗能够降至0.008以下。除了良好的介电性能,该树脂组合物还兼具了良好的耐热性、解像度,反弹力较小,且具有相对较好的柔韧性和耐弯折性。同时,该树脂组合物为感光性树脂组合物,能够通过感光显影进行图像转移。以上原因使得本发明的树脂组合物能够满足高频高速PCB和FPC线路板的要求,具有广阔的应用前景。
具体实施方式
需要说明的是,在不冲突的情况下,本申请中的实施例及实施例中的特征可以相互组合。下面将结合实施例来详细说明本发明。
正如本发明背景技术部分所描述的,现有技术中的印刷线路板用树脂组合物因介电常数或介电损耗过高,不适于在高频高速印刷线路板中应用。
为了解决这一问题,本发明提供了一种树脂组合物,其特征在于,按重量份计,树脂组合物包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂和0~15份的第二环氧树脂;其中第一环氧树脂为介电常数<3.5的低介电环氧树脂,第二环氧树脂不同于第一环氧树脂。
本发明提供的上述树脂组合物通过添加介电常数<3.5的低介电环氧树脂,再通过调整各组分的配比,显著地降低了其介电常数和介电损耗,介电常数能够降至3.0以下,介电损耗能够降至0.008以下。除了良好的介电性能,该树脂组合物还兼具了良好的耐热性、解像度,反弹力较小,且具有相对较好的柔韧性和耐弯折性。同时,该树脂组合物为感光性树脂组合物,能够通过感光显影进行图像转移。以上原因使得本发明的树脂组合物能够满足高频高速PCB和FPC线路板的要求,具有广阔的应用前景。
为了进一步提高树脂组合物的锡焊耐热性、显影性、粘附性等,在一种优选的实施方式中,上述低介电环氧树脂为至少含有两个环氧基、环氧当量为160~2000g/eq的环氧树脂。优选地,低介电环氧树脂包括但不限于联苯型环氧树脂、萘环型环氧树脂、萘酚型环氧树脂、亚萘基醚型环氧树脂、聚苯醚型环氧树脂、双环戊二烯型酚醛环氧树脂、结晶型环氧树脂中的一种或多种,更优选为萘环型环氧树脂。上述几类低介电环氧树脂除了能够降低树脂组合物的介电常数和介电损耗外,还有助于提高树脂组合物的耐热性等其他性能,且均为不含氟的环氧树脂,在制备成本方面也具有较大优势。
更优选地,上述几类低介电环氧树脂分别具有以下化学结构:
联苯型环氧树脂具有式I所示结构:
萘环型环氧树脂具有式II所示结构:
萘酚型环氧树脂具有式III所示结构:
亚萘基醚型环氧树脂具有式Ⅳ所示结构:
聚苯醚型环氧树脂具有式Ⅴ所示结构:
双环戊二烯型酚醛环氧树脂具有式Ⅵ所示结构:
结晶性芴型环氧树脂具有式Ⅶ所示结构:
这几种结构的低介电环氧树脂应用于树脂组合物,能够进一步改善树脂组合物的各项性能,使其更适用于高频高速印刷电路板中,作为其阻焊保护层材料。需说明的是,上述几种低介电环氧树脂均可商购。
上述第二环氧树脂可以采用除低介电环氧树脂以外的其他通用型环氧树脂,当然,考虑到与低介电环氧树脂的相容性及对树脂组合物性能的提升,在一种优选的实施方式中,上述第二环氧树脂包括但不限于南亚环氧树脂NPES-901、NPEL-128、NPES-904、NPCN704、或DIC环氧树脂Epiclon-1050、Epiclon-830、Epiclon N-695中的一种或多种。
在一种优选的实施方式中,上述碱溶性树脂的酸值为60~150mg KOH/g,当酸值低于60mg KOH/g时,显影较差,产生残胶等显影不尽的问题;而当酸值高于150mg KOH/g时,显影过度导致线宽、线距偏离标准值。优选地,碱溶性树脂选自感光性环氧丙烯酸树脂、苯丙烯树脂、感光性聚氨酯丙烯酸树脂中的一种或多种。这几类碱溶性树脂的使用能够进一步提高树脂组合物的感光显影能力,从而有利于提高树脂组合物成膜后的解像度,满足线路板的高精度要求。其中,优选地,感光性环氧丙烯酸树脂包括但不限于羧酸改性双酚A型环氧树脂、羧酸改性双酚F型环氧树脂、羧酸改性酚醛环氧树脂、羧酸改性邻甲酚醛环氧树脂中的一种或多种。感光性环氧丙烯酸树脂也可采用以下市售品:日本化药的ZAR-1035、ZAR-2000、ZAR-1000、ZFR-1491H、CCR-1291H、CCR-1235等。优选地,苯丙烯树脂选自重均分子量为3~20w、玻璃化转变温度为90~150℃的羧酸改性苯丙烯酸树脂;优选地,感光性聚氨酯丙烯酸树脂包括但不限于脂肪族聚氨酯丙烯酸树脂、脂环族聚氨酯丙烯酸树脂、芳香族聚氨酯丙烯酸树脂中的一种或多种。使用以上碱溶性树脂后,树脂组合物综合性能更佳。
上述丙烯酸酯类单体可以采用光固化领域常用的类型,比如可以使用单官能或多官能丙烯酸酯类单体。在一种优选的实施方式中,上述丙烯酸酯类单体的重均分子量为200~2000,玻璃化转变温度为-20~100℃,由此可调控固化膜的硬度、柔韧性、反弹力和显影性。优选地,丙烯酸酯类单体包括但不限于(乙氧基)苯酚(甲基)丙烯酸酯、硬脂酸丙烯酸酯、乙氧基(丙氧基)壬基苯酚(甲基)丙烯酸酯、乙氧基(丙氧基)四氢糠基(甲基)丙烯酸酯、1,6-己二醇二丙烯酸酯、PPG(400)二丙烯酸酯、三环葵烷二甲醇二丙烯酸酯、二氧杂环己烷二醇二丙烯酸酯、乙氧化(丙氧化)双酚A二(甲基)丙烯酸酯、聚乙二醇(400)二丙烯酸酯、聚丙二醇(600)二丙烯酸酯、乙氧基(丙氧基)三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、六丙烯酸二季戊四醇酯、乙氧基化季戊四醇四丙烯酸酯、双季戊四醇六丙烯酸酯中的一种或多种。
为了进一步改善树脂组合物的光固化性能,在一种优选的实施方式中,上述光引发剂包括光聚合引发剂和光敏剂,且光聚合引发剂和光敏剂的重量比为2~20:1。光敏剂的使用有助于提高树脂组合物的感光性能,且将二者比例控制在上述范围内,树脂组合物的光固化性能更佳。优选地,光聚合引发剂包括但不限于1-羟基环己基苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、1-[4-(2-羟基)-苯基]-3-羟基-2-甲基-1-丙酮-1-酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮、2-苯基苄-2-二甲基胺-1-(4-吗啉苄苯基)丁酮、2,4,6-三甲基苯甲酰-二苯基氧化磷、双(2,4,6-三甲基苯甲酰基)苯基氧化膦、2,4,6-三甲基苯甲酰基苯基膦酸乙酯中的一种或多种;优选地,光敏剂包括但不限于2,4-乙二酸二乙酯、2-异丙基硫杂蒽酮、2,4-二乙基硫杂蒽酮、二苯甲酮、聚丁二醇双(9-氧代-9H-噻吨氧乙酸)酯中的一种或多种。
在一种优选的实施方式中,按重量份计,树脂组合物还包括3~10份的增韧树脂。使用增韧树脂有利于提高树脂组合物形成的保护层的弯折性,并是保护层在耐热性、反弹力等方面的表现更佳。优选地,增韧树脂包括但不限于核壳橡胶增韧环氧树脂、热塑性弹性体、聚氨酯弹性体、橡胶粉中的一种或多种。核壳橡胶增韧环氧树脂市售品可采用Kaneka的MX154、MX113、MX158、M257等。热塑性弹性体可采用苯乙烯-丁二烯嵌段共聚物(SBS)、苯乙烯-聚(乙烯-乙烯/丙烯)嵌段-聚苯乙烯(SEEPS)、苯乙烯-异戊二烯-苯乙烯嵌段共聚物(SIS)等;聚氨酯弹性体市售品可采用Dainichiseika的RHC-730,Negami ChemicalIndustry的Artpearl C-300T、Artpearl C-400T、Artpearl C-600T、Artpearl SE-050T、Artpearl GR-50W等;橡胶粉市售品可采用Kaneka的MZ100、MZ 210、MZ711等。
为了进一步提高树脂组合物的综合性能,在一种优选的实施方式中,按重量份计,树脂组合物还包括0~5份的颜填料和0.01~1份的助剂。上述颜填料和助剂可以采用本领域的常用类型,优选地,颜料选自联苯胺黄、酞菁绿、酞菁蓝、炭黑等。为了提高耐热性、降低成本,优选同时加入填料,比如二氧化硅、硫酸钡、硫酸钙、滑石粉、水滑石等。优选地,助剂选自热固化促进剂、分散剂、流平剂、消泡剂中的一种或多种。选用热固化促进剂有助于提高树脂组合物的热固化性能,且从延长储存期、提高常温保存性角度出发,更优选热固化促进剂为潜伏型热固化促进剂,进一步优选热固化促进剂选自三氟化硼乙胺络合物、己二酸二酰肼、对羟基安息香酸酰肼、间苯二甲酸酰肼、二胺基二苯砜、双氰胺及其衍生物中的一种或多种。使用分散剂、流平剂和消泡剂有助于提高树脂组合物的稳定性、润湿性、分散性、成膜性等,比如BYK9077、BYK110、BYK168等润湿分散剂,BYK394、BYK322、BYK UV3530等流平剂;BYK015、BYK1730、BYK354等消泡剂。
在一种优选的实施方式中,按重量份计,树脂组合物包括100份的碱溶性树脂、5~30份的丙烯酸酯类单体、0.1~10份的光引发剂、10~30份的第一环氧树脂、0~15份的第二环氧树脂、3~10份的增韧树脂、1~5份的颜填料和1~5份的添加剂。将各组分的重量关系控制在上述范围内,树脂组合物的性能更佳,更适于作为高频高速印刷线路板的阻焊保护层材料。
根据本发明的另一方面,还提供了上述树脂组合物在高频高速印刷线路板领域的应用。
根据本发明的有一方面,还提供了一种高频高速印刷线路板阻焊保护层的制备方法,其包括以下步骤:将上述树脂组合物进行辊涂成膜,形成湿膜;将湿膜进行预烘干后,依次进行热辊贴膜、曝光、显影、热固化,得到阻焊保护层。采用上述树脂组合物,形成的高频高速印刷线路板(PCB、FPC等)的介电常数和介电损耗更低,且在耐热性、弯折性、反弹力、解像度等方面表现良好。
在一种优选的实施方式中,湿膜的厚度为25~50μm;优选地,预烘干过程中,预烘干温度为80~100℃,时间为15~30min;优选地,曝光过程中的曝光能量为100~500mJ cm-2;优选地,显影过程中,采用的显影液为0.8~1.2wt%Na2CO3溶液,显影时间为30~60s,显影温度为27~33℃,喷淋压力为0.2~0.4MPa;优选地,热固化过程中,热固化温度为150~200℃,热固化时间为1~1.5h。
以下结合具体实施例对本申请作进一步详细描述,这些实施例不能理解为限制本申请所要求保护的范围。
实施例1
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中2.7g萘环型低介电环氧树脂、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例2
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中1.8g萘环型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例3
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中0.96g萘环型低介电环氧树脂、1.44g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例4
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性丙烯酸树脂(酸值120mgKOH/g,分子量15万),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.1g光聚合引发剂(其中0.04g 184、0.06g 907)、0.01g光敏剂(ITX),3.5g环氧树脂(其中1.8g萘环型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例5
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性聚氨酯环氧丙烯酸树脂UXE3000(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中1.8g萘环型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例6
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),10g环氧树脂(其中1.8g双环戊二烯型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例7
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中2.1g双环戊二烯型低介电环氧树脂、1.4g NPES-901),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例8
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中1.8g联苯型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例9
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中1.8g结晶性芴型环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例10
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),0.48g丙烯酸酯单体(其中0.29g20EOBPDMA、0.19g 10EOTMPTA),0.01g光聚合引发剂(其中0.004g 184、0.006g 907)、0.001g光敏剂(ITX),3.5g环氧树脂(其中1.8g环戊二烯型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
实施例11
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.8g丙烯酸酯单体(其中1.7g 20EOBPDMA、1.1g 10EOTMPTA,0.96g光聚合引发剂(其中0.38g 184、0.58g 907)、0.1g光敏剂(ITX),3.5g环氧树脂(其中1.8g双环戊二烯型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
对比例1
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中2.7g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
对比例2
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g环氧树脂(其中1.8g萘环型低介电环氧树脂、0.9g NPES-901、0.8g增韧环氧树脂MX-154),0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
对比例3
一种用于高频高速印刷线路板的树脂组合物的制备:15g碱溶性光敏环氧丙烯酸树脂ZAR-1035(酸值100mgKOH/g,固含量64%),2.5g丙烯酸酯单体(其中1.5g 20EOBPDMA、1.0g 10EOTMPTA),0.5g光聚合引发剂(其中0.2g 184、0.3g 907)、0.05g光敏剂(ITX),3.5g萘环型低介电环氧树脂,0.01g三氟化硼乙胺潜伏型固化促进剂,0.3g炭黑MA-7,0.5g其他助剂(其中0.3g分散剂BYK168、0.1g流平剂BYK 394、0.1g消泡剂BYK354),先经三辊研磨、然后高速搅拌溶解、分散,最后过滤制得胶液,暗光保存备用。
潜伏型热固化促进剂和其他助剂未列入表1。
表1
*1:双酚A型含羧基环氧丙烯酸树脂ZAR-1035(Nippon Kayaku、酸值100mgKOH/g、固含量64%)
*2:丙烯酸树脂,n-BMA/EA/MMA/MAA/HEMA/STY(自己合成、酸值120mgKOH/g、分子量15w)
*3:氨基甲酸酯型含酸基树脂UXE-3000(Nippon Kayaku、酸值100mgKOH/g、固含量64%)
*4:20EOBPDMA为20乙氧基双酚A二甲基丙烯酸酯(沙多玛有限公司)
*5:10EOTMPTA为10乙氧基三羟甲基丙烷三丙烯酸酯(沙多玛有限公司)
*6:表层光引发剂,1-羟基环己基苯基甲酮(184)
*7:深层光引发剂,2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮(907)
*8:光敏剂,2异丙基硫杂蒽酮(ITX)
*9:萘环型低介电环氧树脂,EBA-65(上海华谊树脂)
*10:环戊二烯型低介电环氧树脂,XD-1000(Nippon Kayaku)
*11:联苯型低介电环氧树脂,NC-3000(Nippon Kayaku)
*12:结晶性芴型环氧树脂,CG500(大阪瓦斯化学、环氧当量310g/eq)
*13:NPES-901(固体环氧树脂、南亚制造、环氧当量450-500g/eq)
*14:MX-154(核壳橡胶增韧环氧树脂、Kaneka、环氧当量301g/eq、聚丁二烯橡胶)
*15:炭黑MA-7(三菱化学、平均粒径24nm、pH值3.0、炉黑)
对所得的实施例及比较例用于高频高速印刷线路板的树脂组合物固化膜进行以下评价:
1、解像度
采用菲林片RP-4:um,L/S=n/400对分辨率进行评价,显影后利用扫描电子显微镜(SEM)观察,以侧边形貌良好,完全显影清晰的最小线宽作为评价标准。
2、固化膜耐弯折性测试
将实施例和比较例中的固化膜进行180°角度对折测试,记录开始出现裂痕的次数并以下述基准进行评估。
◎:对折6次,固化膜上无裂痕
○:对折6次,固化膜固化膜上轻微裂痕
×:对折1次,固化膜断裂
3、锡焊耐热性的比较
参照IPC-TM650.2.6.8标准。固化膜垂直浸入温度300℃的锡炉浸泡3次,每次10s,观察表面是否起泡、变色、浮起和剥离等,以下述基准评估外观的变化。
◎:固化膜外观无变化
○:固化膜表面有变色
×:固化膜有浮起、薄离、锡焊深入
4、介电常数(Dk)和介电损耗(Df)的测量
将实施例和比较例中得到的固化膜在150℃干燥30min,在25℃及50%RH的条件下使用谐振器(安捷伦E5071BENA)通过分离介质谐振器(SPDR)方法测量各个树脂组合物在10GHz频率下的介电常数和介电损耗。
5、电绝缘性测试
固化膜在85℃、85%RH的恒温恒湿箱中静置24h后测试其表面电阻和体积电阻,测试条件为50V、1min。
◎:加湿后的绝缘电阻在109以上,无铜迁移
○:加湿后的绝缘电阻在109以上,有铜迁移
×:加湿后的绝缘电阻在109以下,有铜迁移
6、反弹力测试
参照环刚度测量法,将固化膜制成宽度10mm、周长60mm的测试圆环,记录使圆环沿径向压缩10mm所需的力,随后迅速撤掉外力,并记录圆环能恢复的径向高度,反弹力越小越好。
◎:反弹力<40mN/mm
○:40≤反弹力<50mN/mm
×:反弹力≥50mN/mm
表2固化膜性能测试比较
由表2可知,在感光性树脂组合物中添加低介电环氧树脂能提高固化膜的介电性能,显著降低介电常数和介电损耗因子,介电常数由3.5降至3.0以下,介电损耗因子由0.012降至0.008以下,满足了高频高速PCB和FPCB的要求,从而获得了兼具高解像度和优异介电性能的感光性阻焊保护层。同时,低介电环氧树脂特殊的分子结构也能进一步提高固化膜的耐热性并且对其反弹力影响较小,从而不会降低阻焊保护层的柔韧性和耐弯折性。
以上所述仅为本发明的优选实施例而已,并不用于限制本发明,对于本领域的技术人员来说,本发明可以有各种更改和变化。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。
Claims (26)
2.根据权利要求1所述的树脂组合物,其特征在于,所述低介电环氧树脂为所述萘环型环氧树脂。
3.根据权利要求1或2所述的树脂组合物,其特征在于,所述碱溶性树脂的酸值为60~150mgKOH/g。
4.根据权利要求3所述的树脂组合物,其特征在于,所述碱溶性树脂选自感光性环氧丙烯酸树脂、苯丙烯树脂、感光性聚氨酯丙烯酸树脂中的一种或多种。
5.根据权利要求4所述的树脂组合物,其特征在于,所述感光性环氧丙烯酸树脂选自羧酸改性双酚A型环氧树脂、羧酸改性双酚F型环氧树脂、羧酸改性酚醛环氧树脂、羧酸改性邻甲酚醛环氧树脂中的一种或多种。
6.根据权利要求4所述的树脂组合物,其特征在于,所述苯丙烯树脂选自重均分子量为3~20w、玻璃化转变温度为90~150℃的羧酸改性苯丙烯酸树脂。
7.根据权利要求4所述的树脂组合物,其特征在于,所述感光性聚氨酯丙烯酸树脂选自脂肪族聚氨酯丙烯酸树脂、脂环族聚氨酯丙烯酸树脂、芳香族聚氨酯丙烯酸树脂中的一种或多种。
8.根据权利要求1或2所述的树脂组合物,其特征在于,所述丙烯酸酯类单体的重均分子量为200~2000,玻璃化转变温度为-20~100℃。
9.根据权利要求8所述的树脂组合物,其特征在于,所述丙烯酸酯类单体选自(乙氧基)苯酚(甲基)丙烯酸酯、硬脂酸丙烯酸酯、乙氧基(丙氧基)壬基苯酚(甲基)丙烯酸酯、乙氧基(丙氧基)四氢糠基(甲基)丙烯酸酯、1,6-己二醇二丙烯酸酯、PPG400二丙烯酸酯、三环葵烷二甲醇二丙烯酸酯、二氧杂环己烷二醇二丙烯酸酯、乙氧化(丙氧化)双酚A二(甲基)丙烯酸酯、聚乙二醇400二丙烯酸酯、聚丙二醇600二丙烯酸酯、乙氧基(丙氧基)三羟甲基丙烷三(甲基)丙烯酸酯、季戊四醇三丙烯酸酯、三(2-羟乙基)异氰尿酸三丙烯酸酯、六丙烯酸二季戊四醇酯、乙氧基化季戊四醇四丙烯酸酯、双季戊四醇六丙烯酸酯中的一种或多种。
10.根据权利要求1或2所述的树脂组合物,其特征在于,所述光引发剂包括光聚合引发剂和光敏剂,且所述光聚合引发剂和所述光敏剂的重量比为2~20:1。
11.根据权利要求10所述的树脂组合物,其特征在于,所述光聚合引发剂选自1-羟基环己基苯基甲酮、2-羟基-2-甲基-1-苯基-1-丙酮、1-[4-(2-羟基)-苯基]-3-羟基-2-甲基-1-丙酮-1-酮、2-甲基-1-(4-甲硫基苯基)-2-吗啉-1-丙酮、2-苯基苄-2-二甲基胺-1-(4-吗啉苄苯基)丁酮、2,4,6-三甲基苯甲酰-二苯基氧化磷、双(2,4,6-三甲基苯甲酰基)苯基氧化膦、2,4,6-三甲基苯甲酰基苯基膦酸乙酯中的一种或多种。
12.根据权利要求10所述的树脂组合物,其特征在于,所述光敏剂选自2,4-乙二酸二乙酯、2-异丙基硫杂蒽酮、2,4-二乙基硫杂蒽酮、二苯甲酮、聚丁二醇双(9-氧代-9H-噻吨氧乙酸)酯中的一种或多种。
13.根据权利要求1或2所述的树脂组合物,其特征在于,按重量份计,所述树脂组合物还包括3~10份的增韧树脂。
14.根据权利要求13所述的树脂组合物,其特征在于,所述增韧树脂选自核壳橡胶增韧环氧树脂、热塑性弹性体、聚氨酯弹性体、液体橡胶、橡胶粉中的一种或多种。
15.根据权利要求14所述的树脂组合物,其特征在于,按重量份计,所述树脂组合物还包括0~5份的颜填料和0.01~5份的添加剂,所述添加剂选自热固化促进剂、分散剂、流平剂、消泡剂中的一种或多种。
16.根据权利要求15所述的树脂组合物,其特征在于,所述颜填料选自联苯胺黄、酞菁绿、酞菁蓝、炭黑、二氧化硅、硫酸钡、硫酸钙、滑石粉、水滑石中的一种多种。
17.根据权利要求15所述的树脂组合物,其特征在于,所述热固化促进剂为潜伏型热固化促进剂。
18.根据权利要求17所述的树脂组合物,其特征在于,所述热固化促进剂选自三氟化硼乙胺络合物、己二酸二酰肼、对羟基安息香酸酰肼、间苯二甲酸酰肼、二胺基二苯砜、双氰胺及其衍生物中的一种或多种。
19.根据权利要求15所述的树脂组合物,其特征在于,按重量份计,所述树脂组合物包括100份的所述碱溶性树脂、5~30份的所述丙烯酸酯类单体、0.1~10份的所述光引发剂、10~30份的所述第一环氧树脂、6~15份的所述第二环氧树脂、5~7份的所述增韧树脂、1~5份的所述颜填料和1~5份的所述添加剂。
20.权利要求1至9中任一项所述的树脂组合物在高频高速印刷线路板领域的应用。
21.一种高频高速印刷线路板阻焊保护层的制备方法,其特征在于,包括以下步骤:
将权利要求1至19中任一项所述的树脂组合物进行辊涂成膜,形成湿膜;
将所述湿膜进行预烘干后,依次进行热辊贴膜、曝光、显影、热固化,得到所述阻焊保护层。
22.根据权利要求21所述的制备方法,其特征在于,所述湿膜的厚度为25~50μm。
23.根据权利要求22所述的制备方法,其特征在于,所述预烘干过程中,预烘干温度为80℃~100℃,时间为15~30min。
24.根据权利要求22所述的制备方法,其特征在于,所述曝光过程中的曝光能量为100~500mJcm-2。
25.根据权利要求22所述的制备方法,其特征在于,所述显影过程中,采用的显影液为0.8~1.2wt%Na2CO3溶液,显影时间为30~60s,显影温度为27~33℃,喷淋压力为0.2~0.4MPa。
26.根据权利要求22所述的制备方法,其特征在于,所述热固化过程中,热固化温度为150~200℃,热固化时间为1~1.5h。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910804508.XA CN110554567B (zh) | 2019-08-28 | 2019-08-28 | 树脂组合物及其应用 |
PCT/CN2020/100911 WO2021036527A1 (zh) | 2019-08-28 | 2020-07-08 | 树脂组合物及其应用 |
EP20856582.0A EP4024134A4 (en) | 2019-08-28 | 2020-07-08 | RESIN COMPOSITION AND USES THEREOF |
US17/638,204 US20220308450A1 (en) | 2019-08-28 | 2020-07-08 | Resin composition and use thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910804508.XA CN110554567B (zh) | 2019-08-28 | 2019-08-28 | 树脂组合物及其应用 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN110554567A CN110554567A (zh) | 2019-12-10 |
CN110554567B true CN110554567B (zh) | 2022-04-15 |
Family
ID=68736719
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910804508.XA Active CN110554567B (zh) | 2019-08-28 | 2019-08-28 | 树脂组合物及其应用 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20220308450A1 (zh) |
EP (1) | EP4024134A4 (zh) |
CN (1) | CN110554567B (zh) |
WO (1) | WO2021036527A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110554567B (zh) * | 2019-08-28 | 2022-04-15 | 浙江福斯特新材料研究院有限公司 | 树脂组合物及其应用 |
CN111381440A (zh) * | 2020-04-24 | 2020-07-07 | 浙江福斯特新材料研究院有限公司 | 感光覆盖膜组合物 |
CN112409756A (zh) * | 2020-10-20 | 2021-02-26 | 中电科芜湖钻石飞机制造有限公司 | 低介电环氧树脂组合物及其制备方法、复合材料 |
CN112859518B (zh) * | 2021-01-04 | 2024-04-19 | 赣州西琦光学科技有限公司 | 一种感光干膜及其制备方法 |
CN113604099A (zh) * | 2021-07-08 | 2021-11-05 | 江苏海田电子材料有限公司 | 低介电常数阻焊油墨及其制备方法 |
CN113651920B (zh) * | 2021-09-28 | 2023-06-06 | 泉州师范学院 | 基于丙烯酸液晶光敏树脂的组合物及其在405nm 3D打印中的应用 |
CN114058212A (zh) * | 2021-11-18 | 2022-02-18 | 惠州市艾比森光电有限公司 | 黑色哑光油墨和pcb板及其制备方法 |
CN114539709B (zh) * | 2022-03-11 | 2023-08-04 | 广东鸿翔瑞材料科技有限公司 | 树脂组合物、应用该树脂组合物的高分子膜及电路板 |
CN114716868B (zh) * | 2022-04-19 | 2023-06-20 | 广州市红太电子科技有限公司 | 一种用于印刷电路板的光固化型油墨 |
CN117004270B (zh) * | 2023-08-10 | 2024-01-05 | 鹤山市炎墨科技有限公司 | 一种基于聚苯醚树脂的防焊油墨及其制备方法和应用 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105778412A (zh) * | 2014-12-26 | 2016-07-20 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
CN106318019A (zh) * | 2015-07-06 | 2017-01-11 | 南亚塑胶工业股份有限公司 | 印刷电路板用低介电抗焊光阻油墨组合物 |
CN106939117A (zh) * | 2017-04-17 | 2017-07-11 | 广州宏仁电子工业有限公司 | 树脂组合物及其应用 |
CN107450269A (zh) * | 2017-08-11 | 2017-12-08 | 浙江福斯特新材料研究院有限公司 | 一种高韧性、可弱碱水显影的光敏环氧丙烯酸树脂组合物及其制备方法 |
CN108287451A (zh) * | 2018-01-24 | 2018-07-17 | 浙江福斯特新材料研究院有限公司 | 一种低介电感光覆盖膜树脂组合物 |
CN109270792A (zh) * | 2018-10-30 | 2019-01-25 | 浙江福斯特新材料研究院有限公司 | 一种高韧性、高耐热、可弱碱水显影的聚酰亚胺/光敏环氧丙烯酸树脂组合物 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4628022A (en) * | 1983-07-13 | 1986-12-09 | At&T Technologies, Inc. | Multilayer circuit board fabrication process and polymer insulator used therein |
JP2004018615A (ja) * | 2002-06-14 | 2004-01-22 | Sumitomo Bakelite Co Ltd | 樹脂組成物、プリプレグ及び積層板 |
JP4033455B2 (ja) * | 2002-11-07 | 2008-01-16 | 日本化薬株式会社 | 感光性樹脂組成物及びその硬化物 |
KR100725432B1 (ko) * | 2003-03-06 | 2007-06-07 | 닛뽄 가야쿠 가부시키가이샤 | 감광성 수지 조성물 및 그 경화물 |
JP6130693B2 (ja) * | 2012-03-30 | 2017-05-17 | 太陽インキ製造株式会社 | 積層構造体、ドライフィルムおよび積層構造体の製造方法 |
JP6061576B2 (ja) * | 2012-09-10 | 2017-01-18 | 株式会社タムラ製作所 | 感光性樹脂組成物及び感光性樹脂組成物の硬化被膜を有するプリント配線板 |
KR102207627B1 (ko) * | 2013-03-07 | 2021-01-25 | 쇼와덴코머티리얼즈가부시끼가이샤 | 감광성 수지 조성물, 그것을 사용한 드라이 필름, 프린트 배선판, 및 프린트 배선판의 제조 방법 |
CN103694642B (zh) * | 2013-12-27 | 2015-11-25 | 广东生益科技股份有限公司 | 一种热固性树脂组合物及其用途 |
JP2017156590A (ja) * | 2016-03-02 | 2017-09-07 | 太陽インキ製造株式会社 | 感光性樹脂組成物、ドライフィルム、硬化物およびそれを用いたプリント配線板 |
US10527936B2 (en) * | 2016-06-17 | 2020-01-07 | Nan Ya Plastics Corporation | Low Dk/Df solder resistant composition use for printed circuit board |
KR102399159B1 (ko) * | 2016-11-24 | 2022-05-17 | 나믹스 가부시끼가이샤 | 수지 조성물, 이를 사용한 열경화성 필름, 수지 경화물, 적층판, 프린트 배선판 및 반도체 장치 |
CN111164512A (zh) * | 2017-09-29 | 2020-05-15 | 东丽株式会社 | 感光性树脂组合物、固化膜、具备固化膜的元件和有机el显示器及有机el显示器的制造方法 |
CN107942618B (zh) * | 2017-11-29 | 2021-02-05 | 浙江福斯特新材料研究院有限公司 | 一种高粘附力速显影性干膜抗蚀剂 |
JP6950536B2 (ja) * | 2018-01-09 | 2021-10-13 | 味の素株式会社 | 樹脂組成物 |
CN109884859B (zh) * | 2019-04-03 | 2022-06-10 | 杭州福斯特电子材料有限公司 | 一种高柔韧、高解析的光敏环氧丙烯酸树脂组合物 |
CN110554567B (zh) * | 2019-08-28 | 2022-04-15 | 浙江福斯特新材料研究院有限公司 | 树脂组合物及其应用 |
CN111381440A (zh) * | 2020-04-24 | 2020-07-07 | 浙江福斯特新材料研究院有限公司 | 感光覆盖膜组合物 |
-
2019
- 2019-08-28 CN CN201910804508.XA patent/CN110554567B/zh active Active
-
2020
- 2020-07-08 US US17/638,204 patent/US20220308450A1/en active Pending
- 2020-07-08 EP EP20856582.0A patent/EP4024134A4/en active Pending
- 2020-07-08 WO PCT/CN2020/100911 patent/WO2021036527A1/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105778412A (zh) * | 2014-12-26 | 2016-07-20 | 广东生益科技股份有限公司 | 一种环氧树脂组合物以及使用它的预浸料和层压板 |
CN106318019A (zh) * | 2015-07-06 | 2017-01-11 | 南亚塑胶工业股份有限公司 | 印刷电路板用低介电抗焊光阻油墨组合物 |
CN106939117A (zh) * | 2017-04-17 | 2017-07-11 | 广州宏仁电子工业有限公司 | 树脂组合物及其应用 |
CN107450269A (zh) * | 2017-08-11 | 2017-12-08 | 浙江福斯特新材料研究院有限公司 | 一种高韧性、可弱碱水显影的光敏环氧丙烯酸树脂组合物及其制备方法 |
CN108287451A (zh) * | 2018-01-24 | 2018-07-17 | 浙江福斯特新材料研究院有限公司 | 一种低介电感光覆盖膜树脂组合物 |
CN109270792A (zh) * | 2018-10-30 | 2019-01-25 | 浙江福斯特新材料研究院有限公司 | 一种高韧性、高耐热、可弱碱水显影的聚酰亚胺/光敏环氧丙烯酸树脂组合物 |
Also Published As
Publication number | Publication date |
---|---|
CN110554567A (zh) | 2019-12-10 |
US20220308450A1 (en) | 2022-09-29 |
EP4024134A1 (en) | 2022-07-06 |
EP4024134A4 (en) | 2023-10-25 |
WO2021036527A1 (zh) | 2021-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN110554567B (zh) | 树脂组合物及其应用 | |
EP1266922B1 (en) | Photocurable/thermosetting composition for forming matte film | |
US9891523B2 (en) | Photosensitive dry film and process for producing printed wiring board using the same | |
CN106814538B (zh) | 固化性树脂组合物、干膜、固化物和印刷电路板 | |
TWI399614B (zh) | Anti - welding ink composition and its hardened | |
US20130260109A1 (en) | Photocurable resin composition, dry film, cured product and printed wiring board | |
CN107272334B (zh) | 固化性树脂组合物、干膜、固化物和印刷电路板 | |
CN210381446U (zh) | 带有电磁波屏蔽片的印刷配线板 | |
JP6814248B2 (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物及びプリント配線板 | |
KR20090092730A (ko) | 활성 에너지선 경화성 수지 및 그의 제조 방법 | |
JP4532002B2 (ja) | ソルダーレジストインク | |
CN111868628B (zh) | 碱显影型光固化性热固化性树脂组合物 | |
CN106338887A (zh) | 一种光致抗蚀剂组合物及其用途 | |
JP7130519B2 (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物、および電子部品 | |
JP7187227B2 (ja) | 硬化性樹脂組成物、ドライフィルム、硬化物およびプリント配線板 | |
CN112940560B (zh) | 感光阻焊油墨组合物、其用途以及含有其的线路板 | |
CN110895381A (zh) | 感光阻焊油墨组合物、其用途及含有其的线路板 | |
CN112925168A (zh) | 一种氧化石墨烯增强感光覆盖膜组合物 | |
CN112711175A (zh) | 一种黑色固化性树脂组合物 | |
JP7170420B2 (ja) | 感光性フィルム積層体およびその硬化物 | |
CN109563222B (zh) | 光固化性树脂组合物、干膜、固化物和印刷电路板 | |
KR20210148171A (ko) | 경화성 수지 조성물, 드라이 필름, 경화물 및 전자 부품 | |
KR20060124859A (ko) | 솔더 레지스트 조성물 | |
KR20120033968A (ko) | 감광성 수지 조성물 | |
CN109143779B (zh) | 感光性膜层积体及其固化物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220418 Address after: 311300 room 212, building 1, No. 8, foster street, Jinbei street, Lin'an District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou foster Electronic Materials Co.,Ltd. Address before: No. 1235, Dayuan Road, Qingshanhu street, Lin'an District, Hangzhou City, Zhejiang Province Patentee before: ZHEJIANG FIRST ADVANCED MATERIAL R&D INSTITUTE Co.,Ltd. |
|
TR01 | Transfer of patent right |