CN110527302A - 导热性有机硅组合物 - Google Patents
导热性有机硅组合物 Download PDFInfo
- Publication number
- CN110527302A CN110527302A CN201910871684.5A CN201910871684A CN110527302A CN 110527302 A CN110527302 A CN 110527302A CN 201910871684 A CN201910871684 A CN 201910871684A CN 110527302 A CN110527302 A CN 110527302A
- Authority
- CN
- China
- Prior art keywords
- component
- mass
- thermally conductive
- parts
- conductive silicone
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 95
- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 74
- 239000002245 particle Substances 0.000 claims abstract description 34
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 10
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007788 liquid Substances 0.000 claims abstract description 5
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 30
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 16
- 125000003342 alkenyl group Chemical group 0.000 claims description 11
- 229910052697 platinum Inorganic materials 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 230000003197 catalytic effect Effects 0.000 claims description 4
- 239000000945 filler Substances 0.000 claims description 4
- 230000005484 gravity Effects 0.000 abstract description 7
- -1 2-methylundecyl Chemical group 0.000 description 78
- 229920002379 silicone rubber Polymers 0.000 description 42
- 239000004945 silicone rubber Substances 0.000 description 42
- 239000004205 dimethyl polysiloxane Substances 0.000 description 29
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 29
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 29
- 229920001577 copolymer Polymers 0.000 description 18
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 10
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 9
- KSLSOBUAIFEGLT-UHFFFAOYSA-N 2-phenylbut-3-yn-2-ol Chemical compound C#CC(O)(C)C1=CC=CC=C1 KSLSOBUAIFEGLT-UHFFFAOYSA-N 0.000 description 8
- 229920001971 elastomer Polymers 0.000 description 7
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 7
- 125000000217 alkyl group Chemical group 0.000 description 6
- 239000004519 grease Substances 0.000 description 5
- 238000010438 heat treatment Methods 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 4
- 150000001335 aliphatic alkanes Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- 239000011231 conductive filler Substances 0.000 description 4
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 4
- 230000002708 enhancing effect Effects 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 125000003944 tolyl group Chemical group 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003431 cross linking reagent Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000002683 reaction inhibitor Substances 0.000 description 3
- 125000005372 silanol group Chemical group 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 229910004283 SiO 4 Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000001204 arachidyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000003710 aryl alkyl group Chemical group 0.000 description 2
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000006165 cyclic alkyl group Chemical group 0.000 description 2
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 2
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 2
- 229910021485 fumed silica Inorganic materials 0.000 description 2
- 125000001188 haloalkyl group Chemical group 0.000 description 2
- 238000007542 hardness measurement Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 238000006459 hydrosilylation reaction Methods 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 125000001196 nonadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 125000005023 xylyl group Chemical group 0.000 description 2
- VMAWODUEPLAHOE-UHFFFAOYSA-N 2,4,6,8-tetrakis(ethenyl)-2,4,6,8-tetramethyl-1,3,5,7,2,4,6,8-tetraoxatetrasilocane Chemical compound C=C[Si]1(C)O[Si](C)(C=C)O[Si](C)(C=C)O[Si](C)(C=C)O1 VMAWODUEPLAHOE-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- CEBKHWWANWSNTI-UHFFFAOYSA-N 2-methylbut-3-yn-2-ol Chemical compound CC(C)(O)C#C CEBKHWWANWSNTI-UHFFFAOYSA-N 0.000 description 1
- 125000000094 2-phenylethyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- AOOGNPSUQVRFMF-UHFFFAOYSA-N 3,5-dimethylhex-1-en-3-ol Chemical compound CC(C)CC(C)(O)C=C AOOGNPSUQVRFMF-UHFFFAOYSA-N 0.000 description 1
- 229910052580 B4C Inorganic materials 0.000 description 1
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DHXVGJBLRPWPCS-UHFFFAOYSA-N Tetrahydropyran Chemical compound C1CCOCC1 DHXVGJBLRPWPCS-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 150000001565 benzotriazoles Chemical class 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- INAHAJYZKVIDIZ-UHFFFAOYSA-N boron carbide Chemical compound B12B3B4C32B41 INAHAJYZKVIDIZ-UHFFFAOYSA-N 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 239000005350 fused silica glass Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- VRINOTYEGADLMW-UHFFFAOYSA-N heptyl(trimethoxy)silane Chemical compound CCCCCCC[Si](OC)(OC)OC VRINOTYEGADLMW-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 150000004692 metal hydroxides Chemical class 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 150000003961 organosilicon compounds Chemical class 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 125000002255 pentenyl group Chemical group C(=CCCC)* 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 150000003058 platinum compounds Chemical class 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010058 rubber compounding Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- FBEIPJNQGITEBL-UHFFFAOYSA-J tetrachloroplatinum Chemical compound Cl[Pt](Cl)(Cl)Cl FBEIPJNQGITEBL-UHFFFAOYSA-J 0.000 description 1
- 150000003527 tetrahydropyrans Chemical class 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920002725 thermoplastic elastomer Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012054887A JP5940325B2 (ja) | 2012-03-12 | 2012-03-12 | 熱伝導性シリコーン組成物 |
| JP2012-054887 | 2012-03-12 | ||
| CN201380013711.6A CN104169390A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380013711.6A Division CN104169390A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110527302A true CN110527302A (zh) | 2019-12-03 |
Family
ID=48050202
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910871684.5A Pending CN110527302A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
| CN201380013711.6A Pending CN104169390A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380013711.6A Pending CN104169390A (zh) | 2012-03-12 | 2013-03-08 | 导热性有机硅组合物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20150097138A1 (https=) |
| EP (1) | EP2825612A1 (https=) |
| JP (1) | JP5940325B2 (https=) |
| KR (1) | KR102106759B1 (https=) |
| CN (2) | CN110527302A (https=) |
| TW (1) | TW201341471A (https=) |
| WO (1) | WO2013137423A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109196052B (zh) * | 2016-05-31 | 2021-05-07 | 积水保力马科技株式会社 | 导热部件、导热组合物及导热组合物的制造方法 |
| JP6841547B2 (ja) * | 2017-01-18 | 2021-03-10 | 出光興産株式会社 | グリース組成物及びその製造方法 |
| CN110719939B (zh) * | 2017-05-31 | 2022-02-18 | 迈图高新材料日本合同公司 | 导热性聚硅氧烷组合物 |
| CN107964380B (zh) * | 2017-12-28 | 2020-05-12 | 石家庄惠得科技有限公司 | 一种非正态分布氢氧化铝粉及其制备方法和应用 |
| KR102498951B1 (ko) * | 2018-01-11 | 2023-02-15 | 다우 실리콘즈 코포레이션 | 전자 구성요소 상에 열 전도성 조성물을 도포하는 방법 |
| JP7033047B2 (ja) * | 2018-10-26 | 2022-03-09 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| JP7001071B2 (ja) * | 2019-01-10 | 2022-01-19 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物 |
| EP3986968B1 (en) * | 2019-06-21 | 2025-09-03 | Dow Silicones Corporation | Thermal conductive silicone composition |
| JP7675026B2 (ja) | 2019-06-21 | 2025-05-12 | ダウ シリコーンズ コーポレーション | チキソトロピック性の硬化性シリコーン組成物の製造方法 |
| WO2020261958A1 (ja) | 2019-06-24 | 2020-12-30 | 信越化学工業株式会社 | 高熱伝導性シリコーン組成物及びその硬化物 |
| JP7136065B2 (ja) * | 2019-11-14 | 2022-09-13 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート |
| JP7165647B2 (ja) * | 2019-12-26 | 2022-11-04 | 信越化学工業株式会社 | 熱伝導性シリコーン樹脂組成物 |
| WO2021184149A1 (en) * | 2020-03-16 | 2021-09-23 | Dow Silicones Corporation | Thermal conductive silicone composition |
| JP2023536881A (ja) * | 2020-08-03 | 2023-08-30 | ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン | 低粘度熱伝導性ペースト |
| JPWO2023188491A1 (https=) * | 2022-03-31 | 2023-10-05 | ||
| JP2024172885A (ja) | 2023-06-01 | 2024-12-12 | 信越化学工業株式会社 | 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000136307A (ja) * | 1998-08-24 | 2000-05-16 | Shin Etsu Chem Co Ltd | 高電圧電気絶縁体用シリコ―ンゴム組成物、ポリマ―碍子用シ―ル材及びポリマ―碍子用補修材 |
| CN101168620A (zh) * | 2007-09-04 | 2008-04-30 | 广州兆舜化工材料有限公司 | 导热阻燃液体硅橡胶及其制备方法 |
| CN102046728A (zh) * | 2008-05-27 | 2011-05-04 | 道康宁东丽株式会社 | 导热硅氧烷组合物和电子器件 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2590654B2 (ja) | 1991-11-20 | 1997-03-12 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物の製造方法 |
| JP2557604B2 (ja) * | 1993-08-17 | 1996-11-27 | 東レ・ダウコーニング・シリコーン株式会社 | 碍 子 |
| US5668205A (en) * | 1994-05-27 | 1997-09-16 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
| EP0928008A3 (en) * | 1997-12-30 | 2000-01-05 | General Electric Company | Silicone compositions for high voltage insulator applications |
| US6232387B1 (en) * | 1998-05-19 | 2001-05-15 | Shin-Etsu Chemical Co., Ltd. | Silicone rubber compositions for high-voltage electrical insulators |
| JP4759122B2 (ja) * | 2000-09-12 | 2011-08-31 | ポリマテック株式会社 | 熱伝導性シート及び熱伝導性グリス |
| US6448329B1 (en) * | 2001-02-28 | 2002-09-10 | Dow Corning Corporation | Silicone composition and thermally conductive cured silicone product |
| JP4663153B2 (ja) * | 2001-05-22 | 2011-03-30 | ポリマテック株式会社 | 熱伝導性複合材料組成物 |
| US20030113461A1 (en) * | 2001-12-14 | 2003-06-19 | Farooq Ahmed | Coated composite high voltage electrical insulator |
| DE602004024049D1 (de) * | 2003-04-15 | 2009-12-24 | Dow Corning Toray Co Ltd | Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze |
| WO2004110931A2 (en) * | 2003-06-12 | 2004-12-23 | Showa Denko K.K. | Method for producing particulate alumina and composition containing particulate alumina |
| JP2010018786A (ja) * | 2008-06-09 | 2010-01-28 | Shin-Etsu Chemical Co Ltd | 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース |
| JP5300408B2 (ja) | 2008-10-21 | 2013-09-25 | 信越化学工業株式会社 | 熱伝導性シリコーングリース組成物 |
| JP5108825B2 (ja) * | 2009-04-24 | 2012-12-26 | 信越化学工業株式会社 | 光半導体装置用シリコーン樹脂組成物及び光半導体装置 |
| JP5488326B2 (ja) * | 2009-09-01 | 2014-05-14 | 信越化学工業株式会社 | 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置 |
| JP5304588B2 (ja) | 2009-10-26 | 2013-10-02 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| JP5418298B2 (ja) * | 2010-02-26 | 2014-02-19 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
| TWI532815B (zh) * | 2012-01-20 | 2016-05-11 | 先鋒材料科技股份有限公司 | 導熱、絕緣、耐燃及耐高溫之黏著劑及其組合物 |
-
2012
- 2012-03-12 JP JP2012054887A patent/JP5940325B2/ja active Active
-
2013
- 2013-03-08 EP EP13714705.4A patent/EP2825612A1/en not_active Withdrawn
- 2013-03-08 CN CN201910871684.5A patent/CN110527302A/zh active Pending
- 2013-03-08 US US14/384,419 patent/US20150097138A1/en not_active Abandoned
- 2013-03-08 KR KR1020147028507A patent/KR102106759B1/ko active Active
- 2013-03-08 CN CN201380013711.6A patent/CN104169390A/zh active Pending
- 2013-03-08 WO PCT/JP2013/057327 patent/WO2013137423A1/en not_active Ceased
- 2013-03-12 TW TW102108723A patent/TW201341471A/zh unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000136307A (ja) * | 1998-08-24 | 2000-05-16 | Shin Etsu Chem Co Ltd | 高電圧電気絶縁体用シリコ―ンゴム組成物、ポリマ―碍子用シ―ル材及びポリマ―碍子用補修材 |
| CN101168620A (zh) * | 2007-09-04 | 2008-04-30 | 广州兆舜化工材料有限公司 | 导热阻燃液体硅橡胶及其制备方法 |
| CN102046728A (zh) * | 2008-05-27 | 2011-05-04 | 道康宁东丽株式会社 | 导热硅氧烷组合物和电子器件 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104169390A (zh) | 2014-11-26 |
| EP2825612A1 (en) | 2015-01-21 |
| US20150097138A1 (en) | 2015-04-09 |
| TW201341471A (zh) | 2013-10-16 |
| KR20140133931A (ko) | 2014-11-20 |
| KR102106759B1 (ko) | 2020-05-06 |
| WO2013137423A1 (en) | 2013-09-19 |
| JP2013189498A (ja) | 2013-09-26 |
| JP5940325B2 (ja) | 2016-06-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110527302A (zh) | 导热性有机硅组合物 | |
| JP6014299B2 (ja) | 熱伝導性シリコーン組成物及び半導体装置 | |
| JP6648837B2 (ja) | 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法 | |
| JP5619487B2 (ja) | 熱伝導性シリコーングリース組成物 | |
| US10150902B2 (en) | Thermally conductive silicone composition and electrical/electronic apparatus | |
| JP5507059B2 (ja) | 熱伝導性シリコーン組成物および電子装置 | |
| JP5372388B2 (ja) | 熱伝導性シリコーングリース組成物 | |
| JP5445415B2 (ja) | 熱伝導性シリコーン接着剤組成物及び熱伝導性シリコーンエラストマー成形品 | |
| US20210261844A9 (en) | Multicomponent-curable thermally-conductive silicone gel composition, thermally-conductive member and heat dissipation structure | |
| WO2015111409A1 (en) | Silicone gel composition | |
| CN112867765B (zh) | 导热性有机硅组合物及其固化物 | |
| CN106574120A (zh) | 导热性有机硅组合物及导热性有机硅成型物 | |
| JP2020512465A (ja) | 放熱ゲル型シリコーンゴム組成物 | |
| JP2017075202A (ja) | 付加一液硬化型熱伝導性シリコーングリース組成物 | |
| JP2001139818A (ja) | 熱伝導性シリコーンゴム組成物 | |
| JP6264307B2 (ja) | 付加硬化型シリコーン組成物 | |
| CN115885381A (zh) | 固化性聚有机硅氧烷组合物、导热性构件以及散热结构体 | |
| TW202043373A (zh) | 高熱傳導性聚矽氧組成物及其製造方法 | |
| WO2024195569A1 (ja) | 熱伝導性シリコーン組成物及びその硬化物、ならびに製造方法 | |
| WO2024024454A1 (ja) | 片末端変性オルガノポリシロキサン及びその製造方法、表面処理剤、並びにシリコーン組成物 | |
| WO2025211259A1 (ja) | 熱伝導性シリコーン組成物、硬化物及び製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20191203 |