KR102106759B1 - 열전도성 실리콘 조성물 - Google Patents

열전도성 실리콘 조성물 Download PDF

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KR102106759B1
KR102106759B1 KR1020147028507A KR20147028507A KR102106759B1 KR 102106759 B1 KR102106759 B1 KR 102106759B1 KR 1020147028507 A KR1020147028507 A KR 1020147028507A KR 20147028507 A KR20147028507 A KR 20147028507A KR 102106759 B1 KR102106759 B1 KR 102106759B1
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mass
component
parts
thermally conductive
conductive silicone
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KR20140133931A (ko
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도모코 가토
가즈미 나카요시
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듀폰 도레이 스페셜티 머티리얼즈 가부시키가이샤
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08—Materials not undergoing a change of physical state when used
    • C09K5/14—Solid materials, e.g. powdery or granular
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
KR1020147028507A 2012-03-12 2013-03-08 열전도성 실리콘 조성물 Active KR102106759B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2012-054887 2012-03-12
JP2012054887A JP5940325B2 (ja) 2012-03-12 2012-03-12 熱伝導性シリコーン組成物
PCT/JP2013/057327 WO2013137423A1 (en) 2012-03-12 2013-03-08 Thermally conductive silicone composition

Publications (2)

Publication Number Publication Date
KR20140133931A KR20140133931A (ko) 2014-11-20
KR102106759B1 true KR102106759B1 (ko) 2020-05-06

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Country Link
US (1) US20150097138A1 (https=)
EP (1) EP2825612A1 (https=)
JP (1) JP5940325B2 (https=)
KR (1) KR102106759B1 (https=)
CN (2) CN110527302A (https=)
TW (1) TW201341471A (https=)
WO (1) WO2013137423A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109196052B (zh) * 2016-05-31 2021-05-07 积水保力马科技株式会社 导热部件、导热组合物及导热组合物的制造方法
JP6841547B2 (ja) * 2017-01-18 2021-03-10 出光興産株式会社 グリース組成物及びその製造方法
CN110719939B (zh) * 2017-05-31 2022-02-18 迈图高新材料日本合同公司 导热性聚硅氧烷组合物
CN107964380B (zh) * 2017-12-28 2020-05-12 石家庄惠得科技有限公司 一种非正态分布氢氧化铝粉及其制备方法和应用
KR102498951B1 (ko) * 2018-01-11 2023-02-15 다우 실리콘즈 코포레이션 전자 구성요소 상에 열 전도성 조성물을 도포하는 방법
JP7033047B2 (ja) * 2018-10-26 2022-03-09 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP7001071B2 (ja) * 2019-01-10 2022-01-19 信越化学工業株式会社 熱伝導性シリコーン組成物
EP3986968B1 (en) * 2019-06-21 2025-09-03 Dow Silicones Corporation Thermal conductive silicone composition
JP7675026B2 (ja) 2019-06-21 2025-05-12 ダウ シリコーンズ コーポレーション チキソトロピック性の硬化性シリコーン組成物の製造方法
WO2020261958A1 (ja) 2019-06-24 2020-12-30 信越化学工業株式会社 高熱伝導性シリコーン組成物及びその硬化物
JP7136065B2 (ja) * 2019-11-14 2022-09-13 信越化学工業株式会社 熱伝導性シリコーン組成物及び熱伝導性シリコーンシート
JP7165647B2 (ja) * 2019-12-26 2022-11-04 信越化学工業株式会社 熱伝導性シリコーン樹脂組成物
WO2021184149A1 (en) * 2020-03-16 2021-09-23 Dow Silicones Corporation Thermal conductive silicone composition
JP2023536881A (ja) * 2020-08-03 2023-08-30 ヘンケル・アクチェンゲゼルシャフト・ウント・コムパニー・コマンディットゲゼルシャフト・アウフ・アクチェン 低粘度熱伝導性ペースト
JPWO2023188491A1 (https=) * 2022-03-31 2023-10-05
JP2024172885A (ja) 2023-06-01 2024-12-12 信越化学工業株式会社 熱伝導性２液付加硬化型シリコーン組成物、硬化物及びシート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101168620A (zh) * 2007-09-04 2008-04-30 广州兆舜化工材料有限公司 导热阻燃液体硅橡胶及其制备方法

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2590654B2 (ja) 1991-11-20 1997-03-12 信越化学工業株式会社 熱伝導性シリコーンゴム組成物の製造方法
JP2557604B2 (ja) * 1993-08-17 1996-11-27 東レ・ダウコーニング・シリコーン株式会社 碍 子
US5668205A (en) * 1994-05-27 1997-09-16 Shin-Etsu Chemical Co., Ltd. Silicone rubber compositions for high-voltage electrical insulators
EP0928008A3 (en) * 1997-12-30 2000-01-05 General Electric Company Silicone compositions for high voltage insulator applications
US6232387B1 (en) * 1998-05-19 2001-05-15 Shin-Etsu Chemical Co., Ltd. Silicone rubber compositions for high-voltage electrical insulators
JP4780256B2 (ja) * 1998-08-24 2011-09-28 信越化学工業株式会社 ポリマー碍子用シール材及びポリマー碍子用補修材
JP4759122B2 (ja) * 2000-09-12 2011-08-31 ポリマテック株式会社 熱伝導性シート及び熱伝導性グリス
US6448329B1 (en) * 2001-02-28 2002-09-10 Dow Corning Corporation Silicone composition and thermally conductive cured silicone product
JP4663153B2 (ja) * 2001-05-22 2011-03-30 ポリマテック株式会社 熱伝導性複合材料組成物
US20030113461A1 (en) * 2001-12-14 2003-06-19 Farooq Ahmed Coated composite high voltage electrical insulator
DE602004024049D1 (de) * 2003-04-15 2009-12-24 Dow Corning Toray Co Ltd Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze
WO2004110931A2 (en) * 2003-06-12 2004-12-23 Showa Denko K.K. Method for producing particulate alumina and composition containing particulate alumina
JP5507059B2 (ja) * 2008-05-27 2014-05-28 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物および電子装置
JP2010018786A (ja) * 2008-06-09 2010-01-28 Shin-Etsu Chemical Co Ltd 光半導体ケース形成用白色熱硬化性シリコーン樹脂組成物及び光半導体ケース
JP5300408B2 (ja) 2008-10-21 2013-09-25 信越化学工業株式会社 熱伝導性シリコーングリース組成物
JP5108825B2 (ja) * 2009-04-24 2012-12-26 信越化学工業株式会社 光半導体装置用シリコーン樹脂組成物及び光半導体装置
JP5488326B2 (ja) * 2009-09-01 2014-05-14 信越化学工業株式会社 光半導体装置用白色熱硬化性シリコーンエポキシ混成樹脂組成物及びその製造方法並びにプレモールドパッケージ及びｌｅｄ装置
JP5304588B2 (ja) 2009-10-26 2013-10-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5418298B2 (ja) * 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
TWI532815B (zh) * 2012-01-20 2016-05-11 先鋒材料科技股份有限公司 導熱、絕緣、耐燃及耐高溫之黏著劑及其組合物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101168620A (zh) * 2007-09-04 2008-04-30 广州兆舜化工材料有限公司 导热阻燃液体硅橡胶及其制备方法

Also Published As

Publication number Publication date
CN104169390A (zh) 2014-11-26
CN110527302A (zh) 2019-12-03
EP2825612A1 (en) 2015-01-21
US20150097138A1 (en) 2015-04-09
TW201341471A (zh) 2013-10-16
KR20140133931A (ko) 2014-11-20
WO2013137423A1 (en) 2013-09-19
JP2013189498A (ja) 2013-09-26
JP5940325B2 (ja) 2016-06-29

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