JPWO2023188491A1 - - Google Patents

Info

Publication number
JPWO2023188491A1
JPWO2023188491A1 JP2023503240A JP2023503240A JPWO2023188491A1 JP WO2023188491 A1 JPWO2023188491 A1 JP WO2023188491A1 JP 2023503240 A JP2023503240 A JP 2023503240A JP 2023503240 A JP2023503240 A JP 2023503240A JP WO2023188491 A1 JPWO2023188491 A1 JP WO2023188491A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023503240A
Other languages
Japanese (ja)
Other versions
JPWO2023188491A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2023188491A1 publication Critical patent/JPWO2023188491A1/ja
Publication of JPWO2023188491A5 publication Critical patent/JPWO2023188491A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2023503240A 2022-03-31 2022-10-25 Pending JPWO2023188491A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022059463 2022-03-31
PCT/JP2022/039700 WO2023188491A1 (ja) 2022-03-31 2022-10-25 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2023188491A1 true JPWO2023188491A1 (https=) 2023-10-05
JPWO2023188491A5 JPWO2023188491A5 (https=) 2024-03-07

Family

ID=88200607

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023503240A Pending JPWO2023188491A1 (https=) 2022-03-31 2022-10-25

Country Status (3)

Country Link
JP (1) JPWO2023188491A1 (https=)
TW (1) TW202340375A (https=)
WO (1) WO2023188491A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187352A1 (ja) * 2024-03-04 2025-09-12 信越化学工業株式会社 熱伝導性シリコーン熱収縮チューブ
WO2025204719A1 (ja) * 2024-03-29 2025-10-02 三菱マテリアル株式会社 熱伝導性樹脂組成物

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011089079A (ja) * 2009-10-26 2011-05-06 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2011178821A (ja) * 2010-02-26 2011-09-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2012238820A (ja) * 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP2013147600A (ja) * 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2013189498A (ja) * 2012-03-12 2013-09-26 Dow Corning Toray Co Ltd 熱伝導性シリコーン組成物
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP2020002236A (ja) * 2018-06-27 2020-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法
WO2022049902A1 (ja) * 2020-09-03 2022-03-10 富士高分子工業株式会社 熱伝導性シリコーン放熱材料

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011089079A (ja) * 2009-10-26 2011-05-06 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2011178821A (ja) * 2010-02-26 2011-09-15 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2012238820A (ja) * 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP2013147600A (ja) * 2012-01-23 2013-08-01 Shin-Etsu Chemical Co Ltd 熱伝導性シリコーン組成物及びその硬化物
JP2013189498A (ja) * 2012-03-12 2013-09-26 Dow Corning Toray Co Ltd 熱伝導性シリコーン組成物
JP2016011322A (ja) * 2014-06-27 2016-01-21 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP2020002236A (ja) * 2018-06-27 2020-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法
WO2022049902A1 (ja) * 2020-09-03 2022-03-10 富士高分子工業株式会社 熱伝導性シリコーン放熱材料

Also Published As

Publication number Publication date
WO2023188491A1 (ja) 2023-10-05
TW202340375A (zh) 2023-10-16

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