TW202340375A - 熱傳導性聚矽氧組成物、熱傳導性聚矽氧片及其製造方法 - Google Patents

熱傳導性聚矽氧組成物、熱傳導性聚矽氧片及其製造方法 Download PDF

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Publication number
TW202340375A
TW202340375A TW111142045A TW111142045A TW202340375A TW 202340375 A TW202340375 A TW 202340375A TW 111142045 A TW111142045 A TW 111142045A TW 111142045 A TW111142045 A TW 111142045A TW 202340375 A TW202340375 A TW 202340375A
Authority
TW
Taiwan
Prior art keywords
thermally conductive
particles
vol
sheet
polysiloxane
Prior art date
Application number
TW111142045A
Other languages
English (en)
Chinese (zh)
Inventor
中島雄司
Original Assignee
日商富士高分子工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士高分子工業股份有限公司 filed Critical 日商富士高分子工業股份有限公司
Publication of TW202340375A publication Critical patent/TW202340375A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW111142045A 2022-03-31 2022-11-03 熱傳導性聚矽氧組成物、熱傳導性聚矽氧片及其製造方法 TW202340375A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022059463 2022-03-31
JP2022-059463 2022-03-31

Publications (1)

Publication Number Publication Date
TW202340375A true TW202340375A (zh) 2023-10-16

Family

ID=88200607

Family Applications (1)

Application Number Title Priority Date Filing Date
TW111142045A TW202340375A (zh) 2022-03-31 2022-11-03 熱傳導性聚矽氧組成物、熱傳導性聚矽氧片及其製造方法

Country Status (3)

Country Link
JP (1) JPWO2023188491A1 (https=)
TW (1) TW202340375A (https=)
WO (1) WO2023188491A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025187352A1 (ja) * 2024-03-04 2025-09-12 信越化学工業株式会社 熱伝導性シリコーン熱収縮チューブ
WO2025204719A1 (ja) * 2024-03-29 2025-10-02 三菱マテリアル株式会社 熱伝導性樹脂組成物

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5304588B2 (ja) * 2009-10-26 2013-10-02 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5418298B2 (ja) * 2010-02-26 2014-02-19 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP2012238820A (ja) * 2011-05-13 2012-12-06 Nitto Denko Corp 熱伝導性シート、絶縁シートおよび放熱部材
JP2013062379A (ja) * 2011-09-13 2013-04-04 Nitto Denko Corp 熱伝導性シートおよびその製造方法
JP5664563B2 (ja) * 2012-01-23 2015-02-04 信越化学工業株式会社 熱伝導性シリコーン組成物及びその硬化物
JP5940325B2 (ja) * 2012-03-12 2016-06-29 東レ・ダウコーニング株式会社 熱伝導性シリコーン組成物
JP6202475B2 (ja) * 2014-06-27 2017-09-27 信越化学工業株式会社 熱伝導性複合シリコーンゴムシート
JP2020002236A (ja) * 2018-06-27 2020-01-09 信越化学工業株式会社 熱伝導性シリコーン組成物、熱伝導性シリコーンシート及びその製造方法
WO2022049902A1 (ja) * 2020-09-03 2022-03-10 富士高分子工業株式会社 熱伝導性シリコーン放熱材料

Also Published As

Publication number Publication date
JPWO2023188491A1 (https=) 2023-10-05
WO2023188491A1 (ja) 2023-10-05

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