CN1103179C - 微电子连接元件以及包含该元件的组件 - Google Patents

微电子连接元件以及包含该元件的组件 Download PDF

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Publication number
CN1103179C
CN1103179C CN96197033A CN96197033A CN1103179C CN 1103179 C CN1103179 C CN 1103179C CN 96197033 A CN96197033 A CN 96197033A CN 96197033 A CN96197033 A CN 96197033A CN 1103179 C CN1103179 C CN 1103179C
Authority
CN
China
Prior art keywords
lead
wire
supporting structure
dielectric
conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN96197033A
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English (en)
Chinese (zh)
Other versions
CN1196869A (zh
Inventor
约瑟夫·菲耶尔斯塔
约翰·W·施密斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Adeia Semiconductor Solutions LLC
Original Assignee
Tessera LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tessera LLC filed Critical Tessera LLC
Publication of CN1196869A publication Critical patent/CN1196869A/zh
Application granted granted Critical
Publication of CN1103179C publication Critical patent/CN1103179C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/453—Leadframes comprising flexible metallic tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/077—Connecting of TAB connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Wire Bonding (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN96197033A 1995-09-18 1996-09-18 微电子连接元件以及包含该元件的组件 Expired - Fee Related CN1103179C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US392795P 1995-09-18 1995-09-18
US60/003,927 1995-09-18

Publications (2)

Publication Number Publication Date
CN1196869A CN1196869A (zh) 1998-10-21
CN1103179C true CN1103179C (zh) 2003-03-12

Family

ID=21708266

Family Applications (1)

Application Number Title Priority Date Filing Date
CN96197033A Expired - Fee Related CN1103179C (zh) 1995-09-18 1996-09-18 微电子连接元件以及包含该元件的组件

Country Status (7)

Country Link
US (1) US6329607B1 (https=)
EP (1) EP0956745A1 (https=)
JP (2) JP3807508B2 (https=)
KR (1) KR100407055B1 (https=)
CN (1) CN1103179C (https=)
AU (1) AU7161596A (https=)
WO (1) WO1997011588A1 (https=)

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TWI378546B (en) * 2009-09-16 2012-12-01 Powertech Technology Inc Substrate and package for micro bga
JP6001956B2 (ja) * 2012-08-10 2016-10-05 株式会社東芝 半導体装置
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JP2018527761A (ja) * 2015-09-01 2018-09-20 アールアンドディー サーキッツ，インク． あらゆる場での相互接続のトレース
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Also Published As

Publication number Publication date
JP2006108704A (ja) 2006-04-20
WO1997011588A1 (en) 1997-03-27
JP3807508B2 (ja) 2006-08-09
EP0956745A1 (en) 1999-11-17
EP0956745A4 (https=) 1999-11-17
CN1196869A (zh) 1998-10-21
KR100407055B1 (ko) 2004-03-31
JPH11513532A (ja) 1999-11-16
AU7161596A (en) 1997-04-09
KR19990045755A (ko) 1999-06-25
US6329607B1 (en) 2001-12-11

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