JPH11513532A - 誘電層を備えた超小形電子リード構造体 - Google Patents
誘電層を備えた超小形電子リード構造体Info
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- JPH11513532A JPH11513532A JP9512863A JP51286397A JPH11513532A JP H11513532 A JPH11513532 A JP H11513532A JP 9512863 A JP9512863 A JP 9512863A JP 51286397 A JP51286397 A JP 51286397A JP H11513532 A JPH11513532 A JP H11513532A
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Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.(a)端子を有する誘電支持構造体と、 (b)前記基板に取着された複数の柔軟なリードとを備え、該各リードは柔軟 な誘電部材と、前記端子の少なくとも1つに接続された主導体と、誘電部材に沿 って同方向に延びる基準導体とを有することを特徴とする超小形電子接続構成素 子。 2.前記各柔軟な誘電部材は上面および底面を有する誘電ストリップであり、前 記各リードの主導体はかかるリードのストリップの前記面に配置され、基準導体 はかかるリードのストリップの反対側の面に配置されていることを特徴とする請 求の範囲第1項に記載の構成素子。 3.前記誘電支持構造体は上面および底面を有し、前記端子は前記基板の一方の 前記面に配置されていることを特徴とする請求の範囲第2項に記載の構成素子。 4.前記ストリップの前記上面および底面は前記支持構造体の上面および底面に それぞれ連続していることを特徴とする請求の範囲第3項に記載の構成素子。 5.前記ストリップと前記支持構造体は互いに一体に形成されていることを特徴 とする請求の範囲第4項に記載の構成素子。 6.前記ストリップと前記支持構造体は同じ厚さを有することを特徴とする請求 の範囲第5項に記載の構成素子。 7.前記支持構造体の一方の前記面に配置された導電性の第1の電位基準素子を 更に備え、前記リードの少なくとも幾つかの前記基準導体は前記電位基準素子に 電気的に接続されていることを特徴とする請求の範囲第3項に記載の構成素子。 8.前記第1の電位基準素子は前記支持構造体の前記上面に配置され、前記第1 の電位基準素子は孔を有し、前記端子は前記孔の中で前記支持構造体の前記上面 に配置され、前記端子の少なくとも幾つかは前記第1の電位基準素子から電気的 に隔離され、前記リードの前記基準導体は前記ストリップの前記上面に配置され かつ前記第1の電位基準素子と連続しており、前記リードの前記主導体は前記ス トリップの底面に配置されていることを特徴とする請求の範囲第7項に記載の構 成素子。 9.前記端子の少なくとも幾つかから前記支持構造体の底面へ延びる導電性のバ イアを更に備え、前記リードの少なくとも幾つかの主導体は前記バイアに接続さ れていることを特徴とする請求の範囲第8項に記載の構成素子。 10.前記支持構造体の底面に沿って延びかつ前記バイアの少なくとも幾つかを 前記主導体の少なくとも幾つかに電気的に接続する導電性トレースを更に備える ことを特徴とする請求の範囲第9項に記載の構成素子。 11.前記主導体の少なくとも幾つかは前記トレースに連続していることを特徴 とする請求の範囲第10項に記載の構成素子。 12.前記端子の少なくとも1つは前記第1の電位基準素子に電気的に接続され ていることを特徴とする請求の範囲第7項に記載の構成素子。 13.前記リードの少なくとも1つの主導体は前記第1の電位基準素子に電気的 に接続されていることを特徴とする請求の範囲第12項に記載の構成素子。 14.第1の電位基準素子から反対の前記支持構造体の側に配置されかつ前記第 1の電位基準素子から電気的に隔離された第2の電位基準素子を更に備え、前記 端子の少なくとも1つおよび前記リードの少なくとも1つの主導体は前記第2の 電位基準素子に電気的に接続されていることを特徴とする請求の範囲第13項に 記載の構成素子。 15.前記導体は厚さが約10ミクロン以下の金属から形成されていることを特 徴とする請求の範囲第3項に記載の構成素子。 16.前記導体は厚さが約5ミクロン以下の金属から形成されていることを特徴 とする請求の範囲第15項に記載の構成素子。 17.前記金属は約2ミクロン乃至約5ミクロンの厚さを有することを特徴とす る請求の範囲第16項に記載の構成素子。 18.前記金属は銅および銅合金よりなる群から選ばれることを特徴とする請求 の範囲第15項に記載の構成素子。 19.(a)反対方向を向く上面および底面を有する誘電支持構造体と、 (b)前記基板に取着された複数の柔軟なリードとを備え、該各リードは上面 と底面とを有する柔軟な誘電ストリップと、ストリップの一方の面に配置された 主導体と、ストリップの他方の面に配置された基準導体とを有することを特徴と する超小形電子接続構成素子。 20.前記ストリップと前記支持構造体は共通する柔軟な誘電シートの一部とし て互いに一体に形成されていることを特徴とする請求の範囲第19項に記載の構 成素子。 21.前記支持構造体の一方の面に配置された前記基準導体の少なくとも幾つか に電気的に接続された第1の電位基準素子を更に備えることを特徴とする請求の 範囲第19項に記載の構成素子。 22.前記支持構造体の面に配置されかつ前記主導体の少なくとも幾つかに電気 的に接続された端子を更に備えることを特徴とする請求の範囲第19項に記載の 構成素子。 23.前記支持面の底面と前記ストリップに対向する前面を有しかつ該前面に接 点を有する超小形電子素子を更に備え、前記リードの前記主導体は前記接点に接 続され、前記リードの前記基準導体は前記接点の付近まで延びていることを特徴 とする請求の範囲第2、3、8、15または19項に記載の構成素子を備える集 成体。 24.前記超小形電子素子は半導体チップであることを特徴とする請求の範囲第 23項に記載の集成体。 25.(a)支持構造体と、 (b)1つ以上の柔軟なリードとを備え、該各リードは前記支持構造体に取着 された第1の端部と該第1の端部から離隔した第2の端部とを有し、各リードは 反対方向を向く上面および底面を有する重合体ストリップと前記面の一方に配置 された第1の金属層とを含み、前記第1の導電層は厚さが10ミクロン未満であ る超小形電子接続構成素子。 26.前記第1の導電層は金属であることを特徴とする請求の範囲第25項に記 載の構成素子。 27.前記第1の金属導電層は厚さが約2乃至約5ミクロンであることを特徴と する請求の範囲第26項に記載の構成素子。 28.前記リードは更に前記面の他方に配置された第2の導電層を有し、該第2 の導電層は厚さが10ミクロン未満であることを特徴とする請求の範囲第25項 に記載の構成素子。 29.前記導電層は厚さが約10ミクロン乃至約50ミクロンであることを特徴 とする請求の範囲第25項に記載の構成素子。 30.(a)ギャップを画成する支持構造体と、 (b)前記ギャップを介して延びる1つ以上のリードとを備え、該各リードは 前記ギャップの一方の側で前記支持構造体に取着された第1の端部と第2の端部 とを有する接続部を含み、前記各リードは更に脆弱部を有し、接続部の第2の端 部は脆弱部を介して支持構造体に取着され、前記各リードの接続部は前記接続部 の第2の端部に延びる柔軟な重合体層と該重合体層に配置された1つ以上の金属 層とを含み、脆弱部は前記重合体層はなもたないが前記金属層に1つ以上を含む ことを特徴とする超小形電子接続構成素子。 31.前記1つ以上の金属層は前記重合体層の両方の面に配置された2つの金属 層を有し、前記脆弱部は前記金属層の1つだけを有することを特徴とする請求の 範囲第30項に記載の構成素子。 32.前記金属層の前記一方は厚さが約10ミクロンであることを特徴とする請 求の範囲第31項に記載の構成素子。 33.前記金属層は前記リードの隣接部において前記金属層の幅よりも小さい前 記脆弱部の幅を有することを特徴とする請求の範囲第32項に記載の構成素子。 34.支持構造体と1つ以上のリードとを備え、該各リードは支持構造体に取着 された第1の端部を有するとともに第1の端部から離隔した第2の端部を有し、 前記各接続部は反対方向を向く上面および底面を有する重合体ストリップと、前 記面の一方に配置された第1の金属層と、該金属層から下方へ延びかつ前記第2 の端部に隣接したリードから下方へ突出する金属突起とを含むことを特徴とする 超小形電子接続構成素子。 35.前記各第1の金属層は連係するストリップの上面に配置され、前記各突起 はかかるストリップを介して延びることを特徴とする請求の範囲第34項に記載 の構成素子。 36.前記第1の金属層は連係するストリップの底面に配置されていることを特 徴とする請求の範囲第35項に記載の構成素子。 37.前記各ストリップは前記突起に整合してストリップの上面からストリップ を介して少なくとも部分的に延びる孔を有することを特徴とする請求の範囲第3 6項に記載の構成素子。 38.前記各リードは更にストリップの上部側でストリップに配置された第2の 金属層を有し、該第2の金属層はリードの第2の端部へ延びるとともにストリッ プの孔と整合しかつかかるリードと整合する孔を有することを特徴とする請求の 範囲第37項に記載の構成素子。 39.支持構造体と、1つ以上のリードとを備え、該各リードは支持構造体に取 着された第1の端部を有するとともに第1の端部から離隔した第2の端部を有し 、前記各接続部は反対方向を向く上面および底面を有する重合体ストリップと、 ストリップの底面に配置された第1の金属層と、前記ストリップの上面に配置さ れた第2の金属層とを含み、前記金属層の双方は第2の端部に隣接したリードの 結合領域に延び、前記第2の金属層と前記ストリップは前記結合領域において互 いに整合する孔を有することを特徴とする超小形電子接続構成素子。 40.支持構造体と、1つ以上のリードとを備え、該各リードは支持構造体に取 着された第1の端部を有するとともに第1の端部から離隔した第2の端部を有し 、前記各接続部は反対方向を向く上面および底面を有する重合体ストリップと、 ストリップの底面に配置された第1の金属層とを含み、前記第1の金属層は第2 の端部に隣接するリードの結合領域に延び、前記上面から少なくとも部分的に前 記各ストリップは前記結合領域において前記重合体層を介して延びる孔を有する ことを特徴とする超小形電子接続構成素子。 41.リードの第2の端部を構成素子の接点と並列配置する工程と、ボンディン グツールが第1の金属層と係合するように前記リードの孔ボンディングツールを 挿入しかつボンディングツールを介して第1の金属層にエネルギをすることによ りリードを接点に結合する工程とを備えることを特徴とする請求の範囲第37、 38、39または40項に記載の接続構成素子を結合する方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US392795P | 1995-09-18 | 1995-09-18 | |
US60/003,927 | 1995-09-18 | ||
PCT/US1996/014965 WO1997011588A1 (en) | 1995-09-18 | 1996-09-18 | Microelectronic lead structures with dielectric layers |
Related Child Applications (1)
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JP2005338610A Division JP2006108704A (ja) | 1995-09-18 | 2005-11-24 | 誘電層を備えた超小型電子リード構造体 |
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JP2005338610A Withdrawn JP2006108704A (ja) | 1995-09-18 | 2005-11-24 | 誘電層を備えた超小型電子リード構造体 |
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Country Status (7)
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US (1) | US6329607B1 (ja) |
EP (1) | EP0956745A1 (ja) |
JP (2) | JP3807508B2 (ja) |
KR (1) | KR100407055B1 (ja) |
CN (1) | CN1103179C (ja) |
AU (1) | AU7161596A (ja) |
WO (1) | WO1997011588A1 (ja) |
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-
1996
- 1996-09-18 EP EP96933048A patent/EP0956745A1/en not_active Withdrawn
- 1996-09-18 US US08/715,571 patent/US6329607B1/en not_active Expired - Lifetime
- 1996-09-18 CN CN96197033A patent/CN1103179C/zh not_active Expired - Fee Related
- 1996-09-18 WO PCT/US1996/014965 patent/WO1997011588A1/en active Search and Examination
- 1996-09-18 KR KR10-1998-0701999A patent/KR100407055B1/ko not_active IP Right Cessation
- 1996-09-18 JP JP51286397A patent/JP3807508B2/ja not_active Expired - Fee Related
- 1996-09-18 AU AU71615/96A patent/AU7161596A/en not_active Abandoned
-
2005
- 2005-11-24 JP JP2005338610A patent/JP2006108704A/ja not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
KR100407055B1 (ko) | 2004-03-31 |
CN1103179C (zh) | 2003-03-12 |
WO1997011588A1 (en) | 1997-03-27 |
EP0956745A4 (ja) | 1999-11-17 |
KR19990045755A (ko) | 1999-06-25 |
JP2006108704A (ja) | 2006-04-20 |
CN1196869A (zh) | 1998-10-21 |
JP3807508B2 (ja) | 2006-08-09 |
US6329607B1 (en) | 2001-12-11 |
EP0956745A1 (en) | 1999-11-17 |
AU7161596A (en) | 1997-04-09 |
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