CN110300780A - 树脂组合物、树脂组合物的制备方法和结构体 - Google Patents

树脂组合物、树脂组合物的制备方法和结构体 Download PDF

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Publication number
CN110300780A
CN110300780A CN201880013719.5A CN201880013719A CN110300780A CN 110300780 A CN110300780 A CN 110300780A CN 201880013719 A CN201880013719 A CN 201880013719A CN 110300780 A CN110300780 A CN 110300780A
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mentioned
insulating properties
filler
conducting
particle
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Chinese (zh)
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田中雄介
佐藤伸一
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Dexerials Corp
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Dexerials Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/02—Ingredients treated with inorganic substances
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/12—Compositions of unspecified macromolecular compounds characterised by physical features, e.g. anisotropy, viscosity or electrical conductivity
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/001—Conductive additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Non-Insulated Conductors (AREA)
CN201880013719.5A 2017-03-06 2018-02-27 树脂组合物、树脂组合物的制备方法和结构体 Pending CN110300780A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017-042220 2017-03-06
JP2017042220 2017-03-06
PCT/JP2018/007377 WO2018163921A1 (ja) 2017-03-06 2018-02-27 樹脂組成物、樹脂組成物の製造方法、及び構造体

Publications (1)

Publication Number Publication Date
CN110300780A true CN110300780A (zh) 2019-10-01

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Country Link
JP (2) JP2018145418A (ja)
KR (2) KR102309135B1 (ja)
CN (1) CN110300780A (ja)
TW (1) TWI829633B (ja)
WO (1) WO2018163921A1 (ja)

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JP2020139020A (ja) * 2019-02-27 2020-09-03 ナミックス株式会社 導電性接着剤
CN113728402B (zh) 2019-05-01 2024-01-09 迪睿合株式会社 连接结构体、连接结构体的制造方法、连接材料和被覆导电颗粒
JP7417396B2 (ja) * 2019-10-01 2024-01-18 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
CN113046004A (zh) * 2021-03-23 2021-06-29 业成科技（成都）有限公司 异方性导电胶及贴合方法
CN117941095A (zh) 2021-09-10 2024-04-26 株式会社Lg新能源 正极活性材料、包含其的正极和锂二次电池
EP4382487A1 (en) 2021-09-10 2024-06-12 Lg Energy Solution, Ltd. Positive electrode active material, method for preparing same, positive electrode including same, and lithium secondary battery
JP2023146209A (ja) * 2022-03-29 2023-10-12 デクセリアルズ株式会社 接続構造体及びその製造方法

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CN102474023A (zh) * 2009-07-01 2012-05-23 日立化成工业株式会社 包覆导电粒子及其制造方法
CN102959641A (zh) * 2010-07-02 2013-03-06 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、各向异性导电材料及连接结构体
CN103328595A (zh) * 2011-01-27 2013-09-25 日立化成株式会社 导电性粘接剂组合物、带导电性粘接剂的金属导线、连接体及太阳能电池模块
CN103426499A (zh) * 2012-05-16 2013-12-04 日立化成株式会社 导电粒子、各向异性导电粘接剂膜和连接结构体
CN103548207A (zh) * 2011-05-18 2014-01-29 日立化成株式会社 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN103597667A (zh) * 2011-06-06 2014-02-19 日立化成株式会社 膜状电路连接材料和电路连接结构体
CN103594146A (zh) * 2008-02-05 2014-02-19 日立化成工业株式会社 导电粒子及导电粒子的制造方法
CN104520398A (zh) * 2012-09-24 2015-04-15 迪睿合电子材料有限公司 各向异性导电粘合剂及连接结构体

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CN101484950A (zh) * 2006-07-03 2009-07-15 日立化成工业株式会社 导电粒子、粘接剂组合物、电路连接材料和连接结构，以及电路部件的连接方法
CN103594146A (zh) * 2008-02-05 2014-02-19 日立化成工业株式会社 导电粒子及导电粒子的制造方法
CN102474023A (zh) * 2009-07-01 2012-05-23 日立化成工业株式会社 包覆导电粒子及其制造方法
CN102959641A (zh) * 2010-07-02 2013-03-06 积水化学工业株式会社 带有绝缘性粒子的导电性粒子、各向异性导电材料及连接结构体
CN103328595A (zh) * 2011-01-27 2013-09-25 日立化成株式会社 导电性粘接剂组合物、带导电性粘接剂的金属导线、连接体及太阳能电池模块
CN103548207A (zh) * 2011-05-18 2014-01-29 日立化成株式会社 电路连接材料、电路部件的连接结构以及电路部件的连接结构的制造方法
CN103597667A (zh) * 2011-06-06 2014-02-19 日立化成株式会社 膜状电路连接材料和电路连接结构体
CN103426499A (zh) * 2012-05-16 2013-12-04 日立化成株式会社 导电粒子、各向异性导电粘接剂膜和连接结构体
CN104520398A (zh) * 2012-09-24 2015-04-15 迪睿合电子材料有限公司 各向异性导电粘合剂及连接结构体

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TWI829633B (zh) 2024-01-21
WO2018163921A1 (ja) 2018-09-13
TW201840418A (zh) 2018-11-16
JP2018145418A (ja) 2018-09-20
JP2023038214A (ja) 2023-03-16
KR102309135B1 (ko) 2021-10-07
KR20210121308A (ko) 2021-10-07
KR20190104625A (ko) 2019-09-10

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