CN101836515B - 各向异性导电粘接剂 - Google Patents

各向异性导电粘接剂 Download PDF

Info

Publication number
CN101836515B
CN101836515B CN2008801134881A CN200880113488A CN101836515B CN 101836515 B CN101836515 B CN 101836515B CN 2008801134881 A CN2008801134881 A CN 2008801134881A CN 200880113488 A CN200880113488 A CN 200880113488A CN 101836515 B CN101836515 B CN 101836515B
Authority
CN
China
Prior art keywords
adhesive
pressure
electronic unit
anisotropically
conducting adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008801134881A
Other languages
English (en)
Other versions
CN101836515A (zh
Inventor
熊仓博之
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dexerials Corp
Original Assignee
Sony Chemical and Information Device Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemical and Information Device Corp filed Critical Sony Chemical and Information Device Corp
Publication of CN101836515A publication Critical patent/CN101836515A/zh
Application granted granted Critical
Publication of CN101836515B publication Critical patent/CN101836515B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/5046—Amines heterocyclic
    • C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
    • C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/016—Additives defined by their aspect ratio
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/08—Metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/06—Elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/29338—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/29355—Nickel [Ni] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01009—Fluorine [F]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01023—Vanadium [V]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/0665—Epoxy resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

各向异性导电粘接剂用于在无压力或低压力的情况下将电子部件各向异性导电连接至布线板，其中，导电粒子分散于粘合剂树脂组合物。作为该导电粒子，使用长径为10～40μm、厚度为0.5～2μm、长宽比为5～50的金属片状粉。而且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。将该各向异性导电粘接剂供给布线板的连接端子，使电子部件的连接端子临时连接到隔着各向异性导电粘接剂的基板的连接端子，在对电子部件不施加压力或者施加低压力的情况下进行加热，从而能够将基板和电子部件进行各向异性导电连接。

Description

各向异性导电粘接剂
技术领域
本发明涉及用于以无压力或低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂以及利用该各向异性导电粘接剂的各向异性导电粘接方法。
背景技术
使球状的导电粒子分散于由环氧树脂和固化剂构成的粘合剂(binder)树脂组合物的各向异性导电粘接剂，在刚性(rigid)基板等的布线板连接柔性印刷电路膜或IC芯片等的电子部件时被广泛使用(例如，专利文献1)。这时，使各向异性导电粘接剂介于布线板和电子部件之间，用热接合器(heat bonder)来将电子部件加热至粘合剂树脂的固化温度(例如，150℃)以上，同时施加1MPa以上的压力，以确保良好的连接可靠度。其原因是为了确保一定程度的宽度的接触面积，有必要使球状的导电粒子深入于布线板或电子部件的连接端子区域，为此需要较大的加压。
专利文献1：日本特公平5-47922号公报
发明内容
但是，在对刚性基板等的布线板各向异性导电连接柔性印刷电路膜等时，结果上也对布线板施加压力，因此有时布线板会受到损伤。特别是，为了实现高密度安装，在布线板的背面也安装了电子部件的情况下，不仅有损伤布线板的情况，而还有损伤背面的电子部件或连接它们的布线的情况。
本发明的目的是解决以上传统技术的课题，提供能够以无压力或施加低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂。
本发明人发现能够通过使用具有特定尺寸、厚度、而且长度方向的直径/厚度的比(aspect ratio)的金属片状粉(metal flake powder)作为用于各向异性导电粘接剂的导电粒子，达成上述目的，并完成本发明。
即，本发明提供一种各向异性导电粘接剂，用于将电子部件以无压力或低压力的情况下各向异性导电连接至布线板，其特征在于：在导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂中，该导电粒子是长度方向的直径为10～40μm、厚度为0.5～2μm、长度方向的直径/厚度的比为5～50的金属片状粉，且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。
此外，本发明提供一种各向异性导电连接方法，对布线板的连接端子供给上述各向异性导电粘接剂，使电子部件的连接端子隔着各向异性导电粘接剂而临时连接至基板的连接端子，对于电子部件不施加压力或者施加低压力的情况下进行加热，从而将基板和电子部件进行连接。
发明效果
在本发明的各向异性导电粘接剂中，作为导电粒子使用具有特定尺寸、厚度、长度方向的直径/厚度的比的金属片状粉。导电粒子采用这样的形状/尺寸的金属片状粉，这样即使金属片状粉没有深入布线板或电子部件的各连接端子，也可以在连接端子与导电粒子之间达成面接触。因而，使布线板的连接端子和电子部件的连接端子隔着各向异性导电粘接剂并进行定位，在较低的压力下进行临时连接，然后在无压力(即，不施加压力)或者施加比以往较低的压力的条件下进行加热，可实现显示良好的连接可靠度的各向异性导电连接。
具体实施方式
本发明中，用于以无压力或低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂，是导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂。本发明的特征在于，作为导电粒子，使用长度方向的直径为10～40μm、厚度为0.5～2μm、长度方向的直径/厚度的比为5～50的金属片状粉。
作为金属片状粉，能够使用镍、银等金属的片状粉，但从低成本和良好的导电性方面考虑，能够优选使用其中的镍片状粉。
本发明中所使用的金属片状粉，其长度方向的直径为10～40μm，优选为10～30μm，厚度为0.5～2μm，优选为0.5～1.5μm。关于长度方向的直径，如果小于10μm就有连接后的导通电阻升高的倾向，若超过40μm，则有绝缘电阻降低的倾向，故选择上述范围。此外，关于厚度，如果小于0.5μm就有绝缘电阻降低的倾向，若超过2μm，则有连接后的导通电阻升高的倾向，故选择上述范围。金属片状粉的长度方向的直径、厚度是用电子显微镜等观察外观来测定的数值。再者，金属的片状粉的短径通常为长度方向的直径的10～50％程度的长度。
而且，在本发明中所使用的金属片状粉使用长度方向的直径/厚度的比(即，长度方向的直径除以厚度的数值)为5～50、优选为5～42的金属片状粉。关于长度方向的直径/厚度的比，如果小于5就有连接后的导通电阻升高的倾向，若超过50则有绝缘电阻降低的倾向，故选择上述范围。
在本发明中，导电粒子在各向异性导电粘接剂中的含有量为5～35质量％，优选为7～30质量％。如果其含有量小于5质量％，连接可靠度就会不充分，若超过35质量％，则有可能失去导电连接的各向异性或者有连接强度的低下的情况，故选择上述范围。
作为构成本发明的各向异性导电粘接剂的粘合剂树脂组合物，能够从传统各向异性导电粘接剂中所采用的热固化性的粘合剂树脂组合物之中适当选择并加以使用。能够列举出例如对热固化型环氧树脂、热固化型尿素树脂、热固化型三聚氰氨树脂、热固化型酚醛树脂等混合了咪唑类固化剂、胺类固化剂等固化剂的粘合剂树脂组合物。从固化后的粘接强度良好的方面考虑，能够优选使用其中的作为粘合剂树脂使用了热固化型环氧树脂的粘合剂树脂组合物。
这种热固化型环氧树脂，可为液状也可为固体状，优选为环氧当量通常为100～4000程度，且分子中具有2以上的环氧基的环氧树脂。能够优选使用例如双酚A型环氧化合物、酚醛清漆(phenol novolac)型环氧化合物、甲酚清漆(cresol novolac)型环氧化合物、酯型环氧化合物、指环型环氧化合物等。此外，在这些化合物中含有单体或齐聚物。
本发明的粘合剂树脂组合物，根据需要也能够含有硅石、云母等的填充剂、颜料、防带电剂等。也能混合着色料、防腐剂、聚异氰酸酯类交联剂、硅烷耦合剂等。
此外，也能够混合公知的球状导电粒子。如果混合金属片状粉而且混合球状导电粒子，就可得到能够更加稳定导通电阻值的效果或者减少金属片状粉的使用量而能够抑制各向异性导电粘接剂的制造成本的效果。作为这种球状导电粒子的尺寸，优选平均粒径为1～10μm的导电粒子且最好小于导电粒子的长度方向的直径。此外，球状导电粒子的混合量优选为金属片状粉的混合量(质量份)的0.1～1倍。
本发明的各向异性导电粘接剂的粘度如果过低就会临时压接，因此在主固化工序中会流动并且容易引起连接不良。即使过高也在涂敷时容易发生不良，因此用锥板(cone plate)型粘度计测定的25℃的粘度优选为50～200Pa·s，更优选为50～150Pa·s。
本发明的各向异性导电粘接剂能够通过将导电粒子即金属片状粉按照常用方法均匀分散到热固化性的粘合剂树脂组合物来制造。
本发明的各向异性导电粘接剂如以下说明的那样，最好在各向异性导电连接布线板和电子部件时使用。
首先，对布线板的连接端子供给该各向异性导电粘接剂。在此，作为布线板，能够举出形成有透明电极的玻璃布线基板、玻璃环氧布线基板、聚酰亚胺印刷电路膜基板等。作为连接端子，能够使用适合各基板的端子。
此外，作为各向异性导电粘接剂的供给方法，一般采用从注射器(syringe)供给的方法，但并不局限于此。也可以形成各向异性导电粘接剂的膜，作为各向异性导电膜加以供给。所供给的各向异性导电粘接剂的厚度通常为30～50μm。
接着，使电子部件的连接端子隔着各向异性导电粘接剂而与布线板的连接端子临时连接。具体而言，使电子部件的连接端子隔着各向异性导电粘接剂并定位于布线板的连接端子。然后，对电子部件施加优选为0.1～1MPa的压力而进行临时连接。这时，也可以将粘合剂树脂组合物加热至不致完全固化的程度。在此，作为电子部件能够举出IC芯片、柔性印刷电路膜等。
接着，对于电子部件，不施加压力或者施加低压力(即，1MPa以下)并进行加热，使粘合剂树脂组合物几乎完全或完全固化。从而，可以进行稳定且显示良好的连接可靠度的各向异性导电连接。
本发明的各向异性导电粘接剂不仅能够作为上述各向异性导电连接用途而使用，而且也适合作为不需要各向异性的导电连接用途而使用。可以举出例如电阻或电容器、压电元件等的电子部件的连接。
实施例
以下，借助实施例，对本发明进行具体说明。
实施例1～7、比较例1～9
用搅拌器均匀地混合表1的成分，从而调制出各向异性导电粘接剂。用流变仪(rheometer)(HAAKE(ハ一ケ)公司制造的锥板型粘度计)，在温度25℃、剪切速率(shear rate)10(1/s)的情况下测定了所得到的各向异性导电粘接剂的粘度。将所得到的结果示于表1。此外，关于所使用的镍薄片(Ni flake)及球状镍粒子的尺寸，将利用电子显微镜直接观察到的结果示出表1。
(各向异性导电连接评价)
此外，从注射器向刚性印刷布线基板(玻璃环氧基体材料1.1mm厚/Cu布线35μm厚/表面金镀层：2mm间距(pitch)，L/S＝1/1)的连接端子部涂敷所得到的各向异性导电粘接剂，以使厚度成为35μm。从该各向异性导电粘接剂的上方，对于刚性印刷布线基板的连接端子，定位柔性布线电路膜(聚酰亚胺膜基体材料22μm厚/Cu布线18μm厚/表面金镀层：2mm间距，L/S＝1/1)的连接端子，在常温下施加0.5MPa的压力而进行临时连接。
将临时连接后的物体放入120℃的烤箱(oven)中，对连接部不施加压力而加热10分钟，通过使粘合剂树脂组合物固化，进行各向异性导电连接，对于所得到的连接构造体，如以下说明的那样，对导通电阻值、绝缘电阻值、剥离(peel)强度进行了试验评价。
<导通电阻值>
对于各向异性导电连接而获得的连接构造体，利用数字式万用表(digital multimeter)(ADVANTEST公司)并借助4端子法来测定了导通电阻值(最大Max.)、最小(Min.)、平均(Ave.))。将所得到的结果示于表1。实用上，最好最大值为10Ω以下、最小值为0.5Ω以下、平均为1～5Ω。
<绝缘电阻值>
在施加20V的条件下测定了经各向异性导电连接而获得的连接构造体的邻接端子间的绝缘电阻。将绝缘电阻值在108Ω以上的评价为A，将107Ω～108Ω的评价为B，将小于107Ω的评价为C。实用上，评价最好为A或B。
<剥离强度>
将各向异性导电连接而获得的连接构造体的刚性印刷布线基板固定，将柔性布线电路膜在90度方向上以50mm/分钟的速度进行剥离，用拉伸试验机测定了此时的剥离强度。将所得到的结果示于表1。实用上，最好为5N/cm以上。
表1
表1注：
*1 BPA型环氧树脂，日本环氧树脂(Japan Epoxy Resins)公司
*2 酚醛清漆型环氧树脂，日本环氧树脂公司
*3 母料(master batch)型潜在性(latent)固化树脂(固化剂成分/BPA型环氧树脂＝35/65)，旭化成化学公司(Asahi KaseiChemicals Corporation)
*4 环氧硅烷耦合剂，信越化学工业公司
*5 长度方向的直径5μm、厚2.2μm，长度方向的直径/厚度的比2.3
*6 长度方向的直径10μm、厚1.5μm，长度方向的直径/厚度的比6.7
*7 长度方向的直径20μm、厚1μm，长度方向的直径/厚度的比20
*8 长度方向的直径30μm、厚0.7μm，长度方向的直径/厚度的比42.9
*9 长度方向的直径50μm、厚0.4μm，长度方向的直径/厚度的比125
*10 粒径10μm
由表1可知，使用具有特定尺寸和长度方向的直径/厚度的比的金属片状粉作为导电粒子的本发明的各向异性导电粘接剂，显示出关于导通电阻值、绝缘电阻值及剥离强度方面实用上没有问题的特性。另一方面，在比较例1的各向异性导电粘接剂中，镍薄片的含有量小于5质量％，因此导通电阻值(最大)过高而不适合实用。在比较例2～6的各向异性导电粘接剂中，镍薄片的含有量超过35质量％，因此邻接端子间无法确保绝缘电阻而不适合实用。在比较例7的各向异性导电粘接剂中，所使用的金属薄片的长度方向的直径/厚度的比小于5，因此导通电阻值(最大)过高而不适合实用。此外，在比较例8的各向异性导电粘接剂中，所使用的金属薄片的长度方向的直径/厚度的比超过50，因此邻接端子间无法确保绝缘电阻而不适合实用。再者比较例9的各向异性导电粘接剂中，使用球状导电粒子而不使用金属薄片，因此导通电阻值(最大)较高且无法供实用。
实施例8、比较例10
使用实施例4或比较例9的各向异性导电粘接剂，在临时连接后进行各向异性导电连接时，用恒热接合器(constant heat bonder)(2mm宽)在180℃、10秒间按照以下表2所示的连接压力来将柔性印刷电路膜进行各向异性导电连接。与实施例1同样地，对于所得到的连接构造体进行导通电阻值及绝缘电阻的试验评价。将得到的结果示于表2。
表2
Figure GSB00000662302000091
由表2可知，本发明的各向异性导电粘接剂在对连接部不施加压力的情况下，或者在1MPa以下，尤其是0.5MPa以下的低压条件下，也能确保良好的连接可靠度。与之相对，在使用球状导电粒子的比较例10的情况下，导通电阻值比实施例8时高，在低压条件难以确保良好的连接可靠度。
产业上的利用可能性
在本发明的各向异性导电粘接剂中，作为导电粒子使用具有特定尺寸、厚度、长度方向的直径/厚度的比的金属片状粉。因而，隔着该各向异性导电粘接剂使布线板的连接端子和电子部件的连接端子定位，并在较低的压力下进行临时连接，然后在不施加压力或者施加比以往较低的压力的条件下进行加热，可以进行显示良好的连接可靠度的各向异性导电连接。因而，本发明的各向异性导电粘接剂对于连接部在无压力或施加低压的条件下的各向异性导电连接而言是有用的。

Claims (8)

1.一种各向异性导电粘接剂，用于将电子部件在无压力或低压力的情况下各向异性导电连接至布线板，其特征在于：
在导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂中，该导电粒子是长度方向的直径为10～40μm、厚度为0.5～2μm、长度方向的直径/厚度的比为5～50的金属片状粉，且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。
2.如权利要求1所述的各向异性导电粘接剂，其中金属片状粉为镍片状粉。
3.如权利要求1或2所述的各向异性导电粘接剂，其中该粘合剂树脂组合物含有环氧树脂和咪唑类固化剂。
4.如权利要求1或2所述的各向异性导电粘接剂，其中在25℃中的粘度为50～200Pa·s。
5.一种各向异性导电连接方法，对布线板的连接端子供给权利要求1所述的各向异性导电粘接剂，使电子部件的连接端子隔着各向异性导电粘接剂而临时连接到基板的连接端子，对于电子部件不施加压力或者施加低压力的情况下进行加热，从而将基板和电子部件进行连接。
6.如权利要求5所述的各向异性导电连接方法，其中在加热时对电子部件施加1MPa以下的低压力。
7.如权利要求5或6所述的各向异性导电连接方法，其中在临时连接时对电子部件施加0.1～1MPa的压力。
8.如权利要求5所述的各向异性导电连接方法，其中在加热时对电子部件不施加压力。
CN2008801134881A 2007-10-22 2008-09-05 各向异性导电粘接剂 Expired - Fee Related CN101836515B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-273612 2007-10-22
JP2007273612A JP4998732B2 (ja) 2007-10-22 2007-10-22 異方性導電接着剤
PCT/JP2008/066066 WO2009054194A1 (ja) 2007-10-22 2008-09-05 異方性導電接着剤

Publications (2)

Publication Number Publication Date
CN101836515A CN101836515A (zh) 2010-09-15
CN101836515B true CN101836515B (zh) 2012-08-29

Family

ID=40579301

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008801134881A Expired - Fee Related CN101836515B (zh) 2007-10-22 2008-09-05 各向异性导电粘接剂

Country Status (6)

Country Link
US (3) US8092636B2 (zh)
JP (1) JP4998732B2 (zh)
KR (1) KR101530401B1 (zh)
CN (1) CN101836515B (zh)
TW (1) TWI421323B (zh)
WO (1) WO2009054194A1 (zh)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011043265A1 (ja) * 2009-10-05 2011-04-14 株式会社村田製作所 扁平形状のＮｉ粒子、それを用いた積層セラミック電子部品、および扁平形状のＮｉ粒子の製造方法
US8674509B2 (en) * 2012-05-31 2014-03-18 Freescale Semiconductor, Inc. Integrated circuit die assembly with heat spreader
CN103709944A (zh) * 2013-12-20 2014-04-09 北京郁懋科技有限责任公司 一种导电的热固化环氧树脂体系的应用
CN106463200B (zh) * 2014-09-18 2019-05-31 积水化学工业株式会社 导电糊剂、连接结构体及连接结构体的制造方法
WO2018143501A1 (ko) * 2017-02-06 2018-08-09 이경섭 미세피치용 이방성 도전 접착제 제조방법 및 이 방법에 의해 제조된 미세피치용 이방성 도전 접착제
US11168235B2 (en) * 2017-05-09 2021-11-09 3M Innovative Properties Company Electrically conductive adhesive
WO2019074060A1 (ja) * 2017-10-12 2019-04-18 富士フイルム株式会社 複合材
EP3578606A1 (en) * 2018-06-06 2019-12-11 Jotun A/S Particulate coating composition
JP6798646B2 (ja) * 2018-06-12 2020-12-09 Dic株式会社 導電性粘着シート

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001164207A (ja) * 1999-12-07 2001-06-19 Bridgestone Corp 異方性導電フィルム
JP2001261974A (ja) * 2000-03-13 2001-09-26 Hitachi Chem Co Ltd ペースト組成物
CN1427035A (zh) * 2001-11-30 2003-07-02 三井化学株式会社 电路连接用糊剂、各向异性导电糊剂以及它们的应用
JP2006104273A (ja) * 2004-10-04 2006-04-20 Toppan Printing Co Ltd 導電性接着剤及び導電性フィルム及び、これを用いたプリント配線版
JP2006210621A (ja) * 2005-01-27 2006-08-10 Sumitomo Bakelite Co Ltd 半導体製品搭載回路基板、チップ部品搭載回路基板及びＳｉＰ

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60117504A (ja) 1983-11-28 1985-06-25 日立化成工業株式会社 高電流回路接続用導電異方性接着シ−ト
JPH04323290A (ja) * 1991-02-25 1992-11-12 Fuji Kobunshi Kogyo Kk 異方導電性接着剤組成物
US5672297A (en) 1995-10-27 1997-09-30 The Dow Chemical Company Conductive composite articles based on expandable and contractible particulate matrices
JPH10130600A (ja) * 1996-11-01 1998-05-19 Sumitomo Metal Mining Co Ltd 導電性接着剤
JPH10330718A (ja) * 1997-05-30 1998-12-15 Sumitomo Metal Mining Co Ltd 導電性接着剤
JP3851767B2 (ja) * 2000-10-16 2006-11-29 ソニーケミカル＆インフォメーションデバイス株式会社 接着フィルム、及び接着フィルムの製造方法
JP3665579B2 (ja) * 2001-02-26 2005-06-29 ソニーケミカル株式会社 電気装置製造方法
JP4928021B2 (ja) * 2001-03-13 2012-05-09 ナミックス株式会社 導電性接着剤およびそれを用いた回路
JP3842981B2 (ja) * 2001-03-16 2006-11-08 守光 若林 基板の製造方法、電子部品の製造方法及び電子部品の実装方法
DE60313200T2 (de) * 2002-07-23 2008-01-03 Otsuka Chemical Co., Ltd. ELEKTROLEITFuHIGE ZUSAMMENSETZUNG IN FLOCKENFORM UND ELEKTROLEITFuHIGE ZUSAMMENSETZUNG
JP4401294B2 (ja) 2002-09-04 2010-01-20 ナミックス株式会社 導電性接着剤およびそれを用いた回路

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001164207A (ja) * 1999-12-07 2001-06-19 Bridgestone Corp 異方性導電フィルム
JP2001261974A (ja) * 2000-03-13 2001-09-26 Hitachi Chem Co Ltd ペースト組成物
CN1427035A (zh) * 2001-11-30 2003-07-02 三井化学株式会社 电路连接用糊剂、各向异性导电糊剂以及它们的应用
JP2006104273A (ja) * 2004-10-04 2006-04-20 Toppan Printing Co Ltd 導電性接着剤及び導電性フィルム及び、これを用いたプリント配線版
JP2006210621A (ja) * 2005-01-27 2006-08-10 Sumitomo Bakelite Co Ltd 半導体製品搭載回路基板、チップ部品搭載回路基板及びＳｉＰ

Also Published As

Publication number Publication date
USRE45092E1 (en) 2014-08-26
US8092636B2 (en) 2012-01-10
US8845849B2 (en) 2014-09-30
US20120112136A1 (en) 2012-05-10
US20100200160A1 (en) 2010-08-12
TW200918637A (en) 2009-05-01
KR20100074210A (ko) 2010-07-01
TWI421323B (zh) 2014-01-01
WO2009054194A1 (ja) 2009-04-30
JP2009105117A (ja) 2009-05-14
CN101836515A (zh) 2010-09-15
KR101530401B1 (ko) 2015-06-19
JP4998732B2 (ja) 2012-08-15

Similar Documents

Publication Publication Date Title
CN101836515B (zh) 各向异性导电粘接剂
JP5151902B2 (ja) 異方導電性フィルム
JP5010990B2 (ja) 接続方法
JP5093482B2 (ja) 異方性導電材料、接続構造体及びその製造方法
JP4556936B2 (ja) 電極接続用接着剤
KR102309135B1 (ko) 수지 조성물, 수지 조성물의 제조 방법, 및 구조체
JP2008094908A (ja) 電極接続用接着剤
CN101681692A (zh) 导电性粒子体及使用该粒子体的各向异性导电连接材料、以及导电性粒子体的制造方法
JP2006339160A (ja) 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP2005290241A (ja) フィルム状接着剤
JP5609492B2 (ja) 電子部品及びその製造方法
JP2008308519A (ja) 電極接続用接着剤
JP5273514B2 (ja) 電極接続用接着剤とその製造方法
JP2010010142A (ja) 熱硬化性回路接続部材及びそれを用いた電極の接続構造、電極の接続方法
JP4631893B2 (ja) 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
KR20110076173A (ko) 접착 신뢰성이 우수한 이방성 도전 필름 및 그 제조방법
JP4631889B2 (ja) 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2008022037A (ja) 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP6398416B2 (ja) 接続構造体の製造方法及び接続構造体
JP2008031483A (ja) 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP2008084545A (ja) 電極接続用接着剤
JP2013151706A (ja) 電極接続用接着剤
KR20080062462A (ko) 이방성 도전 필름의 제조방법

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20120829

Termination date: 20170905