JP4998732B2 - 異方性導電接着剤 - Google Patents
異方性導電接着剤 Download PDFInfo
- Publication number
- JP4998732B2 JP4998732B2 JP2007273612A JP2007273612A JP4998732B2 JP 4998732 B2 JP4998732 B2 JP 4998732B2 JP 2007273612 A JP2007273612 A JP 2007273612A JP 2007273612 A JP2007273612 A JP 2007273612A JP 4998732 B2 JP4998732 B2 JP 4998732B2
- Authority
- JP
- Japan
- Prior art keywords
- anisotropic conductive
- conductive adhesive
- connection
- electronic component
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000853 adhesive Substances 0.000 title claims description 55
- 230000001070 adhesive effect Effects 0.000 title claims description 55
- 239000002245 particle Substances 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 23
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000000843 powder Substances 0.000 claims description 22
- 239000011230 binding agent Substances 0.000 claims description 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 14
- 239000011342 resin composition Substances 0.000 claims description 14
- 238000000034 method Methods 0.000 claims description 8
- 229910052759 nickel Inorganic materials 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 2
- 238000009413 insulation Methods 0.000 description 11
- 230000000052 comparative effect Effects 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 8
- 229920001187 thermosetting polymer Polymers 0.000 description 8
- 150000001875 compounds Chemical class 0.000 description 6
- 239000011521 glass Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000003755 preservative agent Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Classifications
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
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- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
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Description
表1の成分をミキサーにて均一に混合することにより、異方性導電接着剤を調製した。得られた異方性導電接着剤の粘度を、レオメータ(ハーケ社製コーンプレート型粘度計)を用い、温度25℃、シアレート10(1/s)で測定した。得られた結果を表1に示す。また、使用したニッケルフレーク及び球状ニッケル粒子の大きさについては、電子顕微鏡にて直接観察した結果を表1に示す。
また、得られた異方性導電接着剤を、リジッド印刷配線基板(ガラスエポキシ基材1.1mm厚/Cu配線35μm厚/表面金メッキ:2mmピッチ、L/S=1/1)の接続端子部に、シリンジから35μm厚となるように塗布した。その異方性導電接着剤の上から、リジッド印刷配線基板の接続端子に対し、フレキシブル配線回路フィルム(ポリイミドフィルム基材22μm厚/Cu配線18μm厚/表面金メッキ:2mmピッチ、L/S=1/1)の接続端子を位置合わせし、常温で0.5MPaの圧力を印加して仮接続した。
異方性導電接続して得られた接続構造体について、デジタルマルチメーター(アドバンテスト社)を使用して4端子法により導通抵抗値(最大(Max.)、最小(Min.)、平均(Ave.))を測定した。得られた結果を表1に示す。実用上、最大値は10Ω以下、最小値は0.5Ω以下、平均は1〜5Ωであることが望まれる。
異方性導電接続して得られた接続構造体の隣接端子間の絶縁抵抗を、20V印加条件下で測定した。絶縁抵抗値が108Ω以上をAと評価し、107〜108ΩをBと評価し、107Ω未満をCと評価した。実用上、評価がA又はBであることが望まれる。
異方性導電接続して得られた接続構造体のリジッド印刷配線基板を固定し、フレキシブル配線回路フィルムを90度方向に、50mm/分の速度で引き剥がし、その際のピール強度を引張試験機を用いて測定した。得られた結果を表1に示す。実用上、5N/cm以上であることが望まれる。
実施例4又は比較例9の異方性導電接着剤を用い、仮接続後の異方性導電接続の際に、フレキブル印刷回路フィルムをコンスタントヒートボンダー(2mm幅)にて180℃で10秒間、以下の表2に示す接続圧力で異方性導電接続した。得られた接続構造体について、実施例1と同様に、導通抵抗値及び絶縁抗について試験評価した。得られた結果を表2に示す。
Claims (6)
- 配線板に電子部品を無圧力乃至低圧力で異方性導電接続するための異方性導電接着剤であって、導電粒子がバインダー樹脂組成物に分散されてなる異方性導電接着剤において、
該導電粒子が、10〜30μmの長径、長径の10〜50%の短径、0.5〜1.5μmの厚み、5〜42のアスペクト比を有する金属フレーク粉であり、導電粒子の異方性導電接着剤中の含有量が、7〜30質量%であり、
異方性導電接着剤の25℃における粘度が、50〜150Pa・sであることを特徴とする異方性導電接着剤。 - 金属フレーク粉が、ニッケルフレーク粉である請求項1記載の異方性導電接着剤。
- 該バインダー樹脂組成物が、エポキシ樹脂とイミダゾール系硬化剤とを含有する請求項1又は2記載の異方性導電接着剤。
- 配線板の接続端子に請求項1記載の異方性導電接着剤を供給し、電子部品の接続端子を、異方性導電接着剤を介在させつつ基板の接続端子に仮接続し、電子部品に対し圧力を印加することなく若しくは低圧力を印加しながら加熱することにより基板と電子部品とを接続する異方性導電接続方法。
- 加熱の際に電子部品に、1MPa以下の低圧力を印加する請求項4記載の異方性導電接続方法。
- 仮接続の際に電子部品に、0.1〜1MPaの圧力を印加する請求項4又は5記載の異方性導電接続方法。
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JP2007273612A JP4998732B2 (ja) | 2007-10-22 | 2007-10-22 | 異方性導電接着剤 |
US13/846,051 USRE45092E1 (en) | 2007-10-22 | 2008-09-05 | Anisotropic conductive adhesive |
KR1020107008680A KR101530401B1 (ko) | 2007-10-22 | 2008-09-05 | 이방성 도전 접착제 |
US12/678,424 US8092636B2 (en) | 2007-10-22 | 2008-09-05 | Anisotropic conductive adhesive |
CN2008801134881A CN101836515B (zh) | 2007-10-22 | 2008-09-05 | 各向异性导电粘接剂 |
PCT/JP2008/066066 WO2009054194A1 (ja) | 2007-10-22 | 2008-09-05 | 異方性導電接着剤 |
TW097134811A TWI421323B (zh) | 2007-10-22 | 2008-09-11 | Anisotropic conductive adhesive |
US13/314,847 US8845849B2 (en) | 2007-10-22 | 2011-12-08 | Anisotropic conductive adhesive |
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JP (1) | JP4998732B2 (ja) |
KR (1) | KR101530401B1 (ja) |
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CN102686341A (zh) * | 2009-10-05 | 2012-09-19 | 株式会社村田制作所 | 扁平形状的Ni粒子、使用其的层叠陶瓷电子部件、以及扁平形状的Ni粒子的制造方法 |
US8674509B2 (en) * | 2012-05-31 | 2014-03-18 | Freescale Semiconductor, Inc. | Integrated circuit die assembly with heat spreader |
CN103709944A (zh) * | 2013-12-20 | 2014-04-09 | 北京郁懋科技有限责任公司 | 一种导电的热固化环氧树脂体系的应用 |
JP6577867B2 (ja) * | 2014-09-18 | 2019-09-18 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
JP6899599B2 (ja) * | 2017-02-06 | 2021-07-07 | ノピオン カンパニー リミテッド | 微細ピッチ用の異方性導電接着剤の製造方法及びその方法により製造された微細ピッチ用の異方性導電接着剤 |
US11168235B2 (en) | 2017-05-09 | 2021-11-09 | 3M Innovative Properties Company | Electrically conductive adhesive |
WO2019074060A1 (ja) * | 2017-10-12 | 2019-04-18 | 富士フイルム株式会社 | 複合材 |
EP3578606A1 (en) * | 2018-06-06 | 2019-12-11 | Jotun A/S | Particulate coating composition |
CN112105699B (zh) * | 2018-06-12 | 2023-05-23 | Dic株式会社 | 导电性粘合片 |
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JPS60117504A (ja) | 1983-11-28 | 1985-06-25 | 日立化成工業株式会社 | 高電流回路接続用導電異方性接着シ−ト |
JPH04323290A (ja) * | 1991-02-25 | 1992-11-12 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
US5672297A (en) | 1995-10-27 | 1997-09-30 | The Dow Chemical Company | Conductive composite articles based on expandable and contractible particulate matrices |
JPH10130600A (ja) * | 1996-11-01 | 1998-05-19 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
JPH10330718A (ja) * | 1997-05-30 | 1998-12-15 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
JP4635287B2 (ja) | 1999-12-07 | 2011-02-23 | 株式会社ブリヂストン | 異方性導電フィルム |
JP2001261974A (ja) | 2000-03-13 | 2001-09-26 | Hitachi Chem Co Ltd | ペースト組成物 |
JP3851767B2 (ja) | 2000-10-16 | 2006-11-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着フィルム、及び接着フィルムの製造方法 |
JP3665579B2 (ja) * | 2001-02-26 | 2005-06-29 | ソニーケミカル株式会社 | 電気装置製造方法 |
JP4928021B2 (ja) * | 2001-03-13 | 2012-05-09 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
JP3842981B2 (ja) * | 2001-03-16 | 2006-11-08 | 守光 若林 | 基板の製造方法、電子部品の製造方法及び電子部品の実装方法 |
KR100527990B1 (ko) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | 회로 접속용 페이스트, 이방성 도전 페이스트 및 이들의사용방법 |
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ATE547494T1 (de) | 2002-09-04 | 2012-03-15 | Namics Corp | Leitfähiger klebstoff und ihn enthaltender schaltkreis |
JP2006104273A (ja) * | 2004-10-04 | 2006-04-20 | Toppan Printing Co Ltd | 導電性接着剤及び導電性フィルム及び、これを用いたプリント配線版 |
JP2006210621A (ja) | 2005-01-27 | 2006-08-10 | Sumitomo Bakelite Co Ltd | 半導体製品搭載回路基板、チップ部品搭載回路基板及びSiP |
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TWI421323B (zh) | 2014-01-01 |
KR20100074210A (ko) | 2010-07-01 |
US20120112136A1 (en) | 2012-05-10 |
US8845849B2 (en) | 2014-09-30 |
KR101530401B1 (ko) | 2015-06-19 |
JP2009105117A (ja) | 2009-05-14 |
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US20100200160A1 (en) | 2010-08-12 |
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