CN101836515A - 各向异性导电粘接剂 - Google Patents

各向异性导电粘接剂 Download PDF

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CN101836515A
CN101836515A CN200880113488A CN200880113488A CN101836515A CN 101836515 A CN101836515 A CN 101836515A CN 200880113488 A CN200880113488 A CN 200880113488A CN 200880113488 A CN200880113488 A CN 200880113488A CN 101836515 A CN101836515 A CN 101836515A
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adhesive
pressure
anisotropically
electronic unit
conducting adhesive
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CN101836515B (zh
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熊仓博之
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Dexerials Corp
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Sony Chemical and Information Device Corp
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Abstract

各向异性导电粘接剂用于在无压力或低压力的情况下将电子部件各向异性导电连接至布线板，其中，导电粒子分散于粘合剂树脂组合物。作为该导电粒子，使用长径为10～40μm、厚度为0.5～2μm、长宽比为5～50的金属片状粉。而且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。将该各向异性导电粘接剂供给布线板的连接端子，使电子部件的连接端子临时连接到隔着各向异性导电粘接剂的基板的连接端子，在对电子部件不施加压力或者施加低压力的情况下进行加热，从而能够将基板和电子部件进行各向异性导电连接。

Description

各向异性导电粘接剂
技术领域
本发明涉及用于以无压力或低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂以及利用该各向异性导电粘接剂的各向异性导电粘接方法。
背景技术
使球状的导电粒子分散于由环氧树脂和固化剂构成的粘合剂(binder)树脂组合物的各向异性导电粘接剂，在刚性(rigid)基板等的布线板连接柔性印刷电路膜或IC芯片等的电子部件时被广泛使用(例如，专利文献1)。这时，使各向异性导电粘接剂介于布线板和电子部件之间，用热接合器(heat bonder)来将电子部件加热至粘合剂树脂的固化温度(例如，150℃)以上，同时施加1MPa以上的压力，以确保良好的连接可靠度。其原因是为了确保一定程度的宽度的接触面积，有必要使球状的导电粒子深入于布线板或电子部件的连接端子区域，为此需要较大的加压。
专利文献1：日本特公平5-47922号公报
发明内容
但是，在对刚性基板等的布线板各向异性导电连接柔性印刷电路膜等时，结果上也对布线板施加压力，因此有时布线板会受到损伤。特别是，为了实现高密度安装，在布线板的背面也安装了电子部件的情况下，不仅有损伤布线板的情况，而还有损伤背面的电子部件或连接它们的布线的情况。
本发明的目的是解决以上传统技术的课题，提供能够以无压力或施加低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂。
本发明人发现能够通过使用具有特定尺寸、厚度、而且长宽比(aspect ratio)的金属片状粉(metal flake powder)作为用于各向异性导电粘接剂的导电粒子，达成上述目的，并完成本发明。
即，本发明提供一种各向异性导电粘接剂，用于将电子部件以无压力或低压力的情况下各向异性导电连接至布线板，其特征在于：在导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂中，该导电粒子是长径为10～40μm、厚度为0.5～2μm、长宽比为5～50的金属片状粉，且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。
此外，本发明提供一种各向异性导电连接方法，对布线板的连接端子供给上述各向异性导电粘接剂，使电子部件的连接端子隔着各向异性导电粘接剂而临时连接至基板的连接端子，对于电子部件不施加压力或者施加低压力的情况下进行加热，从而将基板和电子部件进行连接。
发明效果
在本发明的各向异性导电粘接剂中，作为导电粒子使用具有特定尺寸、厚度、长宽比的金属片状粉。导电粒子采用这样的形状/尺寸的金属片状粉，这样即使金属片状粉没有深入布线板或电子部件的各连接端子，也可以在连接端子与导电粒子之间达成面接触。因而，使布线板的连接端子和电子部件的连接端子隔着各向异性导电粘接剂并进行定位，在较低的压力下进行临时连接，然后在无压力(即，不施加压力)或者施加比以往较低的压力的条件下进行加热，可实现显示良好的连接可靠度的各向异性导电连接。
具体实施方式
本发明中，用于以无压力或低压力来将电子部件各向异性导电连接至布线板的各向异性导电粘接剂，是导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂。本发明的特征在于，作为导电粒子，使用长径为10～40μm、厚度为0.5～2μm、长宽比为5～50的金属片状粉。
作为金属片状粉，能够使用镍、银等金属的片状粉，但从低成本和良好的导电性方面考虑，能够优选使用其中的镍片状粉。
本发明中所使用的金属片状粉，其长径为10～40μm，优选为10～30μm，厚度为0.5～2μm，优选为0.5～1.5μm。关于长径，如果小于10μm就有连接后的导通电阻升高的倾向，若超过40μm，则有绝缘电阻降低的倾向，故选择上述范围。此外，关于厚度，如果小于0.5μm就有绝缘电阻降低的倾向，若超过2μm，则有连接后的导通电阻升高的倾向，故选择上述范围。金属片状粉的长径、厚度是用电子显微镜等观察外观来测定的数值。再者，金属的片状粉的短径通常为长径的10～50％程度的长度。
而且，在本发明中所使用的金属片状粉使用长宽比(即，长径除以厚度的数值)为5～50、优选为5～42的金属片状粉。关于长宽比，如果小于5就有连接后的导通电阻升高的倾向，若超过50则有绝缘电阻降低的倾向，故选择上述范围。
在本发明中，导电粒子在各向异性导电粘接剂中的含有量为5～35质量％，优选为7～30质量％。如果其含有量小于5质量％，连接可靠度就会不充分，若超过35质量％，则有可能失去导电连接的各向异性或者有连接强度的低下的情况，故选择上述范围。
作为构成本发明的各向异性导电粘接剂的粘合剂树脂组合物，能够从传统各向异性导电粘接剂中所采用的热固化性的粘合剂树脂组合物之中适当选择并加以使用。能够列举出例如对热固化型环氧树脂、热固化型尿素树脂、热固化型三聚氰氨树脂、热固化型酚醛树脂等混合了咪唑类固化剂、胺类固化剂等固化剂的粘合剂树脂组合物。从固化后的粘接强度良好的方面考虑，能够优选使用其中的作为粘合剂树脂使用了热固化型环氧树脂的粘合剂树脂组合物。
这种热固化型环氧树脂，可为液状也可为固体状，优选为环氧当量通常为100～4000程度，且分子中具有2以上的环氧基的环氧树脂。能够优选使用例如双酚A型环氧化合物、酚醛清漆(phenol novolac)型环氧化合物、甲酚清漆(cresol novolac)型环氧化合物、酯型环氧化合物、指环型环氧化合物等。此外，在这些化合物中含有单体或齐聚物。
本发明的粘合剂树脂组合物，根据需要也能够含有硅石、云母等的填充剂、颜料、防带电剂等。也能混合着色料、防腐剂、聚异氰酸酯类交联剂、硅烷耦合剂等。
此外，也能够混合公知的球状导电粒子。如果混合金属片状粉而且混合球状导电粒子，就可得到能够更加稳定导通电阻值的效果或者减少金属片状粉的使用量而能够抑制各向异性导电粘接剂的制造成本的效果。作为这种球状导电粒子的尺寸，优选平均粒径为1～10μm的导电粒子且最好小于导电粒子的长径。此外，球状导电粒子的混合量优选为金属片状粉的混合量(质量份)的0.1～1倍。
本发明的各向异性导电粘接剂的粘度如果过低就会临时压接，因此在主固化工序中会流动并且容易引起连接不良。即使过高也在涂敷时容易发生不良，因此用锥板(cone plate)型粘度计测定的25℃的粘度优选为50～200Pa·s，更优选为50～150Pa·s。
本发明的各向异性导电粘接剂能够通过将导电粒子即金属片状粉按照常用方法均匀分散到热固化性的粘合剂树脂组合物来制造。
本发明的各向异性导电粘接剂如以下说明的那样，最好在各向异性导电连接布线板和电子部件时使用。
首先，对布线板的连接端子供给该各向异性导电粘接剂。在此，作为布线板，能够举出形成有透明电极的玻璃布线基板、玻璃环氧布线基板、聚酰亚胺印刷电路膜基板等。作为连接端子，能够使用适合各基板的端子。
此外，作为各向异性导电粘接剂的供给方法，一般采用从注射器(syringe)供给的方法，但并不局限于此。也可以形成各向异性导电粘接剂的膜，作为各向异性导电膜加以供给。所供给的各向异性导电粘接剂的厚度通常为30～50μm。
接着，使电子部件的连接端子隔着各向异性导电粘接剂而与布线板的连接端子临时连接。具体而言，使电子部件的连接端子隔着各向异性导电粘接剂并定位于布线板的连接端子。然后，对电子部件施加优选为0.1～1MPa的压力而进行临时连接。这时，也可以将粘合剂树脂组合物加热至不致完全固化的程度。在此，作为电子部件能够举出IC芯片、柔性印刷电路膜等。
接着，对于电子部件，不施加压力或者施加低压力(即，1MPa以下)并进行加热，使粘合剂树脂组合物几乎完全或完全固化。从而，可以进行稳定且显示良好的连接可靠度的各向异性导电连接。
本发明的各向异性导电粘接剂不仅能够作为上述各向异性导电连接用途而使用，而且也适合作为不需要各向异性的导电连接用途而使用。可以举出例如电阻或电容器、压电元件等的电子部件的连接。
实施例
以下，借助实施例，对本发明进行具体说明。
实施例1～7、比较例1～9
用搅拌器均匀地混合表1的成分，从而调制出各向异性导电粘接剂。用流变仪(rheometer)(HAAKE(ハ一ケ)公司制造的锥板型粘度计)，在温度25℃、剪切速率(shear rate)10(l/s)的情况下测定了所得到的各向异性导电粘接剂的粘度。将所得到的结果示于表1。此外，关于所使用的镍薄片(Ni flake)及球状镍粒子的尺寸，将利用电子显微镜直接观察到的结果示出表1。
(各向异性导电连接评价)
此外，从注射器向刚性印刷布线基板(玻璃环氧基体材料1.1mm厚/Cu布线35μm厚/表面金镀层：2mm间距(pitch)，L/S＝1/1)的连接端子部涂敷所得到的各向异性导电粘接剂，以使厚度成为35μm。从该各向异性导电粘接剂的上方，对于刚性印刷布线基板的连接端子，定位柔性布线电路膜(聚酰亚胺膜基体材料22μm厚/Cu布线18μm厚/表面金镀层：2mm间距，L/S＝1/1)的连接端子，在常温下施加0.5MPa的压力而进行临时连接。
将临时连接后的物体放入120℃的烤箱(oven)中，对连接部不施加压力而加热10分钟，通过使粘合剂树脂组合物固化，进行各向异性导电连接，对于所得到的连接构造体，如以下说明的那样，对导通电阻值、绝缘电阻值、剥离(peel)强度进行了试验评价。
<导通电阻值>
对于各向异性导电连接而获得的连接构造体，利用数字式万用表(digital multimeter)(ADVANTEST公司)并借助4端子法来测定了导通电阻值(最大Max.)、最小(Min.)、平均(Ave.))。将所得到的结果示于表1。实用上，最好最大值为10Ω以下、最小值为0.5Ω以下、平均为1～5Ω。
<绝缘电阻值>
在施加20V的条件下测定了经各向异性导电连接而获得的连接构造体的邻接端子间的绝缘电阻。将绝缘电阻值在108Ω以上的评价为A，将107Ω～108Ω的评价为B，将小于107Ω的评价为C。实用上，评价最好为A或B。
<剥离强度>
将各向异性导电连接而获得的连接构造体的刚性印刷布线基板固定，将柔性布线电路膜在90度方向上以50mm/分钟的速度进行剥离，用拉伸试验机测定了此时的剥离强度。将所得到的结果示于表1。实用上，最好为5N/cm以上。
表1
Figure GPA00001115672700071
表1注：
*1BPA型环氧树脂，日本环氧树脂(Japan Epoxy Resins)公司
*2酚醛清漆型环氧树脂，日本环氧树脂公司
*3母料(master batch)型潜在性(latent)固化树脂(固化剂成分/BPA型环氧树脂＝35/65)，旭化成化学公司(Asahi KaseiChemicals Corporation)
*4环氧硅烷耦合剂，信越化学工业公司
*5长径5μm、厚2.2μm，长宽比2.3
*6长径10μm、厚1.5μm，长宽比6.7
*7长径20μm、厚1μm，长宽比20
*8长径30μm、厚0.7μm，长宽比42.9
*9长径50μm、厚0.4μm，长宽比125
*10粒径10μm
由表1可知，使用具有特定尺寸和长宽比的金属片状粉作为导电粒子的本发明的各向异性导电粘接剂，显示出关于导通电阻值、绝缘电阻值及剥离强度方面实用上没有问题的特性。另一方面，在比较例1的各向异性导电粘接剂中，镍薄片的含有量小于5质量％，因此导通电阻值(最大)过高而不适合实用。在比较例2～6的各向异性导电粘接剂中，镍薄片的含有量超过35质量％，因此邻接端子间无法确保绝缘电阻而不适合实用。在比较例7的各向异性导电粘接剂中，所使用的金属薄片的长宽比小于5，因此导通电阻值(最大)过高而不适合实用。此外，在比较例8的各向异性导电粘接剂中，所使用的金属薄片的长宽比超过50，因此邻接端子间无法确保绝缘电阻而不适合实用。再者比较例9的各向异性导电粘接剂中，使用球状导电粒子而不使用金属薄片，因此导通电阻值(最大)较高且无法供实用。
实施例8、比较例10
使用实施例4或比较例9的各向异性导电粘接剂，在临时连接后进行各向异性导电连接时，用恒热接合器(constant heat bonder)(2mm宽)在180℃、10秒间按照以下表2所示的连接压力来将柔性印刷电路膜进行各向异性导电连接。与实施例1同样地，对于所得到的连接构造体进行导通电阻值及绝缘电阻的试验评价。将得到的结果示于表2。
表2
Figure GPA00001115672700091
由表2可知，本发明的各向异性导电粘接剂在对连接部不施加压力的情况下，或者在1MPa以下，尤其是0.5MPa以下的低压条件下，也能确保良好的连接可靠度。与之相对，在使用球状导电粒子的比较例10的情况下，导通电阻值比实施例8时高，在低压条件难以确保良好的连接可靠度。
产业上的利用可能性
在本发明的各向异性导电粘接剂中，作为导电粒子使用具有特定尺寸、厚度、长宽比的金属片状粉。因而，隔着该各向异性导电粘接剂使布线板的连接端子和电子部件的连接端子定位，并在较低的压力下进行临时连接，然后在不施加压力或者施加比以往较低的压力的条件下进行加热，可以进行显示良好的连接可靠度的各向异性导电连接。因而，本发明的各向异性导电粘接剂对于连接部在无压力或施加低压的条件下的各向异性导电连接而言是有用的。

Claims (7)

1.一种各向异性导电粘接剂，用于将电子部件在无压力或低压力的情况下各向异性导电连接至布线板，其特征在于：
在导电粒子分散于粘合剂树脂组合物而成的各向异性导电粘接剂中，该导电粒子是长径为10～40μm、厚度为0.5～2μm、长宽比为5～50的金属片状粉，且导电粒子在各向异性导电粘接剂中的含有量为5～35质量％。
2.如权利要求1所述的各向异性导电粘接剂，其中金属片状粉为镍片状粉。
3.如权利要求1或2所述的各向异性导电粘接剂，其中该粘合剂树脂组合物含有环氧树脂和咪唑类固化剂。
4.如权利要求1至3中任一项所述的各向异性导电粘接剂，其中在25℃中的粘度为50～200Pa·s。
5.一种各向异性导电连接方法，对布线板的连接端子供给权利要求1所述的各向异性导电粘接剂，使电子部件的连接端子隔着各向异性导电粘接剂而临时连接到基板的连接端子，对于电子部件不施加压力或者施加低压力的情况下进行加热，从而将基板和电子部件进行连接。
6.如权利要求5所述的各向异性导电连接方法，其中在加热时对电子部件施加1MPa以下的低压力。
7.如权利要求5或6所述的各向异性导电连接方法，其中在临时连接时对电子部件施加0.1～1MPa的压力。
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