WO2009054194A1 - 異方性導電接着剤 - Google Patents
異方性導電接着剤 Download PDFInfo
- Publication number
- WO2009054194A1 WO2009054194A1 PCT/JP2008/066066 JP2008066066W WO2009054194A1 WO 2009054194 A1 WO2009054194 A1 WO 2009054194A1 JP 2008066066 W JP2008066066 W JP 2008066066W WO 2009054194 A1 WO2009054194 A1 WO 2009054194A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- anisotropically conductive
- conductive adhesive
- adhesive
- electronic part
- anisotropically
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
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- C08K2201/00—Specific properties of additives
- C08K2201/016—Additives defined by their aspect ratio
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- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0242—Shape of an individual particle
- H05K2201/0245—Flakes, flat particles or lamellar particles
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Abstract
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/846,051 USRE45092E1 (en) | 2007-10-22 | 2008-09-05 | Anisotropic conductive adhesive |
KR1020107008680A KR101530401B1 (ko) | 2007-10-22 | 2008-09-05 | 이방성 도전 접착제 |
CN2008801134881A CN101836515B (zh) | 2007-10-22 | 2008-09-05 | 各向异性导电粘接剂 |
US12/678,424 US8092636B2 (en) | 2007-10-22 | 2008-09-05 | Anisotropic conductive adhesive |
US13/314,847 US8845849B2 (en) | 2007-10-22 | 2011-12-08 | Anisotropic conductive adhesive |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007273612A JP4998732B2 (ja) | 2007-10-22 | 2007-10-22 | 異方性導電接着剤 |
JP2007-273612 | 2007-10-22 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US13/314,847 Division US8845849B2 (en) | 2007-10-22 | 2011-12-08 | Anisotropic conductive adhesive |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2009054194A1 true WO2009054194A1 (ja) | 2009-04-30 |
Family
ID=40579301
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2008/066066 WO2009054194A1 (ja) | 2007-10-22 | 2008-09-05 | 異方性導電接着剤 |
Country Status (6)
Country | Link |
---|---|
US (3) | US8092636B2 (ja) |
JP (1) | JP4998732B2 (ja) |
KR (1) | KR101530401B1 (ja) |
CN (1) | CN101836515B (ja) |
TW (1) | TWI421323B (ja) |
WO (1) | WO2009054194A1 (ja) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102686341A (zh) * | 2009-10-05 | 2012-09-19 | 株式会社村田制作所 | 扁平形状的Ni粒子、使用其的层叠陶瓷电子部件、以及扁平形状的Ni粒子的制造方法 |
US8674509B2 (en) * | 2012-05-31 | 2014-03-18 | Freescale Semiconductor, Inc. | Integrated circuit die assembly with heat spreader |
CN103709944A (zh) * | 2013-12-20 | 2014-04-09 | 北京郁懋科技有限责任公司 | 一种导电的热固化环氧树脂体系的应用 |
JP6577867B2 (ja) * | 2014-09-18 | 2019-09-18 | 積水化学工業株式会社 | 導電ペースト、接続構造体及び接続構造体の製造方法 |
CN110268028B (zh) * | 2017-02-06 | 2021-06-22 | 李京燮 | 微间距用各向异性导电粘合剂制备方法及根据该方法制备的微间距用各向异性导电粘合剂 |
WO2018205127A1 (en) | 2017-05-09 | 2018-11-15 | 3M Innovative Properties Company | Electrically conductive adhesive |
JPWO2019074060A1 (ja) * | 2017-10-12 | 2020-12-17 | 富士フイルム株式会社 | 複合材 |
EP3578606A1 (en) * | 2018-06-06 | 2019-12-11 | Jotun A/S | Particulate coating composition |
JP6798646B2 (ja) * | 2018-06-12 | 2020-12-09 | Dic株式会社 | 導電性粘着シート |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261974A (ja) * | 2000-03-13 | 2001-09-26 | Hitachi Chem Co Ltd | ペースト組成物 |
JP2006104273A (ja) * | 2004-10-04 | 2006-04-20 | Toppan Printing Co Ltd | 導電性接着剤及び導電性フィルム及び、これを用いたプリント配線版 |
JP2006210621A (ja) * | 2005-01-27 | 2006-08-10 | Sumitomo Bakelite Co Ltd | 半導体製品搭載回路基板、チップ部品搭載回路基板及びSiP |
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JPS60117504A (ja) | 1983-11-28 | 1985-06-25 | 日立化成工業株式会社 | 高電流回路接続用導電異方性接着シ−ト |
JPH04323290A (ja) * | 1991-02-25 | 1992-11-12 | Fuji Kobunshi Kogyo Kk | 異方導電性接着剤組成物 |
US5672297A (en) | 1995-10-27 | 1997-09-30 | The Dow Chemical Company | Conductive composite articles based on expandable and contractible particulate matrices |
JPH10130600A (ja) * | 1996-11-01 | 1998-05-19 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
JPH10330718A (ja) * | 1997-05-30 | 1998-12-15 | Sumitomo Metal Mining Co Ltd | 導電性接着剤 |
JP4635287B2 (ja) | 1999-12-07 | 2011-02-23 | 株式会社ブリヂストン | 異方性導電フィルム |
JP3851767B2 (ja) | 2000-10-16 | 2006-11-29 | ソニーケミカル&インフォメーションデバイス株式会社 | 接着フィルム、及び接着フィルムの製造方法 |
JP3665579B2 (ja) | 2001-02-26 | 2005-06-29 | ソニーケミカル株式会社 | 電気装置製造方法 |
JP4928021B2 (ja) * | 2001-03-13 | 2012-05-09 | ナミックス株式会社 | 導電性接着剤およびそれを用いた回路 |
JP3842981B2 (ja) * | 2001-03-16 | 2006-11-08 | 守光 若林 | 基板の製造方法、電子部品の製造方法及び電子部品の実装方法 |
KR100527990B1 (ko) * | 2001-11-30 | 2005-11-09 | 미쯔이카가쿠 가부시기가이샤 | 회로 접속용 페이스트, 이방성 도전 페이스트 및 이들의사용방법 |
ES2285192T3 (es) | 2002-07-23 | 2007-11-16 | Otsuka Chemical Company, Limited | Compuesto electroconductor en forma de copos y composicion electroconductora. |
EP1541654B1 (en) | 2002-09-04 | 2012-02-29 | Namics Corporation | Conductive adhesive and circuit comprising it |
-
2007
- 2007-10-22 JP JP2007273612A patent/JP4998732B2/ja active Active
-
2008
- 2008-09-05 US US12/678,424 patent/US8092636B2/en not_active Ceased
- 2008-09-05 WO PCT/JP2008/066066 patent/WO2009054194A1/ja active Application Filing
- 2008-09-05 US US13/846,051 patent/USRE45092E1/en not_active Expired - Fee Related
- 2008-09-05 CN CN2008801134881A patent/CN101836515B/zh not_active Expired - Fee Related
- 2008-09-05 KR KR1020107008680A patent/KR101530401B1/ko not_active IP Right Cessation
- 2008-09-11 TW TW097134811A patent/TWI421323B/zh not_active IP Right Cessation
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2011
- 2011-12-08 US US13/314,847 patent/US8845849B2/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001261974A (ja) * | 2000-03-13 | 2001-09-26 | Hitachi Chem Co Ltd | ペースト組成物 |
JP2006104273A (ja) * | 2004-10-04 | 2006-04-20 | Toppan Printing Co Ltd | 導電性接着剤及び導電性フィルム及び、これを用いたプリント配線版 |
JP2006210621A (ja) * | 2005-01-27 | 2006-08-10 | Sumitomo Bakelite Co Ltd | 半導体製品搭載回路基板、チップ部品搭載回路基板及びSiP |
Also Published As
Publication number | Publication date |
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US8092636B2 (en) | 2012-01-10 |
TWI421323B (zh) | 2014-01-01 |
US20100200160A1 (en) | 2010-08-12 |
JP2009105117A (ja) | 2009-05-14 |
KR101530401B1 (ko) | 2015-06-19 |
CN101836515B (zh) | 2012-08-29 |
JP4998732B2 (ja) | 2012-08-15 |
TW200918637A (en) | 2009-05-01 |
US20120112136A1 (en) | 2012-05-10 |
KR20100074210A (ko) | 2010-07-01 |
CN101836515A (zh) | 2010-09-15 |
USRE45092E1 (en) | 2014-08-26 |
US8845849B2 (en) | 2014-09-30 |
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