WO2009069273A1 - 導電性ペーストおよびこれを用いた電気電子機器 - Google Patents

導電性ペーストおよびこれを用いた電気電子機器 Download PDF

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Publication number
WO2009069273A1
WO2009069273A1 PCT/JP2008/003433 JP2008003433W WO2009069273A1 WO 2009069273 A1 WO2009069273 A1 WO 2009069273A1 JP 2008003433 W JP2008003433 W JP 2008003433W WO 2009069273 A1 WO2009069273 A1 WO 2009069273A1
Authority
WO
WIPO (PCT)
Prior art keywords
electrically conductive
conductive paste
electrical
electronic device
same
Prior art date
Application number
PCT/JP2008/003433
Other languages
English (en)
French (fr)
Inventor
Takayuki Higuchi
Hidenori Miyakawa
Atsushi Yamaguchi
Arata Kishi
Naomichi Ohashi
Original Assignee
Panasonic Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Corporation filed Critical Panasonic Corporation
Priority to CN2008801184429A priority Critical patent/CN101878509B/zh
Priority to US12/744,994 priority patent/US8540903B2/en
Priority to JP2009543654A priority patent/JP5342453B2/ja
Priority to EP08853410A priority patent/EP2216790B1/en
Publication of WO2009069273A1 publication Critical patent/WO2009069273A1/ja

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0272—Mixed conductive particles, i.e. using different conductive particles, e.g. differing in shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0425—Solder powder or solder coated metal powder
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Conductive Materials (AREA)
  • Powder Metallurgy (AREA)

Abstract

　導電性ペーストを用いて回路基板に電子部品を実装する際に、導電性ペーストを硬化させた後に得られる接合部の導通経路に生じるボイドの程度を低減させること、ならびに添加すべき粘度調整／チクソ性付与添加剤の量を低減させることが可能な導電性ペーストを提供する。 　導電性ペーストに用いる導電性フィラー成分として、Ｓｎを含む低融点の合金組成から、融点および平均粒子径の異なる２種類の合金粒子を選択し、所定の割合にて混合して使用する。
PCT/JP2008/003433 2007-11-28 2008-11-21 導電性ペーストおよびこれを用いた電気電子機器 WO2009069273A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN2008801184429A CN101878509B (zh) 2007-11-28 2008-11-21 导电糊及使用该导电糊的电气电子设备
US12/744,994 US8540903B2 (en) 2007-11-28 2008-11-21 Electrically conductive paste, and electrical and electronic device comprising the same
JP2009543654A JP5342453B2 (ja) 2007-11-28 2008-11-21 導電性ペーストおよびこれを用いた電気電子機器
EP08853410A EP2216790B1 (en) 2007-11-28 2008-11-21 Electrically conductive paste, and electrical and electronic device comprising the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-307125 2007-11-28
JP2007307125 2007-11-28

Publications (1)

Publication Number Publication Date
WO2009069273A1 true WO2009069273A1 (ja) 2009-06-04

Family

ID=40678185

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/003433 WO2009069273A1 (ja) 2007-11-28 2008-11-21 導電性ペーストおよびこれを用いた電気電子機器

Country Status (5)

Country Link
US (1) US8540903B2 (ja)
EP (1) EP2216790B1 (ja)
JP (1) JP5342453B2 (ja)
CN (1) CN101878509B (ja)
WO (1) WO2009069273A1 (ja)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023577A (ja) * 2009-07-16 2011-02-03 Hitachi Chem Co Ltd 導電性接着剤組成物、これを用いた接続体、太陽電池セルの製造方法及び太陽電池モジュール
WO2012101869A1 (ja) * 2011-01-27 2012-08-02 日立化成工業株式会社 導電性接着剤組成物及びその塗布方法、接続体、並びに太陽電池モジュール及びその製造方法
JP2013211173A (ja) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd 導電ペーストおよび導電回路
US20130340806A1 (en) * 2011-01-27 2013-12-26 Hitachi Chemical Company, Ltd. Electrically conductive adhesive composition, connector and solar cell module
US20130340813A1 (en) * 2011-01-27 2013-12-26 Hitachi Chemical Company, Ltd. Solar cell module and method of manufacturing thereof
JP2014240490A (ja) * 2014-07-24 2014-12-25 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
JP2021028895A (ja) * 2019-08-09 2021-02-25 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
WO2024150769A1 (ja) * 2023-01-10 2024-07-18 株式会社レゾナック 配線形成用部材、配線層の形成方法、及び、配線形成部材

Families Citing this family (16)

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JP2011096900A (ja) * 2009-10-30 2011-05-12 Fujitsu Ltd 導電体およびプリント配線板並びにそれらの製造方法
KR20130129392A (ko) * 2010-11-22 2013-11-28 도와 일렉트로닉스 가부시키가이샤 접합재료, 접합체, 및 접합방법
WO2012085364A1 (fr) * 2010-12-24 2012-06-28 Bluestar Silicones France Inhibiteurs de réaction d'hydrosilylation et leur application pour la préparation de compositions silicones durcissables stables.
US8551367B2 (en) * 2012-01-19 2013-10-08 E I Du Pont De Nemours And Company Polymer thick film solder alloy conductor composition
US8557146B1 (en) * 2012-03-26 2013-10-15 E I Du Pont De Nemours And Company Polymer thick film solder alloy/metal conductor compositions
US8986579B2 (en) * 2012-10-10 2015-03-24 E I Du Pont De Nemours And Company Lamination of polymer thick film conductor compositions
WO2014185537A1 (ja) * 2013-05-17 2014-11-20 株式会社カネカ 太陽電池およびその製造方法、ならびに太陽電池モジュール
JP5935947B2 (ja) * 2013-08-06 2016-06-15 千住金属工業株式会社 導電性接合剤およびはんだ継手
EP2839904B1 (en) * 2013-08-21 2020-12-16 Napra Co., Ltd. Functional material
JP6049606B2 (ja) * 2013-12-25 2016-12-21 株式会社ノリタケカンパニーリミテド 加熱硬化型導電性ペースト
TWI738735B (zh) 2016-05-27 2021-09-11 德商漢高智慧財產控股公司 藉由毛細流動以於電子封裝中進行間隙塗覆及／或於其中或其間充填的組合物及其使用方法
CN106119667B (zh) * 2016-06-29 2018-05-25 北京态金科技有限公司 熔点为60℃的低熔点金属粘接膏及其制备方法和应用
US10575412B2 (en) 2016-12-27 2020-02-25 Mitsuboshi Belting Ltd. Electroconductive paste, electronic substrate, and method for manufacturing said substrate
JP6584543B2 (ja) * 2018-01-23 2019-10-02 田中貴金属工業株式会社 導電性接着剤組成物
KR20240069825A (ko) * 2018-05-16 2024-05-20 헨켈 아게 운트 코. 카게아아 다이 부착을 위한 경화성 접착제 조성물
CN110493952B (zh) * 2019-08-21 2022-04-12 苏州晶讯科技股份有限公司 一种线路板用微孔填充浆料、其制备方法及其应用

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154417A (ja) * 1996-11-26 1998-06-09 Toyobo Co Ltd 導電性ペースト
JPH10279903A (ja) 1997-04-04 1998-10-20 Asahi Chem Ind Co Ltd 導電性接着剤
JP2002057423A (ja) * 2000-08-07 2002-02-22 Matsushita Electric Ind Co Ltd 導電性ペーストを用いた回路基板とその製造方法
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP2004315871A (ja) * 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置
JP2005005054A (ja) * 2003-06-10 2005-01-06 Asahi Kasei Corp 導電性ペースト
JP2005019310A (ja) * 2003-06-27 2005-01-20 Murata Mfg Co Ltd 導電性ペーストおよびセラミック電子部品
JP2005071825A (ja) 2003-08-25 2005-03-17 Kyocera Corp 導電性ペースト及び配線基板並びにその製造方法
JP2005089559A (ja) 2003-09-16 2005-04-07 Denso Corp 導電性接着剤を用いた部材の接続方法

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EP0831981B1 (en) * 1995-05-24 2007-03-14 Fry's Metals Inc. Epoxy-based, voc-free soldering flux
JP3854103B2 (ja) * 2001-06-28 2006-12-06 住友ベークライト株式会社 導電性ペースト及び該ペーストを用いてなる半導体装置
JP4248938B2 (ja) 2003-06-06 2009-04-02 旭化成エレクトロニクス株式会社 導電性材料、導電性成形体、導電性成形体の製造方法
CN101107678B (zh) * 2005-01-25 2012-03-07 藤仓化成株式会社 导电浆料
WO2006109573A1 (ja) 2005-04-01 2006-10-19 Asahi Kasei Emd Corporation 導電性フィラー、及びはんだ材料

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10154417A (ja) * 1996-11-26 1998-06-09 Toyobo Co Ltd 導電性ペースト
JPH10279903A (ja) 1997-04-04 1998-10-20 Asahi Chem Ind Co Ltd 導電性接着剤
JP2002057423A (ja) * 2000-08-07 2002-02-22 Matsushita Electric Ind Co Ltd 導電性ペーストを用いた回路基板とその製造方法
JP2004234900A (ja) * 2003-01-28 2004-08-19 Asahi Kasei Corp 導電性粒子を用いた導電性ペースト、及び、これを用いた接続用シート
JP2004315871A (ja) * 2003-04-15 2004-11-11 Asahi Kasei Corp 金属超微粒子の製造方法およびその製造装置
JP2005005054A (ja) * 2003-06-10 2005-01-06 Asahi Kasei Corp 導電性ペースト
JP2005019310A (ja) * 2003-06-27 2005-01-20 Murata Mfg Co Ltd 導電性ペーストおよびセラミック電子部品
JP2005071825A (ja) 2003-08-25 2005-03-17 Kyocera Corp 導電性ペースト及び配線基板並びにその製造方法
JP2005089559A (ja) 2003-09-16 2005-04-07 Denso Corp 導電性接着剤を用いた部材の接続方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP2216790A4 *

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011023577A (ja) * 2009-07-16 2011-02-03 Hitachi Chem Co Ltd 導電性接着剤組成物、これを用いた接続体、太陽電池セルの製造方法及び太陽電池モジュール
JP2017201021A (ja) * 2011-01-27 2017-11-09 日立化成株式会社 導電性接着剤組成物
US20130340806A1 (en) * 2011-01-27 2013-12-26 Hitachi Chemical Company, Ltd. Electrically conductive adhesive composition, connector and solar cell module
US20130340813A1 (en) * 2011-01-27 2013-12-26 Hitachi Chemical Company, Ltd. Solar cell module and method of manufacturing thereof
JPWO2012101869A1 (ja) * 2011-01-27 2014-06-30 日立化成株式会社 導電性接着剤組成物及びその塗布方法、接続体、並びに太陽電池モジュール及びその製造方法
JP2016074911A (ja) * 2011-01-27 2016-05-12 日立化成株式会社 導電性接着剤組成物
JP6144048B2 (ja) * 2011-01-27 2017-06-07 日立化成株式会社 導電性接着剤組成物及びその塗布方法、接続体、並びに太陽電池モジュール及びその製造方法
WO2012101869A1 (ja) * 2011-01-27 2012-08-02 日立化成工業株式会社 導電性接着剤組成物及びその塗布方法、接続体、並びに太陽電池モジュール及びその製造方法
US9837572B2 (en) * 2011-01-27 2017-12-05 Hitachi Chemical Company, Ltd. Solar cell module and method of manufacturing thereof
JP2013211173A (ja) * 2012-03-30 2013-10-10 Taiyo Holdings Co Ltd 導電ペーストおよび導電回路
JP2014240490A (ja) * 2014-07-24 2014-12-25 パナソニックＩｐマネジメント株式会社 熱硬化性樹脂組成物及び半導体部品実装基板
JP2021028895A (ja) * 2019-08-09 2021-02-25 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
WO2024150769A1 (ja) * 2023-01-10 2024-07-18 株式会社レゾナック 配線形成用部材、配線層の形成方法、及び、配線形成部材

Also Published As

Publication number Publication date
EP2216790B1 (en) 2012-07-11
JP5342453B2 (ja) 2013-11-13
CN101878509B (zh) 2012-08-29
EP2216790A4 (en) 2010-12-15
EP2216790A1 (en) 2010-08-11
JPWO2009069273A1 (ja) 2011-04-07
US20110049439A1 (en) 2011-03-03
US8540903B2 (en) 2013-09-24
CN101878509A (zh) 2010-11-03

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