CN110194435A - 电子设备 - Google Patents

电子设备 Download PDF

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Publication number
CN110194435A
CN110194435A CN201910143481.4A CN201910143481A CN110194435A CN 110194435 A CN110194435 A CN 110194435A CN 201910143481 A CN201910143481 A CN 201910143481A CN 110194435 A CN110194435 A CN 110194435A
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China
Prior art keywords
electronic equipment
carrier board
equipment according
chip
column
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Granted
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CN201910143481.4A
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CN110194435B (zh
Inventor
W.帕尔
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TDK Corp
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TDK Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
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    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0045—Packages or encapsulation for reducing stress inside of the package structure
    • B81B7/0048—Packages or encapsulation for reducing stress inside of the package structure between the MEMS die and the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
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    • B81B7/007—Interconnections between the MEMS and external electrical signals
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    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
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    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261—Processes for packaging MEMS devices
    • B81C1/00309—Processes for packaging MEMS devices suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
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Abstract

本发明涉及一种电子设备（100），其包括具有上表面（11）的载体板（1）；安装在载体板的上表面上的电子芯片（2），电子芯片具有面向载体板的上表面的安装侧（21）、背离载体板的上表面的顶侧（22）、以及将安装侧连接到顶侧的侧壁（23），其中电子芯片在安装侧上具有在每平方毫米安装侧的基部区域上等于或小于5个的柱形凸起（24）；以及叠层式聚合物罩（4），其至少部分地覆盖电子芯片的顶侧并延伸到载体板的上表面上。

Description

电子设备
技术领域
本发明的实施例涉及一种电子设备，特别是涉及一种包括载体和安装在载体上的电子芯片的电子设备。电子设备可以是例如包括MEMS（微机电系统）芯片的传感器设备。例如，电子设备可以是MEMS麦克风。
背景技术
MEMS麦克风使用微结构化的、主要基于硅的声电变换器。这些高灵敏度的传感器芯片采用薄的可移动膜，使其也对来自保护性封装件中的其组件的机械应力非常敏感。将这种压力保持在较低水平的最常见方法是使用具有柔软且厚的接合线的传统芯片附接件。在这种情况下，膜和因此电触点竖直定位，并且与封装件和/或补充ASIC（专用集成电路）的内部电互连通过线接合完成。这导致两个主要缺点：在主要的底部端口构型的情况下，MEMS内部腔体不能有助于（有益的）声学后部体积，但是增加（有害的）前部体积，这两者都损害了麦克风的性能。此外，接合线需要相当大的横向空间（用于衬底着陆）和净空（用于线环和朝向盖的安全边缘），这两者都增加了部件的尺寸，这违背了一般的小型化努力。
焊料凸起上的倒装芯片组件是微电子学中的常见趋势，其可以为所述问题提供解决方案。但在这种情况下，反过来，传感器芯片刚性地耦合到封装件衬底，使其易受静态组装应力、来自焊料重熔的偏移、由于传感器和封装件材料之间的CTE不匹配导致的温度引起的应力、和来自外部冲击的动态压力的影响。
因此，例如对于所描述的麦克风应用，需要一种用于使用MEMS传感器的内部倒装芯片组件的底部端口麦克风的封装解决方案而没有有害的应力效应。
发明内容
要解决的目的是提供一种避免或至少减少上述问题的电子设备。
该目的尤其通过根据独立权利要求1的电子设备来实现。进一步的实施例和构型是从属权利要求的主题。
根据至少一个实施例，电子设备包括具有上表面的载体板。电子芯片安装在载体板的上表面上。电子芯片例如可以是传感器芯片。在优选实施例中，电子芯片可以是MEMS芯片。
载体板可以优选地提供用于连接电子芯片的电连接。特别地，载体板可以是叠层式多层板，其可以基于HTCC（高温共烧陶瓷）、LTCC（低温共烧陶瓷）、聚合物材料和/或玻璃。导体线和/或通孔可以在安装在载体板上的元件和外部焊盘之间提供电气布线（electrical routing）。
电子芯片可以具有面向载体板的上表面的安装侧。特别地，芯片可以在安装侧具有连接元件，连接元件被实施为用于电连接芯片并且将芯片安装在载体板的上表面上。此外，电子芯片可以具有背离载体板的上表面的顶侧和将安装侧连接到顶侧的侧壁。
根据另一实施例，电子芯片具有作为安装侧上的连接元件的柱形凸起。柱形凸起可以例如位于电子芯片的电极盘上。为了形成柱形凸起，使用标准球形凸起工艺形成球。在将球接合到电极盘之后，闭合线夹并且接合头移动以撕裂线。如果移动基本上垂直于安装侧指向，则“尾部”可以留在凸起的顶部。取决于移动参数，可以调节尾部的宽度和长度，并且从而调节柱形凸起的尺寸和形状。柱形凸起中的每个可以形成机电连接元件，其可以结合固有的柔韧性、低轮廓和小的占地面积。
安装侧可以由芯片外形限定，使得由芯片外形包围的区域可以表示为电子芯片的基本区域。特别地，电子芯片可以特别优选地具有在每平方毫米安装侧的基本区域上等于或者小于5个的柱形凸起。简而言之，电子芯片可以仅配备少量的柱形凸起，例如等于或小于10个柱形凸起。作为示例，方形或矩形的电子芯片可具有四个柱形凸起，每个柱形凸起位于方形或矩形基本区域的角落中的一个中。此外，在每个角落中，例如可以施加两个柱形凸起，从而产生具有八个柱形凸起的电子芯片。
根据另一实施例，柱形凸起通过导电粘合剂连接到载体的上表面。在将电子芯片放置到载体板上之前，可以通过将柱形凸起浸入受控厚度的“湿”粘合剂层来施加导电粘合剂。此外，通过印刷、喷射或分配沉积导电粘合剂可以以更好的再现性提供更大的体积（volume）。有利地，导电粘合剂的使用提供适度的温度分布。虽然无铅的焊料凸起通常需要约250℃的温度用于回流工艺，但是典型的导电粘合剂在约150℃或更低的温度下固化，甚至约60℃的温度也是可能的。因此，在芯片安装期间仅引入低的初始应力水平。
导电粘合剂可以是热塑性或热固性树脂，包括选自硅酮、丙烯酸酯、环氧树脂和其他树脂材料中的一种或多种，其填充有导电颗粒。通常可以使用银（Ag）和/或钯（Pd）。在MEMS麦克风或其他电容性传感器的情况下，可以容忍高达千欧姆（kOhm）范围的相对高的接合电阻率。在这种情况下，类似碳等的其他填料材料也是可能的。而且，可以选择固有导电聚合物作为导电粘合剂。
根据另一实施例，载体板在上表面中具有至少一个凹部，其中至少一个柱形凸起伸入到凹部中。特别地，柱形凸起的尾部可以被容纳在凹部中。优选地，载体板包括用于每个柱形凸起的凹部。（多个）凹部可以由导电粘合剂填充。
此外，柱形凸起中的至少一个或几个或所有具有形状锁定轮廓部。柱形凸起、特别是其尾部的这种形状锁定轮廓部可以在相对柔软的导电粘合剂中提供更强的锚固。例如，尾部可以在端部处弯曲，或者可以形成为钩或支架。此外，将尾部压成蘑菇形状是可能的。
优选地，柱形凸起中的至少一个或几个或所有具有等于或大于30μm且等于或小于180μm的高度。高度尤其可以包括尾部以及被容纳在载体板的凹部中的可选部分。柱形凸起可以例如由直径等于或大于12μm且等于或小于30µm的金线制造。这种柱形凸起可以通过改进的线接合装备如上所述制造，并且可以直接在电极盘（例如，铝盘）上以高达~30/s的高速率设置，并且不需要通常对于MEMS晶片工艺来说是不希望的昂贵的UBM（下凸起金属化）处理。
根据另一实施例，电子设备包括叠层式聚合物罩。聚合物罩至少部分地覆盖电子芯片的顶侧并延伸到载体板的上表面上。这尤其可以意味着聚合物罩例如通过粘合力固定地连接到上表面的一部分。聚合物罩可以被实施为将电子芯片机械地保持在载体板上。
此外，聚合物罩可以覆盖电子芯片的大部分侧壁。在方形或矩形芯片的情况下，聚合物罩可以优选地覆盖电子芯片的四个侧壁中的至少三个。
聚合物罩可以通过将聚合物箔至少部分地叠层到安装在载体板上的电子芯片上，并且部分地叠层到载体板的上表面上来制造。叠层工艺可以优选地基于由箔上方和下方的气压差驱动的热增强深拉工艺。叠层箔的聚合物材料以及因此聚合物罩可以选自各种热塑性或热固性聚合物。特别优选地，聚合物罩包括B阶材料，其是本领域技术人员已知的并且其结合在热塑性条件下的可加工性与在最终热和/或辐射固化期间到热固性状态的转变。优选地，聚合物罩具有等于或大于10μm且等于或小于80μm的厚度。优选的厚度可为约20μm。为了不损害组件（即电子设备）的柔性，聚合物罩（即处于固化和最终状态的构成聚合物罩的叠层箔）优选在室温下具有等于或小于1GPa的杨氏模量。
根据另一实施例，电子芯片的安装侧位于距载体板的上表面一定距离处，从而在安装侧和上表面之间限定间隙。如果适用的话，间隙的高度可以基本上由柱形凸起的高度减去柱形凸起的位于凹部中的那部分的高度来确定。特别地，间隙可以不含任何底部填充材料（underfill material）。换句话说，电子芯片可以仅通过具有导电粘合剂的柱形凸起和聚合物罩安装和固定在载体板上，其中可以避免任何进一步的底部填充材料（例如通常被施加在芯片和衬底之间的粘合材料）。
附图说明
根据结合附图的示例性实施例的以下描述，进一步的特征、优点和便利将变得明显。
图1示出了根据实施例的电子设备，
图2示出了根据另一实施例的电子设备，
图3A和3B示出了根据其他实施例的电子设备的其他特征，
图4示出了根据另一实施例的电子设备的细节，
图5A至5C示出了根据其他实施例的电子设备的柱形凸起的细节。
在附图中，相同设计和/或功能的元件由相同的附图标记标识。应理解，附图中所示的实施例是说明性表示，并且不一定按比例绘制。
具体实施方式
图1示出了根据实施例的电子设备100。电子设备100形成为电子封装件并且包括载体板1，该载体板1具有上表面11和下表面12，上表面11上安装有电子芯片2，下表面12远离上表面11并在该下表面上设置有用于外部接触电子设备100的触点。电子芯片2例如可以是传感器芯片，并且优选地是诸如MEMS麦克风的MEMS芯片。尽管以下描述涉及这种应用，但是本发明不限于MEMS麦克风，而是通常也可用于其他类型的应力敏感传感器以及电子部件。
例如基于HTCC、LTCC、聚合物或玻璃的叠层式多层板用作载体板1，并因此用作封装件衬底。导体线和通孔提供元件和外部焊盘之间的电气布线。接地平面可以通过合适的连接材料30（例如焊料或导电粘合剂）结合附接到载体板1的盖3（优选地，金属盖）而改善电磁屏蔽。
电子芯片2具有面向载体板1的上表面11的安装侧21。此外，电子芯片2具有背离上表面11的顶侧22，以及将安装侧21连接到顶侧22的侧壁23。如上所述被实施为MEMS麦克风芯片的电子芯片2安装在载体板1上，使得芯片2的膜和背板面向载体板1中的开口13，该开口13用作声音端口开口。如图1所示的，可以在开口13上施加作为额外的和可选的元件的阻挡层14。阻挡层14可以是颗粒和/或湿气屏障，其可以密封开口13以防止灰尘或水的侵入。特别地，可选的阻挡层14可以由网形成。其他实施例包括未附接到载体板1、但附接到电子芯片2的结构。替代性地，不存在阻挡层14。
出于声学原因，最顶层的载体板层上的声音端口开口应尽可能宽。这极大地限制了电子芯片2下面的剩余区域。因此，电子芯片2包括在电极盘上的柱形凸起24，其中柱形凸起24形成具有固有柔性、低轮廓和小占用面积的机电连接元件。柱形凸起24中的每个在凸起的顶部上具有尾部并且至少部分地被容纳在载体板1的上表面11上的一滴导电粘合剂5中，从而在载体板1和电子芯片2之间提供应力分离。如下所述，柱形凸起的优选高度（包括尾部和被容纳在凹部中的可选部分）在30μm和180μm之间，其中包括极值。可以使用直径等于或大于12μm且等于或小于30μm的金（Au）线制造柱形凸起24。柱形凸起24由改进的线接合装备制成。它们可以直接在铝（Al）盘上以高速率（高达~30/s）设置，并且不需要在MEMS晶片工艺中通常是不希望的昂贵的UBM处理。
与导电粘合剂5的界面处的良好电接触相关的所有表面优选地涂覆有贵金属，例如Au、Pt、Pd、Ag或其合金，以提供低且稳定的电阻。导电粘合剂5可以是热塑性或热固性树脂（例如硅树脂、丙烯酸酯、环氧树脂或其他合适的树脂），其填充有导电颗粒，例如Ag和/或Pd颗粒，或者在MEMS麦克风或其他电容性传感器的情况下，类似碳等的其他填充材料。而且，固有导电聚合物是另一种选择。在将电子芯片2放置在载体板1上之前，可以通过将柱形凸起24浸入受控厚度的“湿”层中来施加导电粘合剂5。还可以使用通过印刷、喷射或分配的沉积，其可以以更好的再现性提供更大的体积。
固化的粘合剂5的所需机械性能广泛地取决于类似预期的应力水平和灵敏度、所涉及的材料的CTE（热膨胀系数）不匹配、每个芯片的柱形凸起的数量、柱形凸起的高度等参数。在许多构型中，粘合剂5的杨氏模量等于或小于500MPa或优选等于或小于100MPa是合适的。至于载体板热膨胀系数，等于或小于8ppm/K或更好等于或小于5ppm/K的值应该是期望的。但是，甚至可以使用热膨胀系数高达14ppm/K的低性能基底材料。
由于柱形凸起24，可以避免其他连接方法的问题。例如，实际上不可能实施金属弹簧元件以实现所需的应力分离。在这种情况下，传统的芯片焊料凸起将附接到弹簧元件的独立端子，而弹簧元件的另外端子固定到载体板触点。芯片的安装表面和载体板的上表面之间的间隙高度被限制为大约100μm，因此在垂直方向上不允许复杂的弹簧结构。此外，不能避免弹簧结构的部分从芯片外形突出，以便它们由用于分离前部体积和后部体积的任何装置阻挡。此外，传统的倒装芯片底部填充在这方面会更糟。当然，对于MEMS麦克风来说，完整的底部填充将是禁止的，但即使沿着芯片边缘以坝的形式的底部填充也会完全阻挡弹簧。
与传统的焊料凸起相比，柱形凸起24形成接头，该接头显示出较低的结合强度，特别是在每个芯片的接头数量较少的情况下，如针对MEMS麦克风所给出并且在下面说明的那样。然而，借助于底部填充方法的增强不能用于MEMS麦克风，因为在底部填充材料的应用期间朝向功能部件的流动和渗出是有害的。因此，电子芯片的安装侧和载体板的上表面之间的间隙6不含任何底部填充材料。电子设备100包括叠层式聚合物罩4，而不是使用底部填充物。聚合物罩至少部分地覆盖电子芯片2的顶侧22并且延伸到载体板1的上表面11上。特别地，聚合物罩4通过粘合固定地连接到上表面11的一部分，使得叠层式聚合物罩4机械地保持和支撑电子芯片2。在所示实施例中，聚合物罩4在芯片2的所有侧壁23上机械地保持和支撑电子芯片2。特别优选地，聚合物罩4包括B阶材料（B-stage material），其结合在热塑性条件下的可加工性和在最终热和/或辐射固化期间到热固性状态的转变，并且具有等于或大于10μm且等于或小于80微米的厚度。优选的厚度可为约20μm。为了不损害电子设备100的柔性，聚合物罩4（即，以固化和最终状态构成聚合物罩4的叠层箔）优选地具有在室温下等于或小于1GPa的杨氏模量。
叠层过程基于由聚合物箔上方和下方的气压差驱动的热增强深拉。结果，柱形凸起24上的唯一有效力直接向下指向，即朝向载体板1的上表面11，这为它们的单个弹性加载方向。原因在于：柱形凸起24的尾部可以搁置在载体板1上，从而提供机械止动件。所有其他负载情况，例如由弯曲、剪切和/或拉动引起的可能容易破坏柱形凸起接头的力可以在固化工艺后由聚合物罩4处理。该组件的另一优点是其温和的温度曲线。虽然无铅的焊料凸起需要约250℃用于回流工艺，但典型的导电粘合剂在约150℃下固化，其中约60℃也是可能的。因此，在安装芯片2时引入低的初始应力水平。
聚合物罩4还可以提供电子芯片2的前部体积和后部体积之间的分离。在所解释的MEMS麦克风的情况下，聚合物罩4可以在MEMS腔体的区域中具有开口40，作为与盖3提供的延伸的后部体积的连接。
图2示出了电子设备100的另一实施例，与先前实施例相比，电子设备100另外包括安装在载体板1上的ASIC 7。ASIC 7可以支持和控制电子芯片2以及因此电子设备100的功能。ASIC 7可以安装在聚合物罩4下方的电子芯片2的旁边，如图2所示，或者在其外部。其可以以柱形凸起的形式或任何其他安装和互连方法（例如具有焊球的倒装芯片附接件、具有线接合的传统芯片附接件等）使用所描述的连接元件。在所示实施例中，聚合物罩4（也在聚合物罩4下方的ASIC 7的存在下）覆盖电子芯片2的四个侧壁23中的至少三个，从而充分地机械地保持电子芯片2。
在图1和2的实施例中，电子芯片2分别包括在每平方毫米安装侧的基部区域上等于或小于5个的柱形凸起。考虑到MEM芯片的典型尺寸，这尤其意味着电子芯片2具有等于或小于10个柱形凸起。在图3A和3B中，显示了用于电子设备100的布局的两个示例性实施例。在两个图中，电子芯片的外形25（作为示例，其具有正方形形状）由虚线示出。还示出了柱形凸起24、导电粘合剂5和覆盖载体板中的开口的（可选的）阻挡层14的位置。图3A示出了具有四个柱形凸起24的布局，该四个柱形凸起24被挤压到由电子芯片的外形25限制的可用场的角落中，以便尽可能少地损失用于声音端口开口13和阻挡层14的区域。柱形凸起24周围的相应最外侧圆表示载体板上的导电粘合剂5的尺寸，该导电粘合剂5优选地不与聚合物罩接触，以便最小化在该极高阻抗电路中可能的泄露电流。图3B示出了另一实施例，其中两个柱形凸起24在每个角落中形成一个接头以加强连接。在每个角落中还可以有两个以上的柱形凸起。
图4示出根据另一实施例的电子设备的细节。在该实施例中，载体板1具有至少一个凹部15，其中容纳至少一个柱形凸起24或至少其细长的尾部线。凹部15填充有导电粘合剂5。作为所示实施例的替代方案，凹部15可以通过其他方式构建，例如通过载体板1的上表面上的结构、特别是焊接掩模图案。
如果柱形凸起中的至少一个或几个或所有、特别是其尾部具有形状锁定轮廓部以便在相对柔软的导电粘合剂中更牢固地锚固，则可以实现进一步的改进。在图5A至5C中示出形状锁定轮廓部的示例性实施例。例如，尾部可以在端部处弯曲，如图5A所示，或者形成为钩或支架，如图5B所示。替代性地，如图5C所示，将尾部压成蘑菇形状是优选的可能性。
作为结合附图描述的特征的替代或补充，附图中示出的实施例可以包括在说明书的一般部分中描述的其他特征。此外，附图的特征和实施例可以彼此组合，即使没有明确地描述这种组合。
本发明不受基于示例性实施例的描述的限制。相反，本发明包括任何新特征以及特征的任何组合，其特别地包括专利权利要求中的特征的任何组合，即使该特征或该组合本身未在专利权利要求或示例性实施例中明确说明。
使用的参考符号列表
1 载体板
2 电子芯片
3 盖
4 聚合物罩
5 导电粘合剂
6 间隙
7 专用集成电路（ASIC）
11 上表面
12 下表面
13 开口
14 阻挡层
15 凹部
21 安装侧
22 顶端
23 侧壁
24 柱形凸起
25 外形
30 连接材料
40 开口
100 电子设备

Claims (13)

1.一种电子设备（100），其包括：
- 具有上表面（11）的载体板（1），
- 安装在所述载体板的所述上表面上的电子芯片（2），所述电子芯片具有面向所述载体板的所述上表面的安装侧（21）、背离所述载体板的所述上表面的顶侧（22）、以及将所述安装侧连接到所述顶侧的侧壁（23），
其中：
- 所述电子芯片在所述安装侧上具有在每平方毫米所述安装侧的基部区域上等于或小于5个的柱形凸起（24），和
- 叠层式聚合物罩（4），其至少部分地覆盖所述电子芯片的所述顶侧并延伸到所述载体板的所述上表面上。
2.根据权利要求1所述的电子设备，其中，所述聚合物罩覆盖所述电子芯片的至少三个侧壁。
3.根据前述权利要求中的任一项所述的电子设备，其中，所述柱形凸起通过导电粘合剂连接到所述载体板的所述上表面。
4.根据前述权利要求所述的电子设备，其中，所述导电粘合剂具有等于或小于500MPa的杨氏模量，并且优选等于或小于100MPa的杨氏模量。
5.根据前述权利要求中的任一项所述的电子设备，其中，所述电子芯片的所述安装侧位于距所述载体板的所述上表面一定距离处，从而在所述安装侧与所述上表面之间限定间隙，所述间隙不含任何底部填充材料。
6.根据前述权利要求中的任一项所述的电子设备，其中，所述载体板在所述上表面中具有至少一个凹部，至少一个立柱凸起伸入到所述凹部中。
7.根据前述权利要求中的任一项所述的电子设备，其中，所述柱形凸起中的至少一个具有形状锁定轮廓部。
8.根据前述权利要求中的任一项所述的电子设备，其中，所述柱形凸起中的至少一个具有等于或大于30μm且等于或小于180μm的高度。
9.根据前述权利要求中的任一项所述的电子设备，其中，所述聚合物罩包括B阶材料。
10.根据前述权利要求中的任一项所述的电子设备，其中，所述聚合物罩具有等于或大于10μm且等于或小于80μm的厚度。
11.根据前述权利要求中的任一项所述的电子设备，其中，所述聚合物罩具有在室温时等于或小于1GPa的杨氏模量。
12.根据前述权利要求中的任一项所述的电子设备，其中，所述电子芯片是传感器芯片。
13.根据前述权利要求中的任一项所述的电子设备，其中，所述电子芯片是MEMS芯片。
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