CN110063095B - 元件安装机 - Google Patents

元件安装机 Download PDF

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Publication number
CN110063095B
CN110063095B CN201680091452.2A CN201680091452A CN110063095B CN 110063095 B CN110063095 B CN 110063095B CN 201680091452 A CN201680091452 A CN 201680091452A CN 110063095 B CN110063095 B CN 110063095B
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CN
China
Prior art keywords
tray
roller
conveying
component mounting
rotated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201680091452.2A
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English (en)
Chinese (zh)
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CN110063095A (zh
Inventor
今西聪
宫岛崇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Publication of CN110063095A publication Critical patent/CN110063095A/zh
Application granted granted Critical
Publication of CN110063095B publication Critical patent/CN110063095B/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/043—Feeding one by one by other means than belts
    • H05K13/0434—Feeding one by one by other means than belts with containers

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
CN201680091452.2A 2016-12-19 2016-12-19 元件安装机 Active CN110063095B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2016/087767 WO2018116342A1 (ja) 2016-12-19 2016-12-19 部品装着機

Publications (2)

Publication Number Publication Date
CN110063095A CN110063095A (zh) 2019-07-26
CN110063095B true CN110063095B (zh) 2021-02-05

Family

ID=62626348

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201680091452.2A Active CN110063095B (zh) 2016-12-19 2016-12-19 元件安装机

Country Status (4)

Country Link
JP (1) JP6709295B2 (ja)
KR (1) KR102469882B1 (ja)
CN (1) CN110063095B (ja)
WO (1) WO2018116342A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028560A (en) * 1988-06-21 1991-07-02 Mitsubishi Denki Kabushiki Kaisha Method for forming a thin layer on a semiconductor substrate
JPH0840581A (ja) * 1994-07-29 1996-02-13 Nec Toyama Ltd ワーク供給装置
JP2001291991A (ja) * 2000-04-04 2001-10-19 Yamagata Casio Co Ltd 電子部品供給装置
CN2865214Y (zh) * 2004-10-04 2007-01-31 雅马哈发动机株式会社 表面安装机
CN202907410U (zh) * 2011-07-20 2013-04-24 富士机械制造株式会社 元件供给装置
WO2014080800A1 (ja) * 2012-11-20 2014-05-30 株式会社村田製作所 加速度センサ
CN105083976A (zh) * 2014-05-14 2015-11-25 泰科电子(上海)有限公司 电子设备生产系统

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4253150B2 (ja) * 2001-11-26 2009-04-08 シャープ株式会社 搬送システムと搬送方法
US7540367B2 (en) * 2003-04-04 2009-06-02 Fuji Machine Mfg. Co., Ltd. Tray parts feeder
JP4504770B2 (ja) 2004-09-17 2010-07-14 富士機械製造株式会社 トレイ型部品供給装置および部品供給システム
JP5328286B2 (ja) * 2008-10-16 2013-10-30 富士機械製造株式会社 電子部品供給方法
JP5278122B2 (ja) * 2009-04-06 2013-09-04 ソニー株式会社 トレイ供給装置
JP5617264B2 (ja) * 2010-02-04 2014-11-05 富士電機株式会社 半導体装置のヒートシンク
JP5990279B2 (ja) * 2012-11-22 2016-09-07 富士機械製造株式会社 部品実装機

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5028560A (en) * 1988-06-21 1991-07-02 Mitsubishi Denki Kabushiki Kaisha Method for forming a thin layer on a semiconductor substrate
JPH0840581A (ja) * 1994-07-29 1996-02-13 Nec Toyama Ltd ワーク供給装置
JP2001291991A (ja) * 2000-04-04 2001-10-19 Yamagata Casio Co Ltd 電子部品供給装置
CN2865214Y (zh) * 2004-10-04 2007-01-31 雅马哈发动机株式会社 表面安装机
CN202907410U (zh) * 2011-07-20 2013-04-24 富士机械制造株式会社 元件供给装置
WO2014080800A1 (ja) * 2012-11-20 2014-05-30 株式会社村田製作所 加速度センサ
CN105083976A (zh) * 2014-05-14 2015-11-25 泰科电子(上海)有限公司 电子设备生产系统

Also Published As

Publication number Publication date
WO2018116342A1 (ja) 2018-06-28
KR102469882B1 (ko) 2022-11-22
KR20190097081A (ko) 2019-08-20
JP6709295B2 (ja) 2020-06-10
CN110063095A (zh) 2019-07-26
JPWO2018116342A1 (ja) 2019-08-08

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