CN106463367A - 用于控制准分子激光退火的监测方法和装置 - Google Patents

用于控制准分子激光退火的监测方法和装置 Download PDF

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Publication number
CN106463367A
CN106463367A CN201580011771.3A CN201580011771A CN106463367A CN 106463367 A CN106463367 A CN 106463367A CN 201580011771 A CN201580011771 A CN 201580011771A CN 106463367 A CN106463367 A CN 106463367A
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P·范德威尔特
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Coherent Lasersystems GmbH and Co KG
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Coherent Lasersystems GmbH and Co KG
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00—Single-crystal growth directly from the solid state
    • C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
    • C—CHEMISTRY; METALLURGY
    • C30—CRYSTAL GROWTH
    • C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02—Elements
    • C30B29/06—Silicon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/21—Polarisation-affecting properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47—Scattering, i.e. diffuse reflection
    • G01N21/4788—Diffraction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/8422—Investigating thin films, e.g. matrix isolation method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/002—Scanning microscopes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B21/00—Microscopes
    • G02B21/0004—Microscopes specially adapted for specific applications
    • G02B21/0092—Polarisation microscopes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8461—Investigating impurities in semiconductor, e.g. Silicon
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N2021/8477—Investigating crystals, e.g. liquid crystals
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/061—Sources
    • G01N2201/06113—Coherent sources; lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/068—Optics, miscellaneous
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/068—Optics, miscellaneous
    • G01N2201/0683—Brewster plate; polarisation controlling elements
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/069—Supply of sources
    • G01N2201/0696—Pulsed
    • G01N2201/0697—Pulsed lasers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/10—Scanning
    • G01N2201/105—Purely optical scan
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02656—Special treatments
    • H01L21/02664—Aftertreatments
    • H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
    • H01L21/02686—Pulsed laser beam

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
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  • Analytical Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • High Energy & Nuclear Physics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Metallurgy (AREA)
  • Materials Engineering (AREA)
  • Mathematical Physics (AREA)
  • Signal Processing (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Toxicology (AREA)
  • Electromagnetism (AREA)
  • Thermal Sciences (AREA)
  • Recrystallisation Techniques (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201580011771.3A 2014-03-03 2015-03-02 用于控制准分子激光退火的监测方法和装置 Pending CN106463367A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/195,656 2014-03-03
US14/195,656 US9335276B2 (en) 2014-03-03 2014-03-03 Monitoring method and apparatus for control of excimer laser annealing
PCT/EP2015/054326 WO2015132210A1 (en) 2014-03-03 2015-03-02 Monitoring method and apparatus for control of excimer laser annealing

Publications (1)

Publication Number Publication Date
CN106463367A true CN106463367A (zh) 2017-02-22

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Country Link
US (2) US9335276B2 (enExample)
JP (2) JP6738279B2 (enExample)
KR (1) KR102154495B1 (enExample)
CN (1) CN106463367A (enExample)
TW (1) TWI660410B (enExample)
WO (1) WO2015132210A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107421638A (zh) * 2017-08-25 2017-12-01 西京学院 一种新型的光学衍射模拟方法及其装置

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
US9455211B2 (en) 2013-09-11 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with openings in buffer layer
CN106198568B (zh) * 2015-05-24 2019-03-12 上海微电子装备（集团）股份有限公司 一种具有透明基底的薄膜的测量装置及测量方法
US9976969B1 (en) * 2016-10-28 2018-05-22 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer-laser annealing process
US10069273B1 (en) 2017-03-02 2018-09-04 Coherent Lasersystems Gmbh & Co. Kg Lasing-gas mixture for excimer laser
JP2019047058A (ja) * 2017-09-06 2019-03-22 株式会社ブイ・テクノロジー 結晶化モニタ方法、レーザアニール装置、およびレーザアニール方法
CN107677686B (zh) * 2017-09-28 2021-01-26 京东方科技集团股份有限公司 光线透过窗集成装置及采用该装置的设备
TWI672493B (zh) * 2018-03-07 2019-09-21 由田新技股份有限公司 用於檢測面板斑紋的光學檢測系統及其方法
GB2571997B (en) * 2018-03-16 2021-10-27 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
GB2587691B (en) * 2018-03-16 2022-02-09 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
JP7219590B2 (ja) * 2018-10-30 2023-02-08 浜松ホトニクス株式会社 レーザ加工装置
KR102688794B1 (ko) * 2019-01-11 2024-07-29 삼성디스플레이 주식회사 레이저 결정화 장치
US10832635B2 (en) * 2019-03-12 2020-11-10 Himax Display, Inc. Display apparatus having display panel and humidity detection method thereof and gamma curve calibration method thereof
CN110993491B (zh) * 2019-12-19 2023-09-26 信利(仁寿)高端显示科技有限公司 一种准分子激光退火制程oed的自动校正方法
JP7542350B2 (ja) * 2020-07-21 2024-08-30 Ｊｓｗアクティナシステム株式会社 レーザアニール装置、レーザアニール方法、及び半導体装置の製造方法
KR20220022016A (ko) * 2020-08-14 2022-02-23 삼성디스플레이 주식회사 디스플레이 장치의 제조 장치 및 디스플레이 장치의 제조 방법
US12148615B2 (en) 2021-05-06 2024-11-19 Coherent Lasersystems Gmbh & Co. Kg Method and apparatus for laser annealing

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639201B2 (en) * 2001-11-07 2003-10-28 Applied Materials, Inc. Spot grid array imaging system
JP2004172424A (ja) * 2002-11-21 2004-06-17 Japan Steel Works Ltd:The 結晶の周期性構造の形成方法及びその装置並びに結晶の周期性構造
US20040125375A1 (en) * 2002-12-30 2004-07-01 Applied Materials Israel Ltd Method and system for optical inspection of an object
US20050002016A1 (en) * 2003-07-01 2005-01-06 Au Optronics Corp. Inspection method and apparatus of laser crystallized silicons
CN102473615A (zh) * 2010-05-11 2012-05-23 株式会社日本制钢所 激光退火处理装置、激光退火处理体的制造方法及激光退火处理程序
CN102971833A (zh) * 2010-07-05 2013-03-13 株式会社日本制钢所 激光退火处理装置及激光退火处理方法
US20130341310A1 (en) * 2012-06-22 2013-12-26 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer laser annealing process
JP2013258181A (ja) * 2012-06-11 2013-12-26 Hitachi High-Technologies Corp 多結晶シリコン膜の検査方法及びその装置

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263642A (ja) * 1984-06-12 1985-12-27 Nippon Seiko Kk パタ−ン原図自動読取り装置
US4806018A (en) 1987-07-06 1989-02-21 The Boeing Company Angular reflectance sensor
US4810047A (en) 1988-02-16 1989-03-07 Grumman Aerospace Corporation In-line holographic lens arrangement
US5432607A (en) 1993-02-22 1995-07-11 International Business Machines Corporation Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry
US5473426A (en) 1993-03-05 1995-12-05 Nikon Corporation Defect inspection apparatus
JP3342387B2 (ja) 1997-02-28 2002-11-05 三洋電機株式会社 半導体膜の評価方法、評価装置及び形成方法
JP2001110861A (ja) 1999-10-06 2001-04-20 Seiko Epson Corp 半導体膜の検査方法、薄膜トランジスタの製造方法、および半導体膜の検査装置
WO2001061734A1 (en) 2000-02-15 2001-08-23 Matsushita Electric Industrial Co., Ltd. Non-single crystal film, substrate with non-single crystal film, method and apparatus for producing the same, method and apparatus for inspecting the same, thin film transistor, thin film transistor array and image display using it
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US6864971B2 (en) 2001-03-27 2005-03-08 Isoa, Inc. System and method for performing optical inspection utilizing diffracted light
JP3794482B2 (ja) 2002-04-19 2006-07-05 株式会社日本製鋼所 結晶化Ｓｉ膜の評価方法及びその装置
US7359045B2 (en) 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
JP5030382B2 (ja) 2002-08-19 2012-09-19 ザ トラスティーズ オブ コロンビア ユニヴァーシティ イン ザ シティ オブ ニューヨーク 基板上のフィルム領域を処理して、こうした領域内及びその端部領域をほぼ均一にするレーザ結晶化プロセス及びシステム
JP4463600B2 (ja) * 2003-03-26 2010-05-19 株式会社半導体エネルギー研究所 評価方法
US7061623B2 (en) 2003-08-25 2006-06-13 Spectel Research Corporation Interferometric back focal plane scatterometry with Koehler illumination
JP2005191173A (ja) 2003-12-25 2005-07-14 Hitachi Ltd 表示装置及びその製造方法
TWI263267B (en) 2004-03-04 2006-10-01 Sharp Kk Method for fabricating a semiconductor device and apparatus for inspecting a semiconductor
JP4537131B2 (ja) * 2004-06-30 2010-09-01 友達光電股▲ふん▼有限公司 レーザー結晶シリコンの検査方法及びその装置
US7247813B2 (en) 2004-10-13 2007-07-24 Advanced Lcd Technologies Development Center Co., Ltd. Crystallization apparatus using pulsed laser beam
US7515253B2 (en) 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
JP5305442B2 (ja) 2006-02-22 2013-10-02 コヒーレント・インク レーザービーム・ミクロスムージング
JP4946093B2 (ja) * 2006-03-01 2012-06-06 ソニー株式会社 レーザアニール装置のレーザ光のエネルギー決定方法、レーザアニール装置のレーザ光のエネルギー決定装置及びレーザアニール装置及び薄膜トランジスタの製造方法
JP4876019B2 (ja) 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7659989B2 (en) 2007-06-29 2010-02-09 Coherent, Inc. Focus determination for laser-mask imaging systems
JP2009065146A (ja) * 2007-08-15 2009-03-26 Sony Corp 半導体薄膜の形成方法および半導体薄膜の検査装置
FR2921012A1 (fr) 2007-09-13 2009-03-20 Advanced Track And Trace Sa Procede et dispositif de marquage d'une surface par nanostructures periodiques controlees
JP4618360B2 (ja) 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
JP5641545B2 (ja) * 2011-02-23 2014-12-17 株式会社日本製鋼所 薄膜の表面検査方法および検査装置
JP6096228B2 (ja) * 2015-01-09 2017-03-15 株式会社日本製鋼所 半導体膜の表面ムラ検出装置、レーザアニール装置および半導体膜の表面ムラ検出方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6639201B2 (en) * 2001-11-07 2003-10-28 Applied Materials, Inc. Spot grid array imaging system
JP2004172424A (ja) * 2002-11-21 2004-06-17 Japan Steel Works Ltd:The 結晶の周期性構造の形成方法及びその装置並びに結晶の周期性構造
US20040125375A1 (en) * 2002-12-30 2004-07-01 Applied Materials Israel Ltd Method and system for optical inspection of an object
US20050002016A1 (en) * 2003-07-01 2005-01-06 Au Optronics Corp. Inspection method and apparatus of laser crystallized silicons
CN102473615A (zh) * 2010-05-11 2012-05-23 株式会社日本制钢所 激光退火处理装置、激光退火处理体的制造方法及激光退火处理程序
CN102971833A (zh) * 2010-07-05 2013-03-13 株式会社日本制钢所 激光退火处理装置及激光退火处理方法
JP2013258181A (ja) * 2012-06-11 2013-12-26 Hitachi High-Technologies Corp 多結晶シリコン膜の検査方法及びその装置
US20130341310A1 (en) * 2012-06-22 2013-12-26 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer laser annealing process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107421638A (zh) * 2017-08-25 2017-12-01 西京学院 一种新型的光学衍射模拟方法及其装置
CN107421638B (zh) * 2017-08-25 2019-09-06 西京学院 一种光学衍射模拟方法及其装置

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US20150247808A1 (en) 2015-09-03
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