KR102154495B1 - 엑시머 레이저 어닐링 제어를 위한 모니터링 방법 및 장치 - Google Patents

엑시머 레이저 어닐링 제어를 위한 모니터링 방법 및 장치 Download PDF

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KR102154495B1
KR102154495B1 KR1020167026314A KR20167026314A KR102154495B1 KR 102154495 B1 KR102154495 B1 KR 102154495B1 KR 1020167026314 A KR1020167026314 A KR 1020167026314A KR 20167026314 A KR20167026314 A KR 20167026314A KR 102154495 B1 KR102154495 B1 KR 102154495B1
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KR20160127768A (ko
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데르 빌트 폴 반
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코히런트 레이저시스템즈 게엠바하 운트 컴파니 카게
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    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B1/00Single-crystal growth directly from the solid state
    • C30B1/02Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
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    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
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    • H10P14/38Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials characterised by treatments done after the formation of the materials
    • H10P14/3802Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
    • H10P14/3808Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
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  • Recrystallisation Techniques (AREA)
  • Electromagnetism (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
KR1020167026314A 2014-03-03 2015-03-02 엑시머 레이저 어닐링 제어를 위한 모니터링 방법 및 장치 Active KR102154495B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/195,656 US9335276B2 (en) 2014-03-03 2014-03-03 Monitoring method and apparatus for control of excimer laser annealing
US14/195,656 2014-03-03
PCT/EP2015/054326 WO2015132210A1 (en) 2014-03-03 2015-03-02 Monitoring method and apparatus for control of excimer laser annealing

Publications (2)

Publication Number Publication Date
KR20160127768A KR20160127768A (ko) 2016-11-04
KR102154495B1 true KR102154495B1 (ko) 2020-09-10

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US (2) US9335276B2 (enExample)
JP (2) JP6738279B2 (enExample)
KR (1) KR102154495B1 (enExample)
CN (1) CN106463367A (enExample)
TW (1) TWI660410B (enExample)
WO (1) WO2015132210A1 (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455211B2 (en) 2013-09-11 2016-09-27 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with openings in buffer layer
US9425121B2 (en) 2013-09-11 2016-08-23 Taiwan Semiconductor Manufacturing Company, Ltd. Integrated fan-out structure with guiding trenches in buffer layer
CN106198568B (zh) * 2015-05-24 2019-03-12 上海微电子装备(集团)股份有限公司 一种具有透明基底的薄膜的测量装置及测量方法
US9976969B1 (en) * 2016-10-28 2018-05-22 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer-laser annealing process
US10069273B1 (en) 2017-03-02 2018-09-04 Coherent Lasersystems Gmbh & Co. Kg Lasing-gas mixture for excimer laser
CN107421638B (zh) * 2017-08-25 2019-09-06 西京学院 一种光学衍射模拟方法及其装置
JP2019047058A (ja) * 2017-09-06 2019-03-22 株式会社ブイ・テクノロジー 結晶化モニタ方法、レーザアニール装置、およびレーザアニール方法
CN107677686B (zh) * 2017-09-28 2021-01-26 京东方科技集团股份有限公司 光线透过窗集成装置及采用该装置的设备
TWI672493B (zh) * 2018-03-07 2019-09-21 由田新技股份有限公司 用於檢測面板斑紋的光學檢測系統及其方法
GB2587691B (en) * 2018-03-16 2022-02-09 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
GB2571997B (en) * 2018-03-16 2021-10-27 X Fab Texas Inc Use of wafer brightness to monitor laser anneal process and laser anneal tool
JP7219590B2 (ja) * 2018-10-30 2023-02-08 浜松ホトニクス株式会社 レーザ加工装置
KR102688794B1 (ko) * 2019-01-11 2024-07-29 삼성디스플레이 주식회사 레이저 결정화 장치
US10832635B2 (en) * 2019-03-12 2020-11-10 Himax Display, Inc. Display apparatus having display panel and humidity detection method thereof and gamma curve calibration method thereof
CN110993491B (zh) * 2019-12-19 2023-09-26 信利(仁寿)高端显示科技有限公司 一种准分子激光退火制程oed的自动校正方法
JP7542350B2 (ja) * 2020-07-21 2024-08-30 Jswアクティナシステム株式会社 レーザアニール装置、レーザアニール方法、及び半導体装置の製造方法
KR20220022016A (ko) * 2020-08-14 2022-02-23 삼성디스플레이 주식회사 디스플레이 장치의 제조 장치 및 디스플레이 장치의 제조 방법
US12148615B2 (en) 2021-05-06 2024-11-19 Coherent Lasersystems Gmbh & Co. Kg Method and apparatus for laser annealing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065146A (ja) 2007-08-15 2009-03-26 Sony Corp 半導体薄膜の形成方法および半導体薄膜の検査装置
JP2013258181A (ja) 2012-06-11 2013-12-26 Hitachi High-Technologies Corp 多結晶シリコン膜の検査方法及びその装置
US20130341310A1 (en) 2012-06-22 2013-12-26 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer laser annealing process

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60263642A (ja) * 1984-06-12 1985-12-27 Nippon Seiko Kk パタ−ン原図自動読取り装置
US4806018A (en) 1987-07-06 1989-02-21 The Boeing Company Angular reflectance sensor
US4810047A (en) 1988-02-16 1989-03-07 Grumman Aerospace Corporation In-line holographic lens arrangement
US5432607A (en) 1993-02-22 1995-07-11 International Business Machines Corporation Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry
US5473426A (en) 1993-03-05 1995-12-05 Nikon Corporation Defect inspection apparatus
JP3342387B2 (ja) 1997-02-28 2002-11-05 三洋電機株式会社 半導体膜の評価方法、評価装置及び形成方法
JP2001110861A (ja) 1999-10-06 2001-04-20 Seiko Epson Corp 半導体膜の検査方法、薄膜トランジスタの製造方法、および半導体膜の検査装置
CN1397089A (zh) 2000-02-15 2003-02-12 松下电器产业株式会社 非单晶薄膜、带非单晶薄膜的衬底、其制造方法及其制造装置、以及其检查方法及其检查装置、以及利用该非单晶薄膜的薄膜晶体管、薄膜晶体管阵列及图像显示装置
US6429943B1 (en) 2000-03-29 2002-08-06 Therma-Wave, Inc. Critical dimension analysis with simultaneous multiple angle of incidence measurements
US6864971B2 (en) 2001-03-27 2005-03-08 Isoa, Inc. System and method for performing optical inspection utilizing diffracted light
US6639201B2 (en) * 2001-11-07 2003-10-28 Applied Materials, Inc. Spot grid array imaging system
JP3794482B2 (ja) 2002-04-19 2006-07-05 株式会社日本製鋼所 結晶化Si膜の評価方法及びその装置
US7359045B2 (en) 2002-05-06 2008-04-15 Applied Materials, Israel, Ltd. High speed laser scanning inspection system
KR101058464B1 (ko) 2002-08-19 2011-08-24 더 트러스티스 오브 콜롬비아 유니버시티 인 더 시티 오브 뉴욕 기판상의 필름영역과 그 에지영역에서의 실질적인 균일성을제공하기 위한 필름영역의 레이저 결정 가공을 위한 방법과 시스템 및 그 필름영역을 가진 구조물
JP4024657B2 (ja) 2002-11-21 2007-12-19 株式会社日本製鋼所 結晶の周期性構造の形成方法及びその装置
US7006224B2 (en) * 2002-12-30 2006-02-28 Applied Materials, Israel, Ltd. Method and system for optical inspection of an object
JP4463600B2 (ja) * 2003-03-26 2010-05-19 株式会社半導体エネルギー研究所 評価方法
TWI254792B (en) 2003-07-01 2006-05-11 Au Optronics Corp Detecting method and device of laser crystalline silicon
US7061623B2 (en) 2003-08-25 2006-06-13 Spectel Research Corporation Interferometric back focal plane scatterometry with Koehler illumination
JP2005191173A (ja) 2003-12-25 2005-07-14 Hitachi Ltd 表示装置及びその製造方法
JP4963064B2 (ja) 2004-03-04 2012-06-27 シャープ株式会社 半導体装置の製造方法および半導体検査装置
JP4537131B2 (ja) * 2004-06-30 2010-09-01 友達光電股▲ふん▼有限公司 レーザー結晶シリコンの検査方法及びその装置
US7247813B2 (en) 2004-10-13 2007-07-24 Advanced Lcd Technologies Development Center Co., Ltd. Crystallization apparatus using pulsed laser beam
US7515253B2 (en) 2005-01-12 2009-04-07 Kla-Tencor Technologies Corporation System for measuring a sample with a layer containing a periodic diffracting structure
WO2007100608A1 (en) 2006-02-22 2007-09-07 Coherent, Inc. Laser beam micro-smoothing
JP4946093B2 (ja) * 2006-03-01 2012-06-06 ソニー株式会社 レーザアニール装置のレーザ光のエネルギー決定方法、レーザアニール装置のレーザ光のエネルギー決定装置及びレーザアニール装置及び薄膜トランジスタの製造方法
JP4876019B2 (ja) 2007-04-25 2012-02-15 株式会社日立ハイテクノロジーズ 欠陥検査装置およびその方法
US7659989B2 (en) 2007-06-29 2010-02-09 Coherent, Inc. Focus determination for laser-mask imaging systems
FR2921012A1 (fr) 2007-09-13 2009-03-20 Advanced Track And Trace Sa Procede et dispositif de marquage d'une surface par nanostructures periodiques controlees
JP4618360B2 (ja) 2008-10-10 2011-01-26 ソニー株式会社 レーザアニール方法およびレーザアニール装置
JP5430488B2 (ja) * 2010-05-11 2014-02-26 株式会社日本製鋼所 レーザアニール処理装置、レーザアニール処理体の製造方法およびレーザアニール処理プログラム
JP2012015445A (ja) * 2010-07-05 2012-01-19 Japan Steel Works Ltd:The レーザアニール処理装置およびレーザアニール処理方法
KR101490830B1 (ko) * 2011-02-23 2015-02-06 가부시끼가이샤 니혼 세이꼬쇼 박막의 표면 검사 방법 및 검사 장치
JP6096228B2 (ja) * 2015-01-09 2017-03-15 株式会社日本製鋼所 半導体膜の表面ムラ検出装置、レーザアニール装置および半導体膜の表面ムラ検出方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009065146A (ja) 2007-08-15 2009-03-26 Sony Corp 半導体薄膜の形成方法および半導体薄膜の検査装置
JP2013258181A (ja) 2012-06-11 2013-12-26 Hitachi High-Technologies Corp 多結晶シリコン膜の検査方法及びその装置
US20130341310A1 (en) 2012-06-22 2013-12-26 Coherent Lasersystems Gmbh & Co. Kg Monitoring method and apparatus for excimer laser annealing process

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US20150247808A1 (en) 2015-09-03
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