JP6738279B2 - エキシマレーザアニーリングの制御のための監視方法および装置 - Google Patents
エキシマレーザアニーリングの制御のための監視方法および装置 Download PDFInfo
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- JP6738279B2 JP6738279B2 JP2016555338A JP2016555338A JP6738279B2 JP 6738279 B2 JP6738279 B2 JP 6738279B2 JP 2016555338 A JP2016555338 A JP 2016555338A JP 2016555338 A JP2016555338 A JP 2016555338A JP 6738279 B2 JP6738279 B2 JP 6738279B2
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Classifications
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
-
- H10P72/0604—
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0092—Polarisation microscopes
-
- H10P34/42—
-
- H10P74/203—
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8461—Investigating impurities in semiconductor, e.g. Silicon
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8477—Investigating crystals, e.g. liquid crystals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
- G01N2201/0683—Brewster plate; polarisation controlling elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/069—Supply of sources
- G01N2201/0696—Pulsed
- G01N2201/0697—Pulsed lasers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/105—Purely optical scan
-
- H10P14/3411—
-
- H10P14/3816—
Landscapes
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mathematical Physics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Recrystallisation Techniques (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/195,656 | 2014-03-03 | ||
| US14/195,656 US9335276B2 (en) | 2014-03-03 | 2014-03-03 | Monitoring method and apparatus for control of excimer laser annealing |
| PCT/EP2015/054326 WO2015132210A1 (en) | 2014-03-03 | 2015-03-02 | Monitoring method and apparatus for control of excimer laser annealing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108507A Division JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017512382A JP2017512382A (ja) | 2017-05-18 |
| JP2017512382A5 JP2017512382A5 (enExample) | 2018-11-08 |
| JP6738279B2 true JP6738279B2 (ja) | 2020-08-12 |
Family
ID=52596988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016555338A Active JP6738279B2 (ja) | 2014-03-03 | 2015-03-02 | エキシマレーザアニーリングの制御のための監視方法および装置 |
| JP2019108507A Withdrawn JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108507A Withdrawn JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9335276B2 (enExample) |
| JP (2) | JP6738279B2 (enExample) |
| KR (1) | KR102154495B1 (enExample) |
| CN (1) | CN106463367A (enExample) |
| TW (1) | TWI660410B (enExample) |
| WO (1) | WO2015132210A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9455211B2 (en) * | 2013-09-11 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with openings in buffer layer |
| US9425121B2 (en) | 2013-09-11 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with guiding trenches in buffer layer |
| CN106198568B (zh) * | 2015-05-24 | 2019-03-12 | 上海微电子装备(集团)股份有限公司 | 一种具有透明基底的薄膜的测量装置及测量方法 |
| US9976969B1 (en) | 2016-10-28 | 2018-05-22 | Coherent Lasersystems Gmbh & Co. Kg | Monitoring method and apparatus for excimer-laser annealing process |
| US10069273B1 (en) | 2017-03-02 | 2018-09-04 | Coherent Lasersystems Gmbh & Co. Kg | Lasing-gas mixture for excimer laser |
| CN107421638B (zh) * | 2017-08-25 | 2019-09-06 | 西京学院 | 一种光学衍射模拟方法及其装置 |
| JP2019047058A (ja) * | 2017-09-06 | 2019-03-22 | 株式会社ブイ・テクノロジー | 結晶化モニタ方法、レーザアニール装置、およびレーザアニール方法 |
| CN107677686B (zh) * | 2017-09-28 | 2021-01-26 | 京东方科技集团股份有限公司 | 光线透过窗集成装置及采用该装置的设备 |
| TWI672493B (zh) * | 2018-03-07 | 2019-09-21 | 由田新技股份有限公司 | 用於檢測面板斑紋的光學檢測系統及其方法 |
| GB2571997B (en) * | 2018-03-16 | 2021-10-27 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| GB2587691B (en) * | 2018-03-16 | 2022-02-09 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| JP7219590B2 (ja) * | 2018-10-30 | 2023-02-08 | 浜松ホトニクス株式会社 | レーザ加工装置 |
| KR102688794B1 (ko) * | 2019-01-11 | 2024-07-29 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
| US10832635B2 (en) * | 2019-03-12 | 2020-11-10 | Himax Display, Inc. | Display apparatus having display panel and humidity detection method thereof and gamma curve calibration method thereof |
| CN110993491B (zh) * | 2019-12-19 | 2023-09-26 | 信利(仁寿)高端显示科技有限公司 | 一种准分子激光退火制程oed的自动校正方法 |
| JP7542350B2 (ja) * | 2020-07-21 | 2024-08-30 | Jswアクティナシステム株式会社 | レーザアニール装置、レーザアニール方法、及び半導体装置の製造方法 |
| KR20220022016A (ko) * | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 디스플레이 장치의 제조 장치 및 디스플레이 장치의 제조 방법 |
| US12148615B2 (en) | 2021-05-06 | 2024-11-19 | Coherent Lasersystems Gmbh & Co. Kg | Method and apparatus for laser annealing |
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| JPS60263642A (ja) * | 1984-06-12 | 1985-12-27 | Nippon Seiko Kk | パタ−ン原図自動読取り装置 |
| US4806018A (en) | 1987-07-06 | 1989-02-21 | The Boeing Company | Angular reflectance sensor |
| US4810047A (en) | 1988-02-16 | 1989-03-07 | Grumman Aerospace Corporation | In-line holographic lens arrangement |
| US5432607A (en) | 1993-02-22 | 1995-07-11 | International Business Machines Corporation | Method and apparatus for inspecting patterned thin films using diffracted beam ellipsometry |
| US5473426A (en) | 1993-03-05 | 1995-12-05 | Nikon Corporation | Defect inspection apparatus |
| JP3342387B2 (ja) | 1997-02-28 | 2002-11-05 | 三洋電機株式会社 | 半導体膜の評価方法、評価装置及び形成方法 |
| JP2001110861A (ja) | 1999-10-06 | 2001-04-20 | Seiko Epson Corp | 半導体膜の検査方法、薄膜トランジスタの製造方法、および半導体膜の検査装置 |
| US20030017658A1 (en) | 2000-02-15 | 2003-01-23 | Hikaru Nishitani | Non-single crystal film, substrate with non-single crystal film, method and apparatus for producing the same, method and apparatus for inspecting the same, thin film trasistor, thin film transistor array and image display using it |
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| US7359045B2 (en) | 2002-05-06 | 2008-04-15 | Applied Materials, Israel, Ltd. | High speed laser scanning inspection system |
| TWI344027B (en) | 2002-08-19 | 2011-06-21 | Univ Columbia | Process and system for laser crystallization processing of film regions on a substrate to provide substantial uniformity within areas in such regions and edge areas thereof, and a structure of such film regions |
| JP4024657B2 (ja) | 2002-11-21 | 2007-12-19 | 株式会社日本製鋼所 | 結晶の周期性構造の形成方法及びその装置 |
| US7006224B2 (en) * | 2002-12-30 | 2006-02-28 | Applied Materials, Israel, Ltd. | Method and system for optical inspection of an object |
| JP4463600B2 (ja) * | 2003-03-26 | 2010-05-19 | 株式会社半導体エネルギー研究所 | 評価方法 |
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| JP4537131B2 (ja) * | 2004-06-30 | 2010-09-01 | 友達光電股▲ふん▼有限公司 | レーザー結晶シリコンの検査方法及びその装置 |
| US7247813B2 (en) | 2004-10-13 | 2007-07-24 | Advanced Lcd Technologies Development Center Co., Ltd. | Crystallization apparatus using pulsed laser beam |
| US7515253B2 (en) | 2005-01-12 | 2009-04-07 | Kla-Tencor Technologies Corporation | System for measuring a sample with a layer containing a periodic diffracting structure |
| JP5305442B2 (ja) | 2006-02-22 | 2013-10-02 | コヒーレント・インク | レーザービーム・ミクロスムージング |
| JP4946093B2 (ja) * | 2006-03-01 | 2012-06-06 | ソニー株式会社 | レーザアニール装置のレーザ光のエネルギー決定方法、レーザアニール装置のレーザ光のエネルギー決定装置及びレーザアニール装置及び薄膜トランジスタの製造方法 |
| JP4876019B2 (ja) | 2007-04-25 | 2012-02-15 | 株式会社日立ハイテクノロジーズ | 欠陥検査装置およびその方法 |
| US7659989B2 (en) | 2007-06-29 | 2010-02-09 | Coherent, Inc. | Focus determination for laser-mask imaging systems |
| JP2009065146A (ja) * | 2007-08-15 | 2009-03-26 | Sony Corp | 半導体薄膜の形成方法および半導体薄膜の検査装置 |
| FR2921012A1 (fr) | 2007-09-13 | 2009-03-20 | Advanced Track And Trace Sa | Procede et dispositif de marquage d'une surface par nanostructures periodiques controlees |
| JP4618360B2 (ja) | 2008-10-10 | 2011-01-26 | ソニー株式会社 | レーザアニール方法およびレーザアニール装置 |
| JP5430488B2 (ja) * | 2010-05-11 | 2014-02-26 | 株式会社日本製鋼所 | レーザアニール処理装置、レーザアニール処理体の製造方法およびレーザアニール処理プログラム |
| JP2012015445A (ja) * | 2010-07-05 | 2012-01-19 | Japan Steel Works Ltd:The | レーザアニール処理装置およびレーザアニール処理方法 |
| KR101490830B1 (ko) * | 2011-02-23 | 2015-02-06 | 가부시끼가이샤 니혼 세이꼬쇼 | 박막의 표면 검사 방법 및 검사 장치 |
| JP2013258181A (ja) | 2012-06-11 | 2013-12-26 | Hitachi High-Technologies Corp | 多結晶シリコン膜の検査方法及びその装置 |
| US20130341310A1 (en) | 2012-06-22 | 2013-12-26 | Coherent Lasersystems Gmbh & Co. Kg | Monitoring method and apparatus for excimer laser annealing process |
| JP6096228B2 (ja) * | 2015-01-09 | 2017-03-15 | 株式会社日本製鋼所 | 半導体膜の表面ムラ検出装置、レーザアニール装置および半導体膜の表面ムラ検出方法 |
-
2014
- 2014-03-03 US US14/195,656 patent/US9335276B2/en active Active
-
2015
- 2015-02-26 TW TW104106291A patent/TWI660410B/zh active
- 2015-03-02 CN CN201580011771.3A patent/CN106463367A/zh active Pending
- 2015-03-02 JP JP2016555338A patent/JP6738279B2/ja active Active
- 2015-03-02 KR KR1020167026314A patent/KR102154495B1/ko active Active
- 2015-03-02 WO PCT/EP2015/054326 patent/WO2015132210A1/en not_active Ceased
-
2016
- 2016-04-07 US US15/093,424 patent/US10121687B2/en active Active
-
2019
- 2019-06-11 JP JP2019108507A patent/JP2019169732A/ja not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015132210A1 (en) | 2015-09-11 |
| JP2017512382A (ja) | 2017-05-18 |
| US20160233116A1 (en) | 2016-08-11 |
| JP2019169732A (ja) | 2019-10-03 |
| KR20160127768A (ko) | 2016-11-04 |
| US10121687B2 (en) | 2018-11-06 |
| US20150247808A1 (en) | 2015-09-03 |
| KR102154495B1 (ko) | 2020-09-10 |
| TW201539551A (zh) | 2015-10-16 |
| TWI660410B (zh) | 2019-05-21 |
| US9335276B2 (en) | 2016-05-10 |
| CN106463367A (zh) | 2017-02-22 |
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