JP6738279B2 - エキシマレーザアニーリングの制御のための監視方法および装置 - Google Patents
エキシマレーザアニーリングの制御のための監視方法および装置 Download PDFInfo
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- JP6738279B2 JP6738279B2 JP2016555338A JP2016555338A JP6738279B2 JP 6738279 B2 JP6738279 B2 JP 6738279B2 JP 2016555338 A JP2016555338 A JP 2016555338A JP 2016555338 A JP2016555338 A JP 2016555338A JP 6738279 B2 JP6738279 B2 JP 6738279B2
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B1/00—Single-crystal growth directly from the solid state
- C30B1/02—Single-crystal growth directly from the solid state by thermal treatment, e.g. strain annealing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/21—Polarisation-affecting properties
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/47—Scattering, i.e. diffuse reflection
- G01N21/4788—Diffraction
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/8422—Investigating thin films, e.g. matrix isolation method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/002—Scanning microscopes
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/0004—Microscopes specially adapted for specific applications
- G02B21/0092—Polarisation microscopes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02518—Deposited layers
- H01L21/02521—Materials
- H01L21/02524—Group 14 semiconducting materials
- H01L21/02532—Silicon, silicon germanium, germanium
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02656—Special treatments
- H01L21/02664—Aftertreatments
- H01L21/02667—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth
- H01L21/02675—Crystallisation or recrystallisation of non-monocrystalline semiconductor materials, e.g. regrowth using laser beams
- H01L21/02686—Pulsed laser beam
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8461—Investigating impurities in semiconductor, e.g. Silicon
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N2021/8477—Investigating crystals, e.g. liquid crystals
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/061—Sources
- G01N2201/06113—Coherent sources; lasers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/068—Optics, miscellaneous
- G01N2201/0683—Brewster plate; polarisation controlling elements
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/06—Illumination; Optics
- G01N2201/069—Supply of sources
- G01N2201/0696—Pulsed
- G01N2201/0697—Pulsed lasers
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2201/00—Features of devices classified in G01N21/00
- G01N2201/10—Scanning
- G01N2201/105—Purely optical scan
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- High Energy & Nuclear Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mathematical Physics (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Signal Processing (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Thermal Sciences (AREA)
- Recrystallisation Techniques (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/195,656 | 2014-03-03 | ||
| US14/195,656 US9335276B2 (en) | 2014-03-03 | 2014-03-03 | Monitoring method and apparatus for control of excimer laser annealing |
| PCT/EP2015/054326 WO2015132210A1 (en) | 2014-03-03 | 2015-03-02 | Monitoring method and apparatus for control of excimer laser annealing |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108507A Division JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017512382A JP2017512382A (ja) | 2017-05-18 |
| JP2017512382A5 JP2017512382A5 (enExample) | 2018-11-08 |
| JP6738279B2 true JP6738279B2 (ja) | 2020-08-12 |
Family
ID=52596988
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016555338A Active JP6738279B2 (ja) | 2014-03-03 | 2015-03-02 | エキシマレーザアニーリングの制御のための監視方法および装置 |
| JP2019108507A Withdrawn JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019108507A Withdrawn JP2019169732A (ja) | 2014-03-03 | 2019-06-11 | エキシマレーザアニーリングの制御のための監視方法および装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US9335276B2 (enExample) |
| JP (2) | JP6738279B2 (enExample) |
| KR (1) | KR102154495B1 (enExample) |
| CN (1) | CN106463367A (enExample) |
| TW (1) | TWI660410B (enExample) |
| WO (1) | WO2015132210A1 (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9425121B2 (en) | 2013-09-11 | 2016-08-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with guiding trenches in buffer layer |
| US9455211B2 (en) | 2013-09-11 | 2016-09-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | Integrated fan-out structure with openings in buffer layer |
| CN106198568B (zh) * | 2015-05-24 | 2019-03-12 | 上海微电子装备(集团)股份有限公司 | 一种具有透明基底的薄膜的测量装置及测量方法 |
| US9976969B1 (en) * | 2016-10-28 | 2018-05-22 | Coherent Lasersystems Gmbh & Co. Kg | Monitoring method and apparatus for excimer-laser annealing process |
| US10069273B1 (en) | 2017-03-02 | 2018-09-04 | Coherent Lasersystems Gmbh & Co. Kg | Lasing-gas mixture for excimer laser |
| CN107421638B (zh) * | 2017-08-25 | 2019-09-06 | 西京学院 | 一种光学衍射模拟方法及其装置 |
| JP2019047058A (ja) * | 2017-09-06 | 2019-03-22 | 株式会社ブイ・テクノロジー | 結晶化モニタ方法、レーザアニール装置、およびレーザアニール方法 |
| CN107677686B (zh) * | 2017-09-28 | 2021-01-26 | 京东方科技集团股份有限公司 | 光线透过窗集成装置及采用该装置的设备 |
| TWI672493B (zh) * | 2018-03-07 | 2019-09-21 | 由田新技股份有限公司 | 用於檢測面板斑紋的光學檢測系統及其方法 |
| GB2571997B (en) * | 2018-03-16 | 2021-10-27 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| GB2587691B (en) * | 2018-03-16 | 2022-02-09 | X Fab Texas Inc | Use of wafer brightness to monitor laser anneal process and laser anneal tool |
| JP7219590B2 (ja) * | 2018-10-30 | 2023-02-08 | 浜松ホトニクス株式会社 | レーザ加工装置 |
| KR102688794B1 (ko) * | 2019-01-11 | 2024-07-29 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
| US10832635B2 (en) * | 2019-03-12 | 2020-11-10 | Himax Display, Inc. | Display apparatus having display panel and humidity detection method thereof and gamma curve calibration method thereof |
| CN110993491B (zh) * | 2019-12-19 | 2023-09-26 | 信利(仁寿)高端显示科技有限公司 | 一种准分子激光退火制程oed的自动校正方法 |
| JP7542350B2 (ja) * | 2020-07-21 | 2024-08-30 | Jswアクティナシステム株式会社 | レーザアニール装置、レーザアニール方法、及び半導体装置の製造方法 |
| KR20220022016A (ko) * | 2020-08-14 | 2022-02-23 | 삼성디스플레이 주식회사 | 디스플레이 장치의 제조 장치 및 디스플레이 장치의 제조 방법 |
| US12148615B2 (en) | 2021-05-06 | 2024-11-19 | Coherent Lasersystems Gmbh & Co. Kg | Method and apparatus for laser annealing |
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| JP5430488B2 (ja) * | 2010-05-11 | 2014-02-26 | 株式会社日本製鋼所 | レーザアニール処理装置、レーザアニール処理体の製造方法およびレーザアニール処理プログラム |
| JP2012015445A (ja) * | 2010-07-05 | 2012-01-19 | Japan Steel Works Ltd:The | レーザアニール処理装置およびレーザアニール処理方法 |
| JP5641545B2 (ja) * | 2011-02-23 | 2014-12-17 | 株式会社日本製鋼所 | 薄膜の表面検査方法および検査装置 |
| JP2013258181A (ja) | 2012-06-11 | 2013-12-26 | Hitachi High-Technologies Corp | 多結晶シリコン膜の検査方法及びその装置 |
| US20130341310A1 (en) | 2012-06-22 | 2013-12-26 | Coherent Lasersystems Gmbh & Co. Kg | Monitoring method and apparatus for excimer laser annealing process |
| JP6096228B2 (ja) * | 2015-01-09 | 2017-03-15 | 株式会社日本製鋼所 | 半導体膜の表面ムラ検出装置、レーザアニール装置および半導体膜の表面ムラ検出方法 |
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| JP2017512382A (ja) | 2017-05-18 |
| CN106463367A (zh) | 2017-02-22 |
| KR20160127768A (ko) | 2016-11-04 |
| TWI660410B (zh) | 2019-05-21 |
| WO2015132210A1 (en) | 2015-09-11 |
| JP2019169732A (ja) | 2019-10-03 |
| KR102154495B1 (ko) | 2020-09-10 |
| US20150247808A1 (en) | 2015-09-03 |
| US20160233116A1 (en) | 2016-08-11 |
| TW201539551A (zh) | 2015-10-16 |
| US10121687B2 (en) | 2018-11-06 |
| US9335276B2 (en) | 2016-05-10 |
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