CN106449763B - 一种薄膜晶体管及制造方法和显示器面板 - Google Patents

一种薄膜晶体管及制造方法和显示器面板 Download PDF

Info

Publication number
CN106449763B
CN106449763B CN201610964470.9A CN201610964470A CN106449763B CN 106449763 B CN106449763 B CN 106449763B CN 201610964470 A CN201610964470 A CN 201610964470A CN 106449763 B CN106449763 B CN 106449763B
Authority
CN
China
Prior art keywords
electrode
thin film
film transistor
active layer
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201610964470.9A
Other languages
English (en)
Chinese (zh)
Other versions
CN106449763A (zh
Inventor
陆磊
王文
郭海成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of CN106449763A publication Critical patent/CN106449763A/zh
Application granted granted Critical
Publication of CN106449763B publication Critical patent/CN106449763B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1222Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer
    • H01L27/1225Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition, shape or crystalline structure of the active layer with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/324Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/702Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof
    • H01L21/707Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof of thick-or thin-film circuits or parts thereof of thin-film circuits or parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8236Combination of enhancement and depletion transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1251Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs comprising TFTs having a different architecture, e.g. top- and bottom gate TFTs
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0603Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by particular constructional design considerations, e.g. for preventing surface leakage, for controlling electric field concentration or for internal isolations regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/0684Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/08Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/0843Source or drain regions of field-effect devices
    • H01L29/0847Source or drain regions of field-effect devices of field-effect transistors with insulated gate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025Channel region of field-effect devices
    • H01L29/1029Channel region of field-effect devices of field-effect transistors
    • H01L29/1033Channel region of field-effect devices of field-effect transistors with insulated gate, e.g. characterised by the length, the width, the geometric contour or the doping structure
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L2021/775Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate comprising a plurality of TFTs on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Thin Film Transistor (AREA)
CN201610964470.9A 2015-10-29 2016-10-28 一种薄膜晶体管及制造方法和显示器面板 Expired - Fee Related CN106449763B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201562285436P 2015-10-29 2015-10-29
US62/285,436 2015-10-29

Publications (2)

Publication Number Publication Date
CN106449763A CN106449763A (zh) 2017-02-22
CN106449763B true CN106449763B (zh) 2019-06-25

Family

ID=57956711

Family Applications (6)

Application Number Title Priority Date Filing Date
CN201610967204.1A Expired - Fee Related CN106486499B (zh) 2015-10-29 2016-10-28 一种电路结构及制造方法和显示器面板
CN201610964470.9A Expired - Fee Related CN106449763B (zh) 2015-10-29 2016-10-28 一种薄膜晶体管及制造方法和显示器面板
CN201610967203.7A Expired - Fee Related CN106449732B (zh) 2015-10-29 2016-10-28 一种薄膜晶体管及制造方法和显示器面板
CN201610964428.7A Expired - Fee Related CN106409841B (zh) 2015-10-29 2016-10-28 一种电路结构及制作方法和显示器面板
CN201610967201.8A Expired - Fee Related CN106384735B (zh) 2015-10-29 2016-10-28 一种显示器面板及制造方法
CN201621191798.3U Expired - Fee Related CN206505923U (zh) 2015-10-29 2016-10-28 一种薄膜晶体管及显示器面板

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201610967204.1A Expired - Fee Related CN106486499B (zh) 2015-10-29 2016-10-28 一种电路结构及制造方法和显示器面板

Family Applications After (4)

Application Number Title Priority Date Filing Date
CN201610967203.7A Expired - Fee Related CN106449732B (zh) 2015-10-29 2016-10-28 一种薄膜晶体管及制造方法和显示器面板
CN201610964428.7A Expired - Fee Related CN106409841B (zh) 2015-10-29 2016-10-28 一种电路结构及制作方法和显示器面板
CN201610967201.8A Expired - Fee Related CN106384735B (zh) 2015-10-29 2016-10-28 一种显示器面板及制造方法
CN201621191798.3U Expired - Fee Related CN206505923U (zh) 2015-10-29 2016-10-28 一种薄膜晶体管及显示器面板

Country Status (2)

Country Link
CN (6) CN106486499B (fr)
WO (5) WO2017071662A1 (fr)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107425049A (zh) * 2017-05-23 2017-12-01 华南理工大学 一种类岛状电子传输的薄膜晶体管及制备方法
CN107546259A (zh) * 2017-09-06 2018-01-05 深圳市华星光电技术有限公司 Igzo薄膜晶体管及其制作方法
CN109273352B (zh) * 2018-10-25 2021-03-30 山东大学 一种高性能多元非晶金属氧化物薄膜晶体管的制备方法
CN109817723B (zh) * 2019-01-24 2022-07-05 北京京东方技术开发有限公司 一种薄膜晶体管及其制备方法、阵列基板和显示装置
CN110161761A (zh) * 2019-05-10 2019-08-23 香港科技大学 液晶显示面板及其制作方法以及显示设备
CN112802904A (zh) * 2020-12-29 2021-05-14 重庆先进光电显示技术研究院 薄膜晶体管器件的制作方法、薄膜晶体管器件及显示装置
CN113707724B (zh) * 2021-07-14 2024-03-26 山东师范大学 一种氧化物薄膜晶体管及其制备方法与应用
CN113745156A (zh) * 2021-08-23 2021-12-03 Tcl华星光电技术有限公司 显示面板及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102646683A (zh) * 2012-02-02 2012-08-22 京东方科技集团股份有限公司 一种阵列基板及其制造方法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1155095A (zh) * 1989-11-29 1997-07-23 纳幕尔杜邦公司 电-光调制器
JP2000311992A (ja) * 1999-04-26 2000-11-07 Toshiba Corp 不揮発性半導体記憶装置およびその製造方法
US6531365B2 (en) * 2001-06-22 2003-03-11 International Business Machines Corporation Anti-spacer structure for self-aligned independent gate implantation
KR100845557B1 (ko) * 2002-02-20 2008-07-10 삼성전자주식회사 액티브 매트릭스형 유기전계발광 표시장치 및 그 제조방법
KR100659759B1 (ko) * 2004-10-06 2006-12-19 삼성에스디아이 주식회사 바텀 게이트형 박막트랜지스터, 그를 구비하는평판표시장치 및 박막트랜지스터의 제조방법
US8222646B2 (en) * 2005-07-08 2012-07-17 The Hong Kong University Of Science And Technology Thin-film transistors with metal source and drain and methods of fabrication
KR101236427B1 (ko) * 2006-05-10 2013-02-22 삼성디스플레이 주식회사 박막 트랜지스터용 게이트 절연막의 제조방법 및 이를이용한 박막 트랜지스터의 제조방법
JP5127183B2 (ja) * 2006-08-23 2013-01-23 キヤノン株式会社 アモルファス酸化物半導体膜を用いた薄膜トランジスタの製造方法
CN101217112A (zh) * 2007-01-04 2008-07-09 中国科学院微电子研究所 一种纳米尺度W/TiN复合难熔金属栅制备方法
JP5213422B2 (ja) * 2007-12-04 2013-06-19 キヤノン株式会社 絶縁層を有する酸化物半導体素子およびそれを用いた表示装置
KR101490112B1 (ko) * 2008-03-28 2015-02-05 삼성전자주식회사 인버터 및 그를 포함하는 논리회로
JP5331382B2 (ja) * 2008-05-30 2013-10-30 富士フイルム株式会社 半導体素子の製造方法
KR100958006B1 (ko) * 2008-06-18 2010-05-17 삼성모바일디스플레이주식회사 박막 트랜지스터, 그의 제조 방법 및 박막 트랜지스터를구비하는 평판 표시 장치
US8492756B2 (en) * 2009-01-23 2013-07-23 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN101478005B (zh) * 2009-02-13 2010-06-09 北京大学深圳研究生院 一种金属氧化物薄膜晶体管及其制作方法
KR101608887B1 (ko) * 2009-04-17 2016-04-05 삼성전자주식회사 인버터와 그 제조방법 및 인버터를 포함하는 논리회로
WO2011034012A1 (fr) * 2009-09-16 2011-03-24 Semiconductor Energy Laboratory Co., Ltd. Circuit logique, dispositif électroluminescent, dispositif à semi-conducteurs et dispositif électronique
WO2011039853A1 (fr) * 2009-09-30 2011-04-07 キヤノン株式会社 Transistor à couches minces
KR20110093113A (ko) * 2010-02-11 2011-08-18 삼성전자주식회사 박막 트랜지스터 기판 및 이의 제조 방법
US9093539B2 (en) * 2011-05-13 2015-07-28 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method for manufacturing the same
CN102683423A (zh) * 2012-05-08 2012-09-19 东莞彩显有机发光科技有限公司 一种顶栅结构金属氧化物薄膜晶体管及其制作方法
CN104934481B (zh) * 2014-03-21 2017-10-13 北京大学深圳研究生院 一种薄膜晶体管及其制备方法
CN104157699B (zh) * 2014-08-06 2019-02-01 北京大学深圳研究生院 一种背沟道刻蚀型薄膜晶体管及其制备方法
CN104851809A (zh) * 2015-04-09 2015-08-19 信利(惠州)智能显示有限公司 薄膜晶体管及其制作方法、以及阵列基板与显示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102646683A (zh) * 2012-02-02 2012-08-22 京东方科技集团股份有限公司 一种阵列基板及其制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
A Bottom-Gate Indium-Gallium-Zinc Oxide Thin-Film Transistor With an Inherent Etch-Stop and Annealing-Induced Source and Drain Regions;Lei Lu;《IEEE TRANSACTIONS ON ELECTRON DEVICES》;20150228;第574-578页

Also Published As

Publication number Publication date
CN106449763A (zh) 2017-02-22
WO2017071662A1 (fr) 2017-05-04
CN106449732B (zh) 2020-04-21
WO2017071661A1 (fr) 2017-05-04
WO2017071659A1 (fr) 2017-05-04
CN106486499A (zh) 2017-03-08
CN106449732A (zh) 2017-02-22
WO2017071658A1 (fr) 2017-05-04
CN106384735A (zh) 2017-02-08
CN106486499B (zh) 2019-08-06
CN106409841B (zh) 2019-06-25
CN106384735B (zh) 2020-04-21
WO2017071660A1 (fr) 2017-05-04
CN106409841A (zh) 2017-02-15
CN206505923U (zh) 2017-09-19

Similar Documents

Publication Publication Date Title
CN106449763B (zh) 一种薄膜晶体管及制造方法和显示器面板
JP4919811B2 (ja) ドープされた部分を有する堆積チャネル領域を含むトランジスタ
KR100679917B1 (ko) 박막 트랜지스터 및 그 제조방법
KR101675114B1 (ko) 박막 트랜지스터 및 그 제조방법
TW201721720A (zh) 陣列基板、顯示裝置及陣列基板的製備方法陣列基板
JP6827270B2 (ja) 半導体装置の作製方法
CN101794819A (zh) 薄膜晶体管、其制备方法和包括它的平板显示装置
KR20090105561A (ko) 반도체 장치 및 그를 구비하는 평판 표시 장치
CN109037343B (zh) 一种双层沟道薄膜晶体管及其制备方法、显示面板
CN105789317A (zh) 薄膜晶体管器件及其制备方法
CN112599605A (zh) 一种阵列基板及其制备方法、显示装置
CN207517701U (zh) 一种薄膜晶体管及显示器面板
TWI422035B (zh) 半導體元件結構及其製造方法
CN206259353U (zh) 一种显示器面板
CN110047848B (zh) 一种阵列基板及其制备方法
US11309427B2 (en) Thin film transistor and method for manufacturing a thin film transistor
CN112542516B (zh) 一种主动开关及其制作方法和显示面板
US11081586B2 (en) Thin film transistor and method for manufacturing the same
TWI841913B (zh) 高壓元件及其製造方法
KR102668105B1 (ko) 박막 트랜지스터 및 그 제조 방법
CN110161761A (zh) 液晶显示面板及其制作方法以及显示设备
US8124979B2 (en) Thin film transistor and method of manufacturing the same
CN113571533A (zh) 阵列基板及显示面板
KR20200052203A (ko) 박막 트랜지스터 및 그 제조 방법
CN115050758A (zh) 阵列基板和显示面板

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190625

CF01 Termination of patent right due to non-payment of annual fee