CN105845635B - 电子封装结构 - Google Patents

电子封装结构 Download PDF

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Publication number
CN105845635B
CN105845635B CN201510022806.5A CN201510022806A CN105845635B CN 105845635 B CN105845635 B CN 105845635B CN 201510022806 A CN201510022806 A CN 201510022806A CN 105845635 B CN105845635 B CN 105845635B
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CN
China
Prior art keywords
layer
package structure
insulating
circuit layer
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201510022806.5A
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English (en)
Chinese (zh)
Other versions
CN105845635A (zh
Inventor
胡竹青
许诗滨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Phoenix Pioneer Technology Co Ltd
Original Assignee
Phoenix Pioneer Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Pioneer Technology Co Ltd filed Critical Phoenix Pioneer Technology Co Ltd
Priority to CN201510022806.5A priority Critical patent/CN105845635B/zh
Priority to JP2015090773A priority patent/JP6548949B2/ja
Priority to US14/990,933 priority patent/US10784205B2/en
Publication of CN105845635A publication Critical patent/CN105845635A/zh
Application granted granted Critical
Publication of CN105845635B publication Critical patent/CN105845635B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/611—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together
    • H10W70/614—Insulating or insulated package substrates; Interposers; Redistribution layers for connecting multiple chips together the multiple chips being integrally enclosed
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/093—Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10121—Optical component, e.g. opto-electronic component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/60—Seals
    • H10W76/63—Seals characterised by their shape or disposition, e.g. between cap and walls of a container
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Light Receiving Elements (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CN201510022806.5A 2015-01-16 2015-01-16 电子封装结构 Expired - Fee Related CN105845635B (zh)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN201510022806.5A CN105845635B (zh) 2015-01-16 2015-01-16 电子封装结构
JP2015090773A JP6548949B2 (ja) 2015-01-16 2015-04-27 電子パッケージ構造
US14/990,933 US10784205B2 (en) 2015-01-16 2016-01-08 Electronic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510022806.5A CN105845635B (zh) 2015-01-16 2015-01-16 电子封装结构

Publications (2)

Publication Number Publication Date
CN105845635A CN105845635A (zh) 2016-08-10
CN105845635B true CN105845635B (zh) 2018-12-07

Family

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Country Status (3)

Country Link
US (1) US10784205B2 (enExample)
JP (1) JP6548949B2 (enExample)
CN (1) CN105845635B (enExample)

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KR101942141B1 (ko) * 2015-05-12 2019-01-24 앰코테크놀로지코리아(주) 지문센서 패키지
JP6566726B2 (ja) * 2015-05-28 2019-08-28 新光電気工業株式会社 配線基板、及び、配線基板の製造方法
US9691708B1 (en) * 2016-07-20 2017-06-27 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor package and manufacturing method thereof
US9960328B2 (en) * 2016-09-06 2018-05-01 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
CN107968083A (zh) * 2016-10-19 2018-04-27 兆邦电子股份有限公司 芯片的封装结构
US10644046B2 (en) * 2017-04-07 2020-05-05 Samsung Electronics Co., Ltd. Fan-out sensor package and optical fingerprint sensor module including the same
WO2019004906A1 (en) * 2017-06-28 2019-01-03 Fingerprint Cards Ab METHOD FOR MANUFACTURING DIGITAL FOOTPRINT SENSOR MODULE
US10192843B1 (en) * 2017-07-26 2019-01-29 Micron Technology, Inc. Methods of making semiconductor device modules with increased yield
CN109585403B (zh) * 2017-09-29 2020-09-25 恒劲科技股份有限公司 传感器封装件及其制作方法
CN109698208B (zh) 2017-10-20 2023-06-30 新加坡有限公司 图像传感器的封装方法、图像传感器封装结构和镜头模组
CN109841638B (zh) * 2017-11-29 2024-12-27 宁波舜宇光电信息有限公司 一体光刻成型的感光组件和包括其的模塑感光组件和摄像模组及其制备方法
CN109872986B (zh) * 2017-12-04 2023-07-04 新加坡有限公司 光学传感器的封装结构及光学传感器的封装方法
CN110164984B (zh) * 2018-02-13 2024-02-09 宁波舜宇光电信息有限公司 一体感光模块、感光组件、摄像模组及制备方法
TWI688049B (zh) * 2018-05-18 2020-03-11 矽品精密工業股份有限公司 電子封裝件及其製法
CN109616466A (zh) * 2018-09-21 2019-04-12 芯光科技新加坡有限公司 指纹封装模组、封装方法、显示模组
TWI673834B (zh) * 2018-09-26 2019-10-01 矽品精密工業股份有限公司 電子封裝件及其製法
CN109461746A (zh) * 2018-09-30 2019-03-12 华为技术有限公司 一种摄像头组件、组装方法以及终端
CN111003682A (zh) * 2018-10-08 2020-04-14 凤凰先驱股份有限公司 电子封装件及其制法
WO2020098212A1 (zh) 2018-11-12 2020-05-22 通富微电子股份有限公司 一种半导体芯片封装方法及封装器件
CN109524479B (zh) * 2018-11-12 2021-02-19 通富微电子股份有限公司 一种半导体芯片封装方法
CN109545809B (zh) * 2018-11-12 2021-02-19 通富微电子股份有限公司 一种半导体封装器件
CN111199924B (zh) * 2018-11-16 2022-11-18 恒劲科技股份有限公司 半导体封装结构及其制作方法
CN111627865B (zh) * 2019-02-27 2022-06-14 恒劲科技股份有限公司 一种半导体封装结构及其制造方法
CN111627866B (zh) * 2019-02-27 2022-03-04 胜丽国际股份有限公司 芯片级传感器封装结构
US11374136B2 (en) * 2019-09-27 2022-06-28 Taiwan Semiconductor Manufacturing Company, Ltd. Semiconductor package and forming method thereof
CN112827516B (zh) * 2019-11-22 2023-03-07 富泰华工业（深圳）有限公司 生物芯片封装结构
CN111128763A (zh) * 2019-12-06 2020-05-08 上海先方半导体有限公司 一种芯片封装结构的制作方法
CN111029262A (zh) * 2019-12-06 2020-04-17 上海先方半导体有限公司 一种芯片封装结构的制作方法
CN111739863A (zh) * 2020-08-25 2020-10-02 甬矽电子(宁波)股份有限公司 指纹识别芯片封装结构及其制备方法
CN112992955B (zh) * 2021-05-14 2021-08-06 甬矽电子(宁波)股份有限公司 芯片封装结构及其制作方法和电子设备
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TWI866051B (zh) * 2023-02-03 2024-12-11 矽品精密工業股份有限公司 電子封裝件及其製法

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Also Published As

Publication number Publication date
JP2016134615A (ja) 2016-07-25
CN105845635A (zh) 2016-08-10
US10784205B2 (en) 2020-09-22
US20160212852A1 (en) 2016-07-21
JP6548949B2 (ja) 2019-07-24

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Granted publication date: 20181207