TWI562411B - Package of optoelectronic device - Google Patents
Package of optoelectronic deviceInfo
- Publication number
- TWI562411B TWI562411B TW101145182A TW101145182A TWI562411B TW I562411 B TWI562411 B TW I562411B TW 101145182 A TW101145182 A TW 101145182A TW 101145182 A TW101145182 A TW 101145182A TW I562411 B TWI562411 B TW I562411B
- Authority
- TW
- Taiwan
- Prior art keywords
- package
- optoelectronic device
- optoelectronic
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101145182A TWI562411B (en) | 2012-11-30 | 2012-11-30 | Package of optoelectronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW101145182A TWI562411B (en) | 2012-11-30 | 2012-11-30 | Package of optoelectronic device |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201421754A TW201421754A (en) | 2014-06-01 |
TWI562411B true TWI562411B (en) | 2016-12-11 |
Family
ID=51393550
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW101145182A TWI562411B (en) | 2012-11-30 | 2012-11-30 | Package of optoelectronic device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI562411B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105845635B (en) | 2015-01-16 | 2018-12-07 | 恒劲科技股份有限公司 | Electron package structure |
TWI611544B (en) * | 2015-01-16 | 2018-01-11 | 恆勁科技股份有限公司 | Electronic package structure |
US9875388B2 (en) | 2016-02-26 | 2018-01-23 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fingerprint sensor device and method |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201034132A (en) * | 2009-03-13 | 2010-09-16 | Xintec Inc | Package structure for electronic device and method of forming the same |
-
2012
- 2012-11-30 TW TW101145182A patent/TWI562411B/en active
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201034132A (en) * | 2009-03-13 | 2010-09-16 | Xintec Inc | Package structure for electronic device and method of forming the same |
Also Published As
Publication number | Publication date |
---|---|
TW201421754A (en) | 2014-06-01 |
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