TWI562411B - Package of optoelectronic device - Google Patents

Package of optoelectronic device

Info

Publication number
TWI562411B
TWI562411B TW101145182A TW101145182A TWI562411B TW I562411 B TWI562411 B TW I562411B TW 101145182 A TW101145182 A TW 101145182A TW 101145182 A TW101145182 A TW 101145182A TW I562411 B TWI562411 B TW I562411B
Authority
TW
Taiwan
Prior art keywords
package
optoelectronic device
optoelectronic
Prior art date
Application number
TW101145182A
Other languages
Chinese (zh)
Other versions
TW201421754A (en
Inventor
Ming Ji Dai
Ra Min Tain
Li Ling Liao
Original Assignee
Ind Tech Res Inst
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ind Tech Res Inst filed Critical Ind Tech Res Inst
Priority to TW101145182A priority Critical patent/TWI562411B/en
Publication of TW201421754A publication Critical patent/TW201421754A/en
Application granted granted Critical
Publication of TWI562411B publication Critical patent/TWI562411B/en

Links

TW101145182A 2012-11-30 2012-11-30 Package of optoelectronic device TWI562411B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW101145182A TWI562411B (en) 2012-11-30 2012-11-30 Package of optoelectronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW101145182A TWI562411B (en) 2012-11-30 2012-11-30 Package of optoelectronic device

Publications (2)

Publication Number Publication Date
TW201421754A TW201421754A (en) 2014-06-01
TWI562411B true TWI562411B (en) 2016-12-11

Family

ID=51393550

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101145182A TWI562411B (en) 2012-11-30 2012-11-30 Package of optoelectronic device

Country Status (1)

Country Link
TW (1) TWI562411B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105845635B (en) 2015-01-16 2018-12-07 恒劲科技股份有限公司 Electron package structure
TWI611544B (en) * 2015-01-16 2018-01-11 恆勁科技股份有限公司 Electronic package structure
US9875388B2 (en) 2016-02-26 2018-01-23 Taiwan Semiconductor Manufacturing Company, Ltd. Fingerprint sensor device and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201034132A (en) * 2009-03-13 2010-09-16 Xintec Inc Package structure for electronic device and method of forming the same

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201034132A (en) * 2009-03-13 2010-09-16 Xintec Inc Package structure for electronic device and method of forming the same

Also Published As

Publication number Publication date
TW201421754A (en) 2014-06-01

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