CN105556656B - 具有温度分布控制的加热式基板支撑件 - Google Patents

具有温度分布控制的加热式基板支撑件 Download PDF

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Publication number
CN105556656B
CN105556656B CN201480049638.2A CN201480049638A CN105556656B CN 105556656 B CN105556656 B CN 105556656B CN 201480049638 A CN201480049638 A CN 201480049638A CN 105556656 B CN105556656 B CN 105556656B
Authority
CN
China
Prior art keywords
heater
layer
shaft
substrate support
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480049638.2A
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English (en)
Chinese (zh)
Other versions
CN105556656A (zh
Inventor
尼尔·玛利
利昂·沃尔福夫斯基
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of CN105556656A publication Critical patent/CN105556656A/zh
Application granted granted Critical
Publication of CN105556656B publication Critical patent/CN105556656B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
    • H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
    • H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67248—Temperature monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49082—Resistor making
    • Y10T29/49083—Heater type

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Chemical Vapour Deposition (AREA)
  • Resistance Heating (AREA)
  • Physical Vapour Deposition (AREA)
CN201480049638.2A 2013-09-16 2014-09-10 具有温度分布控制的加热式基板支撑件 Expired - Fee Related CN105556656B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361878370P 2013-09-16 2013-09-16
US61/878,370 2013-09-16
US14/481,283 2014-09-09
US14/481,283 US9698074B2 (en) 2013-09-16 2014-09-09 Heated substrate support with temperature profile control
PCT/US2014/054945 WO2015038610A1 (en) 2013-09-16 2014-09-10 Heated substrate support with temperature profile control

Publications (2)

Publication Number Publication Date
CN105556656A CN105556656A (zh) 2016-05-04
CN105556656B true CN105556656B (zh) 2018-11-02

Family

ID=52666222

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201480049638.2A Expired - Fee Related CN105556656B (zh) 2013-09-16 2014-09-10 具有温度分布控制的加热式基板支撑件

Country Status (6)

Country Link
US (1) US9698074B2 (enExample)
JP (1) JP6404355B2 (enExample)
KR (1) KR102244625B1 (enExample)
CN (1) CN105556656B (enExample)
TW (1) TWI645498B (enExample)
WO (1) WO2015038610A1 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9972477B2 (en) 2014-06-28 2018-05-15 Applied Materials, Inc. Multiple point gas delivery apparatus for etching materials
US10186437B2 (en) * 2015-10-05 2019-01-22 Lam Research Corporation Substrate holder having integrated temperature measurement electrical devices
WO2017139353A1 (en) * 2016-02-08 2017-08-17 Watlow Electric Manufacturing Company Temperature sensing system for rotatable wafer support assembly
US10184183B2 (en) * 2016-06-21 2019-01-22 Applied Materials, Inc. Substrate temperature monitoring
TWI671851B (zh) 2016-09-22 2019-09-11 美商應用材料股份有限公司 用於寬範圍溫度控制的加熱器基座組件
JP6704834B2 (ja) * 2016-10-28 2020-06-03 日本特殊陶業株式会社 加熱装置
WO2018159189A1 (ja) * 2017-02-28 2018-09-07 日本発條株式会社 基板支持ユニット、および基板支持ユニットを有する成膜装置
US11978646B2 (en) 2017-05-18 2024-05-07 Applied Materials, Inc. Thermal chamber with improved thermal uniformity
JP7049818B2 (ja) * 2017-12-13 2022-04-07 東京エレクトロン株式会社 成膜装置
CN111886672A (zh) * 2018-03-19 2020-11-03 日新电机株式会社 基板加热系统以及基板处理装置
JP6952633B2 (ja) * 2018-03-23 2021-10-20 東京エレクトロン株式会社 基板加熱装置及びこれを用いた基板処理装置
WO2019181500A1 (ja) * 2018-03-23 2019-09-26 日本碍子株式会社 マルチゾーンヒータ
KR102098556B1 (ko) * 2018-07-09 2020-04-17 주식회사 테스 기판지지유닛 및 이를 구비한 기판처리장치
WO2020086122A1 (en) * 2018-10-24 2020-04-30 Applied Materials, Inc. Substrate support designs for a deposition chamber
CN111383891B (zh) 2018-12-29 2023-03-10 中微半导体设备(上海)股份有限公司 用于半导体处理设备的温度控制装置及其温度控制方法
CN113632588B (zh) * 2019-03-18 2024-06-25 日本碍子株式会社 陶瓷加热器及其制法
CN110060913A (zh) * 2019-04-22 2019-07-26 德淮半导体有限公司 离子植入机以及监测离子植入机中离子束的方法
WO2021002169A1 (ja) 2019-07-01 2021-01-07 日本碍子株式会社 シャフト付きセラミックヒータ
WO2021010063A1 (ja) * 2019-07-16 2021-01-21 日本碍子株式会社 シャフト付きセラミックヒータ
CN114175851B (zh) * 2019-07-16 2024-06-25 日本碍子株式会社 带轴的陶瓷加热器
JP7430617B2 (ja) * 2020-10-16 2024-02-13 日本碍子株式会社 ウエハ載置台
JP7375069B2 (ja) * 2022-03-07 2023-11-07 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法及びプログラム
US20250125181A1 (en) * 2023-10-12 2025-04-17 Applied Materials, Inc. Low temperature electrostatic chuck
US20250227851A1 (en) * 2024-01-08 2025-07-10 Tokyo Electron Limited Substrate support with printed heater

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688331A (en) * 1993-05-27 1997-11-18 Applied Materisls, Inc. Resistance heated stem mounted aluminum susceptor assembly
JP2005303292A (ja) * 2004-04-15 2005-10-27 Asm Japan Kk 薄膜形成装置
US7126092B2 (en) * 2005-01-13 2006-10-24 Watlow Electric Manufacturing Company Heater for wafer processing and methods of operating and manufacturing the same
CN101114605A (zh) * 2006-07-26 2008-01-30 国立大学法人东北大学 基板工作台以及热处理装置

Family Cites Families (11)

* Cited by examiner, † Cited by third party
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JP2001118662A (ja) * 1999-08-09 2001-04-27 Ibiden Co Ltd セラミックヒータ
JP4637316B2 (ja) * 2000-02-24 2011-02-23 京セラ株式会社 筒状体を有するセラミックヒーター及びこれを用いた加熱装置
JP4435742B2 (ja) * 2005-08-09 2010-03-24 信越化学工業株式会社 加熱素子
JP4889385B2 (ja) 2006-07-07 2012-03-07 日本発條株式会社 ヒータユニットおよびシャフト
JP5135915B2 (ja) * 2007-06-28 2013-02-06 東京エレクトロン株式会社 載置台構造及び熱処理装置
KR101305760B1 (ko) * 2008-03-21 2013-09-17 엔지케이 인슐레이터 엘티디 세라믹스 히터
JP5358543B2 (ja) * 2009-09-17 2013-12-04 日本碍子株式会社 セラミックスヒーター及びその製造方法
US8274017B2 (en) 2009-12-18 2012-09-25 Applied Materials, Inc. Multifunctional heater/chiller pedestal for wide range wafer temperature control
JP5666167B2 (ja) * 2010-05-07 2015-02-12 日本発條株式会社 ステージヒータ及びシャフトの製造方法
US20120211484A1 (en) 2011-02-23 2012-08-23 Applied Materials, Inc. Methods and apparatus for a multi-zone pedestal heater
US9706605B2 (en) 2012-03-30 2017-07-11 Applied Materials, Inc. Substrate support with feedthrough structure

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5688331A (en) * 1993-05-27 1997-11-18 Applied Materisls, Inc. Resistance heated stem mounted aluminum susceptor assembly
JP2005303292A (ja) * 2004-04-15 2005-10-27 Asm Japan Kk 薄膜形成装置
US7126092B2 (en) * 2005-01-13 2006-10-24 Watlow Electric Manufacturing Company Heater for wafer processing and methods of operating and manufacturing the same
CN101114605A (zh) * 2006-07-26 2008-01-30 国立大学法人东北大学 基板工作台以及热处理装置

Also Published As

Publication number Publication date
JP2016536803A (ja) 2016-11-24
JP6404355B2 (ja) 2018-10-10
US20150076135A1 (en) 2015-03-19
KR102244625B1 (ko) 2021-04-23
KR20160055257A (ko) 2016-05-17
TW201515145A (zh) 2015-04-16
TWI645498B (zh) 2018-12-21
WO2015038610A1 (en) 2015-03-19
CN105556656A (zh) 2016-05-04
US9698074B2 (en) 2017-07-04

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