WO2019181500A1 - マルチゾーンヒータ - Google Patents
マルチゾーンヒータ Download PDFInfo
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- WO2019181500A1 WO2019181500A1 PCT/JP2019/008815 JP2019008815W WO2019181500A1 WO 2019181500 A1 WO2019181500 A1 WO 2019181500A1 JP 2019008815 W JP2019008815 W JP 2019008815W WO 2019181500 A1 WO2019181500 A1 WO 2019181500A1
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- zone heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32522—Temperature
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/46—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for heating the substrate
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/26—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
- H05B3/265—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/32—Processing objects by plasma generation
- H01J2237/33—Processing objects by plasma generation characterised by the type of processing
- H01J2237/332—Coating
- H01J2237/3321—CVD [Chemical Vapor Deposition]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
- H05B1/0227—Applications
- H05B1/023—Industrial applications
- H05B1/0233—Industrial applications for semiconductors manufacturing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/003—Heaters using a particular layout for the resistive material or resistive elements using serpentine layout
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/002—Heaters using a particular layout for the resistive material or resistive elements
- H05B2203/005—Heaters using a particular layout for the resistive material or resistive elements using multiple resistive elements or resistive zones isolated from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Analytical Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inorganic Chemistry (AREA)
- Resistance Heating (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
Description
ウエハ載置面を有する円盤状のセラミック基体と、
前記セラミック基体の中央部に設けられたコイル状又はメッシュ状の中央部ゾーンヒータと、
前記中央部ゾーンヒータと同一平面上で前記セラミック基体の外周部の1以上の外周部ゾーンのそれぞれに対応して設けられ、前記外周部ゾーン内で一方の端部から他方の端部まで一筆書きの要領で前記外周部ゾーンの全域にわたって配線されたコイル状又はメッシュ状の外周部ゾーンヒータと、
前記セラミック基体の前記中央部に配置された第1端子から前記中央部を通過して前記外周部ゾーンヒータの一方の端部に接続され、平面視したときの形状が蛇行した形状である第1素線部と、
前記セラミック基体の前記中央部に配置された第2端子から前記中央部を通過して前記外周部ゾーンヒータの他方の端部に接続され、平面視したときの形状が蛇行した形状である第2素線部と、
を備えたものである。
Claims (5)
- ウエハ載置面を有する円盤状のセラミック基体と、
前記セラミック基体の中央部に設けられたコイル状又はメッシュ状の中央部ゾーンヒータと、
前記中央部ゾーンヒータと同一平面上で前記セラミック基体の外周部の1以上の外周部ゾーンのそれぞれに対応して設けられ、前記外周部ゾーン内で一方の端部から他方の端部まで一筆書きの要領で前記外周部ゾーンの全域にわたって配線されたコイル状又はメッシュ状の外周部ゾーンヒータと、
前記セラミック基体の前記中央部に配置された第1端子から前記中央部を通過して前記外周部ゾーンヒータの一方の端部に接続され、平面視したときの形状が蛇行した形状である第1素線部と、
前記セラミック基体の前記中央部に配置された第2端子から前記中央部を通過して前記外周部ゾーンヒータの他方の端部に接続され、平面視したときの形状が蛇行した形状である第2素線部と、
を備えたマルチゾーンヒータ。 - 前記第1素線部及び前記第2素線部は、互いに接近している部分と離間している部分とを有している、
請求項1に記載のマルチゾーンヒータ。 - 前記第1素線部及び前記第2素線部は、それぞれ複数の湾曲部を有している、
請求項1又は2に記載のマルチゾーンヒータ。 - 前記外周部ゾーンは、前記セラミック基体の前記外周部に複数設けられている、
請求項1~3のいずれか1項に記載のマルチゾーンヒータ。 - 前記第1素線部及び前記第2素線部の単位長さあたりの抵抗値は、前記外周部ゾーンヒータの単位長さあたりの抵抗値よりも小さい、
請求項1~4のいずれか1項に記載のマルチゾーンヒータ。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020207026438A KR20200120720A (ko) | 2018-03-23 | 2019-03-06 | 멀티 존 히터 |
KR1020237013214A KR20230058534A (ko) | 2018-03-23 | 2019-03-06 | 멀티 존 히터 |
JP2020508165A JP7216710B2 (ja) | 2018-03-23 | 2019-03-06 | マルチゾーンヒータ |
CN201980020212.7A CN111869318B (zh) | 2018-03-23 | 2019-03-06 | 多区域加热器 |
US17/005,745 US11956863B2 (en) | 2018-03-23 | 2020-08-28 | Multi-zone heater |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2018-055520 | 2018-03-23 | ||
JP2018055520 | 2018-03-23 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/005,745 Continuation US11956863B2 (en) | 2018-03-23 | 2020-08-28 | Multi-zone heater |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2019181500A1 true WO2019181500A1 (ja) | 2019-09-26 |
Family
ID=67987786
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2019/008815 WO2019181500A1 (ja) | 2018-03-23 | 2019-03-06 | マルチゾーンヒータ |
Country Status (6)
Country | Link |
---|---|
US (1) | US11956863B2 (ja) |
JP (1) | JP7216710B2 (ja) |
KR (2) | KR20230058534A (ja) |
CN (1) | CN111869318B (ja) |
TW (1) | TWI805707B (ja) |
WO (1) | WO2019181500A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3614802A1 (en) * | 2018-08-21 | 2020-02-26 | LG Electronics Inc. -1- | Electric heater |
CN112680707A (zh) * | 2019-10-18 | 2021-04-20 | 台湾积体电路制造股份有限公司 | 工件托架、薄膜沉积腔体、薄膜沉积方法 |
JP2021179010A (ja) * | 2020-05-14 | 2021-11-18 | ケーエスエム・コンポーネント・カンパニー・リミテッド | プレートタイプ加熱装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102159802B1 (ko) * | 2018-08-21 | 2020-09-25 | 엘지전자 주식회사 | 전기 히터 |
KR102159800B1 (ko) * | 2018-08-21 | 2020-09-25 | 엘지전자 주식회사 | 전기 히터 |
KR102110410B1 (ko) * | 2018-08-21 | 2020-05-14 | 엘지전자 주식회사 | 전기 히터 |
KR102111332B1 (ko) * | 2018-10-11 | 2020-05-15 | 엘지전자 주식회사 | 전기 히터 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133195A (ja) * | 2001-10-24 | 2003-05-09 | Ngk Insulators Ltd | 加熱装置 |
JP2003272805A (ja) * | 2002-03-18 | 2003-09-26 | Ngk Insulators Ltd | セラミックヒーター |
JP2004006242A (ja) * | 2002-03-28 | 2004-01-08 | Ngk Insulators Ltd | セラミックヒーター |
JP2005197074A (ja) * | 2004-01-07 | 2005-07-21 | Ngk Insulators Ltd | 抵抗発熱体およびヒーター |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19603845B4 (de) * | 1996-02-05 | 2010-07-22 | E.G.O. Elektro-Gerätebau GmbH | Elektrischer Strahlungsheizkörper mit einem aktiven Sensor zur Kochgefäßerkennung |
WO2001078454A1 (fr) * | 2000-04-07 | 2001-10-18 | Ibiden Co., Ltd. | Dispositif chauffant ceramique |
GB0217351D0 (en) * | 2002-07-25 | 2002-09-04 | Ceramaspeed Ltd | Radiant electric heater |
KR100870776B1 (ko) | 2004-07-05 | 2008-11-26 | 도쿄엘렉트론가부시키가이샤 | 처리 장치 및 히터 유닛 |
JP4879060B2 (ja) * | 2007-03-26 | 2012-02-15 | 日本碍子株式会社 | 基板加熱装置 |
WO2011017060A2 (en) * | 2009-08-07 | 2011-02-10 | Applied Materials, Inc. | Dual temperature heater |
JP5763962B2 (ja) * | 2011-04-19 | 2015-08-12 | 日本特殊陶業株式会社 | セラミック配線基板、多数個取りセラミック配線基板、およびその製造方法 |
JP2013004247A (ja) * | 2011-06-15 | 2013-01-07 | Shin Etsu Chem Co Ltd | セラミックスヒーター |
JP5807032B2 (ja) * | 2012-03-21 | 2015-11-10 | 日本碍子株式会社 | 加熱装置及び半導体製造装置 |
US9698074B2 (en) * | 2013-09-16 | 2017-07-04 | Applied Materials, Inc. | Heated substrate support with temperature profile control |
CN104576442A (zh) * | 2013-10-15 | 2015-04-29 | 住友电气工业株式会社 | 半导体制造装置用陶瓷加热器 |
CN105282877B (zh) * | 2014-06-17 | 2019-10-25 | 住友电气工业株式会社 | 用于半导体制造装置的陶瓷加热器 |
US10160636B2 (en) * | 2015-01-23 | 2018-12-25 | Mitsubishi Electric Corporation | Ceramic substrate, bonded body, module, and method for manufacturing ceramic substrate |
KR102348108B1 (ko) | 2015-10-05 | 2022-01-10 | 주식회사 미코세라믹스 | 온도 편차 특성이 개선된 기판 가열 장치 |
US10345802B2 (en) * | 2016-02-17 | 2019-07-09 | Lam Research Corporation | Common terminal heater for ceramic pedestals used in semiconductor fabrication |
-
2019
- 2019-03-06 KR KR1020237013214A patent/KR20230058534A/ko not_active Application Discontinuation
- 2019-03-06 KR KR1020207026438A patent/KR20200120720A/ko not_active IP Right Cessation
- 2019-03-06 WO PCT/JP2019/008815 patent/WO2019181500A1/ja active Application Filing
- 2019-03-06 JP JP2020508165A patent/JP7216710B2/ja active Active
- 2019-03-06 CN CN201980020212.7A patent/CN111869318B/zh active Active
- 2019-03-13 TW TW108108399A patent/TWI805707B/zh active
-
2020
- 2020-08-28 US US17/005,745 patent/US11956863B2/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003133195A (ja) * | 2001-10-24 | 2003-05-09 | Ngk Insulators Ltd | 加熱装置 |
JP2003272805A (ja) * | 2002-03-18 | 2003-09-26 | Ngk Insulators Ltd | セラミックヒーター |
JP2004006242A (ja) * | 2002-03-28 | 2004-01-08 | Ngk Insulators Ltd | セラミックヒーター |
JP2005197074A (ja) * | 2004-01-07 | 2005-07-21 | Ngk Insulators Ltd | 抵抗発熱体およびヒーター |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3614802A1 (en) * | 2018-08-21 | 2020-02-26 | LG Electronics Inc. -1- | Electric heater |
US11415324B2 (en) | 2018-08-21 | 2022-08-16 | Lg Electronics Inc. | Electric heater |
CN112680707A (zh) * | 2019-10-18 | 2021-04-20 | 台湾积体电路制造股份有限公司 | 工件托架、薄膜沉积腔体、薄膜沉积方法 |
US11742231B2 (en) | 2019-10-18 | 2023-08-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Movable wafer holder for film deposition chamber having six degrees of freedom |
CN112680707B (zh) * | 2019-10-18 | 2023-09-05 | 台湾积体电路制造股份有限公司 | 工件托架、薄膜沉积腔体、薄膜沉积方法 |
JP2021179010A (ja) * | 2020-05-14 | 2021-11-18 | ケーエスエム・コンポーネント・カンパニー・リミテッド | プレートタイプ加熱装置 |
JP7260589B2 (ja) | 2020-05-14 | 2023-04-18 | ケーエスエム・コンポーネント・カンパニー・リミテッド | プレートタイプ加熱装置 |
Also Published As
Publication number | Publication date |
---|---|
US11956863B2 (en) | 2024-04-09 |
US20200396801A1 (en) | 2020-12-17 |
KR20230058534A (ko) | 2023-05-03 |
TW201941260A (zh) | 2019-10-16 |
TWI805707B (zh) | 2023-06-21 |
KR20200120720A (ko) | 2020-10-21 |
JP7216710B2 (ja) | 2023-02-01 |
CN111869318A (zh) | 2020-10-30 |
CN111869318B (zh) | 2022-08-26 |
JPWO2019181500A1 (ja) | 2021-02-04 |
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