JP5058862B2 - 加熱装置 - Google Patents
加熱装置 Download PDFInfo
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- JP5058862B2 JP5058862B2 JP2008082075A JP2008082075A JP5058862B2 JP 5058862 B2 JP5058862 B2 JP 5058862B2 JP 2008082075 A JP2008082075 A JP 2008082075A JP 2008082075 A JP2008082075 A JP 2008082075A JP 5058862 B2 JP5058862 B2 JP 5058862B2
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- heating
- heating element
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- heat generation
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- 238000010438 heat treatment Methods 0.000 title claims description 241
- 239000000758 substrate Substances 0.000 claims description 59
- 230000020169 heat generation Effects 0.000 claims description 43
- 239000000919 ceramic Substances 0.000 claims description 21
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 7
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 239000011733 molybdenum Substances 0.000 claims description 5
- 230000002093 peripheral effect Effects 0.000 description 26
- 239000004065 semiconductor Substances 0.000 description 14
- 239000000463 material Substances 0.000 description 13
- 238000000034 method Methods 0.000 description 11
- 238000004519 manufacturing process Methods 0.000 description 10
- 230000008646 thermal stress Effects 0.000 description 10
- 238000009826 distribution Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 238000005336 cracking Methods 0.000 description 4
- 238000002791 soaking Methods 0.000 description 4
- 238000005219 brazing Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000005304 joining Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 230000004043 responsiveness Effects 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- -1 and sialon Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000011224 oxide ceramic Substances 0.000 description 1
- 229910052574 oxide ceramic Inorganic materials 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910052702 rhenium Inorganic materials 0.000 description 1
- WUAPFZMCVAUBPE-UHFFFAOYSA-N rhenium atom Chemical compound [Re] WUAPFZMCVAUBPE-UHFFFAOYSA-N 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
- H05B3/143—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds applied to semiconductors, e.g. wafers heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68757—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating or a hardness or a material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
Description
図1及び図2に示した構造を有する加熱装置を作製した。基体11は直径が320mm、厚さが10mmに作製した。基体11の材質は窒化アルミとした。基体11内に(材質はモリブデンでコイル状の発熱体よりなる)第1の発熱体12と第2の発熱体13を、図1に示した配線パターンで、それぞれ基体11内に埋設した。第1の発熱体12は、基体11の中央部寄りに高発熱密度部12aを、基体11の周縁部寄りに高発熱密度部12aよりも発熱密度の低い低発熱密度部12bを有するようにした。第2の発熱体13は、基体11の中央部寄りに低熱密度部13bを、基体11の周縁部寄りに低熱密度部13bよりも発熱密度の高い高発熱密度部13aを有するようにした。
図3及び図4に示した構造を有する加熱装置20を作製した。本実施例の加熱装置20は、実施例1の加熱装置10と対比すると、第1の発熱体12に接続する2個の端子のうちの一つと、第2の発熱体13に接続する2個の端子のうちの一つが共用されているコモン端子19を有していて、このコモン端子に共用給電棒22が接続されている点で相違し、それ以外は実施例1の加熱装置10と同様である。
12 第1の発熱体
13 第2の発熱体
18 支持部材
Claims (4)
- セラミックスよりなり、加熱面を有する基体と、
この基体内に埋設されて個々に温度制御可能な第1の発熱体及び第2の発熱体と
を備え、
この第1の発熱体及び第2の発熱体は、この基体の加熱面と平行な略同一平面内で互いに非接触に基体の中央部から基体の外周部にかけて渦巻き状に形成されてなり、かつ、
この第1の発熱体及び第2の発熱体のうち、一方の発熱体は、基体の中央部寄りに高発熱密度部を、基体の周縁部寄りに低発熱密度部を有し、他方の発熱体は、基体の中央部寄りに低発熱密度部を、基体の周縁部寄りに高発熱密度部を有する
ことを特徴とする加熱装置。 - 前記基体が窒化アルミニウムよりなり、前記第1の発熱体及び第2の発熱体がモリブデンよりなることを特徴とする請求項1に記載の加熱装置。
- 前記第1の発熱体に接続する端子及び前記第2の発熱体に接続する端子を、それぞれ前記基体の中央部に備え、かつ、前記基体の加熱面とは反対側の面に、基体とは同種のセラミックスよりなる中空の支持部材を備えることを特徴とする請求項1又は2に記載の加熱装置。
- 前記第1の発熱体に接続する2個の端子のうちの一つと、前記第2の発熱体に接続する2個の端子のうちの一つが共用されているコモン端子を有することを特徴とする請求項1に記載の加熱装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008082075A JP5058862B2 (ja) | 2007-03-26 | 2008-03-26 | 加熱装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007079527 | 2007-03-26 | ||
JP2007079527 | 2007-03-26 | ||
JP2008082075A JP5058862B2 (ja) | 2007-03-26 | 2008-03-26 | 加熱装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008270198A JP2008270198A (ja) | 2008-11-06 |
JP5058862B2 true JP5058862B2 (ja) | 2012-10-24 |
Family
ID=39792460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008082075A Active JP5058862B2 (ja) | 2007-03-26 | 2008-03-26 | 加熱装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US8168926B2 (ja) |
JP (1) | JP5058862B2 (ja) |
KR (1) | KR101427427B1 (ja) |
Families Citing this family (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5358543B2 (ja) * | 2009-09-17 | 2013-12-04 | 日本碍子株式会社 | セラミックスヒーター及びその製造方法 |
US11113299B2 (en) | 2009-12-01 | 2021-09-07 | Apple Inc. | System and method for metadata transfer among search entities |
JP5712054B2 (ja) | 2011-05-31 | 2015-05-07 | 日本発條株式会社 | シャフト付きヒータユニットおよびシャフト付きヒータユニットの製造方法 |
JP5807032B2 (ja) * | 2012-03-21 | 2015-11-10 | 日本碍子株式会社 | 加熱装置及び半導体製造装置 |
KR101343556B1 (ko) | 2012-05-18 | 2013-12-19 | 주식회사 케이에스엠컴포넌트 | 2차원적으로 배선된 열선을 포함하는 세라믹 히터 |
KR102027461B1 (ko) * | 2013-02-14 | 2019-11-04 | 부산대학교 산학협력단 | 다중 온도 자가조절형 면상발열체를 이용한 식탁 |
KR102027457B1 (ko) * | 2013-02-14 | 2019-10-01 | 부산대학교 산학협력단 | 다중 온도 자가조절형 면상발열체를 이용한 전기레인지 |
KR102027465B1 (ko) * | 2013-10-30 | 2019-10-01 | 부산대학교 산학협력단 | 다중 온도 자가조절형 면상발열체를 이용한 조리 용기 |
CA2952471A1 (en) | 2014-06-23 | 2015-12-30 | Free Form Fibers, Llc | An additive manufacturing technology for the fabrication and characterization of nuclear reactor fuel |
DE102014014069A1 (de) * | 2014-09-29 | 2016-03-31 | Forschungszentrum Jülich GmbH | Hochleistungsheizer |
US10345802B2 (en) * | 2016-02-17 | 2019-07-09 | Lam Research Corporation | Common terminal heater for ceramic pedestals used in semiconductor fabrication |
JP6397588B2 (ja) * | 2016-07-19 | 2018-09-26 | 日本碍子株式会社 | 静電チャックヒータ |
US10679873B2 (en) * | 2016-09-30 | 2020-06-09 | Ngk Spark Plug Co., Ltd. | Ceramic heater |
EP3609686A4 (en) * | 2017-04-12 | 2020-09-09 | The Government of the United States of America, as represented by the Secretary of the Navy | TEMPERATURE CONTROLLED ELECTRIC SPINNING SUBSTRATE |
JP7027198B2 (ja) * | 2018-03-06 | 2022-03-01 | 株式会社Screenホールディングス | 基板処理装置 |
KR20210088003A (ko) * | 2018-11-30 | 2021-07-13 | 램 리써치 코포레이션 | 향상된 열 균일성을 위한 복수 층 히터를 갖는 세라믹 페데스탈 |
WO2020153086A1 (ja) * | 2019-01-25 | 2020-07-30 | 日本碍子株式会社 | セラミックヒータ |
US20220411921A1 (en) * | 2021-06-29 | 2022-12-29 | Free Form Fibers, Llc | Embedded wire chemical vapor deposition (ewcvd) |
CN115938995B (zh) * | 2023-02-24 | 2023-05-30 | 深圳市新凯来技术有限公司 | 晶圆加热装置以及半导体加工设备 |
Family Cites Families (12)
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US2152126A (en) * | 1936-10-02 | 1939-03-28 | John Wentworth | Heating device |
JP2819018B2 (ja) * | 1996-11-18 | 1998-10-30 | 日本ピラー工業株式会社 | 抵抗発熱ヒータ |
DE59813206D1 (de) * | 1997-01-10 | 2005-12-29 | Ego Elektro Geraetebau Gmbh | Kochsystem mit einer Kontaktwärme übertragenden Elektro-Kochplatte |
US6423949B1 (en) | 1999-05-19 | 2002-07-23 | Applied Materials, Inc. | Multi-zone resistive heater |
US6617553B2 (en) | 1999-05-19 | 2003-09-09 | Applied Materials, Inc. | Multi-zone resistive heater |
KR20010055907A (ko) * | 1999-12-13 | 2001-07-04 | 윤종용 | 다중온도제어장치 |
JP4028149B2 (ja) * | 2000-02-03 | 2007-12-26 | 日本碍子株式会社 | 加熱装置 |
JP2002161731A (ja) * | 2000-11-29 | 2002-06-07 | Hitachi Hometec Ltd | 発熱体ユニット |
JP2002190371A (ja) * | 2000-12-20 | 2002-07-05 | Ibiden Co Ltd | セラミックヒータ |
JP3897563B2 (ja) * | 2001-10-24 | 2007-03-28 | 日本碍子株式会社 | 加熱装置 |
JP2004296254A (ja) * | 2003-03-27 | 2004-10-21 | Sumitomo Electric Ind Ltd | セラミックスヒータおよびそれを搭載した半導体あるいは液晶製造装置 |
JP2007066542A (ja) * | 2005-08-29 | 2007-03-15 | Kyocera Corp | ヒータおよびウェハ加熱装置ならびにこのヒータの製造方法 |
-
2008
- 2008-03-24 US US12/053,758 patent/US8168926B2/en active Active
- 2008-03-25 KR KR1020080027249A patent/KR101427427B1/ko active IP Right Grant
- 2008-03-26 JP JP2008082075A patent/JP5058862B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
US20080237216A1 (en) | 2008-10-02 |
KR101427427B1 (ko) | 2014-08-08 |
KR20080087702A (ko) | 2008-10-01 |
US8168926B2 (en) | 2012-05-01 |
JP2008270198A (ja) | 2008-11-06 |
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