CN105449086B - 发光二极管 - Google Patents
发光二极管 Download PDFInfo
- Publication number
- CN105449086B CN105449086B CN201510957553.0A CN201510957553A CN105449086B CN 105449086 B CN105449086 B CN 105449086B CN 201510957553 A CN201510957553 A CN 201510957553A CN 105449086 B CN105449086 B CN 105449086B
- Authority
- CN
- China
- Prior art keywords
- light emitting
- electrode pad
- layer
- emitting diode
- area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/816—Bodies having carrier transport control structures, e.g. highly-doped semiconductor layers or current-blocking structures
- H10H20/8162—Current-blocking structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/819—Bodies characterised by their shape, e.g. curved or truncated substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/83—Electrodes
- H10H20/831—Electrodes characterised by their shape
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020100070840A KR101158080B1 (ko) | 2010-07-22 | 2010-07-22 | 발광다이오드 |
| KR10-2010-0070840 | 2010-07-22 | ||
| KR10-2010-0106172 | 2010-10-28 | ||
| KR1020100106172A KR101272708B1 (ko) | 2010-10-28 | 2010-10-28 | 개선된 발광 효율을 갖는 발광다이오드 및 제조방법 |
| CN201180035911.2A CN103026516B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180035911.2A Division CN103026516B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105449086A CN105449086A (zh) | 2016-03-30 |
| CN105449086B true CN105449086B (zh) | 2018-03-27 |
Family
ID=45497303
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510957553.0A Active CN105449086B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
| CN201510958319.XA Active CN105529343B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
| CN201180035911.2A Active CN103026516B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510958319.XA Active CN105529343B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
| CN201180035911.2A Active CN103026516B (zh) | 2010-07-22 | 2011-07-21 | 发光二极管 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US8629471B2 (https=) |
| JP (2) | JP2012028749A (https=) |
| CN (3) | CN105449086B (https=) |
| TW (1) | TWI535076B (https=) |
| WO (1) | WO2012011749A2 (https=) |
Families Citing this family (47)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101871372B1 (ko) * | 2011-10-28 | 2018-08-02 | 엘지이노텍 주식회사 | 발광 소자 |
| KR101888604B1 (ko) * | 2011-10-28 | 2018-08-14 | 엘지이노텍 주식회사 | 발광 소자 및 발광 소자 패키지 |
| CN102593284B (zh) * | 2012-03-05 | 2014-06-18 | 映瑞光电科技(上海)有限公司 | 隔离深沟槽及其高压led芯片的制造方法 |
| TWI572068B (zh) | 2012-12-07 | 2017-02-21 | 晶元光電股份有限公司 | 發光元件 |
| KR102087933B1 (ko) * | 2012-11-05 | 2020-04-14 | 엘지이노텍 주식회사 | 발광 소자 및 이를 포함하는 발광 소자 어레이 |
| KR20140059985A (ko) * | 2012-11-09 | 2014-05-19 | 엘지이노텍 주식회사 | 발광소자 |
| CN104813489B (zh) * | 2012-11-23 | 2018-01-02 | 首尔伟傲世有限公司 | 发光二极管及其制造方法 |
| KR20140073351A (ko) * | 2012-12-06 | 2014-06-16 | 엘지이노텍 주식회사 | 발광 소자 |
| US9356212B2 (en) | 2012-12-21 | 2016-05-31 | Seoul Viosys Co., Ltd. | Light emitting diode and method of fabricating the same |
| WO2014098510A1 (en) | 2012-12-21 | 2014-06-26 | Seoul Viosys Co., Ltd. | Light emitting diode and method of fabricating the same |
| KR102087935B1 (ko) * | 2012-12-27 | 2020-03-11 | 엘지이노텍 주식회사 | 발광 소자 |
| KR101992366B1 (ko) | 2012-12-27 | 2019-06-24 | 엘지이노텍 주식회사 | 발광 소자 |
| CN103915463B (zh) * | 2013-01-09 | 2016-12-28 | 新世纪光电股份有限公司 | 发光装置 |
| EP2973714B1 (en) * | 2013-03-15 | 2019-05-08 | Lumileds Holding B.V. | Light emitting structure and mount |
| JP6391917B2 (ja) * | 2013-07-03 | 2018-09-19 | 株式会社ジャパンディスプレイ | 発光素子表示装置及びその製造方法 |
| DE102014011893B4 (de) * | 2013-08-16 | 2020-10-01 | Seoul Viosys Co., Ltd. | Leuchtdiode |
| USD709841S1 (en) * | 2013-08-22 | 2014-07-29 | Epistar Corporation | Light-emitting diode array |
| KR102100286B1 (ko) * | 2013-10-10 | 2020-04-14 | 엘지디스플레이 주식회사 | 발광다이오드 구조 |
| TW201517298A (zh) * | 2013-10-17 | 2015-05-01 | Lextar Electronics Corp | 發光結構的製造方法 |
| US9780276B2 (en) * | 2014-01-23 | 2017-10-03 | Suzhou Institute of Nano-tech and Nano-bionics, Chinese Academy of Sciences | Wafer-level semiconductor device and manufacturing method thereof |
| TWI614920B (zh) | 2014-05-19 | 2018-02-11 | 晶元光電股份有限公司 | 光電元件及其製造方法 |
| CN113035851B (zh) * | 2014-06-18 | 2022-03-29 | 艾克斯展示公司技术有限公司 | 微组装led显示器 |
| KR102231646B1 (ko) * | 2014-10-17 | 2021-03-24 | 엘지이노텍 주식회사 | 발광 소자 |
| KR101888608B1 (ko) | 2014-10-17 | 2018-09-20 | 엘지이노텍 주식회사 | 발광 소자 패키지 및 조명 장치 |
| CN110061027B (zh) * | 2015-02-13 | 2024-01-19 | 首尔伟傲世有限公司 | 发光元件 |
| TWD175295S (zh) * | 2015-02-16 | 2016-05-01 | 晶元光電股份有限公司 | 發光二極體陣列之部分 |
| US9905729B2 (en) * | 2015-03-27 | 2018-02-27 | Seoul Viosys Co., Ltd. | Light emitting diode |
| JP6428467B2 (ja) * | 2015-04-24 | 2018-11-28 | 日亜化学工業株式会社 | 発光素子 |
| JP6176298B2 (ja) | 2015-09-03 | 2017-08-09 | 富士ゼロックス株式会社 | 面発光型半導体レーザアレイ及び面発光型半導体レーザアレイの製造方法 |
| US10782002B2 (en) | 2016-10-28 | 2020-09-22 | X Display Company Technology Limited | LED optical components |
| CN108183157B (zh) * | 2017-11-30 | 2019-11-12 | 华灿光电(浙江)有限公司 | 一种发光二极管及制备方法 |
| JP2019149480A (ja) * | 2018-02-27 | 2019-09-05 | 豊田合成株式会社 | 半導体素子、発光装置、および発光装置の製造方法 |
| CN108987425B (zh) * | 2018-07-19 | 2020-09-18 | 豪威半导体(上海)有限责任公司 | 微led显示器及其制造方法 |
| EP3836234A4 (en) * | 2018-08-10 | 2022-05-04 | Lin, Hong-Cheng | DIODE DEVICE, DISPLAY PANEL AND FLEXIBLE DISPLAY |
| CN109765472A (zh) * | 2018-12-29 | 2019-05-17 | 江西兆驰半导体有限公司 | 一种非直接电接触式的发光二极管器件的电致发光量测方法 |
| CN109768126B (zh) * | 2019-01-07 | 2020-05-19 | 华灿光电(浙江)有限公司 | 一种发光二极管外延片的制造方法 |
| MX2021013719A (es) | 2019-05-14 | 2021-12-10 | Seoul Viosys Co Ltd | Paquete de chip led y metodo de manufactura del mismo. |
| US12199215B2 (en) | 2019-08-21 | 2025-01-14 | Industrial Technology Research Institute | Light-emitting device and display apparatus |
| US20210057611A1 (en) * | 2019-08-21 | 2021-02-25 | Industrial Technology Research Institute | Light-emitting device and display apparatus |
| US11811005B2 (en) * | 2020-04-21 | 2023-11-07 | Jade Bird Display (shanghai) Limited | Light-emitting diode chip structures with reflective elements |
| TWI893104B (zh) * | 2020-04-21 | 2025-08-11 | 中國大陸商上海顯耀顯示科技有限公司 | 具反射元件之發光二極體晶片結構 |
| KR20220014388A (ko) * | 2020-07-24 | 2022-02-07 | 삼성디스플레이 주식회사 | 발광 소자, 이의 제조 방법 및 표시 장치 |
| JP7339559B2 (ja) * | 2021-05-20 | 2023-09-06 | 日亜化学工業株式会社 | 発光素子 |
| WO2023279259A1 (zh) * | 2021-07-06 | 2023-01-12 | 泉州三安半导体科技有限公司 | 一种高压发光二极管 |
| KR102895315B1 (ko) * | 2021-12-23 | 2025-12-04 | 삼성디스플레이 주식회사 | 표시 장치 |
| CN115966642B (zh) * | 2022-12-29 | 2024-03-12 | 淮安澳洋顺昌光电技术有限公司 | 一种高压发光二极管芯片 |
| DE102023135556A1 (de) * | 2023-12-18 | 2025-06-18 | Ams-Osram International Gmbh | Optoelektronisches halbleiterbauelement und vorrichtung zur reinigung eines fluids |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997922A (ja) * | 1995-09-29 | 1997-04-08 | Sanyo Electric Co Ltd | 発光素子 |
| JP2000228562A (ja) * | 1999-02-05 | 2000-08-15 | Agilent Technol Inc | AlxGayInzN構造の組立方法 |
| JP2007096117A (ja) * | 2005-09-29 | 2007-04-12 | Toyoda Gosei Co Ltd | 発光素子 |
| JP2007287849A (ja) * | 2006-04-14 | 2007-11-01 | Nichia Chem Ind Ltd | 半導体発光素子 |
| JP2008135554A (ja) * | 2006-11-28 | 2008-06-12 | Nichia Chem Ind Ltd | 半導体発光素子、発光装置及び半導体発光素子の製造方法 |
| CN101305476A (zh) * | 2005-12-16 | 2008-11-12 | 首尔Opto仪器股份有限公司 | 具有排列的发光单元的发光装置 |
| WO2009119889A1 (ja) * | 2008-03-28 | 2009-10-01 | 住友化学株式会社 | 有機エレクトロルミネッセンス素子 |
| WO2010024375A1 (ja) * | 2008-08-29 | 2010-03-04 | 日亜化学工業株式会社 | 半導体発光素子及び半導体発光装置 |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1093136A (ja) * | 1996-09-11 | 1998-04-10 | Sanken Electric Co Ltd | 半導体発光素子 |
| JPH10107316A (ja) | 1996-10-01 | 1998-04-24 | Toyoda Gosei Co Ltd | 3族窒化物半導体発光素子 |
| US5893562A (en) * | 1997-06-16 | 1999-04-13 | Spector; Donald | Shooter and target water gun game |
| US6504180B1 (en) * | 1998-07-28 | 2003-01-07 | Imec Vzw And Vrije Universiteit | Method of manufacturing surface textured high-efficiency radiating devices and devices obtained therefrom |
| EP1107316A3 (en) * | 1999-12-02 | 2004-05-19 | Nikon Corporation | Solid-state image sensor, production method of the same and digital camera |
| JP4810746B2 (ja) * | 2000-03-31 | 2011-11-09 | 豊田合成株式会社 | Iii族窒化物系化合物半導体素子 |
| US6630689B2 (en) * | 2001-05-09 | 2003-10-07 | Lumileds Lighting, U.S. Llc | Semiconductor LED flip-chip with high reflectivity dielectric coating on the mesa |
| AU2003251541A1 (en) * | 2002-06-17 | 2003-12-31 | Kopin Corporation | Light-emitting diode electrode geometry |
| EP1892764B1 (en) | 2002-08-29 | 2016-03-09 | Seoul Semiconductor Co., Ltd. | Light-emitting device having light-emitting diodes |
| TW200414556A (en) * | 2003-01-17 | 2004-08-01 | Epitech Corp Ltd | Light emitting diode having distributed electrodes |
| JP4415575B2 (ja) * | 2003-06-25 | 2010-02-17 | 日亜化学工業株式会社 | 半導体発光素子及びそれを用いた発光装置 |
| US7535028B2 (en) * | 2005-02-03 | 2009-05-19 | Ac Led Lighting, L.Lc. | Micro-LED based high voltage AC/DC indicator lamp |
| JP2008544540A (ja) * | 2005-06-22 | 2008-12-04 | ソウル オプト デバイス カンパニー リミテッド | 発光素子及びその製造方法 |
| KR100640496B1 (ko) | 2005-11-23 | 2006-11-01 | 삼성전기주식회사 | 수직구조 질화갈륨계 발광다이오드 소자 |
| CN101820043A (zh) * | 2006-01-09 | 2010-09-01 | 首尔Opto仪器股份有限公司 | 发光装置 |
| KR100721515B1 (ko) * | 2006-01-09 | 2007-05-23 | 서울옵토디바이스주식회사 | Ⅰto층을 갖는 발광다이오드 및 그 제조방법 |
| KR100833309B1 (ko) * | 2006-04-04 | 2008-05-28 | 삼성전기주식회사 | 질화물계 반도체 발광소자 |
| SG140473A1 (en) * | 2006-08-16 | 2008-03-28 | Tinggi Tech Private Ltd | Improvements in external light efficiency of light emitting diodes |
| US7737636B2 (en) * | 2006-11-09 | 2010-06-15 | Intematix Corporation | LED assembly with an LED and adjacent lens and method of making same |
| US7535646B2 (en) * | 2006-11-17 | 2009-05-19 | Eastman Kodak Company | Light emitting device with microlens array |
| WO2008133756A1 (en) * | 2006-12-24 | 2008-11-06 | Lehigh University | Efficient light extraction method and device |
| KR20110110867A (ko) | 2007-03-13 | 2011-10-07 | 서울옵토디바이스주식회사 | 교류용 발광 다이오드 |
| KR100886359B1 (ko) | 2007-03-19 | 2009-03-03 | 전남대학교산학협력단 | 마이크로 렌즈가 구비된 발광 다이오드 |
| JP2009059969A (ja) * | 2007-08-31 | 2009-03-19 | Seiwa Electric Mfg Co Ltd | 半導体発光素子、発光装置、照明装置、表示装置及び半導体発光素子の製造方法 |
| TWI363435B (en) * | 2007-09-13 | 2012-05-01 | Delta Electronics Inc | Light-emitting diode apparatus and its manufacturing method |
| JP5178360B2 (ja) * | 2007-09-14 | 2013-04-10 | シャープ株式会社 | 窒化物半導体発光素子 |
| KR101393353B1 (ko) * | 2007-10-29 | 2014-05-13 | 서울바이오시스 주식회사 | 발광다이오드 |
| KR100930195B1 (ko) | 2007-12-20 | 2009-12-07 | 삼성전기주식회사 | 전극 패턴을 구비한 질화물 반도체 발광소자 |
| TW201005994A (en) * | 2008-07-23 | 2010-02-01 | Walsin Lihwa Corp | Light emitting diode and the method for manufacturing the same |
| KR20100042795A (ko) * | 2008-10-17 | 2010-04-27 | 삼성에스디아이 주식회사 | 플라즈마 디스플레이 패널 및 그의 제조 방법 |
| US20110089447A1 (en) * | 2009-10-19 | 2011-04-21 | Wu-Cheng Kuo | Light-emiting device chip with micro-lenses and method for fabricating the same |
| WO2011083923A2 (en) * | 2010-01-07 | 2011-07-14 | Seoul Opto Device Co., Ltd. | Light emitting diode having electrode pads |
| US8242684B2 (en) * | 2010-09-27 | 2012-08-14 | Osram Sylvania Inc. | LED wavelength-converting plate with microlenses |
-
2011
- 2011-06-16 JP JP2011134171A patent/JP2012028749A/ja not_active Withdrawn
- 2011-07-20 US US13/187,010 patent/US8629471B2/en active Active
- 2011-07-21 CN CN201510957553.0A patent/CN105449086B/zh active Active
- 2011-07-21 TW TW100125790A patent/TWI535076B/zh active
- 2011-07-21 CN CN201510958319.XA patent/CN105529343B/zh active Active
- 2011-07-21 CN CN201180035911.2A patent/CN103026516B/zh active Active
- 2011-07-21 WO PCT/KR2011/005372 patent/WO2012011749A2/en not_active Ceased
-
2013
- 2013-12-06 US US14/099,423 patent/US9202973B2/en not_active Expired - Fee Related
-
2015
- 2015-07-17 JP JP2015142774A patent/JP6081536B2/ja not_active Expired - Fee Related
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0997922A (ja) * | 1995-09-29 | 1997-04-08 | Sanyo Electric Co Ltd | 発光素子 |
| JP2000228562A (ja) * | 1999-02-05 | 2000-08-15 | Agilent Technol Inc | AlxGayInzN構造の組立方法 |
| JP2007096117A (ja) * | 2005-09-29 | 2007-04-12 | Toyoda Gosei Co Ltd | 発光素子 |
| CN101305476A (zh) * | 2005-12-16 | 2008-11-12 | 首尔Opto仪器股份有限公司 | 具有排列的发光单元的发光装置 |
| JP2007287849A (ja) * | 2006-04-14 | 2007-11-01 | Nichia Chem Ind Ltd | 半導体発光素子 |
| JP2008135554A (ja) * | 2006-11-28 | 2008-06-12 | Nichia Chem Ind Ltd | 半導体発光素子、発光装置及び半導体発光素子の製造方法 |
| WO2009119889A1 (ja) * | 2008-03-28 | 2009-10-01 | 住友化学株式会社 | 有機エレクトロルミネッセンス素子 |
| WO2010024375A1 (ja) * | 2008-08-29 | 2010-03-04 | 日亜化学工業株式会社 | 半導体発光素子及び半導体発光装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105529343B (zh) | 2018-10-19 |
| TWI535076B (zh) | 2016-05-21 |
| JP6081536B2 (ja) | 2017-02-15 |
| US8629471B2 (en) | 2014-01-14 |
| CN103026516B (zh) | 2016-07-06 |
| TW201214806A (en) | 2012-04-01 |
| CN103026516A (zh) | 2013-04-03 |
| US9202973B2 (en) | 2015-12-01 |
| WO2012011749A3 (en) | 2012-04-26 |
| CN105449086A (zh) | 2016-03-30 |
| US20120187424A1 (en) | 2012-07-26 |
| WO2012011749A2 (en) | 2012-01-26 |
| CN105529343A (zh) | 2016-04-27 |
| JP2015222826A (ja) | 2015-12-10 |
| JP2012028749A (ja) | 2012-02-09 |
| US20140091338A1 (en) | 2014-04-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105449086B (zh) | 发光二极管 | |
| CN207637833U (zh) | 具有侧面反射层的发光二极管 | |
| CN108110117B (zh) | 具有光阻挡层的发光二极管 | |
| CN104377218B (zh) | 发光二极管 | |
| CN105789234B (zh) | 晶片级发光二极管封装件及其制造方法 | |
| TWI464914B (zh) | 發光二極體 | |
| CN109979925B (zh) | 发光二极管 | |
| CN207529966U (zh) | 具有侧面反射层的发光二极管 | |
| US20160338161A1 (en) | Backlight module with mjt led and backlight unit including the same | |
| CN103779471B (zh) | 发光器件 | |
| KR101186684B1 (ko) | 발광 다이오드 및 그것을 제조하는 방법 | |
| CN105529384A (zh) | 发光设备 | |
| TW202329444A (zh) | 於圖案化模板及基板上之微米級發光二極體顯示器 | |
| CN204668306U (zh) | 发光二极管 | |
| KR101877396B1 (ko) | 발광소자 | |
| KR101272708B1 (ko) | 개선된 발광 효율을 갖는 발광다이오드 및 제조방법 | |
| US20110186882A1 (en) | Light emitting device, method of fabricating the light emitting device, light emitting device package, and lighting system | |
| KR20230026248A (ko) | 발광소자 | |
| KR20180097979A (ko) | 광 차단층을 가지는 발광 다이오드 | |
| KR101435512B1 (ko) | 혼성 구조를 갖는 발광다이오드 | |
| KR20110117856A (ko) | 발광다이오드 소자 및 그 제조 방법 | |
| KR20120040854A (ko) | 발광 소자 | |
| KR20110126968A (ko) | 발광 다이오드 및 그것을 제조하는 방법 | |
| KR20180083112A (ko) | 기판 및 이를 갖는 반도체 소자 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |