CN105405805A - 切断装置、吸附机构及具备吸附机构的装置 - Google Patents

切断装置、吸附机构及具备吸附机构的装置 Download PDF

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Publication number
CN105405805A
CN105405805A CN201510490571.2A CN201510490571A CN105405805A CN 105405805 A CN105405805 A CN 105405805A CN 201510490571 A CN201510490571 A CN 201510490571A CN 105405805 A CN105405805 A CN 105405805A
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CN
China
Prior art keywords
adsorption
absorption
hole
base plate
workbench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510490571.2A
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English (en)
Chinese (zh)
Inventor
冈本纯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Towa Corp
Original Assignee
Towa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Towa Corp filed Critical Towa Corp
Publication of CN105405805A publication Critical patent/CN105405805A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Jigs For Machine Tools (AREA)
CN201510490571.2A 2014-09-04 2015-08-11 切断装置、吸附机构及具备吸附机构的装置 Pending CN105405805A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014180254A JP6382039B2 (ja) 2014-09-04 2014-09-04 切断装置並びに吸着機構及びこれを用いる装置
JP2014-180254 2014-09-04

Publications (1)

Publication Number Publication Date
CN105405805A true CN105405805A (zh) 2016-03-16

Family

ID=55471207

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510490571.2A Pending CN105405805A (zh) 2014-09-04 2015-08-11 切断装置、吸附机构及具备吸附机构的装置

Country Status (5)

Country Link
JP (1) JP6382039B2 (enrdf_load_stackoverflow)
KR (1) KR20160028953A (enrdf_load_stackoverflow)
CN (1) CN105405805A (enrdf_load_stackoverflow)
MY (1) MY173967A (enrdf_load_stackoverflow)
TW (1) TWI566291B (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108074841A (zh) * 2016-11-11 2018-05-25 株式会社迪思科 封装基板切断用治具工作台
CN108435714A (zh) * 2018-04-12 2018-08-24 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
CN109585352A (zh) * 2017-09-28 2019-04-05 东和株式会社 保持构件、保持构件的制造方法、检查装置及切断装置
CN110137101A (zh) * 2018-02-08 2019-08-16 东和株式会社 切断装置以及切断品的制造方法
CN113858457A (zh) * 2020-06-30 2021-12-31 株式会社迪思科 卡盘工作台
US20220314595A1 (en) * 2021-03-31 2022-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101899653B1 (ko) * 2016-10-05 2018-09-18 주식회사 포스코 소재 안착장치
JP6626027B2 (ja) * 2017-03-16 2019-12-25 Ｔｏｗａ株式会社 製造装置および電子部品の製造方法
JP2019016700A (ja) * 2017-07-07 2019-01-31 Ｔｏｗａ株式会社 保持部材、保持部材の製造方法、保持装置、搬送装置及び電子部品の製造装置
JP6746756B1 (ja) * 2019-05-24 2020-08-26 Ｔｏｗａ株式会社 吸着プレート、切断装置および切断方法
JP7390855B2 (ja) * 2019-10-24 2023-12-04 株式会社ディスコ 切削装置のチャックテーブル
KR20230135661A (ko) * 2021-03-18 2023-09-25 토와 가부시기가이샤 가공 장치 및 가공품의 제조 방법
CN118235234B (zh) * 2022-10-21 2025-02-21 株式会社东光高岳 工件检查装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62234686A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JPS62234685A (ja) * 1986-04-02 1987-10-14 Mitsubishi Electric Corp 加工材料の切断方法
JP2006229129A (ja) * 2005-02-21 2006-08-31 Fujitsu Ltd 真空吸着装置
JP2006344827A (ja) * 2005-06-09 2006-12-21 Renesas Technology Corp 半導体装置の製造方法
FR2893873B1 (fr) * 2005-11-25 2008-12-12 Air Liquide Procede de coupage avec un laser a fibre d'acier inoxydable
JP5086690B2 (ja) * 2007-05-18 2012-11-28 日本特殊陶業株式会社 セラミック基板の製造方法
JP5117772B2 (ja) * 2007-06-28 2013-01-16 株式会社ディスコ 切削装置
JP2011040542A (ja) 2009-08-10 2011-02-24 Disco Abrasive Syst Ltd パッケージ基板の分割方法
JP2011216704A (ja) * 2010-03-31 2011-10-27 Furukawa Electric Co Ltd:The 半導体ウェハ加工用粘着テープ

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040084128A (ko) * 2003-03-26 2004-10-06 한미반도체 주식회사 반도체 쏘잉장치의 척테이블
JP2004330417A (ja) * 2003-04-30 2004-11-25 Towa Corp 基板の切断方法、切断装置および基板吸着固定機構
JP2008221391A (ja) * 2007-03-13 2008-09-25 Matsushita Electric Ind Co Ltd 基板吸着固定機構

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108074841A (zh) * 2016-11-11 2018-05-25 株式会社迪思科 封装基板切断用治具工作台
CN108074841B (zh) * 2016-11-11 2023-04-07 株式会社迪思科 封装基板切断用治具工作台
CN109585352A (zh) * 2017-09-28 2019-04-05 东和株式会社 保持构件、保持构件的制造方法、检查装置及切断装置
CN110137101B (zh) * 2018-02-08 2023-03-10 东和株式会社 切断装置以及切断品的制造方法
CN110137101A (zh) * 2018-02-08 2019-08-16 东和株式会社 切断装置以及切断品的制造方法
CN108435714A (zh) * 2018-04-12 2018-08-24 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
CN108435714B (zh) * 2018-04-12 2023-08-29 环维电子(上海)有限公司 一种新型干冰清洗底座及其清洗方法
CN113858457A (zh) * 2020-06-30 2021-12-31 株式会社迪思科 卡盘工作台
US20220314595A1 (en) * 2021-03-31 2022-10-06 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
US20240017538A1 (en) * 2021-03-31 2024-01-18 Taiwan Semiconductor Manufacturing Company, Ltd. Lamination process, and manufacturing method of semiconductor package using a chuck
US11993066B2 (en) * 2021-03-31 2024-05-28 Taiwan Semiconductor Manufacturing Company, Ltd. Chuck, lamination process, and manufacturing method of semiconductor package using the same
US20240198651A1 (en) * 2021-03-31 2024-06-20 Taiwan Semiconductor Manufacturing Company, Ltd. Lamination process, and manufacturing method of semiconductor package using a chuck
US12391033B2 (en) * 2021-03-31 2025-08-19 Taiwan Semiconductor Manufacturing Company, Ltd. Lamination process, and manufacturing method of semiconductor package using a chuck

Also Published As

Publication number Publication date
MY173967A (en) 2020-02-28
KR20160028953A (ko) 2016-03-14
TWI566291B (zh) 2017-01-11
JP2016054256A (ja) 2016-04-14
TW201616566A (zh) 2016-05-01
JP6382039B2 (ja) 2018-08-29

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Application publication date: 20160316

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