JP6626027B2 - 製造装置および電子部品の製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims description 24
- 239000004065 semiconductor Substances 0.000 claims description 149
- 230000007246 mechanism Effects 0.000 claims description 85
- 238000003384 imaging method Methods 0.000 claims description 74
- 239000000758 substrate Substances 0.000 claims description 42
- 238000005520 cutting process Methods 0.000 claims description 34
- 239000011347 resin Substances 0.000 claims description 24
- 229920005989 resin Polymers 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 238000001179 sorption measurement Methods 0.000 claims description 6
- 238000007789 sealing Methods 0.000 claims description 3
- 230000007723 transport mechanism Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 description 10
- 239000012790 adhesive layer Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 238000003860 storage Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000002184 metal Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000001514 detection method Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000002923 metal particle Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
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- H01L21/67005—Apparatus not specifically provided for elsewhere
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- H01L21/67092—Apparatus for mechanical treatment
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
- H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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Description
Claims (9)
- 封止樹脂を有する半導体パッケージを作製するために半導体パッケージ基板を切断するための半導体パッケージ基板切断装置と、前記半導体パッケージ基板切断装置により切断された前記半導体パッケージを配置する半導体パッケージ配置装置とを備えた製造装置であって、
前記半導体パッケージ配置装置は、
複数の前記半導体パッケージを吸着するための複数の吸着部材を備えた吸着機構と、
前記吸着機構に吸着される複数の前記半導体パッケージを撮像するための第1の撮像素子と、
前記吸着機構に吸着される前記半導体パッケージを配置するための配置部材と、
前記配置部材の複数の開口を撮像するための第2の撮像素子と、を備え、
前記吸着機構は、前記複数の吸着部材の配列方向である一軸方向のみに移動可能で、前記一軸方向と交差する方向に2つ配列されており、
前記配置部材は、樹脂シートを含む貼付部材であり、
前記第1の撮像素子は、2つの前記吸着機構の下方に設けられており、
前記第2の撮像素子は、2つの前記吸着機構の一方に取り付けられており、
前記第1の撮像素子により撮像される複数の前記半導体パッケージの撮像データと、前記第2の撮像素子により撮像される前記複数の開口の撮像データとに基づいて、前記複数の開口に対する複数の前記半導体パッケージの位置合わせを行って、前記半導体パッケージを前記配置部材上に配置する、製造装置。 - 前記吸着機構は、前記半導体パッケージの吸着位置の上方と前記配置部材の上方との間を前記一軸方向に移動可能であり、
前記吸着機構の移動の間に前記第1の撮像素子は前記吸着機構に吸着された前記半導体パッケージを下方から撮像し、
前記第1の撮像素子による撮像後に前記第2の撮像素子は前記開口を上方から撮像する、請求項1に記載の製造装置。 - 前記複数の開口が前記一軸方向に整列するように前記配置部材を回転させるための回転機構をさらに備えた、請求項1または請求項2に記載の製造装置。
- 前記配置部材を前記一軸方向と直交する第2の一軸方向に移動させることが可能な搬送機構をさらに備えた、請求項1〜請求項3のいずれか1項に記載の製造装置。
- 封止樹脂を有する半導体パッケージを作製するために半導体パッケージ基板を切断する工程と、
前記半導体パッケージを配置部材上に配置する工程と、を含み、
前記半導体パッケージを配置部材上に配置する工程は、
複数の前記半導体パッケージを複数の吸着部材を備えた吸着機構により吸着する工程と、
複数の前記半導体パッケージが吸着された前記吸着機構を前記配置部材まで前記複数の吸着部材の配列方向である一軸方向のみに移動させる工程と、を含み、前記吸着機構は、前記一軸方向と交差する方向に2つ配列されており、前記半導体パッケージを配置部材上に配置する工程はさらに、
前記吸着機構の移動中に前記吸着機構に吸着された複数の前記半導体パッケージを第1の撮像素子により撮像する工程と、
前記配置部材の複数の開口を2つの前記吸着機構の一方に取り付けられた第2の撮像素子により撮像する工程と、
前記第1の撮像素子により撮像された複数の前記半導体パッケージの撮像データと、前記第2の撮像素子により撮像された前記複数の開口の撮像データとに基づいて、前記複数の開口に対する複数の前記半導体パッケージの位置合わせを行う工程と、
前記半導体パッケージを前記配置部材上に配置する工程とを含み、
前記配置部材は、樹脂シートを含む貼付部材であり、
前記第1の撮像素子は、2つの前記吸着機構の下方に設けられている、電子部品の製造方法。 - 前記一軸方向に移動させる工程は、前記半導体パッケージが吸着された前記吸着機構を前記半導体パッケージの吸着位置の上方から前記配置部材の上方まで前記一軸方向に移動させる工程を含み、
前記第1の撮像素子により撮像する工程は、前記第1の撮像素子が前記吸着機構に吸着された前記半導体パッケージを下方から撮像する工程を含み、
前記第2の撮像素子により撮像する工程は、前記第2の撮像素子が前記複数の開口を上方から撮像する工程を含む、請求項5に記載の電子部品の製造方法。 - 前記配置部材の前記複数の開口が前記一軸方向に整列するように前記配置部材を回転させる工程をさらに含む、請求項5または請求項6に記載の電子部品の製造方法。
- 前記配置部材を前記一軸方向と直交する第2の一軸方向に移動させる工程をさらに含む、請求項5〜請求項7のいずれか1項に記載の電子部品の製造方法。
- 前記配置部材上に配置された前記半導体パッケージに導電性膜を形成する工程をさらに含む、請求項5〜請求項8のいずれか1項に記載の電子部品の製造方法。
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JP2017051101A JP6626027B2 (ja) | 2017-03-16 | 2017-03-16 | 製造装置および電子部品の製造方法 |
KR1020180024115A KR102089097B1 (ko) | 2017-03-16 | 2018-02-28 | 반도체 패키지 배치 장치, 제조 장치, 반도체 패키지의 배치 방법 및 전자 부품의 제조 방법 |
TW107108686A TWI707444B (zh) | 2017-03-16 | 2018-03-14 | 半導體封裝體配置裝置、製造裝置、半導體封裝體的配置方法以及電子零件的製造方法 |
CN201810208327.6A CN108630579B (zh) | 2017-03-16 | 2018-03-14 | 制造装置及电子零件的制造方法 |
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JP7498674B2 (ja) * | 2021-01-18 | 2024-06-12 | Towa株式会社 | 搬送機構、切断装置及び切断品の製造方法 |
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JPS6412637A (en) * | 1987-07-06 | 1989-01-17 | Yamatake Honeywell Co Ltd | Automatic restoration system of loopback type |
JP2770817B2 (ja) * | 1996-06-19 | 1998-07-02 | 日本電気株式会社 | チップマウント装置及び方法 |
KR100434832B1 (ko) * | 2001-05-29 | 2004-06-07 | 주식회사 탑 엔지니어링 | 플립칩본더장치 및 그 작동방법 |
EP1535312B1 (en) * | 2002-07-17 | 2007-09-26 | Matsushita Electric Industrial Co., Ltd. | Method and apparatus for picking up semiconductor chip and suction and exfoliation tool up therefor |
JP2007281503A (ja) * | 2007-06-01 | 2007-10-25 | Renesas Technology Corp | チップ移載装置、およびチップ移載方法 |
JP2010135574A (ja) * | 2008-12-05 | 2010-06-17 | Alpha- Design Kk | 移載装置 |
KR101360007B1 (ko) * | 2012-09-27 | 2014-02-07 | 한미반도체 주식회사 | 플립칩 본딩장치 |
JP6000902B2 (ja) * | 2013-06-24 | 2016-10-05 | Towa株式会社 | 電子部品用の収容治具、その製造方法及び個片化装置 |
JP6017382B2 (ja) * | 2013-07-29 | 2016-11-02 | Towa株式会社 | 個片化された電子部品の搬送装置及び搬送方法 |
US9887111B2 (en) * | 2014-03-24 | 2018-02-06 | Fuji Machine Mfg. Co., Ltd. | Die mounting system and die mounting method |
JP6382039B2 (ja) * | 2014-09-04 | 2018-08-29 | Towa株式会社 | 切断装置並びに吸着機構及びこれを用いる装置 |
US20160111375A1 (en) * | 2014-10-17 | 2016-04-21 | Tango Systems, Inc. | Temporary bonding of packages to carrier for depositing metal layer for shielding |
JP5845546B1 (ja) * | 2014-10-31 | 2016-01-20 | アキム株式会社 | 搬送装置、組立装置および組立方法 |
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TWI707444B (zh) | 2020-10-11 |
JP2018157010A (ja) | 2018-10-04 |
KR20180106876A (ko) | 2018-10-01 |
KR102089097B1 (ko) | 2020-03-13 |
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