CN1052096C - 无镉无铅的厚膜糊状组合物 - Google Patents

无镉无铅的厚膜糊状组合物 Download PDF

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Publication number
CN1052096C
CN1052096C CN95119897A CN95119897A CN1052096C CN 1052096 C CN1052096 C CN 1052096C CN 95119897 A CN95119897 A CN 95119897A CN 95119897 A CN95119897 A CN 95119897A CN 1052096 C CN1052096 C CN 1052096C
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China
Prior art keywords
glass
composition
ruo
cadmium
oxide
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Expired - Fee Related
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CN95119897A
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English (en)
Chinese (zh)
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CN1130795A (zh
Inventor
J·霍马达利
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EIDP Inc
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EI Du Pont de Nemours and Co
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Publication of CN1130795A publication Critical patent/CN1130795A/zh
Application granted granted Critical
Publication of CN1052096C publication Critical patent/CN1052096C/zh
Anticipated expiration legal-status Critical
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C3/00—Glass compositions
    • C03C3/04—Glass compositions containing silica
    • C03C3/062—Glass compositions containing silica with less than 40% silica by weight

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Glass Compositions (AREA)
  • Compositions Of Oxide Ceramics (AREA)
  • Thermistors And Varistors (AREA)
  • Conductive Materials (AREA)
CN95119897A 1994-12-20 1995-12-20 无镉无铅的厚膜糊状组合物 Expired - Fee Related CN1052096C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US359768 1994-12-20
US08/359,768 US5491118A (en) 1994-12-20 1994-12-20 Cadmium-free and lead-free thick film paste composition

Publications (2)

Publication Number Publication Date
CN1130795A CN1130795A (zh) 1996-09-11
CN1052096C true CN1052096C (zh) 2000-05-03

Family

ID=23415193

Family Applications (1)

Application Number Title Priority Date Filing Date
CN95119897A Expired - Fee Related CN1052096C (zh) 1994-12-20 1995-12-20 无镉无铅的厚膜糊状组合物

Country Status (8)

Country Link
US (1) US5491118A (enExample)
EP (1) EP0718855B1 (enExample)
JP (1) JP3907725B2 (enExample)
KR (1) KR0164666B1 (enExample)
CN (1) CN1052096C (enExample)
DE (1) DE69514633T2 (enExample)
SG (1) SG42818A1 (enExample)
TW (1) TW305047B (enExample)

Families Citing this family (63)

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JP3611160B2 (ja) * 1997-02-10 2005-01-19 株式会社村田製作所 厚膜抵抗体ペースト
US5753571A (en) * 1997-02-13 1998-05-19 E. I. Du Pont De Nemours And Company Lead and cadmium-free encapsulant composition
DE19736855A1 (de) * 1997-08-23 1999-02-25 Philips Patentverwaltung Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors
US6066271A (en) * 1997-09-05 2000-05-23 Ben Gurion University Of The Negev Cobalt ruthenate thermistors
US5980785A (en) * 1997-10-02 1999-11-09 Ormet Corporation Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements
US6171987B1 (en) 1997-12-29 2001-01-09 Ben-Gurion University Of The Negev Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof
US6255239B1 (en) * 1998-12-04 2001-07-03 Cerdec Corporation Lead-free alkali metal-free glass compositions
JP2001217102A (ja) * 2000-02-04 2001-08-10 Murata Mfg Co Ltd 負特性サーミスタペースト、負特性サーミスタ膜および負特性サーミスタ部品
JP4809966B2 (ja) * 2000-02-10 2011-11-09 富士通株式会社 荷電粒子ビーム露光装置、静電偏向器およびその製造方法
US6444297B1 (en) 2000-07-19 2002-09-03 Electro Technik Industries, Inc. Method of producing a thick film metallization on an aluminum nitride substrate
IL140990A0 (en) * 2001-01-18 2002-02-10 Univ Ben Gurion Thick film compositions containing pyrochlore-related compounds
CN100379704C (zh) * 2001-05-16 2008-04-09 纳幕尔杜邦公司 电阻减小的介电组合物
US6844278B2 (en) * 2001-09-18 2005-01-18 Aem, Inc. Dense lead-free glass ceramic for electronic devices
JP3579836B2 (ja) * 2002-02-28 2004-10-20 小島化学薬品株式会社 固定抵抗器
TW200419593A (en) * 2002-11-21 2004-10-01 Tdk Corp Resistive paste, resistor body and electronic device
JP3992647B2 (ja) * 2003-05-28 2007-10-17 Ｔｄｋ株式会社 抵抗体ペースト、抵抗体および電子部品
CN1812834B (zh) * 2003-06-26 2010-06-09 Scm金属制品公司 使用氧化锌助催化剂生产甲基氯硅烷的催化剂
US20050062585A1 (en) * 2003-09-22 2005-03-24 Tdk Corporation Resistor and electronic device
US6982864B1 (en) * 2004-06-09 2006-01-03 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
US7176152B2 (en) * 2004-06-09 2007-02-13 Ferro Corporation Lead-free and cadmium-free conductive copper thick film pastes
US7339780B2 (en) * 2004-06-09 2008-03-04 Ferro Corporation Copper termination inks containing lead free and cadmium free glasses for capacitors
TW200616920A (en) * 2004-09-01 2006-06-01 Tdk Corp Glass composition for thick-film resistor paste, thick-film resistor paste, thick-film resistor, and electronic device
TW200612443A (en) * 2004-09-01 2006-04-16 Tdk Corp Thick-film resistor paste and thick-film resistor
TW200639880A (en) * 2005-02-21 2006-11-16 Tdk Corp Thick-film resistor and its production process
US7326370B2 (en) * 2005-03-09 2008-02-05 E. I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7384577B2 (en) * 2005-03-09 2008-06-10 E.I. Du Pont De Nemours And Company Black conductive thick film compositions, black electrodes, and methods of forming thereof
US7569165B2 (en) * 2005-03-09 2009-08-04 E. I. Du Pont De Nemours And Company Black conductive compositions, black electrodes, and methods of forming thereof
US7326367B2 (en) 2005-04-25 2008-02-05 E.I. Du Pont De Nemours And Company Thick film conductor paste compositions for LTCC tape in microwave applications
US8093491B2 (en) 2005-06-03 2012-01-10 Ferro Corporation Lead free solar cell contacts
US7459104B2 (en) * 2005-07-18 2008-12-02 Datec Coating Corporation Low temperature fired, lead-free thick film heating element
JP2007103594A (ja) * 2005-10-03 2007-04-19 Shoei Chem Ind Co 抵抗体組成物並びに厚膜抵抗体
JP4513769B2 (ja) * 2006-02-28 2010-07-28 パナソニック株式会社 プラズマディスプレイパネル
JP4904888B2 (ja) * 2006-03-31 2012-03-28 株式会社村田製作所 導電性ペースト及びＭｎ系半導体サーミスタ
US7740725B2 (en) 2006-04-05 2010-06-22 E.I. Du Pont De Nemours And Company Thick film conductor paste composition for LTCC tape in microwave applications
JP2009020061A (ja) * 2007-07-13 2009-01-29 Denso Corp 力学量センサ素子
US8309844B2 (en) 2007-08-29 2012-11-13 Ferro Corporation Thick film pastes for fire through applications in solar cells
US8383011B2 (en) * 2008-01-30 2013-02-26 Basf Se Conductive inks with metallo-organic modifiers
US8308993B2 (en) * 2008-01-30 2012-11-13 Basf Se Conductive inks
US7736546B2 (en) * 2008-01-30 2010-06-15 Basf Se Glass frits
US8257619B2 (en) * 2008-04-18 2012-09-04 E I Du Pont De Nemours And Company Lead-free resistive composition
CN102007080B (zh) * 2008-04-18 2014-05-07 E.I.内穆尔杜邦公司 使用含铜玻璃料的电阻器组合物
US7608206B1 (en) * 2008-04-18 2009-10-27 E.I. Dupont De Nemours & Company Non-lead resistor composition
JP5281375B2 (ja) * 2008-11-28 2013-09-04 三ツ星ベルト株式会社 抵抗体ペースト、抵抗体膜及び抵抗器
CN102041469B (zh) * 2011-01-22 2012-02-22 太原理工大学 一种铸铁表面喷敷铜粉的方法
CN102450944A (zh) * 2011-05-30 2012-05-16 浙江苏泊尔家电制造有限公司 一种电热炊具
US20130004659A1 (en) * 2011-06-30 2013-01-03 E I Du Pont De Nemours And Company Thick film paste and use thereof
US9783874B2 (en) 2011-06-30 2017-10-10 E I Du Pont De Nemours And Company Thick film paste and use thereof
US8808581B2 (en) * 2011-08-15 2014-08-19 E I Du Pont De Nemours And Company Conductive compositions containing Li2RuO3 and ion-exchanged Li2RuO3 and their use in the manufacture of semiconductor devices
CN102682944A (zh) * 2012-06-04 2012-09-19 句容市博远电子有限公司 Ntc热敏电阻材料
US8815125B2 (en) 2012-06-20 2014-08-26 E. I. Du Pont De Nemours And Company Method of manufacturing a resistor paste
CN103021603A (zh) * 2012-12-27 2013-04-03 青岛艾德森能源科技有限公司 一种环保电阻浆料
CN103489550B (zh) * 2013-09-13 2015-03-04 李琴 无机电阻厚膜、其制备方法和应用
WO2016039108A1 (ja) 2014-09-12 2016-03-17 昭栄化学工業株式会社 厚膜抵抗体及びその製造方法
MY183351A (en) 2014-09-12 2021-02-18 Shoei Chemical Ind Co Resistive composition
DE102015110607A1 (de) * 2015-07-01 2017-01-05 Epcos Ag Verfahren zur Herstellung eines elektrischen Bauelements
JP6652003B2 (ja) 2016-07-04 2020-02-19 株式会社デンソー 半導体チップおよび半導体装置
CN106495487B (zh) * 2016-11-01 2019-03-12 福州大学 一种含Ce的低温封接玻璃及其制备和使用方法
CN106477894B (zh) * 2016-11-01 2019-03-12 福州大学 一种含Fe的低温封接玻璃及其制备和使用方法
JP6931455B2 (ja) 2017-02-17 2021-09-08 住友金属鉱山株式会社 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体
JP6887615B2 (ja) * 2017-03-28 2021-06-16 住友金属鉱山株式会社 ルテニウム酸ビスマス粒子を含有するガラスとその製造方法、厚膜抵抗体組成物並びに厚膜抵抗体ペースト
CN108053960B (zh) * 2017-10-23 2019-10-15 潮州三环（集团）股份有限公司 一种厚膜电阻浆料
JP7251068B2 (ja) 2018-07-31 2023-04-04 住友金属鉱山株式会社 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体
CN112768110B (zh) * 2020-12-23 2022-07-01 广东风华高新科技股份有限公司 一种铜浆及片式多层陶瓷电容器

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN85101180A (zh) * 1985-04-01 1987-01-17 株式会社日立制作所 厚膜电路用配方

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US4436829A (en) * 1982-02-04 1984-03-13 Corning Glass Works Glass frits containing WO3 or MoO3 in RuO2 -based resistors
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JPH038302A (ja) * 1989-06-06 1991-01-16 Asahi Glass Co Ltd 抵抗体ペースト及びセラミックス基板
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Patent Citations (1)

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CN85101180A (zh) * 1985-04-01 1987-01-17 株式会社日立制作所 厚膜电路用配方

Also Published As

Publication number Publication date
JP3907725B2 (ja) 2007-04-18
TW305047B (enExample) 1997-05-11
EP0718855A2 (en) 1996-06-26
KR960022305A (ko) 1996-07-18
CN1130795A (zh) 1996-09-11
EP0718855A3 (en) 1997-07-30
DE69514633T2 (de) 2000-06-21
EP0718855B1 (en) 2000-01-19
JPH08253342A (ja) 1996-10-01
DE69514633D1 (de) 2000-02-24
US5491118A (en) 1996-02-13
SG42818A1 (en) 1997-10-17
KR0164666B1 (ko) 1998-12-15

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