TW305047B - - Google Patents
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- TW305047B TW305047B TW084112796A TW84112796A TW305047B TW 305047 B TW305047 B TW 305047B TW 084112796 A TW084112796 A TW 084112796A TW 84112796 A TW84112796 A TW 84112796A TW 305047 B TW305047 B TW 305047B
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- TW
- Taiwan
- Prior art keywords
- glass
- patent application
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- composition according
- Prior art date
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- 239000011521 glass Substances 0.000 claims description 129
- 239000000203 mixture Substances 0.000 claims description 93
- 239000000758 substrate Substances 0.000 claims description 22
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(IV) oxide Inorganic materials O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 20
- 239000004020 conductor Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 15
- 239000007788 liquid Substances 0.000 claims description 14
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 12
- 229910052681 coesite Inorganic materials 0.000 claims description 12
- 229910052906 cristobalite Inorganic materials 0.000 claims description 12
- 229910052682 stishovite Inorganic materials 0.000 claims description 12
- 229910052905 tridymite Inorganic materials 0.000 claims description 12
- 229910052707 ruthenium Inorganic materials 0.000 claims description 11
- 229910052793 cadmium Inorganic materials 0.000 claims description 9
- BDOSMKKIYDKNTQ-UHFFFAOYSA-N cadmium atom Chemical compound [Cd] BDOSMKKIYDKNTQ-UHFFFAOYSA-N 0.000 claims description 9
- 239000006185 dispersion Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 150000001875 compounds Chemical class 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 7
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 6
- 238000007496 glass forming Methods 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 238000001035 drying Methods 0.000 claims description 3
- 239000007791 liquid phase Substances 0.000 claims description 3
- 229910052697 platinum Inorganic materials 0.000 claims description 3
- 229910052703 rhodium Inorganic materials 0.000 claims description 3
- 239000010948 rhodium Substances 0.000 claims description 3
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 claims description 2
- 229910052787 antimony Inorganic materials 0.000 claims description 2
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims description 2
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052738 indium Inorganic materials 0.000 claims description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 2
- 229910052761 rare earth metal Inorganic materials 0.000 claims description 2
- 150000002910 rare earth metals Chemical class 0.000 claims description 2
- 229910052715 tantalum Inorganic materials 0.000 claims description 2
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 2
- 229910052727 yttrium Inorganic materials 0.000 claims description 2
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 claims description 2
- 239000000463 material Substances 0.000 description 29
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 24
- 239000012071 phase Substances 0.000 description 21
- 238000011049 filling Methods 0.000 description 16
- 238000002485 combustion reaction Methods 0.000 description 11
- 239000002245 particle Substances 0.000 description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 239000002253 acid Substances 0.000 description 6
- 229910052797 bismuth Inorganic materials 0.000 description 6
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 239000005416 organic matter Substances 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- 238000007650 screen-printing Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 229910017052 cobalt Inorganic materials 0.000 description 4
- 239000010941 cobalt Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 239000001856 Ethyl cellulose Substances 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 3
- 238000004455 differential thermal analysis Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 229920001249 ethyl cellulose Polymers 0.000 description 3
- 235000019325 ethyl cellulose Nutrition 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 238000003801 milling Methods 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- -1 resistors Substances 0.000 description 3
- 150000003304 ruthenium compounds Chemical class 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 229940116411 terpineol Drugs 0.000 description 3
- 229910000314 transition metal oxide Inorganic materials 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 2
- 229910025794 LaB6 Inorganic materials 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 108091008874 T cell receptors Proteins 0.000 description 2
- 238000002441 X-ray diffraction Methods 0.000 description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 2
- AYJRCSIUFZENHW-UHFFFAOYSA-L barium carbonate Chemical compound [Ba+2].[O-]C([O-])=O AYJRCSIUFZENHW-UHFFFAOYSA-L 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000002079 cooperative effect Effects 0.000 description 2
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 2
- 238000004031 devitrification Methods 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 2
- 238000010952 in-situ formation Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000010606 normalization Methods 0.000 description 2
- 230000005693 optoelectronics Effects 0.000 description 2
- 239000010970 precious metal Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 230000009258 tissue cross reactivity Effects 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- FRWYFWZENXDZMU-UHFFFAOYSA-N 2-iodoquinoline Chemical compound C1=CC=CC2=NC(I)=CC=C21 FRWYFWZENXDZMU-UHFFFAOYSA-N 0.000 description 1
- CRWNQZTZTZWPOF-UHFFFAOYSA-N 2-methyl-4-phenylpyridine Chemical compound C1=NC(C)=CC(C=2C=CC=CC=2)=C1 CRWNQZTZTZWPOF-UHFFFAOYSA-N 0.000 description 1
- 101100494264 Caenorhabditis elegans best-14 gene Proteins 0.000 description 1
- 241000345998 Calamus manan Species 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910021305 CoAl2 Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910016553 CuOx Inorganic materials 0.000 description 1
- 244000241257 Cucumis melo Species 0.000 description 1
- 235000015510 Cucumis melo subsp melo Nutrition 0.000 description 1
- 244000068988 Glycine max Species 0.000 description 1
- 235000010469 Glycine max Nutrition 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910016978 MnOx Inorganic materials 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical class CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- FJJCIZWZNKZHII-UHFFFAOYSA-N [4,6-bis(cyanoamino)-1,3,5-triazin-2-yl]cyanamide Chemical compound N#CNC1=NC(NC#N)=NC(NC#N)=N1 FJJCIZWZNKZHII-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910001570 bauxite Inorganic materials 0.000 description 1
- LTPBRCUWZOMYOC-UHFFFAOYSA-N beryllium oxide Inorganic materials O=[Be] LTPBRCUWZOMYOC-UHFFFAOYSA-N 0.000 description 1
- 150000001621 bismuth Chemical class 0.000 description 1
- CMHXYXQNKLCTDV-UHFFFAOYSA-N boric acid;silicon Chemical compound [Si].OB(O)O CMHXYXQNKLCTDV-UHFFFAOYSA-N 0.000 description 1
- 229910052810 boron oxide Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000005321 cobalt glass Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000875 corresponding effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 238000010908 decantation Methods 0.000 description 1
- DQUIAMCJEJUUJC-UHFFFAOYSA-N dibismuth;dioxido(oxo)silane Chemical compound [Bi+3].[Bi+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O.[O-][Si]([O-])=O DQUIAMCJEJUUJC-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000005337 ground glass Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 229910003480 inorganic solid Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 239000000075 oxide glass Substances 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000010665 pine oil Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000006064 precursor glass Substances 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 235000012950 rattan cane Nutrition 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000518 rheometry Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 150000003505 terpenes Chemical class 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/14—Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
- Compositions Of Oxide Ceramics (AREA)
- Thermistors And Varistors (AREA)
- Conductive Materials (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/359,768 US5491118A (en) | 1994-12-20 | 1994-12-20 | Cadmium-free and lead-free thick film paste composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW305047B true TW305047B (enExample) | 1997-05-11 |
Family
ID=23415193
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084112796A TW305047B (enExample) | 1994-12-20 | 1995-11-30 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US5491118A (enExample) |
| EP (1) | EP0718855B1 (enExample) |
| JP (1) | JP3907725B2 (enExample) |
| KR (1) | KR0164666B1 (enExample) |
| CN (1) | CN1052096C (enExample) |
| DE (1) | DE69514633T2 (enExample) |
| SG (1) | SG42818A1 (enExample) |
| TW (1) | TW305047B (enExample) |
Families Citing this family (63)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3611160B2 (ja) * | 1997-02-10 | 2005-01-19 | 株式会社村田製作所 | 厚膜抵抗体ペースト |
| US5753571A (en) * | 1997-02-13 | 1998-05-19 | E. I. Du Pont De Nemours And Company | Lead and cadmium-free encapsulant composition |
| DE19736855A1 (de) * | 1997-08-23 | 1999-02-25 | Philips Patentverwaltung | Schaltungsanordnung mit einem SMD-Bauelement, insbesondere Temperatursensor und Verfahren zur Herstellung eines Temperatursensors |
| US6066271A (en) * | 1997-09-05 | 2000-05-23 | Ben Gurion University Of The Negev | Cobalt ruthenate thermistors |
| US5980785A (en) * | 1997-10-02 | 1999-11-09 | Ormet Corporation | Metal-containing compositions and uses thereof, including preparation of resistor and thermistor elements |
| US6171987B1 (en) | 1997-12-29 | 2001-01-09 | Ben-Gurion University Of The Negev | Cadmium-free and lead-free glass compositions, thick film formulations containing them and uses thereof |
| US6255239B1 (en) * | 1998-12-04 | 2001-07-03 | Cerdec Corporation | Lead-free alkali metal-free glass compositions |
| JP2001217102A (ja) * | 2000-02-04 | 2001-08-10 | Murata Mfg Co Ltd | 負特性サーミスタペースト、負特性サーミスタ膜および負特性サーミスタ部品 |
| JP4809966B2 (ja) * | 2000-02-10 | 2011-11-09 | 富士通株式会社 | 荷電粒子ビーム露光装置、静電偏向器およびその製造方法 |
| US6444297B1 (en) | 2000-07-19 | 2002-09-03 | Electro Technik Industries, Inc. | Method of producing a thick film metallization on an aluminum nitride substrate |
| IL140990A0 (en) * | 2001-01-18 | 2002-02-10 | Univ Ben Gurion | Thick film compositions containing pyrochlore-related compounds |
| CN100379704C (zh) * | 2001-05-16 | 2008-04-09 | 纳幕尔杜邦公司 | 电阻减小的介电组合物 |
| US6844278B2 (en) * | 2001-09-18 | 2005-01-18 | Aem, Inc. | Dense lead-free glass ceramic for electronic devices |
| JP3579836B2 (ja) * | 2002-02-28 | 2004-10-20 | 小島化学薬品株式会社 | 固定抵抗器 |
| TW200419593A (en) * | 2002-11-21 | 2004-10-01 | Tdk Corp | Resistive paste, resistor body and electronic device |
| JP3992647B2 (ja) * | 2003-05-28 | 2007-10-17 | Ｔｄｋ株式会社 | 抵抗体ペースト、抵抗体および電子部品 |
| CN1812834B (zh) * | 2003-06-26 | 2010-06-09 | Scm金属制品公司 | 使用氧化锌助催化剂生产甲基氯硅烷的催化剂 |
| US20050062585A1 (en) * | 2003-09-22 | 2005-03-24 | Tdk Corporation | Resistor and electronic device |
| US6982864B1 (en) * | 2004-06-09 | 2006-01-03 | Ferro Corporation | Copper termination inks containing lead free and cadmium free glasses for capacitors |
| US7176152B2 (en) * | 2004-06-09 | 2007-02-13 | Ferro Corporation | Lead-free and cadmium-free conductive copper thick film pastes |
| US7339780B2 (en) * | 2004-06-09 | 2008-03-04 | Ferro Corporation | Copper termination inks containing lead free and cadmium free glasses for capacitors |
| TW200616920A (en) * | 2004-09-01 | 2006-06-01 | Tdk Corp | Glass composition for thick-film resistor paste, thick-film resistor paste, thick-film resistor, and electronic device |
| TW200612443A (en) * | 2004-09-01 | 2006-04-16 | Tdk Corp | Thick-film resistor paste and thick-film resistor |
| TW200639880A (en) * | 2005-02-21 | 2006-11-16 | Tdk Corp | Thick-film resistor and its production process |
| US7326370B2 (en) * | 2005-03-09 | 2008-02-05 | E. I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
| US7384577B2 (en) * | 2005-03-09 | 2008-06-10 | E.I. Du Pont De Nemours And Company | Black conductive thick film compositions, black electrodes, and methods of forming thereof |
| US7569165B2 (en) * | 2005-03-09 | 2009-08-04 | E. I. Du Pont De Nemours And Company | Black conductive compositions, black electrodes, and methods of forming thereof |
| US7326367B2 (en) | 2005-04-25 | 2008-02-05 | E.I. Du Pont De Nemours And Company | Thick film conductor paste compositions for LTCC tape in microwave applications |
| US8093491B2 (en) | 2005-06-03 | 2012-01-10 | Ferro Corporation | Lead free solar cell contacts |
| US7459104B2 (en) * | 2005-07-18 | 2008-12-02 | Datec Coating Corporation | Low temperature fired, lead-free thick film heating element |
| JP2007103594A (ja) * | 2005-10-03 | 2007-04-19 | Shoei Chem Ind Co | 抵抗体組成物並びに厚膜抵抗体 |
| JP4513769B2 (ja) * | 2006-02-28 | 2010-07-28 | パナソニック株式会社 | プラズマディスプレイパネル |
| JP4904888B2 (ja) * | 2006-03-31 | 2012-03-28 | 株式会社村田製作所 | 導電性ペースト及びＭｎ系半導体サーミスタ |
| US7740725B2 (en) | 2006-04-05 | 2010-06-22 | E.I. Du Pont De Nemours And Company | Thick film conductor paste composition for LTCC tape in microwave applications |
| JP2009020061A (ja) * | 2007-07-13 | 2009-01-29 | Denso Corp | 力学量センサ素子 |
| US8309844B2 (en) | 2007-08-29 | 2012-11-13 | Ferro Corporation | Thick film pastes for fire through applications in solar cells |
| US8383011B2 (en) * | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
| US8308993B2 (en) * | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
| US7736546B2 (en) * | 2008-01-30 | 2010-06-15 | Basf Se | Glass frits |
| US8257619B2 (en) * | 2008-04-18 | 2012-09-04 | E I Du Pont De Nemours And Company | Lead-free resistive composition |
| CN102007080B (zh) * | 2008-04-18 | 2014-05-07 | E.I.内穆尔杜邦公司 | 使用含铜玻璃料的电阻器组合物 |
| US7608206B1 (en) * | 2008-04-18 | 2009-10-27 | E.I. Dupont De Nemours & Company | Non-lead resistor composition |
| JP5281375B2 (ja) * | 2008-11-28 | 2013-09-04 | 三ツ星ベルト株式会社 | 抵抗体ペースト、抵抗体膜及び抵抗器 |
| CN102041469B (zh) * | 2011-01-22 | 2012-02-22 | 太原理工大学 | 一种铸铁表面喷敷铜粉的方法 |
| CN102450944A (zh) * | 2011-05-30 | 2012-05-16 | 浙江苏泊尔家电制造有限公司 | 一种电热炊具 |
| US20130004659A1 (en) * | 2011-06-30 | 2013-01-03 | E I Du Pont De Nemours And Company | Thick film paste and use thereof |
| US9783874B2 (en) | 2011-06-30 | 2017-10-10 | E I Du Pont De Nemours And Company | Thick film paste and use thereof |
| US8808581B2 (en) * | 2011-08-15 | 2014-08-19 | E I Du Pont De Nemours And Company | Conductive compositions containing Li2RuO3 and ion-exchanged Li2RuO3 and their use in the manufacture of semiconductor devices |
| CN102682944A (zh) * | 2012-06-04 | 2012-09-19 | 句容市博远电子有限公司 | Ntc热敏电阻材料 |
| US8815125B2 (en) | 2012-06-20 | 2014-08-26 | E. I. Du Pont De Nemours And Company | Method of manufacturing a resistor paste |
| CN103021603A (zh) * | 2012-12-27 | 2013-04-03 | 青岛艾德森能源科技有限公司 | 一种环保电阻浆料 |
| CN103489550B (zh) * | 2013-09-13 | 2015-03-04 | 李琴 | 无机电阻厚膜、其制备方法和应用 |
| WO2016039108A1 (ja) | 2014-09-12 | 2016-03-17 | 昭栄化学工業株式会社 | 厚膜抵抗体及びその製造方法 |
| MY183351A (en) | 2014-09-12 | 2021-02-18 | Shoei Chemical Ind Co | Resistive composition |
| DE102015110607A1 (de) * | 2015-07-01 | 2017-01-05 | Epcos Ag | Verfahren zur Herstellung eines elektrischen Bauelements |
| JP6652003B2 (ja) | 2016-07-04 | 2020-02-19 | 株式会社デンソー | 半導体チップおよび半導体装置 |
| CN106495487B (zh) * | 2016-11-01 | 2019-03-12 | 福州大学 | 一种含Ce的低温封接玻璃及其制备和使用方法 |
| CN106477894B (zh) * | 2016-11-01 | 2019-03-12 | 福州大学 | 一种含Fe的低温封接玻璃及其制备和使用方法 |
| JP6931455B2 (ja) | 2017-02-17 | 2021-09-08 | 住友金属鉱山株式会社 | 抵抗体用組成物及びこれを含んだ抵抗体ペーストとそれを用いた厚膜抵抗体 |
| JP6887615B2 (ja) * | 2017-03-28 | 2021-06-16 | 住友金属鉱山株式会社 | ルテニウム酸ビスマス粒子を含有するガラスとその製造方法、厚膜抵抗体組成物並びに厚膜抵抗体ペースト |
| CN108053960B (zh) * | 2017-10-23 | 2019-10-15 | 潮州三环（集团）股份有限公司 | 一种厚膜电阻浆料 |
| JP7251068B2 (ja) | 2018-07-31 | 2023-04-04 | 住友金属鉱山株式会社 | 厚膜抵抗体用組成物、厚膜抵抗体用ペースト、及び厚膜抵抗体 |
| CN112768110B (zh) * | 2020-12-23 | 2022-07-01 | 广东风华高新科技股份有限公司 | 一种铜浆及片式多层陶瓷电容器 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4433092A (en) * | 1981-03-09 | 1984-02-21 | Champion Spark Plug Company | Green ceramic of lead-free glass, conductive carbon, silicone resin and AlPO4, useful, after firing, as an electrical resistor |
| US4436829A (en) * | 1982-02-04 | 1984-03-13 | Corning Glass Works | Glass frits containing WO3 or MoO3 in RuO2 -based resistors |
| US4707346A (en) * | 1982-06-01 | 1987-11-17 | E. I. Du Pont De Nemours And Company | Method for doping tin oxide |
| CN85101180B (zh) * | 1985-04-01 | 1988-05-18 | 株式会社日立制作所 | 一种制作厚膜电路的浆料配方 |
| US4961999A (en) * | 1988-07-21 | 1990-10-09 | E. I. Du Pont De Nemours And Company | Thermistor composition |
| US4906406A (en) * | 1988-07-21 | 1990-03-06 | E. I. Du Pont De Nemours And Company | Thermistor composition |
| JPH038302A (ja) * | 1989-06-06 | 1991-01-16 | Asahi Glass Co Ltd | 抵抗体ペースト及びセラミックス基板 |
| DE3941283C1 (enExample) * | 1989-12-14 | 1991-01-31 | W.C. Heraeus Gmbh, 6450 Hanau, De | |
| US5122302A (en) * | 1991-09-30 | 1992-06-16 | E. I. Du Pont De Nemours And Company | Thick film NTC thermistor compositions |
| US5378408A (en) * | 1993-07-29 | 1995-01-03 | E. I. Du Pont De Nemours And Company | Lead-free thick film paste composition |
| US5439852A (en) * | 1994-08-01 | 1995-08-08 | E. I. Du Pont De Nemours And Company | Cadmium-free and lead-free thick film conductor composition |
-
1994
- 1994-12-20 US US08/359,768 patent/US5491118A/en not_active Expired - Lifetime
-
1995
- 1995-11-30 TW TW084112796A patent/TW305047B/zh not_active IP Right Cessation
- 1995-12-04 DE DE69514633T patent/DE69514633T2/de not_active Expired - Lifetime
- 1995-12-04 EP EP95119036A patent/EP0718855B1/en not_active Expired - Lifetime
- 1995-12-19 SG SG1995002218A patent/SG42818A1/en unknown
- 1995-12-19 KR KR1019950051902A patent/KR0164666B1/ko not_active Expired - Fee Related
- 1995-12-20 CN CN95119897A patent/CN1052096C/zh not_active Expired - Fee Related
- 1995-12-20 JP JP33241795A patent/JP3907725B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3907725B2 (ja) | 2007-04-18 |
| EP0718855A2 (en) | 1996-06-26 |
| KR960022305A (ko) | 1996-07-18 |
| CN1130795A (zh) | 1996-09-11 |
| EP0718855A3 (en) | 1997-07-30 |
| DE69514633T2 (de) | 2000-06-21 |
| CN1052096C (zh) | 2000-05-03 |
| EP0718855B1 (en) | 2000-01-19 |
| JPH08253342A (ja) | 1996-10-01 |
| DE69514633D1 (de) | 2000-02-24 |
| US5491118A (en) | 1996-02-13 |
| SG42818A1 (en) | 1997-10-17 |
| KR0164666B1 (ko) | 1998-12-15 |
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