CN105144376A - 半导体装置及其制造方法 - Google Patents

半导体装置及其制造方法 Download PDF

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Publication number
CN105144376A
CN105144376A CN201380075828.7A CN201380075828A CN105144376A CN 105144376 A CN105144376 A CN 105144376A CN 201380075828 A CN201380075828 A CN 201380075828A CN 105144376 A CN105144376 A CN 105144376A
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China
Prior art keywords
electronic devices
components
semiconductor device
lead frame
seat surface
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CN201380075828.7A
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English (en)
Inventor
国光威宏
田中大辅
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Publication of CN105144376A publication Critical patent/CN105144376A/zh
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Abstract

作为以桥接引线框的两个基座面(21、23)的方式搭载的贴片电容器(35)，使用了具有树脂电极的树脂电极电容器。由此，在对贴片电容器(35)施加了因基座面(21、23)的阶差而产生的应力、因密封时的模塑树脂(7)的压力而产生的应力的情况下，能通过树脂电极进行剥离来防止元件基体的破损，能防止半导体装置的故障。

Description

半导体装置及其制造方法
技术领域
本发明涉及在引线框上搭载电子元器件并进行树脂密封而构成的半导体装置及其制造方法。
背景技术
在现有的半导体装置中，作为布线构件的引线框具有电气独立的多个基座面，并搭载有电子元器件，以桥接上述两个基座面，并利用模塑树脂对这些引线框及电子元器件进行密封(专利文献1)。
现有技术文献
专利文献
专利文献1：日本专利特开2006－32774号公报
发明内容
发明所要解决的技术问题
在上述那样结构的半导体装置中，对以桥接引线框的电气独立的两个基座面的方式搭载的电子元器件施加应力，由此电子元器件的电极发生剥离、破裂，成为半导体装置发生故障的原因。施加于电子元器件的应力是因各种原因而产生的应力，例如因两个基座面之间产生的阶差而产生的应力、因利用模塑树脂进行密封时的树脂的压力而产生的应力、或因来自搭载于引线框的发热体的热量而产生的应力等。
本发明鉴于上述问题点，其目的在于，防止因施加于以桥接引线框的电气独立的两个基座面的方式搭载的电子元器件的应力而导致该电子元器件发生破损，获得耐久性优异的半导体装置。此外，本发明的目的在于，提供一种能缓和施加于以桥接两个基座面的方式搭载的电子元器件的应力的半导体装置的制造方法。
解决技术问题所采用的技术手段
本发明所涉及的半导体装置包括：引线框，该引线框具有电气独立的多个基座面；电子元器件，该电子元器件经由导电性接合材料搭载于基座面上；以及模塑树脂，该模塑树脂对引线框及电子元器件进行密封，该半导体装置的特征在于，电子元器件包含以桥接两个基座面的方式搭载的第一电子元器件，第一电子元器件具有树脂电极。
本发明所涉及的半导体装置的制造方法的特征在于，包括如下工序：第一工序，在该第一工序中，准备具有外框、配置于外框内侧且电气独立的多个基座面、从基座面向多个不同的方向延伸而出并与外框一体化的连结部的引线框；第二工序，在该第二工序中，接着第一工序，以桥接引线框的两个基座面的方式安装第一电子元器件；第三工序，在该第三工序中，接着第二工序，将引线框放置于底座，在利用按压构件分别向底座的方向按压安装有第一电子元器件的两个基座面的状态下，利用熔融后的模塑树脂对引线框及第一电子元器件进行密封，并且在模塑树脂固化前拔出按压构件；以及第四工序，在该第四工序中，接着第三工序，切断电路上不需要的外框及连结部。
发明效果
本发明所涉及的半导体装置中，以桥接两个基座面的方式搭载的第一电子元器件具有树脂电极，由此在有应力施加于第一电子元器件的情况下，能通过树脂电极剥离来防止元器件主体的破损，能防止半导体装置的故障。由此，能获得耐久性优异的半导体装置。
本发明所涉及的半导体装置的制造方法中，在以桥接引线框的两个基座面的方式安装了第一电子元器件之后，将引线框放置于底座，在利用按压构件分别向底座的方向按压安装有第一电子元器件的两个基座面的状态下，利用模塑树脂对引线框及第一电子元器件进行密封，因此能防止因模塑树脂的压力导致第一电子元器件发生破损，能防止半导体装置的故障。由此，能制造耐久性优异的半导体装置。
本发明的上述以外的目的、特征、观点及效果通过参照附图的以下本发明的详细说明来进一步阐明。
附图说明
图1是本发明的实施方式1所涉及的半导体装置的电路图。
图2是表示本发明的实施方式1所涉及的半导体装置的内部结构的俯视图。
图3是表示本发明的实施方式1所涉及的引线框的俯视图。
图4是表示本发明的实施方式1所涉及的半导体装置所使用的树脂电极电容器的结构的图。
图5是对本发明的实施方式1所涉及的半导体装置的制造方法进行说明的俯视图。
图6是对本发明的实施方式1所涉及的半导体装置的制造方法进行说明的局部剖视图。
图7是对本发明的实施方式1所涉及的半导体装置的制造方法进行说明的俯视图。
图8是表示本发明的实施方式1所涉及的半导体装置的局部剖视图。
具体实施方式
实施方式1
基于附图，说明本发明的实施方式1所涉及的半导体装置。图1是本实施方式1所涉及的半导体装置的电路图，表示构成电动机驱动电路的三相桥接电路的一相。图2表示本发明的实施方式1所涉及的半导体装置的内部结构，图3表示本实施方式1所涉及的半导体装置的安装电子元器件前的引线框。此外，在以下所有附图中，对图中相同部分附加相同标号。
如图1及图2所示，半导体装置1包括：作为构成用于从直流输出交流的上段侧桥臂的开关元件的功率半导体芯片31、作为构成下段侧桥臂的开关元件的功率半导体芯片32、作为具有继电器功能的开关元件的继电器半导体芯片33、用于监视电动机电流的分流电阻34、以及作为抑制噪声的缓冲电容器的两个贴片电容器(第一电子元器件)35。作为构成上下桥臂的功率半导体芯片31、32例如使用FET。作为贴片电容器35例如使用陶瓷电容器。
继电器半导体芯片33插入于半导体装置1的输出端子和桥接电路的输出端子之间，对半导体装置1的输出进行连接或切断。分流电阻34插入于下段侧桥臂和GND(接地)之间，贴片电容器35插入于外部的电源和GND之间。这些电子元器件经由导电性接合材料搭载在高导电且高热传导的铜制引线框的基座面上，并利用模塑树脂进行密封。
构成本实施方式1所涉及的半导体装置1的引线框被压切成图3所示的状态。图3所示的引线框2具有电气独立的多个基座面21、22、23、24a、24b，电子元器件搭载于这些基座面。基座面21上构成有与外部的电源端子相连接的电源端子部，基座面22上构成有用于与电动机、电源线(powerline)相连接的电源线(powerline)部。基座面23上构成有与外部的GND相连接的GND部。基座面24a、24b上构成有形成半导体装置1的内部布线的芯片焊盘(diepad)部。
并且，引线框2具有与外部之间输入输出信号的信号导出部25、包围外周的外框26、作为连接各基座面和外框26的连结部的梁27或端子(未图示)。梁27是电路上不需要的部位，但与外框26或其他的梁27形成为一体，对各基座面21、22、23、24a、24b进行支承。
本实施方式1所涉及的半导体装置1的特征在于，搭载有两个贴片电容器35，以桥接两个基座面21、23，使用具有树脂电极的树脂电极电容器来作为这些贴片电容器35。如图4所示，树脂电极电容器由作为电容器元件的元件基体351和内部电极352、及成为外部电极的树脂电极353构成。
从外部施加了应力的情况下，树脂电极电容器通过树脂电极353剥离来防止内部电极352及元件基体351的损伤，避免元器件主体的破损。另外，树脂电极353由于并不完全从电容器元件剥离，因此可保持电路的动作。
贴片电容器35的一个电极与基座面21相接合，该基座面21搭载有作为开关元件的功率半导体芯片31，且与外部的电源端子相连接，另一个电极与构成有GND部的基座面23相接合。由此，通过直接安装贴片电容器35，以使其桥接到基座面21、23，并将该贴片电容器35配置在开关元件的附近，从而高效地去除开关噪声。
对本实施方式1所涉及的半导体装置的制造方法进行说明。首先，作为第一工序，准备图3所示的引线框2。即，准备具有外框26、配置在外框26的内侧且电气独立的多个基座面21、22、23、24a、24b、及从这些基座面向多个不同的方向延伸且与外框26或其他梁27一体化的梁27的引线框2。
另外，多个基座面中以桥接的方式搭载贴片电容器35的两个基座面21、23的任一个中，三根以上的梁27分别向不同方向延伸而出，从而与外框26或其他梁27一体化。具体而言，梁271、272、273、274从基座面21延伸而出。梁274、275、276从基座面23延伸而出。
接着，作为第二工序，如图5所示，在引线框2的各基座面上安装电子元器件。具体而言，以桥接两个基座面21、23的方式安装具有树脂电极的贴片电容器35。如上所述，由于基座面21、23通过分别向不同方向延伸而出的三根以上的梁27与外框26或其他梁27一体化，因此在安装贴片电容器35时，能抑制基座面21和基座面23之间的阶差，缓和了因阶差而施加于贴片电容器35的应力。
将构成上段侧桥臂的功率半导体芯片31安装于基座面21，将构成下段侧桥臂的功率半导体芯片32安装于基座面24a。同样，将继电器半导体芯片33安装于基座面22。接着，利用功率·终端部4a对功率半导体芯片31、继电器半导体芯片33、及作为芯片焊盘部的基座面24a进行连接。利用功率·终端部4b对安装于基座面24a的功率半导体芯片32和安装有分流电阻34的作为芯片焊盘部的基座面24b进行连接。分流电阻34安装为对基座面24b和构成GND部的基座面23进行桥接。
并且，通过接合引线5将功率半导体芯片31的栅极、功率半导体芯片32的栅极和漏极、继电器半导体芯片33的栅极和源极与信号导出部25相连接。这些电子元器件的安装中，作为导电性接合材料6(参照图6)能使用无铅焊料、共晶焊料、或导电性粘接剂等。另外，安装这些电子元器件的顺序并不作限定。
接着，作为第三工序，如图6及图7所示，将引线框2放置于底座10，利用作为按压构件的销9a、9b向底座10的方向对按压部8a、8b分别进行按压，该按压部8a、8b设置于在第二工序中安装有贴片电容器35的两个基座面21、23。该状态下，使熔融后的模塑树脂流入模具中，利用模塑树脂7对引线框2的搭载有电子元器件的面一侧、及包含搭载于该面的贴片电容器35在内的电子元器件进行密封。
通过使用模塑树脂7进行密封，从而利用模塑树脂7的热传导实现模块内部的热均衡，缓和施加于引线框2的热应力，缓和施加于电子元器件的应力。另外，在模塑树脂7固化前拔出销9a、9b，因此如图8所示，完成后的半导体装置1的模塑树脂7中不会残留拔出销9a、9b的痕迹的孔。
如上所述，以桥接的方式安装有贴片电容器35的基座面21、23通过分别向不同方向延伸而出的3根以上的梁27与外框26或其他梁27一体化。通过采用上述结构，能抑制因第二工序中安装时基座面21、23的阶差而施加于贴片电容器35的应力，并且在第三工序中，也能缓和因密封时的模塑树脂7的压力而施加于引线框2及贴片电容器35的应力。
第三工序中，在利用熔融后的模塑树脂7进行密封时，通过利用销9a、9b向底座10的方向按压引线框2的基座面21、22，从而缓和了因模塑树脂7的压力而施加于引线框2及贴片电容器35的应力。并且，即使因密封时的模塑树脂7的压力而向贴片电容器35施加压力，也能通过贴片电容器35的树脂电极353剥离来防止内部电极352及元件基体351的破损，能防止半导体装置1的故障。
另外，分流电阻34及功率·终端部4a、4b也以桥接两个基座面的方式进行安装，但这些元器件的坯体是金属，因应力而导致自身破损的可能性较低。因此，基座面22及基座面24a、24b并没有采用利用三根以上的梁来与外框一体化的结构。
接着，作为第四工序，切断引线框2的电路上的不需要的外框26及梁27。
以上，经过第一工序到第四工序制作而成的半导体装置1中，引线框2的与搭载有电子元器件的面相反一侧的面从模塑树脂7露出。由此，通过不对引线框2的没有搭载电子元器件的面进行树脂密封，从而易于达到引线框2的平面度。此外，所搭载的电子元器件包含伴有发热的发热体，因此可将引线框2的没有搭载电子元器件的面、即从模塑树脂7露出的面与散热器等散热构件相接合。由此，能缓和施加于引线框2的热应力，能防止电子元器件及半导体装置1的破损。
如上所述，根据本实施方式1，半导体装置1包括：引线框2，该引线框2具有电气独立的多个基座面21、22、23、24a、24b；电子元器件，该电子元器件经由导电性接合材料6搭载于上述基座面上；以及模塑树脂7，该模塑树脂7对上述引线框2及电子元器件进行密封，在该半导体装置1中，作为以桥接两个基座面21、23的方式搭载的贴片电容器35，使用具有树脂电极的树脂电极电容器，从而在对贴片电容器35施加了应力的情况下，能通过树脂电极353剥离来防止内部电极352及元件基体351的破损，能防止半导体装置1的故障。由此，能获得耐久性优异的半导体装置1。
根据本实施方式1所涉及的半导体装置的制造方法，在以桥接引线框2的两个基座面21、23的方式安装了贴片电容器35之后，在利用模塑树脂7进行密封时，利用销9a、9b向底座10的方向按压基座面21、22，因此能防止因模塑树脂7的压力而导致贴片电容器35发生破损，能防止半导体装置的故障。由此，能制造耐久性优异的半导体装置。
利用分别向不同的方向延伸而出的三根以上的梁27使以桥接的方式搭载有贴片电容器35的引线框2的两个基座面21、23与外框26或其他的梁27一体化，因此能抑制在两个基座面21、23之间产生阶差，并且能缓和因密封时的模塑树脂7的压力而施加于引线框2及贴片电容器35的应力。
本实施方式1中，作为以桥接引线框2的两个基座面21、23的方式搭载的电子元器件，以树脂电极电容器为例进行了说明，但本发明并不限定于此。作为具有树脂电极的电子元器件，除了树脂电极电容器以外，还存在有树脂电极电阻、线圈等，均能适用于本发明。
本实施方式1中，以构成进行电动机控制的驱动电路的半导体装置1为例进行了说明，但本发明对于以桥接引线框的两个独立的基座面的方式搭载电子元器件并利用模塑树脂进行密封而构成的所有半导体装置，均能适用。另外，本发明在其发明的范围内，能对实施方式进行适当地变形、省略。
工业上的实用性
本发明能利用于以桥接引线框的独立的基座面的方式搭载电子元器件并利用模塑树脂进行密封而构成的半导体装置。

Claims (7)

1.一种半导体装置，该半导体装置包括：引线框，该引线框具有电气独立的多个基座面；电子元器件，该电子元器件经由导电性接合材料搭载于所述基座面上；以及模塑树脂，该模塑树脂对所述引线框及所述电子元器件进行密封，该半导体装置的特征在于，
所述电子元器件包含以桥接两个所述基座面的方式搭载的第一电子元器件，所述第一电子元器件具有树脂电极。
2.如权利要求1所述的半导体装置，其特征在于，
所述电子元器件包含开关元件，所述第一电子元器件是电容器，所述电容器的一个所述树脂电极与搭载有所述开关元件的所述基座面相接合。
3.如权利要求1或2所述的半导体装置，其特征在于，
所述引线框的与搭载有所述电子元器件的面相反一侧的面从所述模塑树脂露出。
4.如权利要求3所述的半导体装置，其特征在于，
所述引线框的与搭载有所述电子元器件的面相反一侧的面与散热构件相接合。
5.一种半导体装置的制造方法，其特征在于，包括如下工序：
第一工序，在该第一工序中，准备具有外框、配置于所述外框的内侧且电气独立的多个基座面、以及从所述基座面向多个不同的方向延伸而出并与所述外框一体化的连结部的引线框；
第二工序，在该第二工序中，接着所述第一工序，以桥接所述引线框的两个所述基座面的方式安装第一电子元器件；
第三工序，在该第三工序中，接着所述第二工序，将所述引线框放置于底座，在利用按压构件分别向所述底座的方向按压安装有所述第一电子元器件的两个所述基座面的状态下，利用熔融后的模塑树脂对所述引线框及所述第一电子元器件进行密封，并且在所述模塑树脂固化前拔出所述按压构件；以及
第四工序，在该第四工序中，接着所述第三工序，切断电路上不需要的所述外框及所述连结部。
6.如权利要求5所述的半导体装置的制造方法，其特征在于，
所述第二工序中安装的所述第一电子元器件具有树脂电极。
7.如权利要求5或6所述的半导体装置的制造方法，其特征在于，
所述第二工序中安装所述第一电子元器件的两个所述基座面的任一个中，三根以上的所述连结部分别向不同的方向延伸而出，从而与所述外框或其他的所述连结部一体化。
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