JP4844311B2 - セラミック電子部品 - Google Patents
セラミック電子部品 Download PDFInfo
- Publication number
- JP4844311B2 JP4844311B2 JP2006249124A JP2006249124A JP4844311B2 JP 4844311 B2 JP4844311 B2 JP 4844311B2 JP 2006249124 A JP2006249124 A JP 2006249124A JP 2006249124 A JP2006249124 A JP 2006249124A JP 4844311 B2 JP4844311 B2 JP 4844311B2
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- JP
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- Prior art keywords
- lower layer
- component
- upper layer
- external electrode
- conductive paste
- Prior art date
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- 239000000919 ceramic Substances 0.000 title claims description 30
- 239000000843 powder Substances 0.000 claims description 24
- 229910052751 metal Inorganic materials 0.000 claims description 18
- 239000002184 metal Substances 0.000 claims description 18
- 239000003985 ceramic capacitor Substances 0.000 claims description 16
- 239000003960 organic solvent Substances 0.000 claims description 12
- 238000007747 plating Methods 0.000 claims description 10
- 229920001187 thermosetting polymer Polymers 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 8
- 239000011347 resin Substances 0.000 claims description 8
- 239000011230 binding agent Substances 0.000 claims description 7
- 238000010304 firing Methods 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 description 10
- 229920000647 polyepoxide Polymers 0.000 description 10
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000007547 defect Effects 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 3
- -1 Mn and Ni Chemical class 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000001723 curing Methods 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 229910052742 iron Inorganic materials 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920003986 novolac Polymers 0.000 description 3
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
- 239000008096 xylene Substances 0.000 description 2
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 1
- 102220476667 Interleukin-1 receptor-associated kinase 3_H60N_mutation Human genes 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000012190 activator Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229910000416 bismuth oxide Inorganic materials 0.000 description 1
- 239000005387 chalcogenide glass Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 description 1
- 229940028356 diethylene glycol monobutyl ether Drugs 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000113 methacrylic resin Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000005324 oxide salts Chemical class 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- JCGNDDUYTRNOFT-UHFFFAOYSA-N oxolane-2,4-dione Chemical compound O=C1COC(=O)C1 JCGNDDUYTRNOFT-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001029 thermal curing Methods 0.000 description 1
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 description 1
- ZFZQOKHLXAVJIF-UHFFFAOYSA-N zinc;boric acid;dihydroxy(dioxido)silane Chemical compound [Zn+2].OB(O)O.O[Si](O)([O-])[O-] ZFZQOKHLXAVJIF-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
- H01G4/2325—Terminals electrically connecting two or more layers of a stacked or rolled capacitor characterised by the material of the terminals
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Description
1.2mm×1.2mm×2.0mmの寸法を有する積層セラミックコンデンサのための部品本体を用意した。
1.6mm×1.6mm×3.2mmの寸法を有する積層セラミックコンデンサのための部品本体を用いたこと、下層用導電性ペーストの塗布に当たって約650μmの厚みとなるようにスキージしたこと、ならびに、上層用導電性ペーストの塗布にあたって約150〜約950μmの厚みとなるようにスキージしたことを除いて、実験例1と同様の工程を経て試料となる積層セラミックコンデンサを作製し、実験例1の場合と同様の条件で高温暴露試験およびたわみ試験を実施した。これらの結果が表4に示されている。
2 セラミック層
3 部品本体
4,5 端面
6 側面
8,9 内部電極
10,11 外部電極
12 下層
13 上層
14 めっき膜
Claims (3)
- 相対向する2つの端面および前記2つの端面間を連結する4つの側面を有する、セラミックからなる直方体状の部品本体と、
前記部品本体のいずれかの前記端面にまで引き出されるように、前記部品本体の内部に形成される、内部電極と、
いずれかの前記内部電極に電気的に接続されるように、前記部品本体の前記端面上にそれぞれ形成される、外部電極と
を備え、
前記外部電極は、金属粉末、ガラス粉末、有機バインダおよび有機溶剤を含む導電性ペーストを焼成することによって形成された下層と、前記下層上に位置するものであって、金属粉末、熱硬化性樹脂および有機溶剤を含む導電性ペーストを熱硬化することによって形成された上層とを備え、
前記外部電極は、前記部品本体の各前記端面から前記側面の一部にまで回り込むよう形成されていて、
熱膨張係数の大小関係は、部品本体<下層<上層であり、
前記部品本体の端面間寸法は2.0mm以上であり、
前記上層の、前記端面に沿って位置する部分の外面の位置を基点としてそれぞれ測定した、前記下層の、前記側面への回り込み部分の端縁までの長さをA[μm]とし、前記上層の、前記側面への回り込み部分の端縁までの長さをB[μm]としたとき、
0<A−B≦36
の関係を満たす、
セラミック電子部品。 - 前記内部電極は、一方の前記端面にまで引き出されかつ一方の前記外部電極に電気的に接続される複数の第1の内部電極と、他方の前記端面にまで引き出されかつ他方の前記外部電極に電気的に接続される複数の第2の内部電極とを備え、前記部品本体は、積層された複数のセラミック層からなる積層構造を備え、前記第1の内部電極と前記第2の内部電極とは、互いの間に前記セラミック層を介在させながら、前記セラミック層の積層方向に関して交互に配置され、それによって、積層セラミックコンデンサを構成している、請求項1に記載のセラミック電子部品。
- 前記外部電極上に形成されるめっき膜をさらに備える、請求項1または2に記載のセラミック電子部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006249124A JP4844311B2 (ja) | 2006-09-14 | 2006-09-14 | セラミック電子部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006249124A JP4844311B2 (ja) | 2006-09-14 | 2006-09-14 | セラミック電子部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008071926A JP2008071926A (ja) | 2008-03-27 |
JP4844311B2 true JP4844311B2 (ja) | 2011-12-28 |
Family
ID=39293269
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006249124A Active JP4844311B2 (ja) | 2006-09-14 | 2006-09-14 | セラミック電子部品 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4844311B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101462769B1 (ko) * | 2013-03-28 | 2014-11-20 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 전자부품이 실장된 회로기판 |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5206440B2 (ja) * | 2009-01-16 | 2013-06-12 | Tdk株式会社 | セラミック電子部品 |
JP5246207B2 (ja) | 2010-06-04 | 2013-07-24 | 株式会社村田製作所 | チップ型電子部品 |
WO2012053313A1 (ja) | 2010-10-18 | 2012-04-26 | 株式会社村田製作所 | チップ型セラミック電子部品およびその製造方法 |
JP6076331B2 (ja) * | 2012-03-19 | 2017-02-08 | 株式会社村田製作所 | セラミック電子部品 |
EP2991108A4 (en) * | 2013-04-22 | 2017-04-12 | Mitsubishi Electric Corporation | Semiconductor device and method of manufacture thereof |
KR101444615B1 (ko) * | 2013-08-09 | 2014-09-26 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조 방법 |
KR101474168B1 (ko) | 2013-11-15 | 2014-12-17 | 삼성전기주식회사 | 적층 세라믹 전자부품 및 그 실장기판 |
KR101701022B1 (ko) * | 2015-01-20 | 2017-01-31 | 삼성전기주식회사 | 적층 세라믹 전자부품, 그 제조방법 및 전자부품이 실장된 회로기판 |
JP2017073539A (ja) * | 2015-10-09 | 2017-04-13 | 株式会社村田製作所 | 電子部品 |
CN106571229B (zh) | 2015-10-09 | 2018-11-09 | 株式会社村田制作所 | 电子部件 |
EP3436136A1 (en) * | 2016-03-31 | 2019-02-06 | Koninklijke Philips N.V. | Defibrillator paddles with use indicators |
KR102191251B1 (ko) * | 2018-08-30 | 2020-12-15 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102271041B1 (ko) * | 2018-11-13 | 2021-07-01 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102263865B1 (ko) * | 2018-11-16 | 2021-06-11 | 삼성전기주식회사 | 적층 세라믹 전자부품 |
KR102551222B1 (ko) * | 2018-12-17 | 2023-07-03 | 삼성전기주식회사 | 적층형 커패시터 |
KR102211744B1 (ko) | 2019-02-21 | 2021-02-04 | 삼성전기주식회사 | 적층형 커패시터 |
US11183331B2 (en) | 2019-02-21 | 2021-11-23 | Samsung Electro-Mechanics Co., Ltd. | MLCC module and method of manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0897072A (ja) * | 1994-09-29 | 1996-04-12 | Tokin Corp | 積層セラミックチップ型電子部品 |
JPH08162357A (ja) * | 1994-11-30 | 1996-06-21 | Murata Mfg Co Ltd | セラミック電子部品 |
JPH10284343A (ja) * | 1997-04-11 | 1998-10-23 | Mitsubishi Materials Corp | チップ型電子部品 |
JP3363369B2 (ja) * | 1998-01-30 | 2003-01-08 | 京セラ株式会社 | 積層セラミックコンデンサ |
JP3633805B2 (ja) * | 1998-12-14 | 2005-03-30 | 株式会社村田製作所 | セラミック電子部品 |
JP4682426B2 (ja) * | 2001-01-15 | 2011-05-11 | Tdk株式会社 | 電子部品およびその製造方法 |
-
2006
- 2006-09-14 JP JP2006249124A patent/JP4844311B2/ja active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101462769B1 (ko) * | 2013-03-28 | 2014-11-20 | 삼성전기주식회사 | 적층 세라믹 커패시터, 그 제조방법 및 전자부품이 실장된 회로기판 |
US9793052B2 (en) | 2013-03-28 | 2017-10-17 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon |
US10163568B2 (en) | 2013-03-28 | 2018-12-25 | Samsung Electro-Mechanics, Co., Ltd. | Multilayer ceramic capacitor, method of fabrication thereof and circuit board having electronic component mounted thereon |
Also Published As
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JP2008071926A (ja) | 2008-03-27 |
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