CN104968828B - Cu-Ga-In-Na靶 - Google Patents
Cu-Ga-In-Na靶 Download PDFInfo
- Publication number
- CN104968828B CN104968828B CN201480007071.2A CN201480007071A CN104968828B CN 104968828 B CN104968828 B CN 104968828B CN 201480007071 A CN201480007071 A CN 201480007071A CN 104968828 B CN104968828 B CN 104968828B
- Authority
- CN
- China
- Prior art keywords
- sputtering target
- preparing
- intermetallic
- powder
- intermetallic phase
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/02—Compacting only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
- B22F9/08—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying
- B22F9/082—Making metallic powder or suspensions thereof using physical processes starting from liquid material by casting, e.g. through sieves or in water, by atomising or spraying atomising using a fluid
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C24/00—Alloys based on an alkali or an alkaline earth metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C30/00—Alloys containing less than 50% by weight of each constituent
- C22C30/02—Alloys containing less than 50% by weight of each constituent containing copper
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/3414—Targets
- H01J37/3426—Material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F71/00—Manufacture or treatment of devices covered by this subclass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/105—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding
- B22F2003/1051—Sintering only by using electric current other than for infrared radiant energy, laser radiation or plasma ; by ultrasonic bonding by electric discharge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/12—Both compacting and sintering
- B22F3/14—Both compacting and sintering simultaneously
- B22F3/15—Hot isostatic pressing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/541—CuInSe2 material PV cells
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATGM26/2013 | 2013-01-31 | ||
| ATGM26/2013U AT13564U1 (de) | 2013-01-31 | 2013-01-31 | CU-GA-IN-NA Target |
| PCT/AT2014/000016 WO2014117190A1 (de) | 2013-01-31 | 2014-01-29 | Cu-ga-in-na target |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104968828A CN104968828A (zh) | 2015-10-07 |
| CN104968828B true CN104968828B (zh) | 2018-10-19 |
Family
ID=50238032
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201480007071.2A Active CN104968828B (zh) | 2013-01-31 | 2014-01-29 | Cu-Ga-In-Na靶 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10329661B2 (enExample) |
| EP (1) | EP2951332B1 (enExample) |
| JP (1) | JP6393696B2 (enExample) |
| CN (1) | CN104968828B (enExample) |
| AT (1) | AT13564U1 (enExample) |
| TW (1) | TWI627292B (enExample) |
| WO (1) | WO2014117190A1 (enExample) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6798852B2 (ja) | 2015-10-26 | 2020-12-09 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
| WO2017138565A1 (ja) * | 2016-02-08 | 2017-08-17 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
| JP6794850B2 (ja) * | 2016-02-08 | 2020-12-02 | 三菱マテリアル株式会社 | スパッタリングターゲット及びスパッタリングターゲットの製造方法 |
| WO2018174019A1 (ja) * | 2017-03-23 | 2018-09-27 | 三菱マテリアル株式会社 | In-Cu焼結体スパッタリングターゲット及びIn-Cu焼結体スパッタリングターゲットの製造方法 |
| CN112680627B (zh) * | 2020-12-21 | 2022-05-13 | 无锡天宝电机有限公司 | 一种转子导条及其制备方法 |
| CN112813397B (zh) * | 2020-12-31 | 2023-06-30 | 金堆城钼业股份有限公司 | 一种钼钠合金板状靶材的制备方法 |
| CN113564545B (zh) * | 2021-07-27 | 2022-02-22 | 杭州阿凡达光电科技有限公司 | 一种环保型氧化铌靶材的加工工艺及其装置 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1556902A4 (en) * | 2002-09-30 | 2009-07-29 | Miasole | MANUFACTURING DEVICE AND METHOD FOR PRODUCING THIN FILM SOLAR CELLS IN A LARGE SCALE |
| DE102006055662B3 (de) * | 2006-11-23 | 2008-06-26 | Gfe Metalle Und Materialien Gmbh | Beschichtungswerkstoff auf Basis einer Kupfer-Indium-Gallium-Legierung, insbesondere zur Herstellung von Sputtertargets, Rohrkathoden und dergleichen |
| CN101260513B (zh) * | 2008-04-23 | 2011-04-06 | 王东生 | 太阳能电池铜铟镓硒薄膜关键靶材的制备方法 |
| US8134069B2 (en) * | 2009-04-13 | 2012-03-13 | Miasole | Method and apparatus for controllable sodium delivery for thin film photovoltaic materials |
| JP5643524B2 (ja) * | 2009-04-14 | 2014-12-17 | 株式会社コベルコ科研 | Cu−Ga合金スパッタリングターゲットおよびその製造方法 |
| WO2011008346A1 (en) * | 2009-07-14 | 2011-01-20 | University Of Florida Research Foundation, Inc. | Finishing of surfaces of tubes |
| CN101613091B (zh) * | 2009-07-27 | 2011-04-06 | 中南大学 | 一种cigs粉末、靶材、薄膜及其制备方法 |
| JP4793504B2 (ja) | 2009-11-06 | 2011-10-12 | 三菱マテリアル株式会社 | スパッタリングターゲット及びその製造方法 |
| JP5501774B2 (ja) * | 2010-01-20 | 2014-05-28 | 山陽特殊製鋼株式会社 | 高強度を有するCu−Ga系スパッタリングターゲット材 |
| CN101820024A (zh) * | 2010-02-11 | 2010-09-01 | 昆山正富机械工业有限公司 | 多层铜铟镓硒(硫)光吸收前驱层制造方法 |
| JP4720949B1 (ja) | 2010-04-09 | 2011-07-13 | 住友金属鉱山株式会社 | Cu−Ga合金粉末の製造方法及びCu−Ga合金粉末、並びにCu−Ga合金スパッタリングターゲットの製造方法及びCu−Ga合金スパッタリングターゲット |
| US20120018828A1 (en) | 2010-07-23 | 2012-01-26 | Stion Corporation | Sodium Sputtering Doping Method for Large Scale CIGS Based Thin Film Photovoltaic Materials |
| JP2012029794A (ja) * | 2010-07-29 | 2012-02-16 | Omron Healthcare Co Ltd | 電子血圧計用基板、電子血圧計用モジュール、および電子血圧計 |
| JP2012079997A (ja) | 2010-10-05 | 2012-04-19 | Kobe Steel Ltd | 化合物半導体薄膜太陽電池用光吸収層の製造方法、およびIn−Cu合金スパッタリングターゲット |
| JP5418463B2 (ja) | 2010-10-14 | 2014-02-19 | 住友金属鉱山株式会社 | Cu−Ga合金スパッタリングターゲットの製造方法 |
| JP5725610B2 (ja) | 2011-04-29 | 2015-05-27 | 三菱マテリアル株式会社 | スパッタリングターゲット及びその製造方法 |
| JP2013166976A (ja) * | 2012-02-14 | 2013-08-29 | Sumitomo Metal Mining Co Ltd | Cu−Ga合金スパッタリングターゲットの製造方法及びCu−Ga合金スパッタリングターゲット |
-
2013
- 2013-01-31 AT ATGM26/2013U patent/AT13564U1/de not_active IP Right Cessation
- 2013-12-16 TW TW102146309A patent/TWI627292B/zh active
-
2014
- 2014-01-29 JP JP2015555497A patent/JP6393696B2/ja active Active
- 2014-01-29 EP EP14708784.5A patent/EP2951332B1/de active Active
- 2014-01-29 WO PCT/AT2014/000016 patent/WO2014117190A1/de not_active Ceased
- 2014-01-29 CN CN201480007071.2A patent/CN104968828B/zh active Active
- 2014-01-29 US US14/764,007 patent/US10329661B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI627292B (zh) | 2018-06-21 |
| US20150354055A1 (en) | 2015-12-10 |
| EP2951332A1 (de) | 2015-12-09 |
| WO2014117190A1 (de) | 2014-08-07 |
| AT13564U1 (de) | 2014-03-15 |
| TW201439340A (zh) | 2014-10-16 |
| EP2951332B1 (de) | 2017-05-31 |
| JP2016513171A (ja) | 2016-05-12 |
| CN104968828A (zh) | 2015-10-07 |
| US10329661B2 (en) | 2019-06-25 |
| JP6393696B2 (ja) | 2018-09-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104968828B (zh) | Cu-Ga-In-Na靶 | |
| CN107614744B (zh) | 溅射靶的制造方法 | |
| CN102395702B (zh) | 溅射靶及其制造方法 | |
| EP2511397B1 (en) | Magnetic material sputtering target | |
| CN102046836B (zh) | Cu-Ga烧结体溅射靶及该靶的制造方法 | |
| TWI622661B (zh) | W-Ni濺鍍靶及其製法和用途 | |
| JP5818139B2 (ja) | Cu−Ga合金ターゲット材およびその製造方法 | |
| US8173093B2 (en) | Iron silicide sputtering target and method for production thereof | |
| CN102828139A (zh) | 一种喷涂用高熵合金粉末 | |
| JP7654734B2 (ja) | スパッタリングターゲット及び、スパッタリングターゲットの製造方法 | |
| TWI471442B (zh) | Cu-Ga alloy powder, Cu-Ga alloy powder, and Cu-Ga alloy sputtering target manufacturing method and Cu-Ga alloy sputtering target | |
| CN108374113A (zh) | 一种TaTiZrAlSi高熵合金及其粉末的制备方法 | |
| JP4957968B2 (ja) | Cu−In−Ga三元系焼結合金スパッタリングターゲットおよびその製造方法 | |
| CN104532201B (zh) | 一种钼钛合金溅射靶材板的制备方法 | |
| TWI438296B (zh) | Sputtering target and its manufacturing method | |
| JP5819323B2 (ja) | Cu−Gaターゲット及びその製造方法 | |
| CN112111714A (zh) | 一种钽铝合金溅射靶材的制备方法 | |
| WO2021241522A1 (ja) | 金属-Si系粉末、その製造方法、並びに金属-Si系焼結体、スパッタリングターゲット及び金属-Si系薄膜の製造方法 | |
| JP2015045060A (ja) | Cu系粉末の製造方法およびこれを用いたCu系スパッタリングターゲット材の製造方法 | |
| JP2014210943A (ja) | Cu−Ga合金ターゲット材およびその製造方法 | |
| TW200932935A (en) | Ni-W-B-based sputtering target material for producing intermediate layer film in vertical magnetic recording medium, and thin film produced using the same | |
| JP6007840B2 (ja) | Cu−Gaスパッタリングターゲット及びその製造方法 | |
| JP6028714B2 (ja) | Cu−Ga合金スパッタリングターゲットの製造方法 | |
| JP2017095781A (ja) | Cu−Ga合金スパッタリングターゲットおよびその製造方法 | |
| JPH0344461A (ja) | スパッタ用銅セレン系ターゲット材料 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |