CN104952741B - 柔性基板上的电气电路 - Google Patents

柔性基板上的电气电路 Download PDF

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Publication number
CN104952741B
CN104952741B CN201510090404.9A CN201510090404A CN104952741B CN 104952741 B CN104952741 B CN 104952741B CN 201510090404 A CN201510090404 A CN 201510090404A CN 104952741 B CN104952741 B CN 104952741B
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interconnection
gastight material
gastight
flexible
base board
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CN104952741A (zh
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C·胡
S·库马尔
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Intel Corp
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Intel Corp
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Abstract

本发明涉及一种柔性基板上的电气电路。概括地说，本文讨论了具有在其上形成的气密密封的柔性基板的系统和装置。本公开内容还包括制造和使用所述系统和装置的技术。根据在柔性基板上形成气密密封的技术的例子，可以包括：(1)在柔性基板上形成互连，(2)在所述基板上靠近所述互连设置器件，或(3)在所述器件或互连上选择性地沉积第一气密材料，以便将所述器件气密密封在所述互连和第一气密材料的组合内。

Description

柔性基板上的电气电路
技术领域
概括来说，例子涉及柔性电路架构和方法。一些例子涉及柔性电路架构中的气密密封。
背景技术
当前移动设备(超出移动电话和平板电脑的范围)被称为“物联网”(即，事物的网络互连)。物联网包括可穿戴设备，所述可穿戴器件可以包括集成为独特形状因数的小的低功率硅(例如，柔性手环、智能手表、智能眼睛佩戴物等)。随着可穿戴设备的产品类别继续发展，新的设备将以其它独特形状因数和使用条件来出现。
附图说明
在附图(未必按比例绘制)中，相似编号可以在不同视图中描述类似部件。具有不同字母后缀的相似编号可以表示类似部件的不同情形。普遍地说，附图以例子而非限制的方式示出了本文件中所讨论的各个实施例。
图1示出了具有气密密封的柔性器件的例子的框图。
图2A、2B、2C、2D、2E和2F示出了用于制造具有气密密封的柔性器件的技术的例子的框图。
图3A、3B、3C、3D、3E和3F示出了柔性器件架构的例子的框图。
图4示出了用于在柔性基板上创建气密密封的技术的例子。
具体实施方式
概括地说，本公开内容中的例子涉及柔性(例如，可伸缩或可弯曲)电路架构和技术。更具体地说，例子涉及在柔性电路上形成密封(例如，气密(即密闭)密封)。
柔性电子元件可以有助于提供独特的电路架构(例如，形状因数)。可伸缩电子元件具有帮助使得管芯或其它部件能够诸如以纹身或贴纸的形式集成到织物、柔顺塑料、聚合物或甚至皮肤中/上(诸如以用于感测和计算应用)的潜力。传统的刚性片上系统(SoC)(诸如当前用在移动电话、平板电脑或手表等中的那些传统的刚性片上系统)通常由安装在刚性封装上的刚性基板上的硅管芯组成。传统的SoC可能不适于在要求柔性电路或独特(例如，可弯曲或可伸缩)形状因数的情况中使用。
随着可穿戴或柔性设备的引入，所述器件中/上的部件可以从改善的气密性中获益，以便通过使部件免受周围环境的影响来增强性能或可靠性。然而，柔性材料典型地是聚二甲基硅氧烷(PDMS)、聚对苯二甲酸乙二醇酯(PET)或聚酰亚胺(PI)，其不是气密材料。气密的材料(诸如玻璃、金属、陶瓷、一些电介质或其它气密材料)的柔性典型地小于柔性材料并且可能易碎。
一种提供气密性的解决方案包括使用玻璃密封剂，诸如在有机发光二极管(OLED)中使用的玻璃密封剂。此玻璃具有相当有限的弯曲性并且几乎无法伸缩。在OLED中使用的玻璃还相当厚(即，大约一百微米厚或更厚)。另外，当前LED气密密封通常使用注入模制来形成并且所述气密密封不在柔性基板上形成。通过提供在柔性基板上形成气密密封的能力，可以使用各种气密密封设计，并且柔性电路的设计不限于断开(off)气密密封部件。另外，本文中所讨论的气密密封可以在部件已经电连接或以机械方式连接到其中待使用所述部件的电路之后至少部分地形成。气密密封典型地在将气密密封部件连接到电路之前形成。
提供气密性、同时不显著减小器件的柔性的一种解决方案可以包括提供气密材料岛，诸如针对部件(例如，电气器件或电子器件，诸如电阻器、电容器、晶体管、电感器、无线电装置、存储器、处理器、激光器、LED、传感器或其它数字或模拟部件)定大小和成形的岛。岛可以具有各种不同形状因数，诸如通过使用光致抗蚀剂兼容的方法来形成岛。这种解决方案可以容许装置保持柔性，同时为装置的部件提供气密保护。可以通过在柔性(例如，非气密(即，非密闭))基板上包括气密岛来实现气密性和柔性的指定组合。
气密密封可以在低温下完成，以便扩大在装置的制造中使用的柔性基板或部件的材料选择。在大约一百摄氏度(低温)下，可以诸如通过使用溅镀技术来完成气密材料沉积(例如，选择性玻璃沉积)。低温沉积的气密材料可以借助光致抗蚀剂来图案化，以便在去除光致抗蚀剂之后，仅仅在基板的指定区域上选择性地沉积气密材料。
气密材料可以溅镀在迹线、焊盘或其它金属(例如，铜(Cu)、金(Au)、银(Ag)、铝(Al)或其它金属)互连上。可以通过在气密材料沉积之前或期间用离子轰击表面来增加气密材料与其上沉积有气密材料的表面之间的附着强度。
气密材料岛可以足够小，使得主要弹性或塑性加载可以发生在气密材料岛外部，并且器件可以保留其柔性中的大部分(几乎全部)柔性。同样，气密材料的厚度可以在大约一微米与十微米之间(或更小)，以便有助于器件保留纤细轮廓。
图1示出了柔性装置100的例子的框图。柔性装置100可以包括在其上具有气密材料104的基板102。气密材料104可以是具有足以形成气密(即，密闭)密封的结构的材料。气密材料104可以帮助为一个或多个部件106提供气密密封。装置100可以包括导电互连108，诸如迹线、焊盘、过孔等。装置100可以包括电介质110(例如，钝化材料)。装置100可以包括电介质(例如，内建材料或粘合剂)114。
基板102可以提供其上可以构建柔性电路的介质。基板102可以包括柔性材料，诸如PDMS、PET、PI、热塑性弹性体或其它柔性材料。
气密材料104可以有助于提供气密密封，以便使部件106的至少一部分免受周围环境的影响。气密材料104可以是具有不同的，以便满足部件或装置的需求。较厚气密材料可以以空间和成本为代价来帮助为部件提供更多保护，而较薄气密材料可能不提供如较厚气密材料一样的强健的保护，但是节省成本和空间。气密材料104可以包括在厚度在大约一微米与一百微米之间的厚度。在一个或多个实施例中，气密材料104的厚度可以在大约十分之一微米与十微米之间或小于十微米。在一个或多个实施例中，气密材料104的厚度可以在大约一微米与两微米之间。气密材料104可以诸如在低温(例如，大约一百摄氏度或以下)下溅镀在基板102、部件106、互连108或装置100的其它物项上。在一个或多个实施例中，诸如当柔性基板包括PI时，温度可以更高，诸如高达大约二百五十摄氏度。
部件106可以是电气部件或电部件，诸如经封装的部件(例如，表面贴装(SMT)、倒装芯片(FC)、球栅阵列(BGA)、连接盘网格阵列(LGA)，无焊内建层(BBUL)或其它封装)或未经封装的部件。部件106可以包括晶体管、电阻器、管芯(例如，处理器、存储器、无线电装置或其它模拟电路或数字电路)、电容器、发光二极管(LED)、电感器、存储器栅极、组合逻辑或状态逻辑或其它电气组件或电子部件。
互连108可以包括迹线、焊盘、阳或阴连接特征、过孔或其它导电互连。互连108可以包括金属，诸如Cu、Ag、Au或其它导电金属。互连108可以通过导线116或焊料112连接耦合到部件106中的一个或多个部件。互连108可以通过电介质114或110与另一互连或部件106绝缘或分离。
电介质110可以为装置100的物项提供保护，诸如使其免受装置100周围的环境的影响。电介质110可以包括PDMS、橡胶或电介质材料。电介质114可以包括具有足够低的介电常数、损耗角正切或键合强度的材料，诸如液晶聚合物(LCP)、PI、PDMS或丙烯酸电介质。电介质114可以包括添加剂，以便有助于增强材料的性能。
焊料112可以电耦合或以机械方式耦合一个或多个互连108或一个或多个部件106。焊料112尤其可以包括锡、铅、锌、银、铝、铋或各向异性导电膜(ACF)。
电介质114可以与电介质110类似并且可以包括与电介质110的材料类似的材料。
图2A、2B、2C、2D、2E和2F各自示出了用于制造具有气密岛的柔性基板的技术的例子的阶段。图2A示出了装置200A的例子的框图，装置200A可以包括其上具有图案化的光致抗蚀剂202的基板102。可以沉积光致抗蚀剂202，以便使下面的基板102免受气密材料沉积的影响。光致抗蚀剂202的位置可以是未设置的气密材料的位置。光致抗蚀剂202可以通过光刻、镂空版印刷或丝网印刷工艺来设置。镂空版印刷或丝网印刷可以比光刻更有成本效益。
图2B示出了装置200B的例子的框图。装置200B可以与装置200A类似，其中，一层气密材料104沉积在基板102和光致抗蚀剂202上。气密材料104的厚度可以大于一微米，以便帮助阻止来自气密材料104中微裂隙的影响。气密材料104可以帮助为设置在气密材料104上的器件提供气密性。气密岛可以为部件的面向基板102的一侧提供气密性。气密材料104可以在小于大约一百摄氏度的温度下沉积。
图2C示出了装置200C的例子的框图。装置200C可以与装置200B类似，其中，从其去除了光致抗蚀剂202和光致抗蚀剂202上的气密材料104。光致抗蚀剂202可以用化学方法去除，诸如通过使光致抗蚀剂202溶解，或光致抗蚀剂202可以用机械方法去除，诸如通过剥离光致抗蚀剂202(诸如在声能的帮助下)。
图2D示出了装置2000D的例子的框图。装置200D可以与装置200C类似，其中，一个或多个互连108至少部分地设置在基板102上或至少部分地设置在气密材料104上。
图2E示出了装置200E的例子的框图。装置200E可以与装置200D类似，其中，一个或多个部件106设置或构建在基板102上，诸如至少部分地设置或构建在气密材料104或互连108上。电介质114可以设置在气密材料104上，诸如在互连108之间。部件106可以设置在电介质114上或附着到电介质114。部件106可以电耦合或以机械方式耦合到互连108，诸如通过焊接或引线键合。部件106、引线116、电介质114、互连108或气密材料104可以至少部分由模制材料118围绕。
图2F示出了装置200F的例子的框图。装置200F可以与装置200E类似，其中，气密材料104选择性地设置(例如，沉积)在装置200E上。可以沉积气密材料104，以便与先前沉积在基板102上的气密材料结合。选择性地沉积气密材料104可以包括在装置上设置光致抗蚀剂(例如，在装置上光刻、丝网印刷或镂空版印刷光致抗蚀剂)。可以在在装置上沉积气密材料104之前从装置去除水分或其它污染物。去除水分或其它污染物可以包括烘烤装置、对装置吹气或对装置进行干式清洗。气密材料104可以沉积(例如，溅镀)在装置(例如，该经烘烤或经清洗的装置)上。诸如通过用化学方法或用机械方法去除光致抗蚀剂可以去除光致抗蚀剂上的气密材料和光致抗蚀剂。气密材料104可以沉积在部件106、互连108、基板102、其它气密材料、电介质114或模制材料118上。为了改善气密材料104与在其上设置有气密材料的物项(例如，互连108、部件106、基板102、其它气密材料、电介质或装置100的其它物项)之间的附着力，如在气密材料沉积之前或期间，可以将离子轰击到装置(例如，其上待设置气密材料的物项)上。
可以在装置200F上形成电介质110，以便形成图1的装置100。电介质110可以为装置的物项提供钝化或外观美容保护。电介质110可以是柔性的或者可以包括与基板102相同或类似的材料。可以诸如通过(例如)遵循通过关于图2A-2F或图1所述的技术创建开口或构建另一个电路来形成电子装置的另一层。可以通过在电介质中形成孔来电耦合或以机械方式耦合电子装置的层。
图3A、3B、3C、3D、3E和3F各自示出了根据一个或多个实施例的柔性电子电路的框图。传统的片上系统(SoC)封装是刚性的并且包括安装在刚性聚合物基板上的管芯。这些封装通常安装在移动电话、平板电脑或其它器件的刚性母板上。传统的封装通常不安装在柔性表面(诸如织物、柔顺塑料、聚合物或甚至皮肤)上。图3A-3F示出了柔性(例如，可伸缩)多层电路，其可以包括安装在其上或其中的一个或多个硅管芯或管芯部分。
图3A示出了根据一个或多个实施例的柔性电子电路300A的例子的框图。电路300A可以包括在一层或多层柔性材料304上的多个管芯部分302。
每一个管芯部分302可以包括被配置为实现单一SoC(例如，管芯)的一部分的功能的至少一部分的电路。管芯部分302的组合可以实现SoC的功能。管芯部分302可以包括硅或其它半导体、金属或其它电路材料。管芯部分302不与包括管芯和保护壳的封装混淆。
柔性材料304可以包括PDMS、PET、聚酰亚胺PI或其它柔性材料。柔性材料304可以包括在其上图案化的一个或多个互连308(例如，迹线、焊盘或阳或阴连接特征)。互连308可以是弯曲的或另外被配置为经得起弯曲，而没有破坏或破裂。互连308可以设置在柔性材料304的层之间。互连308可以使用光刻(诸如，微接触印刷或形成互连的其它方法)来图案化。通过一个或多个过孔306可以将一层柔性材料304的互连308电连接或以机械方式连接到诸如另一层柔性材料上的互连或管芯部分302。过孔306可以使用光刻(诸如通过旋涂导电聚合物)来形成。过孔306可以通过在柔性材料304上以指定的图案显影光致抗蚀剂来形成。可以在显影之后去除光致抗蚀剂。
可以暴露一个或多个管芯部分302，诸如在图3A中所示出的。一个或多个管芯部分302可以至少部分地浸入柔性材料304中，诸如在图3B中所示出的。电路300B可以包括至少部分地浸入柔性材料304中的多个管芯部分302。可以暴露管芯部分302的一面，诸如在图3B中所示出的。电路300C可以包括完全浸入柔性材料304中的多个管芯部分302，诸如在图3C中所示出的。
如在图3D中所示出的，电路300D可以包括沿与另一个管芯部分的方向相反的方向对准的管芯部分302(即，管芯部分302的功能侧不需要总是面向与另一个管芯部分相同的方向)。管芯部分302的功能侧可以是具有引脚输出或互连的侧，通过引脚输出或互连，提供了到达管芯部分的功能或部件的通路。沿与另一个管芯的方向相反的方向对准的管芯部分302可以被视为反向。
柔性电路300E可以包括设置在多个不同层柔性材料中的管芯部分302，诸如在图3E中所示出的。柔性电路300F可以包括设置在多个不同层柔性材料中的管芯部分302，并且管芯部分302中的至少一个管芯部分可以相对于另一个管芯部分反向(即，可以使其功能侧面向另一个方向)，诸如在图3F中所示出的。
图3A-3F的柔性基板具有与传统封装不同的物理外观。不存在刚性基板；相反，一个或多个管芯部分存在于柔性材料(例如，透明PDMS)的顶部上或嵌入柔性材料(例如，透明PDMS)中。PDMS是柔性且柔顺的透明聚合物。
图的柔性电路并不限于平面的或刚性的。这些柔性器件可以并入到具有弯曲表面、柔顺表面、织物或皮肤的设计中(例如，作为传感器、无线电装置或其它换能器)，使用常规刚性封装，如果并非不可能，其可能十困难的。柔性容许产品设计中的多种选择。
图4示出了根据一个或多个实施例的用于在柔性基板上形成气密密封的技术400的例子的流程图。在402，可以在柔性基板上选择性地沉积第一气密材料。在404，可以在柔性基板上形成互连。可以形成互连，使得互连的一部分与气密材料重叠。在406，可以在气密材料上设置器件。
在408，可以在器件和互连上选择性地沉积第二气密材料。可以沉积第二气密材料，以便将器件气密密封在互连以及第一气密材料和第二气密材料的组合内。技术400可以包括在沉积第二气密材料之前从柔性基板、器件或互连的暴露的表面去除水分。技术400可以包括在沉积第二气密材料之前或在沉积第二气密材料时用离子轰击柔性基板、器件或互连。
第一气密材料和第二气密材料可以包括玻璃。可以沉积第一气密材料或第二气密材料，使得该层气密材料的厚度在大约一微米与十微米之间。可以在小于大约一百摄氏度的温度下沉积第一气密材料或第二气密材料。选择性地沉积第一气密材料或第二气密材料可以包括：在柔性基板、器件、互连或第一气密材料上设置光致抗蚀剂，在光致抗蚀剂、器件、互连、第一气密材料或柔性基板上沉积第一气密材料或第二气密材料、以及去除光致抗蚀剂以便去除所沉积的第一气密材料或第二气密材料的一部分。第一气密材料和第二气密材料可以包括相同或不同材料。
技术400可以包括在第二气密材料上方形成电介质层。在柔性基板上选择性地沉积第一气密材料可以包括在柔性基板的第一和第二相对表面上沉积第一气密材料。在柔性基板上形成互连可以包括在柔性基板的第一侧和第二侧中的每一侧上形成互连。在第一气密材料上设置器件可以包括在柔性基板的第一侧和第二侧中的每一侧上的第一气密材料上设置相应器件。沉积第二气密材料可以包括在柔性基板的第一侧和第二侧中的每一侧上的相应器件上沉积第二气密材料。
例子和注意事项
可以通过数个例子来描述本发明主题。
例子1可以包括或使用主题(例如用于执行动作的装置、方法和构件或包括当由器件执行时可以导致器件执行动作的指令的器件可读存储器)，诸如可以包括或使用：(1)在柔性基板上形成互连，(2)在基板上靠近互连来设置器件，或(3)在器件和互连上选择性地沉积第一气密材料以便将器件气密密封在互连和第一气密材料的组合内。
例子2可以包括或使用例子1的主题或者可选地与例子1的主题结合，以便包括或使用：在形成互连之前在柔性基板上选择性地沉积第二气密材料，或其中，可以形成互连，使得互连的一部分与第二气密材料重叠。
例子3可以包括或使用例子2的主题或者可选地与例子2的主题结合，以便包括或使用：其中，选择性地沉积第一气密材料包括在柔性基板上选择性地沉积玻璃，并且其中，在器件和互连上选择性地沉积第二气密材料包括在器件和互连上选择性地沉积玻璃。
例子4可以包括或使用例子2-3中的至少一个例子的主题或者可选地与例子2-3中的至少一个例子的主题结合，以便包括或使用：其中，选择性地沉积第一气密材料包括在柔性基板上设置光致抗蚀剂、在光致抗蚀剂和柔性基板上沉积第一气密材料、以及去除光致抗蚀剂以便去除所沉积的第一气密材料的一部分。
例子5可以包括或使用例子2-4中的至少一个例子的主题或者可选地与例子2-4中的至少一个例子的主题结合，以便包括或使用在第二气密材料上方形成电介质层。
例子6可以包括或使用例子2-5中的至少一个例子的主题或者可选地与例子2-5中的至少一个例子的主题结合，以便包括或使用：在沉积第二气密材料之前从柔性基板、器件或互连的暴露的表面去除水分。
例子7可以包括或使用例子2-6中的至少一个例子的主题或者可选地与例子2-6中的至少一个例子的主题结合，以便包括或使用：在沉积第二气密材料之前或期间，用离子轰击柔性基板、器件、第一气密材料或互连。
例子8可以包括或使用例子2-7中的至少一个例子的主题或者可选地与例子2-7中的至少一个例子的主题结合，以便包括或使用：其中，沉积第一气密材料或第二气密材料包括沉积第一气密材料或第二气密材料，使得该层气密材料的厚度小于大约十微米。
例子9可以包括或使用例子2-8中的至少一个例子的主题或者可选地与例子2-8中的至少一个例子的主题结合，以便包括或使用：其中，沉积第一气密材料或第二气密材料包括在小于大约一百摄氏度的温度下沉积第一气密材料或第二气密材料。
例子10可以包括或使用例子2-9中的至少一个例子的主题或者可选地与例子2-9中的至少一个例子的主题结合，以便包括或使用：其中，(1)在柔性基板上选择性地沉积第一气密材料包括在柔性基板的第一和第二相对表面上沉积第一气密材料，(2)在柔性基板上形成互连包括在柔性基板的第一侧和第二侧中的每一侧上形成互连，(3)在第一气密材料上设置器件包括在柔性基板的第一侧和第二侧中的每一侧上的第一气密材料上设置相应器件，或(4)沉积第二气密材料包括在柔性基板的第一侧和第二侧中的每一侧上的相应器件上沉积第二气密材料。
例子11可以包括或使用主题(诸如用于执行动作的装置、方法和构件或包括当由器件执行时可以导致器件执行动作的指令的器件可读存储器)，诸如可以包括或使用(1)玻璃岛，所述玻璃岛在柔性基板上，(2)互连，所述互连在柔性基板上并且与玻璃岛部分重叠，(3)器件，所述器件在玻璃岛上并且电耦合到互连，或(4)玻璃层，所述玻璃层在器件上方并且至少部分地在互连上方，使得玻璃层、玻璃岛和互连形成针对器件的气密密封。
例子12可以包括或使用例子11的主题或者可选地与例子11的主题结合，以便包括或使用电介质层，所述电介质层在玻璃层上方。
例子13可以包括或使用例子11-12中的至少一个例子的主题或者可选地与例子11-12中的至少一个例子的主题结合，以便包括或使用：其中，玻璃岛的厚度小于大约十微米。
例子14可以包括或使用例子11-13中的至少一个例子的主题或者可选地与例子11-13中的至少一个例子的主题结合，以便包括或使用：其中，玻璃岛是在基板的第一表面上的第一玻璃岛，互连是在基板的第一表面上的第一金属接触，器件是在基板的第一表面上的第一器件，并且玻璃层是第一玻璃层，并且例子14还包括(1)第二玻璃岛，第二玻璃岛在基板的第二表面上，第二表面与第一表面相对，(2)第二互连，第二互连在第二表面上，第二互连与第二玻璃岛部分重叠，(3)第二器件，第二器件在第二玻璃岛上并且电耦合到第二，或(4)第二玻璃层，第二玻璃层在第二器件上方并且至少部分地在第二互连上方，使得第二玻璃层、第二玻璃岛和第二互连气密密封第二器件。
例子15可以包括或使用例子11-14中的至少一个例子的主题或者可选地与例子11-14中的至少一个例子的主题结合，以便包括或使用粘合剂，粘合剂在器件与玻璃岛之间并且将器件耦合到玻璃岛。
例子16可以包括或使用例子11-15中的至少一个例子的主题或者可选地与例子11-15中的至少一个例子的主题结合，以便包括或使用：其中，柔性基板包括聚二甲基硅氧烷(PDMS)。
例子17可以包括或使用主题(诸如用于执行动作的装置、方法和构件或包括当由器件执行时可以导致器件执行动作的指令的器件可读存储器)，诸如可以包括或使用(1)多个叠置地柔性基板层，多个叠置的柔性基板层包括第二基板层上的第一基板层，(2)第一管芯部分和第二管芯部分，第一管芯部分和第二管芯部分设置在叠置的柔性基板层中，或(3)在第二基板层的邻近第一基板层的表面上被图案化的第一互连电路，其中，第一管芯部分和第二管芯部分通过互连电路进行电耦合。
例子18可以包括或使用例子17的主题或者可选地与例子17的主题结合，以便包括或使用：其中，多个叠置的柔性基板层还包括第三基板层，其中，第二基板层在第一基板层上，或例子18还包括在第三基板层的邻近第二基板层的表面上被图案化的第二互连电路，或穿过第二基板层的过孔，其中，过孔将第一互连电路电耦合到第二互连电路。
例子19可以包括或使用例子17-18中的至少一个例子的主题或者可选地与例子17-18中的至少一个例子的主题结合，以便包括或使用：其中，多个叠置的柔性基板层还包括设置在第一基板层上的第四基板层，其中，第一管芯部分包括面向与第二管芯的第二有源侧相反的方向的第一有源侧，或例子19还包括在第一基板层的邻近四个基板层的表面上被图案化的第三互连电路。
例子20可以包括或使用例子17-19中的至少一个例子的主题或者可选地与例子17-19中的至少一个例子的主题结合，以便包括或使用：其中，多个叠置的柔性基板层包括聚二甲基硅氧烷(PDMS)。
例子21可以包括或使用例子17-20中的至少一个例子的主题或者可选地与例子17-20中的至少一个例子的主题结合，以便包括或使用：其中，使用第一互连电路的互连、设置在第一管芯部分下方的气密材料以及在第一管芯部分上方并且至少部分地在互连上方的气密材料的组合来对第一管芯部分进行气密密封。
以上详细描述包括对附图的参考，附图形成详细描述的一部分。附图以示例的方式示出了其中可以实施本文中所讨论的方法、装置和系统的具体实施例。这些实施例在本文中也被称为“例子”。这些例子可以包括除了所示出的或所描述的那些元件以外的元件。然而，本发明人还预期了其中仅仅提供所示出的或所描述的那些元件的例子。而且，本发明人还预期相对于特定例子(或其一个或多个方面)或相对于本文中所示出的或所描述的其它例子(或其一个或多个方面)的使用了所示出的或所描述的那些元件的任意组合或排列的例子(或其一个或多个方面)。
在此文件中，专利文件中常见的术语“一”或“一个”用于包括一个或多于一个，独立于“至少一个”或“一个或多个”的任何其它情形或用法。在此文件中，术语“或”用于指代非排他性或使得“A或B”包括“A而非B”、“B而非A”以及“A和B”，除非另外指示。在此文件中，术语“包含”和“在……中”用作相应术语“包括”和“其中”的简明英语等效形式。同样，在下面的权利要求中，术语“包含”和“包括”是开放式的，即，包括除了在权利要求中的所述术语之后列出的那些元件之外的元件的系统、器件、物件、组分、公式或工艺仍然被认为落入该权利要求的范围内。而且，在下面的权利要求中，术语“第一”、“第二”和“第三”等仅仅用作标记，而并不旨在对其对象强加数字要求。
如在本文中所使用的，在先前段落中所讨论的非排他意义上，当提及附图标记时所使用得“-”(破折号)意指由所述破折号所指示的范围内的所有元件的“或”。例如，103A-B意指范围{103A，103B}中的元件的非排他性“或”，使得103A-103B包括“103A而非103B”、“103B而非103A”以及“103A和103B”。
以上描述旨在是示例性的，而非限制性的。例如，可以彼此结合地使用以上所描述的例子(或其一个或多个方面)。诸如本领域技术人员一旦审阅以上描述，就可以使用其它实施例。提供了本摘要是为了符合37C.F.R.§1.72(b)，以便容许读者快速弄清本技术公开内容的性质。提交本摘要是基于以下理解：将不用于解释或限制权利要求的范围和意义。同样，在以上具体实施方式中，可以将各个特征分组在一起，以精简本公开内容。这不应解释为旨在未要求保护的所公开的特征对任何权利要求是必不可少。相反，发明主体可以在于少于特定所公开的实施例的所有特征中。从而，下面的权利要求据此并入到具体实施方式中，以作为例子或实施例，其中每一项权利要求自己作为独立实施例，并且可以预期的是，这些实施例可以以各种组合或排列彼此结合。本发明的范围应当参考所附权利要求以及这些权利要求包含的等效形式的全部范围来确定。

Claims (20)

1.一种制造柔性装置的方法，包括：
在柔性基板上选择性地沉积第一气密材料；
在所述柔性基板上形成互连，以使得所述互连的一部分与所述第一气密材料重叠；
在所述第一气密材料上方形成电介质层；
在所述电介质层上靠近所述互连设置器件；以及
在所述器件和互连上选择性地沉积第二气密材料，以便将所述器件气密密封在所述互连和第一气密材料和第二气密材料的组合内，
其中所述电介质层包括与所述柔性基板相同的材料。
2.根据权利要求1所述的方法，其中，选择性地沉积所述第一气密材料包括：在所述柔性基板上选择性地沉积玻璃，并且其中，在所述器件和互连上选择性地沉积所述第二气密材料包括：在所述器件和所述互连上选择性地沉积玻璃。
3.根据权利要求1-2中的任意一项所述的方法，其中，选择性地沉积所述第一气密材料包括：在所述柔性基板上设置光致抗蚀剂，在所述光致抗蚀剂和所述柔性基板上沉积所述第一气密材料，以及去除光致抗蚀剂以便去除所沉积的第一气密材料的一部分。
4.根据权利要求1-2中的任意一项所述的方法，还包括：
在所述第二气密材料上方形成另一电介质层。
5.根据权利要求1-2中的任意一项所述的方法，还包括：
在沉积所述第二气密材料之前，从所述柔性基板、器件或互连的暴露的表面去除水分。
6.根据权利要求1-2中的任意一项所述的方法，还包括：
在沉积所述第二气密材料时，用离子轰击所述柔性基板、器件、第一气密材料或互连。
7.根据权利要求1-2中的任意一项所述的方法，其中，沉积所述第一气密材料或所述第二气密材料包括：沉积所述第一气密材料或所述第二气密材料，使得所述第一气密材料或所述第二气密材料的最大厚度为大约十微米。
8.根据权利要求1-2中的任意一项所述的方法，其中，沉积所述第一气密材料或所述第二气密材料包括：在最高温度为大约一百摄氏度的温度下沉积所述第一气密材料或所述第二气密材料。
9.根据权利要求1-2中的任意一项所述的方法，其中：
在所述柔性基板上选择性地沉积第一气密材料包括：在所述柔性基板的第一和第二相对表面上沉积所述第一气密材料；
在所述柔性基板上形成互连包括：在所述柔性基板的第一和第二侧中的每一侧上形成互连；
在所述第一气密材料上设置器件包括：在所述柔性基板的所述第一和第二侧中的每一侧上的所述第一气密材料上设置相应器件；以及
沉积第二气密材料包括：在所述柔性基板的所述第一和第二侧中的每一侧上的所述相应器件上沉积第二气密材料。
10.一种柔性装置，包括：
玻璃岛，所述玻璃岛在柔性基板上；
互连，所述互连在所述柔性基板上并且与所述玻璃岛部分重叠；
电介质层，所述电介质层在所述玻璃岛上方形成；
器件，所述器件设置在所述电介质层上并且电耦合到所述互连；以及
玻璃层，所述玻璃层在所述器件上方并且至少部分地在所述互连上方，使得所述玻璃层、所述玻璃岛和所述互连形成针对所述器件的气密密封，
其中所述电介质层包括与所述柔性基板相同的材料。
11.根据权利要求10所述的装置，还包括：
另一电介质层，所述另一电介质层在所述玻璃层上方。
12.根据权利要求10-11中的任意一项所述的装置，其中，所述玻璃岛的最大厚度为大约十微米。
13.根据权利要求10-11中的任意一项所述的装置，其中，所述玻璃岛是在所述基板的第一表面上的第一玻璃岛，所述互连是在所述基板的所述第一表面上的第一金属接触，所述器件是在所述基板的所述第一表面上的第一器件，并且所述玻璃层是第一玻璃层，并且所述装置还包括：
第二玻璃岛，所述第二玻璃岛在所述基板的第二表面上，所述第二表面与所述第一表面相对；
第二互连，所述第二互连在所述第二表面上，所述第二互连与所述第二玻璃岛部分重叠；
第二器件，所述第二器件在所述第二玻璃岛上并且电耦合到所述第二互连；以及
第二玻璃层，所述第二玻璃层在所述第二器件上方并且至少部分地在所述第二互连上方，使得所述第二玻璃层、所述第二玻璃岛和所述第二互连气密密封所述第二器件。
14.根据权利要求10-11中的任意一项所述的装置，还包括粘合剂，所述粘合剂在所述器件与所述玻璃岛之间并且将所述器件耦合到所述玻璃岛。
15.根据权利要求10-11中的任意一项所述的装置，其中，所述柔性基板包括聚二甲基硅氧烷(PDMS)。
16.根据权利要求10所述的装置，其中
所述柔性基板层多个叠置的柔性基板层，所述多个叠置的柔性基板层包括第一基板层和第二基板层，所述装置还包括：
第一管芯部分和第二管芯部分，所述第一管芯部分和所述第二管芯部分在所述叠置的柔性基板层中；以及
在所述第二基板层的邻近所述第一基板层的表面上被图案化的第一互连电路，其中，所述第一管芯部分和所述第二管芯部分通过所述互连电路进行电耦合。
17.根据权利要求16所述的装置，其中，所述多个叠置的柔性基板层还包括第三基板层，其中，所述第二基板层在所述第一基板层上，并且所述装置还包括：
在所述第三基板层的邻近所述第二基板层的表面上被图案化的第二互连电路；以及
穿过所述第二基板层的过孔，其中，所述过孔将所述第一互连电路电耦合到所述第二互连电路。
18.根据权利要求16-17中的任意一项所述的装置，其中，所述多个叠置的柔性基板层还包括设置在所述第一基板层上的第四基板层，其中，所述第一管芯部分包括面向与所述第二管芯的第二有源侧相反的方向的第一有源侧，并且所述装置还包括：
在所述第一基板层的邻近所述第四基板层的表面上被图案化的第三互连电路。
19.根据权利要求16-17中的任意一项所述的装置，其中，所述多个叠置的柔性基板层包括聚二甲基硅氧烷(PDMS)。
20.根据权利要求16-17中的任意一项所述的装置，其中，使用所述第一互连电路的互连、设置在所述第一管芯部分下方的气密材料以及在所述第一管芯部分上方并且至少部分地在所述互连上方的气密材料的组合来对所述第一管芯部分进行气密密封。
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