TW309654B - - Google Patents

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Publication number
TW309654B
TW309654B TW085102238A TW85102238A TW309654B TW 309654 B TW309654 B TW 309654B TW 085102238 A TW085102238 A TW 085102238A TW 85102238 A TW85102238 A TW 85102238A TW 309654 B TW309654 B TW 309654B
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Taiwan
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item
circuit path
patent application
majority
component
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TW085102238A
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English (en)
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Olin Corp
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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Description

309654 經濟部中央樣準局員工消費合作社印製 A7 ____B7_五、發明説明（1 ) 本發明係有關電子包裝用之部件。更特定言之，係提供 於球形柵極陣列電子包裝中有用之金屬性基材與受熱器。 微電子裝置典型上係自半導體材料，如：矽、鍺或鎵/坤 化物’而製得。將半導艘材料裝入方模中，此方模爲在表 面上具有電路回路之一般矩形結構。沿著電活性表面之周 邊，係爲輸入/輸出焊盤，以促進對外部電器回路之電轉接 0 半導體裝置脆弱且需要保護以避免濕氣與機械損害。藉 電子包裝以提供此保護。此電子包裝進一步含有導電性裝 置以轉移半導體設備與外部電器回路之間的電訊號。 Mahulikar等人於美國專利第4,939,316號中揭示一種電子 包裝。此專利揭示界定空穴之經各別電鍍之鋁或鋁合金基 底與蓋子部件。將導線機架置於基底與蓋子之間且與二者 黏合。將半導體裝置裝入空穴中，且與導線機架之内部導 線端電相連。導線機架之外部導線端延伸至包裝周迻之外 而與外部電器回路相連。 印刷電路板上可利用之空間有限，且希望減小包裝之周 圍面積。經裝導線之包裝的周圍面積延伸到包裝的基底及 蓋子之周邊之外，至爲導線機架之外部導線部分所界定之 點。 爲減小電子包裝之周团面積，可如揭示於pct國際申請 案PCT/US94/02113(於1994年9月29日所發行）所揭示之經由 包裝部件來電相連。球形柵極陣列包裝具有塗覆非導電層 之金屬性基底。導電通道由通過基底所形成的小孔而延伸 (請先閲讀背面之注意事項再填寫本頁) 装. -訂 本紙張尺度適用中國國家縣（CNS ) M胁（2丨〇X297公羞〉 經濟部中央樣準局員工消费合作社印製 A7 B7 五、發明説明（2 ) 。通道之一端係電相連於半導體裝置及另一端黏合於供連 接至外部電器回路的焊球。 於pct國際申請案PCT/US95/08305 *，揭示球形柵極陣 列電子包裝不需要延伸通過金屬性基材的通道。金屬性基 材塗有非導電層，而電路路徑係在此非導電層上形成，以 將半導體裝置與外部焊球電相連。 雖然揭示於上述專利申請案之球形栅極陣列電子包裝已 經證實令人滿意，發明者又發展了電子包裝部件，可改善 包裝之電性、熱特徵與可靠性。 據此，本發明之目的爲提供改善包裝之電性能、包裝之 熱性能與包裝可靠性之電子包裝部件。 本發明之特點爲：在一個具體實施例中，導電電路路徑係 形成於包裝部件之上，及將積體電路設備之輸入/輸出焊盤 與外部電器回路直接相連。在本發明之第二具體實施例中 ’基底部件及蓋子部件二者均包含可黏結於密封封閉層之 封環。又在本發明之另一具體實施例中，部件包含積分受 熱器以改善熱散逸’或受熱器具有中央通道以接受熱流 在本發明之優點中，電子包裝不需要金屬線黏結，且不 因爲金屬線黏結之破裂使裝置失敗。另一優點爲此包裝部 件適於密封以加強可靠性。本發明之另一優點爲具有受熱 器以改善熱散逸。 係據本發明，提供了供具有塗有非導電層之金屬性基材 之電子包裝用之部件。第一多數導體電路路徑係形成於部 -5- 本紙張尺度適用中國國家橾準（CNS ) A4規格（210X297公羞· 装· (請先閲讀背面之注意事項再填寫本頁) 訂 309654 A7 B7 經濟部中央樣準局員工消費合作社印製 五、發明説明（3 ) 件之表面上。電路路徑被設置成與積體電路設備之輸入/輸 出焊盤直接黏結，及藉著焊接至第二多數電路路徑而做如 此黏結。 在本發明之第二具體實施例中，提供了供具有塗覆第一 非導電層之金屬性基材之電子包裝所用之部件。第一多數 電體電路路徑係形成於此部件之周邊表面，並有第二非導 電層在重疊於電路路徑中間部分之部件周邊上形成。 又在本發明之另一具體實施例中，提供了電子包裝用之 部件。此包裝包含具有第一與第二對抗表面。積體電路裝 置係直接黏結於第一表面，且多數個突出物自基材之第二 表面之周邊延伸同時第二表面之中心部分基本上沒有突出 物或多數個突出物自第二表面之中心向外延伸且普摘與第 二表面平行。 本發明之又另一具體實施例中，提供了一基底部件及蓋 子部件黏結一起而界定一空穴。此空穴之部分爲積嫌電路 裝置所佔據。基本上’此空穴之剩餘部分係充滿導熱而非 導電性流體。基底部件或蓋子部件二者之一所形成之至少 一個小孔可使此流趙與黏結合至含小孔之部件的受熱器之 内部通道流通。 上述目的、特點及優點將自下列詳細説明與圖式變得更 明顯。 圖1顯示係據本發明之電子包裝用之蓋子部件之頂視平面 圖。 圖2顯示圖1之蓋子部件之截面示意圖。 —-I—i-----〈装— (請先閱讀背面之注意事項再填寫本頁) 訂 Λ
-m I
Id 本紙張尺度適用中國國家標準（CNS ) Α4規格（210χ297公釐） 3〇9654
1'發明説明（4) 阖3顯示圖1及圖2之蓋子部件併入球形柵極陣列包裝之 戴面示意圖。 I--------f 裝-- (請先閱讀背面之注意事項再填寫本頁) 闺4顯示圖1及圖2之蓋子部件之另一具體實施例之截面 $意圖。 阖5顯示密封球形柵極陣列包裝用之電子包裝部件之截面 示意圖。 圖6顯示圖5部件之頂視平面圖。 圖7顯示密封球形栅極陣列包裝用之另一部件之截面示意 _ 〇 圖8顯示圖7之密封球形柵極陣列包裝部件之頂視平面圖 圖9顯示密封陣列包裝之截面示意圖。 訂 圖10顯示具有側端針腳之密封包裝之截面示意圖。 圖11顯示具有積分受熱槽之電子包裝之基底部件。 圖12顯示圖11之積分受熱槽之頂視平面圖。 以 圖13顯不具有另一積分受熱槽之基底部件之截面示意圖 〇 圖14顯示圖13之積分受熱槽之頂視平面圖。 經濟部中央揉準局員工消費合作社印製 圖15顯示含有與電子包裝一起使用之受熱槽之飫 截面示意圖。 … 圖16顯示含有如本發明之受熱槽之另一熱流體之截面示 意囷。 ’' 圖17舉例如自先前技藝已知之積體電路裝置。 圖18舉例用以支持多數個積體電路裝置之囷1部件之截 -7- A7 B7 309654 ------ 五、發明説明（5) 面示意圖。 圖19舉例第二個具雜實施例之截面示意圖’其中圖1部 件係用來支持多數個積體電路裝置。 圖20舉例圖！部件與外部受熱槽之熱耦合之截面示意圖 圖21顯示積體電路裝置與球形栅極陣列電子包裝電耦合 之截面示意圖。 圖22顯示具有延伸通過中心部位之突出物之圖和積分受 熱槽之頂視平面圖。 圖17舉例如自先前技藝已知之積體電路裝置積趙電 路裝置ίο,亦稱爲半導雅晶片或半導體方模，具有前側12 及相對之後側14。積體電路裝置1〇係自如矽、姥或鎵/坤 化物之半導體材料所形成。藉著對前側12數個部分選擇性 地摻雜其他材料，在此前側形成電器回路16(僅部分示於 圖17)。電器回路16在金屬化輸入/輸出（〖/ο)焊盤18之處 終止。選擇金屬化以促進I/O焊盤18與外部電器回路之電 互連。例如，若金屬線黏結是藉熱壓縮黏結來貼上，則金 屬化可爲鋁。若I/O焊盤18是直接焊於如跳動晶片（fUp chip)或C4(經控制的崩溃晶片（collapse chip)連接）， 則金屬化可爲鈀。 積體電路裝置10之相對後側14通常爲半導體材料或金屬 化物質如：錄或金。 圖1顯示直接與積體電路裝置之I/O焊盤黏結之電子包裝 用的部件20之頂視平面圖。部件20之截面示於圖2。在此專 -8 - 本紙張尺度適用中國國家揲準（CNS ) A4規格（210X297公釐） --------------ΐτ------f*： (請先閲讀背面之注意事項再填寫本頁) 經濟部中央搮準局員工消费合作社印製 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（6 ) 利申請案全篇中，"主要表面•，意指示於圖1者，即各種部件 之長與寬。對應於圖2之垂直侧邊不被考慮爲"主表面，，。 參照囷1與圖2二者，部件20具有自任何具有熱膨脹係數 在矽（50x 10-7/°C)及鋁（240x 1〇-7/。〇之間之任何材料所形成 之基材22。當基材22爲金屬製的，此基板係塗覆有非導電 層24。金屬製的，意謂基材22爲金屬、金屬合金、以金屬 爲主之複合材料或以金屬爲主之化合物，且通常被認爲具 導電性。金屬性基材之適合材料包含：銅、鋁、鐵、鎳、细 及其合金。較佳爲銅、鋁及其合金，因爲其高導熱性。最 佳爲鋁合金，因爲增加了重量輕之優點。 適合基材22之被覆包含銅/不變鋼/銅及銅/鉬/銅。各被 覆層之厚度及被覆芯係選擇可獲得具有所欲熱膨脹係數及 所欲導熱係數之複合材料者。 基材22用之適宜非金屬包含陶瓷如：氧化鋁、氮化鋁、碳 化石夕、及其複合物以及玻璃如：硼妙酸物。 當金屬性基材22爲鋁或以鋁爲主之合金，非導體層24典 型上爲陽極膜。陽極膜24係自約0.013毫米至約0.076 mm(0.0005-0.003忖），且典型上自約 0.013 mm至約 0.05 1^11(0,0005-0.002吋），以電分隔電器回路，而不會顯示減低 導熱性。 當金屬性基材爲不能陽極化之金屬時，非導雅層24可爲 氧化物、氮化物或碳化物層。藉由化學蒸氣沈積或物理蒸 氣沈積，在有效氣體環境中加熱，可輕易形成此等層。另 外，非導體層24可爲聚合物或玻璃之薄層。可撓性聚合物 -9 - 本紙張尺度適用中國國家標準（CNS ) A4规格（210X 297公釐） (請先閱讀背面之注意事項再填寫本頁) 策· 訂 A7 B7 309654 五、發明説明（7 ) 如：聚醯亞胺、經改質之環氧化物及矽樹脂，其在受壓時會 流動’係特別佳。此等材料補償了電包裝及包裝所安裝之 表面之熱膨脹係數差値，由而改善安裝之可信度。 第一多數導體電路路徑26係形成於金屬性基材22之第一 表面28之上。而第一多數導髏電路路徑26可藉任何所卻手 段’包含：層積或黏著劑黏結，形成於第一表面28之上， 較佳爲使電路路徑26直接與非導體層24接觸而藉著如化學 蒸氣沈積、物理蒸氣沈積、無電電鍍或電解質電鍍之方法 形成。 電路路徑26具有内部終端30與外部終端32，自導電性材 料或材料之組合所形成，主要爲銅或鋼合金。 内部終端30係採用直接焊於積體電路裝置之1/()焊盤， 且與彼等I/O焊盤之圖形成一線。第一隆起34可沈積於内 部終端30之上。雖然亦可使用導電性黏著劑或導電性焊接 劑玻璃作爲第一隆起，但典型上爲低溶點合金如：錯/踢合 金。另外，第一焊接劑隆起可沈積在積體電路裝置之1/〇 焊盤上。 焊接劑不須均勻。第一焊接劑隆起3 4之選擇項包含覆蓋 焊接劑的金屬球，例如塗覆焊接劑之铜球。第一焊接劑隆 起可爲金或另一種材料，藉著如蒸發、濺渡、鍍膜或電線 隆起之工法，積建在1/0焊盤18上。在金屬線隆起中，金 屬線（典型上爲金、銘或其合金）係以熱壓縮或熱音波黏結 至I/O焊盤而形成黏結球，且由其延伸出電線尾端。接著 將電線尾端去除。亦可使用導電性黏著劑’如·填充環氧 —.1---；-----《装------訂------^ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央棣準局員工消費合作社印製
、發明説明（8) 脂之銀粉。 在外部終端提供第二焊接劑隆起3 6，以供黏結至可組成 部分電子包裝或外部電路之第二多數電路路徑（未示出）。 第二焊接劑隆起3 6之組成分獨立爲彼等第一焊接劑隆起3 4 所説明者之任一個。另外，第二焊接劑隆起可在第二多數 電路路徑上，與外部終端32對準，而形成。 圖3顯示使用部件2〇作爲蓋子部件之電子包裝4〇。電子 包裝40包含可爲任何所欲材料（如：金屬、聚合物或陶瓷）之 基底部件。較佳爲，基底部件42亦自金屬、金屬合金金 屬複合物或金屬化合物所形成，以利用此等材料之高導熱 性之優點。當基底部件42爲導電性時，則將基底部件42塗 覆如上述非導體層24所用之非導體層44。 基底部件42具有中心配置之積體電路裝置接收部分46及 周邊部分48。在周邊部分48上所形成者爲第二多數電路路 徑50 ’其具有類似於第一多數電路路徑26。 將積體電路裝置10藉著方模接附52,黏著至基底部件42之 接收部分46。方模接附5 2係爲任何適宜之低熔點溫度焊接 劑、法、封玻璃或黏著劑。一種較佳之材料爲填充著導熱材 料（如銀粉）的環氧樹脂。位於積體電路裝置1〇之前侧12上之 I/O焊盤18係藉由第一隆起34黏結至第—多數電路路徑％ ^ 第二焊接劑隆起36使第一多數電路路徑26與第二多數電 路路徑50電相連。雖然第二焊接劑隆起36使蓋子部件2〇 黏結至基底部件42，爲確保牢固的黏合，較佳使用聚合物 黏合劑54以加強黏結，此聚合物黏合劑54係任何適宜材 309654 A7 經濟部中央橾準局員工消費合作社印製 Β7 五、發明説明（9 ) ’其黏結至非導體層24、44二者，及導體電路路徑26， 50。一種適宜材料爲熱固性環氧樹脂。 將聚合物黏合劑54黏結至第二多數電路路徑50之中間部 分。所黏結至外部部分5 6者爲焊球5 8。焊球5 8係爲連接 電子包裝40至外部電器回路的任何適宜烊接劑，且典型上 爲銘/錫合金。 爲減少經由第一焊接劑隆起34施用於積體電路裝置1〇的 應力，蓋子部件20較佳爲僅可能薄。典型上，蓋子部件2〇 厚度係自約0.13 mm至約0.51 mm(0.005-0.02吋）。選擇蓋子 部件20之厚度及烊球58之直徑，使烊球58延伸之距離"D"爲 蓋子部件20之向外表面上面之至少〇 13 mm(0.005叫)及較佳 爲約 0.18 mm至約 0.25 mm(0.007-0.01 吋）。 電子包裝40具有許多勝於使用金屬線黏結互連之習用球 形栅極陣列包裝之優點。因爲以包埋之微帶狀結構取代金 屬線黏結，故電感較低。第一電路路徑26長度比—般金屬 線黏結短，因爲電路路徑與半導體裝置10之表面平行，而 非如金屬線黏結般以升高之電弧運行。又，不會有wire sweep的問題，且沒有其他有關金屬線脆性之議題，及黏結 迴圈（bond loop)高度與可信度無關。金屬電子包裝中，黏 結迴圈高度很重要，因爲若電弧之頂部接觸金屬蓋，會發 生電短路。此外，黏結金屬線之高度與形狀二者均影響到 金屬線可信度。此電子部件40適用於自積體電路裝置1〇將 熱移除。金屬蓋僅與金屬基底係直接連接於裝置並構成雙 重受熱器。又，蓋子之面向外之表面可爲金屬化，以供焊 -12 J—-------f 裝------訂------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度逋用 Φ ! "* - - i * Ζ 經濟部中央標準局貝工消費合作社印製 A7 B7 五、發明説明（10) 接至印刷電路板。 參考圖1至圖4，藉由將部件20機械式地變形置入杯形部 件20'。第一多數導體電路路徑26在金屬基材22上形成。 非導體層使第一電路路徑26與金屬基材22分開。另者，基 底22可爲熱可形成塑膠，以消除位居其間之非導體層之需 要。當然，基材22爲金屬性時，可加強導熱性。 第一電路路徑26係在基材20變形之前形成於其上，且可 機械式地加以塑形而不會破裂。當此具體實施例接受具有 陰極化層之鋁或鋁合金基底時，較佳爲此金屬性基材22爲 銅或以銅爲主之合金，及非導體層爲介電有機聚合物如：聚 亞醯胺或環氧。藉著適合方法如浸潰或喷鍍將介電層塗敷 在金展性基材26，使具有0.025 mm至0.075 mm(0.〇〇i_ 0.003吋）大小之厚度。若聚合物黏著劑需要將電路路徑層 壓，則環氧黏著劑係爲合適者。 第一隆起34使I/O焊盤18與第一電路路徑26之内部終端 30電相連。藉著第二焊接劑隆起36，使外部終端32與第 二多數電路路徑50電相連。第二多數電路路徑50可在基底 部件上形成或在印刷電路板基材62(如：填充玻璃的環氧樹 脂）上形成。 積體電路裝置10之前侧12及基材20之間的空間可填充可 撓的聚合物64(如：矽石膠）以加強第一隆起34的可信度。 以可撓的聚合物填充整個包裝空穴，可加強第二烊接劑隆 起3 6之可信度。 電子包裝60之優點包含低成本及可適用於大量製造之方 -13- J— ^ f 裝 訂 f 一 (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中圃國家標準（CNS ) A4规格（210X297公釐）
A7 B7 五、發明説明（11 ) 法。因爲第一多數導體電路路徑26係沈積在平面上，所以 得到高解析度之電器回路。在基底22變形之後，高密集電 器回路精確地填滿包裝之杯形區域。杯深可在形成期間予 以精確控制。結果’僅藉著更改變形工具的尺寸，可將類 似的部件20使用在許多不同尺寸之積雜電路裝置。 圏18及19顯示部件20可爲内部部件，而非包裝基底或蓋 子之部份。部件20具有基材22，較佳爲塗覆非導體層24 之金屬。多數積體電路裝置1 〇，i 〇，係黏結於部件2 〇之對 面側。積體電路裝置之後侧14可黏結至部件20，並且如圏 18所示經由金屬線黏結66電相連。金屬線黏結將1/〇焊盤 18與第一多數電路路徑26連接。第一電路路徑26經由焊 球、終端接腳、導線機架等與外部電路電相連。 圖19中’積體電路裝置1〇、ι〇ι經由第一焊接劑降起34 與第一多數電路路徑26黏結且電相連。使裝置電或熱相連 可包含一個或多個導體通道68。 經濟部中央標準局貝工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 圖5截面及圖6頂視平面圏所示之部件7〇提供密封性。濕 氣有害於積嫌電路裝置之操作。濕氣與包裝組件之副產物 如氣化物離子混合形成腐蚀性物種，會將積禮電路裝置上 的電器回路與黏結金屬線腐蚀。有效密封的電子包裝阻斷 濕氣轉移至積體電路裝置及黏結金屬線。 部件7 0具有塗覆非導體層7 4之金屬性基材7 2。金屬性基 材爲任何合適的金屬、金屬合金、金屬複合物或金屬化合 物’較佳爲鋁或鋁合金作爲非導體層74之陰極化層。另者 ，基材72可爲介電物例如：陶瓷，如：氧化鋁、氮化銘或碳 -14- 本紙張尺度適闲中國國家標準（CNS ) A4規格（2丨0X297公釐） 309654 A7 - '丨丨· - B7 經濟部中央標準局員工消費合作社印裝 五、發明説明（12) 化矽。當使用介面基底時，可省略非導體層。 藉著任何合適方法（如：化學蒸氣沈積、物理蒸氣沈積或 噴射蒸氣沈積）可將第—多數電路路徑76在周邊表面冗上 形成。另者，可藉無電或電解質電鍍方法使電路路径^形 成。 電路路徑76具有内部端點8〇、相對之外部端點82及介於 其間之中間部分84。藉著蒸氣沈積方法如電漿蒸氣沈積或 喷射蒸氣沈積，將介電層86蓋過電路路徑76之中間部分 84而形成。此介電層可爲任何合適之無機介電物，如氧 化銘或氣化銘。 藉著適合方法如蒸氣沈積，將金屬化層88沈積在介電層 86上。金屬化層88爲任何可焊接之金屬，如：鈀/鎳合金或 鎳。然後可藉著烊接或玻璃封口，將陶瓷或金屬性蓋子與 部件70接合。可得焊接劑球以與外部電器回路電相連。然 而，也可使用其他方法以經由外部終端而電相連，如：黃銅 導線或終端接角。 另一密封電子包裝90顯示於圖7之截面。包裝90之基底 部件92示於囷8之頂視平面囷。如上文所述，基底部件92 較佳爲塗覆非導體層93之金屬性基材。第一多數電器回路 路徑26園繞基底部件92之周邊表面78而形成。金屬線黏 結94、如在膠帶自動黏結（tab)中所用之銅箔之薄條紋、 管線内電器回路或任何其他電相連裝置使〗/〇烊盤18與第 一多數導體電路路徑26之内部端點80相接。 藉著封口玻璃98將蓋子部件96黏結至基底部件92。封口 -15- 本紙張尺度適用中國國家棣準（CNS ) 规格（210X297公釐） --------f裝— (請先閲讀背面之注^項再填寫本頁) 訂 -ml m !— 1^1 經濟部中央棣準局員工消費合作社印製 A7 ___B7___ 五、發明説明（13 ) 玻璃98黏結至蓋子部件96之週邊表面1〇〇及第一多數導體 電路路徑26之中間部分84，以及介電層94(若存在）或是基 材92(若基材92爲非導體）。 當基材92爲銘或以銘爲基礎之合金，一種合適之封口玻 璃具有下列以重量計之組成： 32%-50% Si02 4%-27% Na20 4%-27% K20 2%-8% BaO 2%-8% SrO 4%-3 0% Ti〇2 至多5%之Li20 至多7%之ZnO 至多2%之Zr02 至多2%之A1203 如Mahulikar等人在美國專利第5,023,398號中所揭示者。除 了封口玻璃外，也可使用反玻璃化陶瓷及可陶瓷化之封口 玻璃。 圖9之截面顯示密封電子包裝11〇。如前一個具禮實施例 ，密封電子包裝110包含基底部件112及蓋子部件114，二者 均較佳爲金屬、金屬合金、金屬複合物或金屬化合物且塗 覆著非導體層116。較佳爲基底部件112與蓋子部件114自鋁 或鋁合金形成及非導體層116爲陰離子化層。基底部件112 或蓋子部件114二者之一或二者可任意自非導電材料（如：陶 -16- 本紙張尺度適用中國國家橾準（CNS ) A4规格（210X297公釐> (請先閲讀背面之注意事項再填寫本頁) 裝· -訂 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（14) 瓷或聚合物樹脂）形成，消除非導體層116之需要。 多數通道118經由基底部件112或蓋子部件〗η二者之一形 成。第一多數導體電路路徑26係在基底部件112或蓋子部件 114一者之一的表面120上形成。第一多數電路路徑延著通 道11 8之壁延伸至基底部件n 2或蓋子部件i 14二者之一的相 對表面122。藉著如上述任何合適方法，如：金屬線黏結、 TAB或管線中電器回路，使積體電路裝置1〇與第一多數電 器回路路徑電相連。 在一具體實施例中，則將通道118予以填充焊接劑膏124 ，將其加熱以再流動而形成固態插塞物而將通道U8封口。 將焊球58黏結於相對表面122上之第一電路路徑。 另者’終端接脚126延伸通過通道118，並藉著焊接劑124 與第一電路路徑26相接。焊接劑延著終端針腳126的柄延伸 通過通道118以提供密封之封口。 基底部件112與蓋子部件114二者之周邊部分128塗覆著可 焊接材料（如：銅或銅/鎳合金）之金屬化130。焊接劑封口 132 使基底部件112與蓋子部件114密封地相接，完成包裝no。 若基底部件112具有侧壁134或銅環框（未示出），則終端接 腳126可如圖1〇所示，以與基底及蓋子部件之—般平面方向 向外延伸。如前一個具禮實施例，第一電路路徑26使積禮 電路装置10與終端接腳126電相連。 圖9與10中使用來填充通道118之焊接劑124可與所用來 使基底部件112與蓋子部件114相接之焊接劑封口 132相同 或不同。若使用相同焊接劑，則同時完成蓋子黏接及通道 -17- 本紙張尺度適用中國鬮家棣準（CNS ) A4規格（210X 297公釐） (装------訂------^ (請先閲讀背面之注意事項再填寫本頁) 309654
五、發明説明（1S ) 塡充之操作。 若希望順序製程，則烊接劑124應 更高之烷St，I» &植&坪接劑封口 ！32 尺熔點，因爲焊接劑封口係最後之组合操作。 =接劑封π 132可以順序局部化熱縫封口操作以避免二 其他焊接劑相接處之任何溶化。此方法限制所施用的教在 包裝邵件周邊部分128之非常局部的局部化部分。 …、 本發明之電子包㈣件對於自積髏電路裝Μ散奴高度 有效。熱之驅散可進一步藉著與基底部件、蓋子部件或二 者形成受熱器整體而加強。圖U之截面示意圈與圖12的頂 視平面圖中顯示了此一種部件。熱加強部件14〇具有第一表 面142與相對第二表面144。積體電路裝置1〇係黏結於第一 表面142。多數突起146自第二表面ι44之周邊向外延伸至約 1 mm至約25 mm之高度。第二表面144之中央部分148基本 上沒有突起146或突起可經由中央部分以如圖22所示之方格 煎餅狀（waffle-like)囷案延伸。受力氣流150以大概與突起 146之列垂直之方向越過第二表面144。中央部分沒有突起 之構形優於第二表面144上面佈滿突脊，因爲中央部分148 則用來作記號或拾取及置放。 第二熱加強部件160示於圖13之截面示意圖與圖14之頂視 平面圈。此結構除了突起146·自第二表面144之中央部分 162向外延伸然後延伸至大約第二表面平行之外，與圖i i及 12之熱加強部件140類似。 熱加強電子包装170示於圖15中之截面圖。包裝170具有 基底部件172及蓋子部件174，二者均自任何所欲金屬、陶 -18- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 裝· -訂 經濟部中央標準局員工消费合作社印裝 經濟部中央標準局員工消費合作社印製 A7 .. _B7 五、發明説明（16) 瓷或聚合物形成。較佳爲使用金屬性部件，及最佳爲金屬 性部件爲銘或以銘爲基礎之合金而如上文所述塗覆著非導 體陰離子化層。基底部件172係藉封口劑176黏結於蓋子部 件174。封口劑172爲使基底172與蓋子174相接之任何有效 方法’如：聚合物黏合劑’例如：熱固性環氧，或金屬焊接 劑。 積體電路裝置10係包膠於藉著基底部件172與蓋子部件 174之組合所界定之空穴178中。積體電路裝置與外部電器 回路之電相連係藉著上文所述之任何方法如：第一焊接劑隆 起34導引第一多數導體電路路徑（未示出）或如圖16所示之 引線框。 參考囷15，基底部件，係爲積體電路裝置1〇之後側14所 黏結者，含有至少一個，且較佳爲多數之延伸通過基底部 件172之小孔180。自熱導禮材料（如：銅或銘）所形成且較佳 具有黑色以增大發射率之受熱器182，藉著封口劑ι84與基 底部件172黏結。此封口劑可爲任何合適之黏合劑、封口玻 璃或金屬性焊接劑。空穴178所餘者遂以熱導性、冲導電性 流體186(如：全氟化之熱傳導流體）填充之。 當積體電路裝置藉電子信號啓動時，產生熱。此熱傳導 至流鍾186，導致一部分流體汽化。流體蒸氣通過小孔ι8〇 而進入受熱器，在此將蒸氣凝結回流至空穴178,而建立熱 泵。 參考圖16，熱加強電子包装190顯示受熱器ι82黏結至蓋 子部件174而非基底部件172之可應用性。 _ -19- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -f裝— I · 一· (請先閱讀背面之注意事項再填寫本頁) 訂
J 309654 經濟部中央橾準局員工消費合作社印製 A7 B7 五、發明説明（17) 本發明之電子包裝之熱驅散，又藉著使包裝部件與外部 受熱器之熱耦合而加強。如圏20所示，圖3之包裝40藉著在 部件20與印刷電路板192之間形成黏結194，與印刷電路板 1 92或其他外部基材熱耦合。黏結1 94係金屬性焊接劑，填 充環氧之銀、熱脂或任何其他合適之高熱導性之黏合劑。 熱通道196(如填滿洞之銅）可接觸部件20以進—步加強熱 驅散。在包裝60(如圖4所示）及具有曝露於外部部件之積體 電路裝置之後侧14之其他包裝中，熱通道1 96可藉著焊接劑 、熱導禮黏合劑或熱脂’與後側1 4直接搞合。若使用焊接 劑，將後側1 4適當金屬化以加強焊接劑黏結。 示於圖21中之電子包裝200係爲積體電路裝置1〇與金屬性 基底部件42電耦合之具體實施例所繪。金屬性基底部件42 如上所述塗覆著非導電層44。非導電層料係不連續且在金 屬性基底部件及一部分第一多數電路路徑26'與一部分第二 多數電路路徑50'之間插置有間隙202。間隙202係藉著將非 導體層44之所欲部分機械式或化學方式移除或雷射切除而 形成。另者，將金屬性基底部件42所選擇之部分護軍住或 其他方式以避免接受導體層44。當沈積第一與第二電路路 徑26’、50’時，電路路徑填充使所選之電路路徑26，、5〇,與 金屬性基底部件42電耦合之間隙。其他電路路徑26、5〇係 藉著非導體層44之被覆部分與金屬性基底部件42電分離。 藉著金屬線黏結94、如上所述之管線中電器回路、tab 黏結或任何其他合適方法，使所選擇之積體電路裝置1〇之 I/O焊盤18·與第一多數電路路徑26,電相連。 -20- 本紙張尺度適用中國國家榡準（CNS ) A4规格（210X297公釐） —-I ^ 「裝-- (請先閱讀背面之注意事項再填寫本頁j 今
A 經濟部中央裸準局員工消費合作社印製 309654 A7 ___B7_ 五、發明説明（18 ) 雖然包裝基底42可構成浮動接地，但較佳爲使第二電路 路徑5 (Γ與外部接地電相連。任何電路路徑位置可與金屬性 基底電耦合。較佳爲，經耦合之第一電路路徑26'與經耦合 之第二電路路徑5 0 ’係分得很開，例如插置在積雜電路裝置 1 〇之相對側。依此方式，接地電流流過金屬性基底部件之 大面積，導致下列益處： 1.較若是自許多小的個別電路路徑或金屬線所形成之接 地平面，有較好之電流分佈及較低阻抗。 2 ·減低包裝之"雜訊"（noise)，特別是在高頻者。電位雜 訊與接地返回路徑有關’稱爲"接地彈回（ground bounce)”， 其定義爲：
Vn〇sie=L(di/dt) 其中（di/dt)爲電路之速度 L爲電路電感 本發明之電耦合電路減低電路電感而使包裝雜訊降低。 當特別注意到球形樹極陣列包裝時’本發明之包裝同等 可應用至接腳柵極陣列包裝、有導線包裝及無導線包裝。 例如，可將導線焊接於電路路徑之第一多數之外部終端。 根據本發明，顯然已提供特別適於球形栅極陣列電子包 裝之電子包裝部件，上文所述之目的，方法及優點完全令 人滿意。雖然本發明組合具禮實施例加以描述，但顯然對 於熟悉此技藝之人士依據前文之敘述可有許多替代、改良 及變異。因此，卻包括所有此類替代、改良及變異在本申 請專利範困之精神及廣大範_中。 -21 - 本紙張尺度適用中國國家揉準（CNS ) A4规格（210X297公嫠） (請先閲讀背面之注意事項再填寫本頁) 裝. 訂

Claims (1)

  1. ABCD 第8510223S號專利申請案 中文申請專利範園修正本(86年2月) 六、申請專利範圍 1. 一種電子包裝用之部件，其特徵爲： 塗覆著可撓性介電聚合物層之金屬性基底；及 在該可撓性介電聚合物層之表面上形成之第一多數導 體電路路徑，該第一多數電路路徑直接與積體電路裝置 之輸入/精出焊盤及第二多數電路路徑黏結。 2. 如申請專利範团第1項之部件，其特徵爲該可撓性介電聚 合物層爲環氧化合物。 3. 如申請專利範園第1項之部件，其特徵爲該第一多數電路 路徑藉著選自由金屬、金屬合金、導體焊接劑玻璃、導 嫌聚合物及塗復焊接劑之金屬性球所組成组群之材料與 該輸入/輸出焊盤黏結β 4. 如申請專利範面第1、2或3项之任一項之部件，其特徵 爲該部件具有一般杯形構形，且該積髏電路裝置位於該 杯内。 5. 如申請專利範圓第4項之部件，其特徵爲將可撓 (compliant)之聚合物插置在該積髏電路裝置及該成分之 間。 6. —種電子包裝用之部件，其特徵爲： 塗復著非導電層之金屬性基材； 在該金屬性基材之相對表面上形成第一多數導體電路 路徑，該第一多數電路路徑直接與至少兩個與該金屬性 基材之相對表面黏結之積體電路裝置之輸入/輸出烊盤， 及第二多數電路路徑黏結；及 延伸通過至少兩個該積醴電路裝置之間之該金屬性基 材之通道β 7. —種電子包裝用之部件，其特徵爲： 本紙張尺度逋用中國國家橾準（CNS > Α4規格（210X297公釐） 装-- (請先閎讀背面之注意事項再填寫本頁) 訂 4..Λ 經濟部中央揉準局負工消費合作社印製 ABCD 經濟部中央標準局員工消费合作社印製 六、申請專利範圍 塗復著非導電層之金屬性基材； 黏結於該金屬性基材之相對表面之至 少二 個積It電路 裝置；及 在該金屬性基材之相對表面上形成之第一多數導II電 路路徑’其中該至少兩個積髗電路裝置之輸入/輸出焊盤 係直接焊接於該第一多數電路路徑，該第一多數電路路 徑又與第二多數電路路徑黏結。 8. —種供安置一積體電路裝置之包裝，其特徵爲： 塗覆著非導電層之金屬性蓋子部件及具有第一多數電 路路徑在其表面上形成； 具有積體電路裝置接受部分及周邊部分之基底部件， 該周邊部分具有第二多數電路路徑在其上形成； 該積體電路裝置與該接受部分黏結，且藉著第一坪接 劑連接焊接至該第一多數電路路徑； 第二焊接劑連接使該第一多數電路路徑與該第二多數 電路路徑電相連；及 第三焊接劑連接使該第二多數電路路徑與外部電路電 相連。 9. 如申請專利範園第8項之包裝，其特徵爲該金屬性蓋子部 件爲鋁或鋁合金及該非導電層爲陽極膜》 10. 如申請專利範圍第8項之包裝，其特徵爲該非導電層係選 自由碳化物、氮化物、氧化物與介電 >聚合物所組成之 組群。 11. 如申請專利範团第8，9或10項中之任包裝，其特 徵爲該第三焊接劑連接構成延伸至該蓋之向外表 — -2- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 叫.装— (請先閲讀背面之注意事項再填寫本頁) 訂 iH. 申請專利範圍 A8 B3 C8 D8 經濟部t央梂準局負工消费合作社印裝 面之外的烊球β 12. 如申請專利範圍第1 1項 子部件與外部受熱器熱耦合 13. 如申請專利範团第1 2项之包装，其特徵爲該外部受熱器 爲含有自該蓋子部件延伸的至少一個導熱通道之印刷電 路板。 14‘如中請專利範圓第12項之包裝，其特徵爲該外部受熱器 具有運送熱流鳢至該包裝之内部通道》 15. 如申請專利範圍第丨2項之包裝，其特徵爲該基底部件含 有自該基底之周邊向外延伸之多數整體突出及基本上沒 有該突出物之中心部分。 16. 如申請專利範圍第12項之包裝，其特徵爲該基底部件含 有自該基底部件向外延伸及與該基底部件之主要表面大 致平行之多數突出。 17. 如申請專利範圍第n項^^ 之包装，其特徵爲該 基底部件亦爲金屬性及該電路路徑之部分與該 金屬基底部件電耦合》 18. —種電子包裝用部件，其特徵爲： 塗復著第一非導電層之金屬性基材； 在該金屬性基材之周邊表面上形成之第一多數導《電 路路徑，該第一多數電路路徑具有内部端點、外部端點 及位於其間之中間部分；及 在被復於該第一多數電路路徑76之該中間部分之該金 屬性基底之周邊之周圍形成第二非導電層。 19. 如申請專利範園第18項之部件，其特徵爲該金屬性基底
    包裝，其特歡爲該蓋 -3 本紙張尺度逋用中國國家標率（CNS > Μ規格（2丨〇><297公嫠） (請先閱讀背面之注意事項再填寫本頁) Η 裝_ 訂 ' 309654 A8 B3 C8 D8 '申請專利範圍 經濟部中央標準局wc工消費合作社印製 爲塗復著陽極膜之銘或銘合金。 20. 如申請專利範面第18或19項之部件，該第二非導電層係 選自由氧化鋁及氮化鋁所組成之组群。 21. 如申請專利範圍第20項之部件，其特徵爲將金屬化層插 置在該位於其間之中間部分對面之該第二非導電層之側 邊上。 22·如申請專利範園第21項之部件，其特徵爲該金屬化層係 選自由免/鎳合金、鉬/鏟合金、鎳及鎳合金所組成之組 群》 23‘ 一種電子包裝用部件，其特徵爲： 塗復蓋非導電層之金屬性基材，且具有經其延伸通過 之多數通道； 在該金屬性基材之表面上形成之第一多數導禮電路路 徑且延伸經過該多數通道；及 插置於該多數通道内且與該第一多數電路路徑電相連 之電接觸》 24. 如申請專利範圍第23項之部件，其特徵爲該電接觸爲烊 接劑栓塞* 25. 如申請專利範圍第23項之部件，其特徵爲該電接觸爲延 伸至與該金屬性基材之主要表面垂直之終端接脚。 26. 如申請專利範園第23項之部件，其特徵爲該電接觸爲延 伸至與該金屬性基材之主要表面平行之終端接腳。 --------^ d— (請先閱讀背面之注意事項再填寫本頁) 、1T -t>1 •11. -4-
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JP4387269B2 (ja) * 2004-08-23 2009-12-16 株式会社テクニスコ ビアが形成されたガラス基板及びビアの形成方法
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JP2010245337A (ja) * 2009-04-07 2010-10-28 Elpida Memory Inc 半導体装置及びその製造方法
WO2011134167A1 (en) * 2010-04-30 2011-11-03 Ubotic Intellectual Property Co., Ltd. Air cavity package configured to electrically couple to a printed circuit board and method of providing same
JP5987222B2 (ja) * 2011-09-30 2016-09-07 住友電工デバイス・イノベーション株式会社 半導体装置
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