CN104827775A - 导通构造、导通构造的制造方法、液滴排出头及打印装置 - Google Patents

导通构造、导通构造的制造方法、液滴排出头及打印装置 Download PDF

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Publication number
CN104827775A
CN104827775A CN201510063749.5A CN201510063749A CN104827775A CN 104827775 A CN104827775 A CN 104827775A CN 201510063749 A CN201510063749 A CN 201510063749A CN 104827775 A CN104827775 A CN 104827775A
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CN
China
Prior art keywords
substrate
conduction structure
conductive layer
main surface
end surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510063749.5A
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English (en)
Chinese (zh)
Inventor
依田刚
田中秀一
宫沢郁也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of CN104827775A publication Critical patent/CN104827775A/zh
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1612—Production of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
CN201510063749.5A 2014-02-10 2015-02-06 导通构造、导通构造的制造方法、液滴排出头及打印装置 Pending CN104827775A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-023736 2014-02-10
JP2014023736A JP6354188B2 (ja) 2014-02-10 2014-02-10 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置

Publications (1)

Publication Number Publication Date
CN104827775A true CN104827775A (zh) 2015-08-12

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510063749.5A Pending CN104827775A (zh) 2014-02-10 2015-02-06 导通构造、导通构造的制造方法、液滴排出头及打印装置

Country Status (3)

Country Link
US (1) US9708715B2 (https=)
JP (1) JP6354188B2 (https=)
CN (1) CN104827775A (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112310023A (zh) * 2019-07-29 2021-02-02 精材科技股份有限公司 晶片结构及其制造方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5278654B2 (ja) * 2008-01-24 2013-09-04 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP6314519B2 (ja) * 2014-02-10 2018-04-25 セイコーエプソン株式会社 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
US11387201B2 (en) * 2019-09-17 2022-07-12 Xintec Inc. Chip package and manufacturing method thereof

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005311122A (ja) * 2004-04-22 2005-11-04 Seiko Epson Corp 半導体基板の製造方法、電気光学装置の製造方法
JP2006140247A (ja) * 2004-11-11 2006-06-01 Sony Corp 配線接続方法、ならびに表示装置およびその製造方法
US20060164468A1 (en) * 2005-01-26 2006-07-27 Seiko Epson Corporation Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
US20060250456A1 (en) * 2005-03-30 2006-11-09 Seiko Epson Corporation Method of manufacturing liquid-jet head and liquid-jet head
CN1915668A (zh) * 2005-08-19 2007-02-21 精工爱普生株式会社 器件安装结构、器件安装方法、电子装置、液滴吐出头以及液滴吐出装置
US20070046178A1 (en) * 2003-08-29 2007-03-01 Keitaro Imai Display device and method for manufacturing the same
JP2007066965A (ja) * 2005-08-29 2007-03-15 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP2007283691A (ja) * 2006-04-19 2007-11-01 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
US20120235261A1 (en) * 2011-03-17 2012-09-20 Seiko Epson Corporation Device-mounted substrate, infrared light sensor and through electrode forming method
JP2012248721A (ja) * 2011-05-30 2012-12-13 Seiko Epson Corp 配線基板、赤外線センサー及び貫通電極形成方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660918B2 (ja) * 2001-07-04 2005-06-15 松下電器産業株式会社 半導体装置及びその製造方法
JP2004063569A (ja) * 2002-07-25 2004-02-26 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
JP4581664B2 (ja) * 2004-12-08 2010-11-17 セイコーエプソン株式会社 半導体基板の製造方法、半導体素子の製造方法及び電気光学装置の製造方法
JP4356683B2 (ja) 2005-01-25 2009-11-04 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置
JP5082285B2 (ja) * 2006-04-25 2012-11-28 セイコーエプソン株式会社 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP5098656B2 (ja) * 2008-01-18 2012-12-12 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
KR20130027628A (ko) * 2011-06-27 2013-03-18 삼성전자주식회사 적층형 반도체 장치
JP6201584B2 (ja) * 2013-09-30 2017-09-27 ブラザー工業株式会社 液滴噴射装置及び液滴噴射装置の製造方法

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070046178A1 (en) * 2003-08-29 2007-03-01 Keitaro Imai Display device and method for manufacturing the same
JP2005311122A (ja) * 2004-04-22 2005-11-04 Seiko Epson Corp 半導体基板の製造方法、電気光学装置の製造方法
JP2006140247A (ja) * 2004-11-11 2006-06-01 Sony Corp 配線接続方法、ならびに表示装置およびその製造方法
US20060164468A1 (en) * 2005-01-26 2006-07-27 Seiko Epson Corporation Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method
US20060250456A1 (en) * 2005-03-30 2006-11-09 Seiko Epson Corporation Method of manufacturing liquid-jet head and liquid-jet head
CN1915668A (zh) * 2005-08-19 2007-02-21 精工爱普生株式会社 器件安装结构、器件安装方法、电子装置、液滴吐出头以及液滴吐出装置
JP2007066965A (ja) * 2005-08-29 2007-03-15 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP2007283691A (ja) * 2006-04-19 2007-11-01 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
US20120235261A1 (en) * 2011-03-17 2012-09-20 Seiko Epson Corporation Device-mounted substrate, infrared light sensor and through electrode forming method
JP2012248721A (ja) * 2011-05-30 2012-12-13 Seiko Epson Corp 配線基板、赤外線センサー及び貫通電極形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112310023A (zh) * 2019-07-29 2021-02-02 精材科技股份有限公司 晶片结构及其制造方法

Also Published As

Publication number Publication date
US20150230333A1 (en) 2015-08-13
US9708715B2 (en) 2017-07-18
JP2015150699A (ja) 2015-08-24
JP6354188B2 (ja) 2018-07-11

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