JP2015168120A - 積層配線の形成方法、液体噴射ヘッドの製造方法、配線実装構造、液体噴射ヘッド及び液体噴射装置 - Google Patents
積層配線の形成方法、液体噴射ヘッドの製造方法、配線実装構造、液体噴射ヘッド及び液体噴射装置 Download PDFInfo
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Abstract
【解決手段】流路形成基板10上に形成されてエッチング液によりエッチングされる第1密着層131上に、断面形状が第1密着層側の幅W1よりも第1密着層131とは反対側の幅W2が広い接続端子91形成し、第1密着層131と同じ材料からなる第2密着層132で接続端子91を覆い、エッチング液を用いたウェットエッチングによって接続端子91上に傾斜配線110を形成する。
【選択図】図10
Description
かかる態様では、第1密着層がサイドエッチングされることを抑制し、第1配線が基体から剥離することを抑制することができる。
かかる態様では、第1密着層がサイドエッチングされることを抑制し、第1配線が第2基体から剥離することを抑制することができ、半導体素子と第1配線とを第2配線でより確実に導通して信頼性の高い液体の噴射を行える液体噴射ヘッドを製造することができる。
かかる態様では、第1密着層がサイドエッチングされることを抑制し、第1配線が基体から剥離することが抑制された信頼性の高い配線実装構造が提供される。
かかる態様では、第1密着層がサイドエッチングされることを抑制し、第1配線が第2基体から剥離することを抑制することができ、半導体素子と第1配線とを第2配線でより確実に導通して信頼性の高い液体の噴射を行える液体噴射ヘッドが提供される。
かかる態様では、ウェットエッチングにより第2配線が形成される第1配線の剥離を抑えて信頼性が向上した液体噴射装置が提供される。
以下に本発明を実施形態に基づいて詳細に説明する。インクジェット式記録ヘッドは液体噴射ヘッドの一例であり、単に記録ヘッドとも言う。
本実施形態では、第1配線の一例である接続端子91を逆台形状に形成する製造方法の別態様について説明する。図11は、接続端子及び傾斜配線を備える積層配線の断面図である。なお、実施形態1と同一のものには同一の符号を付し、重複する説明は省略する。
実施形態1に記載する第1配線の一例である接続端子91は、逆台形状に形成されていたがこのような態様に限定されない。図12は、接続端子及び傾斜配線を備える積層配線の断面図である。なお、実施形態1と同一のものには同一の符号を付し、重複する説明は省略する。
以上、本発明の一実施形態について説明したが、本発明の基本的な構成は上述したものに限定されるものではない。
Claims (7)
- 基体上に形成されてエッチング液によりエッチングされる第1密着層上に、断面形状が前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広い第1配線を形成し、
前記第1密着層と同じ材料からなる第2密着層で前記第1配線を覆い、
前記エッチング液を用いたウェットエッチングによって前記第1配線上に前記第2密着層を介して第2配線を形成する
ことを特徴とする積層配線の形成方法。 - 請求項1に記載する積層配線の形成方法において、
前記基板上に前記第1密着層の材料で第1層を形成し、
前記第1層上に前記第1配線の材料で第2層を形成し、
前記第2層の前記第1配線が形成される領域上にレジストパターンを形成し、
ウェットエッチングにより、前記第1層及び前記第2層にオーバーエッチングを施し、前記第2層の断面形状が、前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広い前記第1配線を形成する
ことを特徴とする積層配線の形成方法。 - 請求項1に記載する積層配線の形成方法において、
前記基板上に前記第1密着層の材料で第1層を形成し、
前記第1層上に前記第1配線の材料で第2層を形成し、
フォトレジスト法により形成されて、前記基板の表面に対して傾斜した側面を有し、対向する側面間の幅が前記第2層から離れる方向に向けて拡張した開口部を有するレジストパターンを、前記第2層の前記第1配線となる領域が当該開口部に露出するように前記第2層上に形成し、
めっきにより、前記開口部内に前記第1配線の材料でめっき層を形成し、
前記レジストパターンを除去することで、断面形状が前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広く、前記めっき層及び前記第1層の間に設けられた前記第2層と、前記めっき層とによって構成された前記第1配線を形成する
ことを特徴とする積層配線の形成方法。 - 半導体素子が電気的に接続される第1主面、前記第1主面とは反対の裏面とされる第2主面、及び前記第1主面と前記第2主面との間で傾斜して設けられた斜面を有する第1基体と、
前記第1基体の前記第2主面に接続される第3主面、及び前記第3主面に設けられた第1配線を有する第2基体と、
前記半導体素子と前記第1配線とを電気的に接続し、前記斜面から前記第1配線に連続して形成された第2配線とを備え、
前記第2基体には、液体を噴射するノズル開口に連通する流路、及び該流路に圧力変化を生じさせる圧力発生手段が設けられており、前記半導体素子によって前記圧力発生手段が駆動される液体噴射ヘッドの製造方法であって、
前記第2基体上に形成されてエッチング液によりエッチングされる第1密着層上に、断面形状が前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広い前記第1配線を形成し、
前記第2基体の前記第3主面上に前記第1基体を接合し、
前記第1密着層と同じ材料からなる第2密着層で前記第1配線を覆い、
前記エッチング液を用いたウェットエッチングによって前記斜面上から前記第1配線上に前記第2配線を形成する
ことを特徴とする液体噴射ヘッドの製造方法。 - 基体上に形成されてエッチング液によりエッチングされる第1密着層上に、断面形状が前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広い第1配線と、
前記第1密着層と同じ材料からなる第2密着層上に前記エッチング液を用いたウェットエッチングによって前記第1配線上に形成された第2配線と、を備える
ことを特徴とする配線実装構造。 - 半導体素子が電気的に接続される第1主面、前記第1主面とは反対の裏面とされる第2主面、及び前記第1主面と前記第2主面との間で傾斜して設けられた斜面を有する第1基体と、
前記第1基体の前記第2主面に接続される第3主面、及び前記第3主面に設けられた第1配線を有する第2基体と、
前記半導体素子と前記第1配線とを電気的に接続し、前記斜面から前記第1配線に連続して形成された第2配線と、を備え、
前記第2基体には、液体を噴射するノズル開口に連通する流路、及び該流路に圧力変化を生じさせる圧力発生手段が設けられており、前記半導体素子によって前記圧力発生手段が駆動される液体噴射ヘッドであって
前記第2基体上に形成されてエッチング液によりエッチングされる第1密着層上に、断面形状が前記第1密着層側の幅よりも前記第1密着層とは反対側の幅が広い前記第1配線と、
前記第1密着層と同じ材料からなる第2密着層上に前記エッチング液を用いたウェットエッチングによって前記斜面上から前記第1配線上に形成された前記第2配線とを備える
ことを特徴とする液体噴射ヘッド。 - 請求項6に記載する液体噴射ヘッドを備えることを特徴とする液体噴射装置。
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