CN104827775A - 导通构造、导通构造的制造方法、液滴排出头及打印装置 - Google Patents
导通构造、导通构造的制造方法、液滴排出头及打印装置 Download PDFInfo
- Publication number
- CN104827775A CN104827775A CN201510063749.5A CN201510063749A CN104827775A CN 104827775 A CN104827775 A CN 104827775A CN 201510063749 A CN201510063749 A CN 201510063749A CN 104827775 A CN104827775 A CN 104827775A
- Authority
- CN
- China
- Prior art keywords
- substrate
- conductive layer
- interarea
- face
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 43
- 238000007639 printing Methods 0.000 title claims abstract description 32
- 239000000758 substrate Substances 0.000 claims abstract description 253
- 238000007747 plating Methods 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 55
- 239000002184 metal Substances 0.000 claims description 41
- 229910052751 metal Inorganic materials 0.000 claims description 41
- 239000000463 material Substances 0.000 claims description 35
- 239000010703 silicon Substances 0.000 claims description 14
- 229910052710 silicon Inorganic materials 0.000 claims description 14
- 238000000576 coating method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 7
- 230000007261 regionalization Effects 0.000 claims description 6
- 238000004544 sputter deposition Methods 0.000 claims description 6
- 239000007769 metal material Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims 22
- 239000011248 coating agent Substances 0.000 claims 3
- 238000007789 sealing Methods 0.000 abstract description 44
- 239000010410 layer Substances 0.000 description 164
- 239000004065 semiconductor Substances 0.000 description 50
- 239000012790 adhesive layer Substances 0.000 description 21
- 239000007788 liquid Substances 0.000 description 17
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 239000000853 adhesive Substances 0.000 description 12
- 230000001070 adhesive effect Effects 0.000 description 12
- 238000004891 communication Methods 0.000 description 9
- 238000005530 etching Methods 0.000 description 9
- 238000000059 patterning Methods 0.000 description 9
- 230000000694 effects Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000000206 photolithography Methods 0.000 description 6
- 230000008901 benefit Effects 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 5
- 238000007772 electroless plating Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000149 penetrating effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 241000251468 Actinopterygii Species 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- 239000008280 blood Substances 0.000 description 1
- 210000004369 blood Anatomy 0.000 description 1
- 230000036772 blood pressure Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/02—Local etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1612—Production of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
- B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14419—Manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2002/14491—Electrical connection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-023736 | 2014-02-10 | ||
| JP2014023736A JP6354188B2 (ja) | 2014-02-10 | 2014-02-10 | 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104827775A true CN104827775A (zh) | 2015-08-12 |
Family
ID=53776202
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510063749.5A Pending CN104827775A (zh) | 2014-02-10 | 2015-02-06 | 导通构造、导通构造的制造方法、液滴排出头及打印装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US9708715B2 (enExample) |
| JP (1) | JP6354188B2 (enExample) |
| CN (1) | CN104827775A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310023A (zh) * | 2019-07-29 | 2021-02-02 | 精材科技股份有限公司 | 晶片结构及其制造方法 |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5278654B2 (ja) * | 2008-01-24 | 2013-09-04 | セイコーエプソン株式会社 | 液体噴射ヘッド及び液体噴射装置 |
| JP6314519B2 (ja) * | 2014-02-10 | 2018-04-25 | セイコーエプソン株式会社 | 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 |
| CN112530898B (zh) * | 2019-09-17 | 2025-08-22 | 精材科技股份有限公司 | 晶片封装体及其制造方法 |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005311122A (ja) * | 2004-04-22 | 2005-11-04 | Seiko Epson Corp | 半導体基板の製造方法、電気光学装置の製造方法 |
| JP2006140247A (ja) * | 2004-11-11 | 2006-06-01 | Sony Corp | 配線接続方法、ならびに表示装置およびその製造方法 |
| US20060164468A1 (en) * | 2005-01-26 | 2006-07-27 | Seiko Epson Corporation | Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method |
| US20060250456A1 (en) * | 2005-03-30 | 2006-11-09 | Seiko Epson Corporation | Method of manufacturing liquid-jet head and liquid-jet head |
| CN1915668A (zh) * | 2005-08-19 | 2007-02-21 | 精工爱普生株式会社 | 器件安装结构、器件安装方法、电子装置、液滴吐出头以及液滴吐出装置 |
| US20070046178A1 (en) * | 2003-08-29 | 2007-03-01 | Keitaro Imai | Display device and method for manufacturing the same |
| JP2007066965A (ja) * | 2005-08-29 | 2007-03-15 | Seiko Epson Corp | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| JP2007283691A (ja) * | 2006-04-19 | 2007-11-01 | Seiko Epson Corp | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| US20120235261A1 (en) * | 2011-03-17 | 2012-09-20 | Seiko Epson Corporation | Device-mounted substrate, infrared light sensor and through electrode forming method |
| JP2012248721A (ja) * | 2011-05-30 | 2012-12-13 | Seiko Epson Corp | 配線基板、赤外線センサー及び貫通電極形成方法 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3660918B2 (ja) * | 2001-07-04 | 2005-06-15 | 松下電器産業株式会社 | 半導体装置及びその製造方法 |
| JP2004063569A (ja) * | 2002-07-25 | 2004-02-26 | Seiko Epson Corp | 半導体装置及びその製造方法、回路基板並びに電子機器 |
| JP4581664B2 (ja) * | 2004-12-08 | 2010-11-17 | セイコーエプソン株式会社 | 半導体基板の製造方法、半導体素子の製造方法及び電気光学装置の製造方法 |
| JP4356683B2 (ja) | 2005-01-25 | 2009-11-04 | セイコーエプソン株式会社 | デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置 |
| JP5082285B2 (ja) * | 2006-04-25 | 2012-11-28 | セイコーエプソン株式会社 | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| JP5098656B2 (ja) * | 2008-01-18 | 2012-12-12 | セイコーエプソン株式会社 | 液体噴射ヘッドの製造方法 |
| KR20130027628A (ko) * | 2011-06-27 | 2013-03-18 | 삼성전자주식회사 | 적층형 반도체 장치 |
| JP6201584B2 (ja) * | 2013-09-30 | 2017-09-27 | ブラザー工業株式会社 | 液滴噴射装置及び液滴噴射装置の製造方法 |
-
2014
- 2014-02-10 JP JP2014023736A patent/JP6354188B2/ja active Active
-
2015
- 2015-02-06 US US14/616,466 patent/US9708715B2/en active Active
- 2015-02-06 CN CN201510063749.5A patent/CN104827775A/zh active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070046178A1 (en) * | 2003-08-29 | 2007-03-01 | Keitaro Imai | Display device and method for manufacturing the same |
| JP2005311122A (ja) * | 2004-04-22 | 2005-11-04 | Seiko Epson Corp | 半導体基板の製造方法、電気光学装置の製造方法 |
| JP2006140247A (ja) * | 2004-11-11 | 2006-06-01 | Sony Corp | 配線接続方法、ならびに表示装置およびその製造方法 |
| US20060164468A1 (en) * | 2005-01-26 | 2006-07-27 | Seiko Epson Corporation | Mounted structure, liquid droplet ejection head, liquid droplet ejection apparatus and manufacturing method |
| US20060250456A1 (en) * | 2005-03-30 | 2006-11-09 | Seiko Epson Corporation | Method of manufacturing liquid-jet head and liquid-jet head |
| CN1915668A (zh) * | 2005-08-19 | 2007-02-21 | 精工爱普生株式会社 | 器件安装结构、器件安装方法、电子装置、液滴吐出头以及液滴吐出装置 |
| JP2007066965A (ja) * | 2005-08-29 | 2007-03-15 | Seiko Epson Corp | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| JP2007283691A (ja) * | 2006-04-19 | 2007-11-01 | Seiko Epson Corp | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
| US20120235261A1 (en) * | 2011-03-17 | 2012-09-20 | Seiko Epson Corporation | Device-mounted substrate, infrared light sensor and through electrode forming method |
| JP2012248721A (ja) * | 2011-05-30 | 2012-12-13 | Seiko Epson Corp | 配線基板、赤外線センサー及び貫通電極形成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112310023A (zh) * | 2019-07-29 | 2021-02-02 | 精材科技股份有限公司 | 晶片结构及其制造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2015150699A (ja) | 2015-08-24 |
| US9708715B2 (en) | 2017-07-18 |
| US20150230333A1 (en) | 2015-08-13 |
| JP6354188B2 (ja) | 2018-07-11 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100579782C (zh) | 器件安装结构、器件安装方法、电子装置、液滴吐出头以及液滴吐出装置 | |
| US8613499B2 (en) | Inkjet head and manufacturing method of inkjet head | |
| CN105966069A (zh) | 液体喷射头以及液体喷射头的制造方法 | |
| JP2017124540A (ja) | 配線基板、ｍｅｍｓデバイス及び液体噴射ヘッド | |
| CN104827775A (zh) | 导通构造、导通构造的制造方法、液滴排出头及打印装置 | |
| CN104766851A (zh) | 布线基板、液滴排出头、印刷装置及布线基板的制造方法 | |
| CN103692773B (zh) | 液滴排出头、打印装置以及液滴排出头的制造方法 | |
| US9579892B2 (en) | Wiring structure, method of manufacturing wiring structure, liquid droplet ejecting head, and liquid droplet ejecting apparatus | |
| CN104827771B (zh) | 导通构造、导通构造的制造方法、液滴排出头以及印刷装置 | |
| JP6160119B2 (ja) | 配線構造体、配線構造体の製造方法、液滴吐出ヘッドおよび液滴吐出装置 | |
| US10625503B2 (en) | Liquid ejection head, liquid ejection apparatus, and electronic device | |
| JP2015168120A (ja) | 積層配線の形成方法、液体噴射ヘッドの製造方法、配線実装構造、液体噴射ヘッド及び液体噴射装置 | |
| US10603914B2 (en) | MEMS device, liquid ejecting head, and liquid ejecting apparatus | |
| JP6269164B2 (ja) | 配線実装構造、液体噴射ヘッド及び液体噴射装置 | |
| JP2000301719A (ja) | インクジェットヘッド及びインクジェットヘッドの製造方法 | |
| JP2015150793A (ja) | 配線実装構造の製造方法、液体噴射ヘッドの製造方法及び配線実装構造 | |
| US9064782B2 (en) | Wiring structure, droplet discharge head, and droplet discharge apparatus | |
| JP2006086265A (ja) | 配線基板、配線基板の製造方法および電子機器 | |
| JP2015160359A (ja) | 配線実装構造、液体噴射ヘッド及び液体噴射装置 | |
| JP2015150830A (ja) | 配線実装構造、液体噴射ヘッド及び液体噴射装置 | |
| JP2017052288A (ja) | 液滴吐出ヘッド、印刷装置および液滴吐出ヘッドの製造方法 | |
| JP2007062034A (ja) | 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150812 |
|
| WD01 | Invention patent application deemed withdrawn after publication |