JP6354188B2 - 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 - Google Patents

導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 Download PDF

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Publication number
JP6354188B2
JP6354188B2 JP2014023736A JP2014023736A JP6354188B2 JP 6354188 B2 JP6354188 B2 JP 6354188B2 JP 2014023736 A JP2014023736 A JP 2014023736A JP 2014023736 A JP2014023736 A JP 2014023736A JP 6354188 B2 JP6354188 B2 JP 6354188B2
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Japan
Prior art keywords
substrate
conductive layer
terminal portion
end surface
structure according
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JP2014023736A
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Japanese (ja)
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JP2015150699A (ja
JP2015150699A5 (enExample
Inventor
依田　剛
剛 依田
田中　秀一
秀一 田中
郁也 宮沢
郁也 宮沢
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Seiko Epson Corp
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Seiko Epson Corp
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Priority to JP2014023736A priority Critical patent/JP6354188B2/ja
Priority to CN201510063749.5A priority patent/CN104827775A/zh
Priority to US14/616,466 priority patent/US9708715B2/en
Publication of JP2015150699A publication Critical patent/JP2015150699A/ja
Publication of JP2015150699A5 publication Critical patent/JP2015150699A5/ja
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/02—Local etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1607—Production of print heads with piezoelectric elements
    • B41J2/1612—Production of print heads with piezoelectric elements of stacked structure type, deformed by compression/extension and disposed on a diaphragm
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1626—Manufacturing processes etching
    • B41J2/1629—Manufacturing processes etching wet etching
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1631—Manufacturing processes photolithography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1642—Manufacturing processes thin film formation thin film formation by CVD [chemical vapor deposition]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1643—Manufacturing processes thin film formation thin film formation by plating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/164—Manufacturing processes thin film formation
    • B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2/14201—Structure of print heads with piezoelectric elements
    • B41J2/14233—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14241—Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14419—Manifold
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B41J2002/14491—Electrical connection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
JP2014023736A 2014-02-10 2014-02-10 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置 Active JP6354188B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2014023736A JP6354188B2 (ja) 2014-02-10 2014-02-10 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
CN201510063749.5A CN104827775A (zh) 2014-02-10 2015-02-06 导通构造、导通构造的制造方法、液滴排出头及打印装置
US14/616,466 US9708715B2 (en) 2014-02-10 2015-02-06 Conduction structure, method of manufacturing conduction structure, droplet ejecting head, and printing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014023736A JP6354188B2 (ja) 2014-02-10 2014-02-10 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置

Publications (3)

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JP2015150699A JP2015150699A (ja) 2015-08-24
JP2015150699A5 JP2015150699A5 (enExample) 2017-03-09
JP6354188B2 true JP6354188B2 (ja) 2018-07-11

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JP2014023736A Active JP6354188B2 (ja) 2014-02-10 2014-02-10 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置

Country Status (3)

Country Link
US (1) US9708715B2 (enExample)
JP (1) JP6354188B2 (enExample)
CN (1) CN104827775A (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5278654B2 (ja) * 2008-01-24 2013-09-04 セイコーエプソン株式会社 液体噴射ヘッド及び液体噴射装置
JP6314519B2 (ja) * 2014-02-10 2018-04-25 セイコーエプソン株式会社 導通構造、導通構造の製造方法、液滴吐出ヘッドおよび印刷装置
TWI727870B (zh) 2019-07-29 2021-05-11 精材科技股份有限公司 晶片結構及其製造方法
CN112530898B (zh) * 2019-09-17 2025-08-22 精材科技股份有限公司 晶片封装体及其制造方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3660918B2 (ja) * 2001-07-04 2005-06-15 松下電器産業株式会社 半導体装置及びその製造方法
JP2004063569A (ja) * 2002-07-25 2004-02-26 Seiko Epson Corp 半導体装置及びその製造方法、回路基板並びに電子機器
CN1875663B (zh) * 2003-08-29 2011-03-23 株式会社半导体能源研究所 显示设备以及制造该显示设备的方法
JP3956955B2 (ja) 2004-04-22 2007-08-08 セイコーエプソン株式会社 半導体基板の製造方法、電気光学装置の製造方法
JP4737502B2 (ja) 2004-11-11 2011-08-03 ソニー株式会社 配線接続方法、ならびに表示装置の製造方法
JP4581664B2 (ja) * 2004-12-08 2010-11-17 セイコーエプソン株式会社 半導体基板の製造方法、半導体素子の製造方法及び電気光学装置の製造方法
JP4356683B2 (ja) 2005-01-25 2009-11-04 セイコーエプソン株式会社 デバイス実装構造とデバイス実装方法、液滴吐出ヘッド及びコネクタ並びに半導体装置
JP4492520B2 (ja) 2005-01-26 2010-06-30 セイコーエプソン株式会社 液滴吐出ヘッドおよび液滴吐出装置。
JP4930678B2 (ja) * 2005-03-30 2012-05-16 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
JP4483738B2 (ja) 2005-08-19 2010-06-16 セイコーエプソン株式会社 デバイス実装構造、デバイス実装方法、電子装置、液滴吐出ヘッド、及び液滴吐出装置
JP2007066965A (ja) * 2005-08-29 2007-03-15 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP2007283691A (ja) 2006-04-19 2007-11-01 Seiko Epson Corp 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP5082285B2 (ja) * 2006-04-25 2012-11-28 セイコーエプソン株式会社 配線構造、デバイス、デバイスの製造方法、液滴吐出ヘッド、液滴吐出ヘッドの製造方法、及び液滴吐出装置
JP5098656B2 (ja) * 2008-01-18 2012-12-12 セイコーエプソン株式会社 液体噴射ヘッドの製造方法
JP2012195514A (ja) * 2011-03-17 2012-10-11 Seiko Epson Corp 素子付き基板、赤外線センサー、および貫通電極形成方法
JP5821284B2 (ja) * 2011-05-30 2015-11-24 セイコーエプソン株式会社 配線基板、赤外線センサー及び貫通電極形成方法
KR20130027628A (ko) * 2011-06-27 2013-03-18 삼성전자주식회사 적층형 반도체 장치
JP6201584B2 (ja) * 2013-09-30 2017-09-27 ブラザー工業株式会社 液滴噴射装置及び液滴噴射装置の製造方法

Also Published As

Publication number Publication date
JP2015150699A (ja) 2015-08-24
US9708715B2 (en) 2017-07-18
CN104827775A (zh) 2015-08-12
US20150230333A1 (en) 2015-08-13

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