CN104795309B - 薄膜片材切除装置及切除方法 - Google Patents

薄膜片材切除装置及切除方法 Download PDF

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Publication number
CN104795309B
CN104795309B CN201510022076.9A CN201510022076A CN104795309B CN 104795309 B CN104795309 B CN 104795309B CN 201510022076 A CN201510022076 A CN 201510022076A CN 104795309 B CN104795309 B CN 104795309B
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CN
China
Prior art keywords
film
thin
cut
excision
residual part
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Active
Application number
CN201510022076.9A
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English (en)
Chinese (zh)
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CN104795309A (zh
Inventor
尾张弘树
高田準子
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Towa Corp
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Towa Corp
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Publication of CN104795309A publication Critical patent/CN104795309A/zh
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Publication of CN104795309B publication Critical patent/CN104795309B/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00—Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/10—Making cuts of other than simple rectilinear form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B26D1/01—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work
    • B26D1/12—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis
    • B26D1/25—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member
    • B26D1/26—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut
    • B26D1/28—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting
    • B26D1/285—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor involving a cutting member which does not travel with the work having a cutting member moving about an axis with a non-circular cutting member moving about an axis substantially perpendicular to the line of cut and rotating continuously in one direction during cutting for thin material, e.g. for sheets, strips or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/18—Means for removing cut-out material or waste
    • B26D7/1845—Means for removing cut-out material or waste by non mechanical means
    • B26D7/1863—Means for removing cut-out material or waste by non mechanical means by suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/27—Means for performing other operations combined with cutting
    • B26D7/32—Means for performing other operations combined with cutting for conveying or stacking cut product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D2007/0012—Details, accessories or auxiliary or special operations not otherwise provided for
    • B26D2007/0018—Trays, reservoirs for waste, chips or cut products

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Mechanical Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Advancing Webs (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Details Of Cutting Devices (AREA)
CN201510022076.9A 2014-01-21 2015-01-16 薄膜片材切除装置及切除方法 Active CN104795309B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2014-008925 2014-01-21
JP2014008925A JP6212399B2 (ja) 2014-01-21 2014-01-21 フィルムシート切り抜き装置及び切り抜き方法

Publications (2)

Publication Number Publication Date
CN104795309A CN104795309A (zh) 2015-07-22
CN104795309B true CN104795309B (zh) 2018-06-01

Family

ID=53560036

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510022076.9A Active CN104795309B (zh) 2014-01-21 2015-01-16 薄膜片材切除装置及切除方法

Country Status (4)

Country Link
JP (1) JP6212399B2 (enrdf_load_stackoverflow)
KR (1) KR101622509B1 (enrdf_load_stackoverflow)
CN (1) CN104795309B (enrdf_load_stackoverflow)
TW (1) TWI551415B (enrdf_load_stackoverflow)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107571321A (zh) * 2017-08-21 2018-01-12 盐城雄鹰精密机械有限公司 可实现废料分离处理的柔性物料出料平台
CN108284460A (zh) * 2018-01-17 2018-07-17 罗弟容 一种切割分页机
KR101924109B1 (ko) * 2018-02-21 2018-11-30 주식회사 상동 비닐포장기의 비닐자투리 제거장치
CN109230724A (zh) * 2018-08-21 2019-01-18 广州和井贸易有限公司 一种尼龙布加工设备
CN109291313A (zh) * 2018-08-21 2019-02-01 广州星引科技有限公司 一种高效的造纸厂废塑料回收利用的方法
CN109291311A (zh) * 2018-08-21 2019-02-01 广州星引科技有限公司 一种塑料回收加工的方法
CN109291312A (zh) * 2018-08-21 2019-02-01 广州星引科技有限公司 一种造纸厂废塑料回收利用装置及其使用方法
CN109455490A (zh) * 2018-11-16 2019-03-12 东莞哈工自控科技有限公司 一种锂电池封装设备的分切机构
CN110203746A (zh) * 2019-05-10 2019-09-06 海盐三湾塑业有限公司 一种防堆叠型转印膜裁切装置
CN110421627B (zh) * 2019-07-08 2020-03-10 广州爱科琪盛塑料有限公司 降低透气薄膜在线自动换卷产生碎膜的装置及使用方法
CN110525754A (zh) * 2019-08-20 2019-12-03 江苏东旭亿泰智能装备有限公司 带体回收装置
CN110948565A (zh) * 2019-12-20 2020-04-03 无锡易玛卡机械科技有限公司 一种裁切机下料结构
CN112519316A (zh) * 2020-12-30 2021-03-19 苏州华日金菱机械有限公司 一种用于造口袋烫包薄膜上料的自动装置
CN113148749B (zh) * 2021-04-09 2024-05-07 威海市龙升精密机械股份有限公司 一种家用裁膜机
CN113753652A (zh) * 2021-10-08 2021-12-07 铜陵天天纸品科技有限公司 一种餐巾纸包装分料系统
CN114380102B (zh) * 2021-12-14 2023-05-12 泉州市环球新材料科技有限公司 一种复合膜自动裁切成型设备
CN115418848B (zh) * 2022-09-23 2024-02-13 绍兴博利豪家纺有限公司 一种高效裁布机
CN118047255B (zh) * 2024-04-15 2024-06-14 无锡市利佳包装装潢有限公司 一种用于瓦楞纸板生产线的堆码输送装置

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US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
CN102034729A (zh) * 2009-10-01 2011-04-27 日东电工株式会社 粘合带粘贴装置
CN102529002A (zh) * 2010-09-16 2012-07-04 东和株式会社 压缩成形模具及压缩成形方法

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JPS6165060U (enrdf_load_stackoverflow) * 1984-10-05 1986-05-02
JPH0487796A (ja) * 1990-07-27 1992-03-19 Kataoka Mach Co Ltd 側面包装紙切断加工装置及び測面包装紙準備装置
JPH085577B2 (ja) * 1992-04-23 1996-01-24 日本金網商工株式会社 帯状薄物の移送装置
JP4796673B2 (ja) 2005-06-14 2011-10-19 日本メクトロン株式会社 長尺フィルム基材の裁断装置
JP4403133B2 (ja) * 2005-11-18 2010-01-20 日本メクトロン株式会社 長尺フィルムの搬送装置および搬送方法。
JP5028233B2 (ja) * 2007-11-26 2012-09-19 日東電工株式会社 半導体ウエハの保護テープ切断方法および保護テープ切断装置
CN101450419B (zh) * 2007-11-30 2011-09-28 深圳市大族激光科技股份有限公司 一种ito薄膜激光蚀刻设备及蚀刻方法
JP5153509B2 (ja) 2008-08-08 2013-02-27 Ｔｏｗａ株式会社 電子部品の圧縮成形方法及び金型装置
JP5413582B2 (ja) 2009-07-17 2014-02-12 岩崎通信機株式会社 裁断装置及び排紙トレイ
JP5991655B2 (ja) * 2012-02-27 2016-09-14 三菱重工メカトロシステムズ株式会社 印刷物発行装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6080263A (en) * 1997-05-30 2000-06-27 Lintec Corporation Method and apparatus for applying a protecting film to a semiconductor wafer
CN102034729A (zh) * 2009-10-01 2011-04-27 日东电工株式会社 粘合带粘贴装置
CN102529002A (zh) * 2010-09-16 2012-07-04 东和株式会社 压缩成形模具及压缩成形方法

Also Published As

Publication number Publication date
KR20150087137A (ko) 2015-07-29
JP6212399B2 (ja) 2017-10-11
KR101622509B1 (ko) 2016-05-18
JP2015137157A (ja) 2015-07-30
TW201532769A (zh) 2015-09-01
CN104795309A (zh) 2015-07-22
TWI551415B (zh) 2016-10-01

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