CN104617053B - 涉及陶瓷基板上射频装置封装的装置和方法 - Google Patents

涉及陶瓷基板上射频装置封装的装置和方法 Download PDF

Info

Publication number
CN104617053B
CN104617053B CN201410858176.0A CN201410858176A CN104617053B CN 104617053 B CN104617053 B CN 104617053B CN 201410858176 A CN201410858176 A CN 201410858176A CN 104617053 B CN104617053 B CN 104617053B
Authority
CN
China
Prior art keywords
ceramic substrate
conductive
electronic device
die
packaged electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201410858176.0A
Other languages
English (en)
Chinese (zh)
Other versions
CN104617053A (zh
Inventor
A·J·洛比安科
H·E·陈
D·S·怀特菲尔德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tiangong Solutions
Original Assignee
Tiangong Solutions
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tiangong Solutions filed Critical Tiangong Solutions
Publication of CN104617053A publication Critical patent/CN104617053A/zh
Application granted granted Critical
Publication of CN104617053B publication Critical patent/CN104617053B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
    • H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
    • H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/412—Deposition of metallic or metal-silicide materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P54/00—Cutting or separating of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H10W42/261—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions
    • H10W42/276—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons characterised by their shapes or dispositions the arrangements being on an external surface of the package, e.g. on the outer surface of an encapsulation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/63—Vias, e.g. via plugs
    • H10W70/635—Through-vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/685—Shapes or dispositions thereof comprising multiple insulating layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/0198—Manufacture or treatment batch processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/012—Manufacture or treatment of encapsulations on active surfaces of flip-chip devices, e.g. forming underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/127—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed characterised by arrangements for sealing or adhesion
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0478—Apparatus for manufacture or treatment the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07253—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H10W72/07254—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/231—Shapes
    • H10W72/232—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/242—Dispositions, e.g. layouts relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/241—Dispositions, e.g. layouts
    • H10W72/247—Dispositions of multiple bumps
    • H10W72/248—Top-view layouts, e.g. mirror arrays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/17—Containers or parts thereof characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Transceivers (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Electromagnetism (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Toxicology (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Health & Medical Sciences (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
CN201410858176.0A 2013-11-05 2014-11-05 涉及陶瓷基板上射频装置封装的装置和方法 Active CN104617053B (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201361900394P 2013-11-05 2013-11-05
US61/900,394 2013-11-05
US14/528,447 2014-10-30
US14/528,447 US9564937B2 (en) 2013-11-05 2014-10-30 Devices and methods related to packaging of radio-frequency devices on ceramic substrates

Publications (2)

Publication Number Publication Date
CN104617053A CN104617053A (zh) 2015-05-13
CN104617053B true CN104617053B (zh) 2020-09-11

Family

ID=53007383

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201410858176.0A Active CN104617053B (zh) 2013-11-05 2014-11-05 涉及陶瓷基板上射频装置封装的装置和方法

Country Status (5)

Country Link
US (2) US9564937B2 (https=)
JP (3) JP6537807B2 (https=)
KR (1) KR102371332B1 (https=)
CN (1) CN104617053B (https=)
TW (1) TWI652789B (https=)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3170228B1 (en) * 2014-07-16 2019-05-01 Siemens Aktiengesellschaft Subsea electrical connector component and method of manufacturing thereof
US10729001B2 (en) * 2014-08-31 2020-07-28 Skyworks Solutions, Inc. Devices and methods related to metallization of ceramic substrates for shielding applications
WO2016080333A1 (ja) * 2014-11-21 2016-05-26 株式会社村田製作所 モジュール
US10594355B2 (en) * 2015-06-30 2020-03-17 Skyworks Solutions, Inc. Devices and methods related to radio-frequency filters on silicon-on-insulator substrate
TWI656543B (zh) * 2015-10-16 2019-04-11 日商村田製作所股份有限公司 Electronic parts
WO2017179325A1 (ja) 2016-04-11 2017-10-19 株式会社村田製作所 高周波部品
TWI632662B (zh) * 2016-04-22 2018-08-11 矽品精密工業股份有限公司 電子封裝件及其製法
JP2017200183A (ja) * 2016-04-29 2017-11-02 スカイワークス ソリューションズ, インコーポレイテッドSkyworks Solutions, Inc. 遮蔽されたダイバーシティ受信モジュール
CN110024115B (zh) * 2016-10-04 2024-02-02 天工方案公司 具有包覆模制结构的双侧射频封装
CN108022886A (zh) * 2017-11-30 2018-05-11 深圳华远微电科技有限公司 一种倒装芯片式滤波器的封装结构
US11503704B2 (en) * 2019-12-30 2022-11-15 General Electric Company Systems and methods for hybrid glass and organic packaging for radio frequency electronics
US11804435B2 (en) 2020-01-03 2023-10-31 Skyworks Solutions, Inc. Semiconductor-on-insulator transistor layout for radio frequency power amplifiers
US11291106B2 (en) * 2020-01-29 2022-03-29 Dell Products L.P. System and method for enhanced cooling
US11342277B2 (en) * 2020-06-10 2022-05-24 Micron Technology, Inc. Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
CN219269209U (zh) 2020-06-22 2023-06-27 株式会社村田制作所 电子部件
WO2021261273A1 (ja) * 2020-06-22 2021-12-30 株式会社村田製作所 電子部品
WO2022044516A1 (ja) 2020-08-26 2022-03-03 株式会社村田製作所 高周波電子部品
CN220086023U (zh) 2020-08-26 2023-11-24 株式会社村田制作所 高频电子部件和模块
CN113327899A (zh) * 2021-04-22 2021-08-31 成都芯源系统有限公司 倒装芯片封装单元及封装方法
JP2023058393A (ja) 2021-10-13 2023-04-25 株式会社村田製作所 高周波モジュール及び通信装置
US20230135057A1 (en) 2021-10-28 2023-05-04 Skyworks Solutions, Inc. Dual sided molded package with varying interconnect pad sizes and uniform exposed solderable area
US12549155B2 (en) 2022-01-11 2026-02-10 Skyworks Solutions, Inc. Filter module for multiple carrier aggregation with ground plane
US12575073B2 (en) 2022-03-30 2026-03-10 Skyworks Solutions, Inc. Electromagnetic interference (EMI) shielded integrated device package
CN119993960A (zh) * 2025-01-13 2025-05-13 歌尔微电子股份有限公司 封装单体、封装结构、电子产品及制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (zh) * 2000-04-21 2003-09-10 电子设备屏蔽公司 印制电路板的emi和rfi屏蔽
TW200805615A (en) * 2006-07-04 2008-01-16 Advanced Semiconductor Eng Semiconductor package having electromagnetic interference shielding and fabricating method thereof
TW200915527A (en) * 2007-09-24 2009-04-01 Stats Chippac Ltd Semiconductor package and method of reducing electromagnetic interference between devices
CN102683329A (zh) * 2011-03-18 2012-09-19 矽品精密工业股份有限公司 半导体封装件及其制法

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08213755A (ja) * 1995-01-31 1996-08-20 Kyocera Corp コンデンサ内蔵型積層セラミック回路基板及びその製造方法
JP2002026178A (ja) * 2000-07-04 2002-01-25 Hitachi Ltd 半導体装置及びその製造方法並びに電子装置
JP3724450B2 (ja) 2002-04-23 2005-12-07 株式会社村田製作所 無線通信用高周波回路およびそれを備えた通信機
JP4178880B2 (ja) * 2002-08-29 2008-11-12 松下電器産業株式会社 モジュール部品
US7167688B2 (en) * 2003-07-30 2007-01-23 Chi Mei Communication Systems, Inc. RF transceiver module formed in multi-layered ceramic
JP2006210629A (ja) 2005-01-28 2006-08-10 Matsushita Electric Ind Co Ltd 半導体装置
US7342303B1 (en) * 2006-02-28 2008-03-11 Amkor Technology, Inc. Semiconductor device having RF shielding and method therefor
JP2007306172A (ja) * 2006-05-10 2007-11-22 Tdk Corp バンドパスフィルタ素子および高周波モジュール
US7906371B2 (en) * 2008-05-28 2011-03-15 Stats Chippac, Ltd. Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
TW201013881A (en) 2008-09-10 2010-04-01 Renesas Tech Corp Semiconductor device and method for manufacturing same
JP5402482B2 (ja) * 2009-10-01 2014-01-29 パナソニック株式会社 モジュールとモジュールの製造方法
CN102054821B (zh) * 2009-10-30 2013-09-11 日月光半导体制造股份有限公司 具有内屏蔽体的封装结构及其制造方法
US8378466B2 (en) * 2009-11-19 2013-02-19 Advanced Semiconductor Engineering, Inc. Wafer-level semiconductor device packages with electromagnetic interference shielding
JP2011193191A (ja) * 2010-03-15 2011-09-29 Renesas Electronics Corp 半導体集積回路およびそれを内蔵した高周波モジュール
KR101171512B1 (ko) * 2010-06-08 2012-08-06 삼성전기주식회사 반도체 패키지의 제조 방법
KR20120053332A (ko) * 2010-11-17 2012-05-25 삼성전자주식회사 반도체 패키지 및 이의 제조 방법
CN102610595B (zh) * 2011-01-24 2015-02-18 国民技术股份有限公司 射频功率放大器及其封装方法
US9179538B2 (en) 2011-06-09 2015-11-03 Apple Inc. Electromagnetic shielding structures for selectively shielding components on a substrate
US9190340B2 (en) * 2011-06-17 2015-11-17 Stats Chippac, Ltd. Semiconductor device and method of forming RF FEM and RF transceiver in semiconductor package
WO2013035819A1 (ja) * 2011-09-08 2013-03-14 株式会社村田製作所 電子部品モジュール及び該電子部品モジュールの製造方法
US8637963B2 (en) * 2011-10-05 2014-01-28 Sandisk Technologies Inc. Radiation-shielded semiconductor device
JP2013207213A (ja) * 2012-03-29 2013-10-07 Tdk Corp 電子部品モジュール及びその製造方法
TW201351599A (zh) * 2012-06-04 2013-12-16 矽品精密工業股份有限公司 半導體封裝件及其製法
CN202888168U (zh) * 2012-09-05 2013-04-17 欣兴电子股份有限公司 电子元件

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1442033A (zh) * 2000-04-21 2003-09-10 电子设备屏蔽公司 印制电路板的emi和rfi屏蔽
TW200805615A (en) * 2006-07-04 2008-01-16 Advanced Semiconductor Eng Semiconductor package having electromagnetic interference shielding and fabricating method thereof
TW200915527A (en) * 2007-09-24 2009-04-01 Stats Chippac Ltd Semiconductor package and method of reducing electromagnetic interference between devices
CN102683329A (zh) * 2011-03-18 2012-09-19 矽品精密工业股份有限公司 半导体封装件及其制法

Also Published As

Publication number Publication date
US10771101B2 (en) 2020-09-08
JP2015091135A (ja) 2015-05-11
JP7214574B2 (ja) 2023-01-30
US20150126134A1 (en) 2015-05-07
TWI652789B (zh) 2019-03-01
JP2019176172A (ja) 2019-10-10
US20170149466A1 (en) 2017-05-25
JP6537807B2 (ja) 2019-07-03
HK1206148A1 (en) 2015-12-31
TW201530731A (zh) 2015-08-01
CN104617053A (zh) 2015-05-13
KR20150051924A (ko) 2015-05-13
JP7242938B2 (ja) 2023-03-20
US9564937B2 (en) 2017-02-07
KR102371332B1 (ko) 2022-03-04
JP2022109908A (ja) 2022-07-28

Similar Documents

Publication Publication Date Title
CN104617053B (zh) 涉及陶瓷基板上射频装置封装的装置和方法
US20220338342A1 (en) Devices and methods related to metallization of ceramic substrates for shielding applications
TWI759297B (zh) 射頻模組的選擇性遮蔽
JP6469572B2 (ja) アンテナ一体型無線モジュールおよびこのモジュールの製造方法
US11430751B2 (en) Microelectronic devices designed with 3D stacked ultra thin package modules for high frequency communications
US20140198459A1 (en) Stacked package device and manufacturing method thereof
KR20120104896A (ko) 초고주파 패키지 모듈
TW202228332A (zh) 天線模組
HK1206148B (zh) 涉及陶瓷基板上射頻裝置封裝的裝置和方法
HK1216052B (zh) 屏蔽應用的陶瓷基板的金屬化的器件及方法
CN102064157A (zh) 无线局域网路的系统封装模块

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
REG Reference to a national code

Ref country code: HK

Ref legal event code: DE

Ref document number: 1206148

Country of ref document: HK

C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant